CN106572610A - Flexible circuit board via hole forming method - Google Patents
Flexible circuit board via hole forming method Download PDFInfo
- Publication number
- CN106572610A CN106572610A CN201610996073.XA CN201610996073A CN106572610A CN 106572610 A CN106572610 A CN 106572610A CN 201610996073 A CN201610996073 A CN 201610996073A CN 106572610 A CN106572610 A CN 106572610A
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- CN
- China
- Prior art keywords
- metal
- basic unit
- circuit board
- flexible circuit
- sputtering
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09563—Metal filled via
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention provides a flexible circuit board via hole forming method. With the flexible circuit board via hole forming method of the invention adopted, the connection of solid via holes between conductor layers of an integrated circuit package substrate can be realized. Compared with a method according to which cut-through hollow via holes formed by a traditional mechanical hole forming technology are connected, the flexible circuit board via hole forming method enables less area occupation, upper and lower corresponding line rackets of the holes are integrally preserved and are not damaged by the via holes, and therefore, corresponding electrical properties are excellent, and high reliability can be realized, and lead bonding operation can be directly operated on the via holes. With the flexible circuit board via hole forming method of the invention, a production process is simplified, production cost is saved, processing efficiency is improved, and a guarantee is provided for subsequent production of a high-precision image.
Description
Technical field
The invention belongs to PCB processing technique fields, and in particular to a kind of method of flexible circuit board molding via hole.
Background technology
As integrated circuit develops, the requirement to integrated antenna package is also improved therewith, wherein the printing used encapsulation
The requirement of circuit board is also to develop to higher wiring density, more preferable electrical property and hot property direction.To reach above-mentioned requirements, open
It is crucial to send out high reliability via technology, and the electricity, hot property after its density and encapsulation to wiring suffers from very big impact.
It is well known that must have some vias on printed circuit board for connecting the neighbouring conducting surface of insulating medium layer
On circuit.Via of the prior art has very big negative effect to follow-up technological process, for example, lead copper hollow
Line pattern transfer process after the shaping of hole, because the rough and uneven in surface of substrate surface that hollow bore is caused can cause photosensitive resist
Film attaching is bad, easily causes line defct.In addition this through hole can have a great impact to wires design, receive cloth hole on racket
To restriction, the special wire structures such as folded hole are prevented from realizing, so as to constrain the raising of wiring density.If needed on hole
Continue to make if wire pattern, it is necessary to fill and lead up depression using special jack process, could realize folding hole, cloth on racket
The special wire structures such as hole.And for flexible circuit board, based on the property of raw material of sheet material, for via requirement just more
It is high.
The content of the invention
In view of this, the present invention provides a kind of method of flexible circuit board molding via hole, of the prior art to solve
Weak point.
The technical scheme is that：A kind of method of flexible circuit board molding via hole, it comprises the steps：
S1. in the basic unit of the double-faced flexible wiring board for being provided with through hole by the way of laser drill in advance, conducting connection is needed
The upper and lower upper and lower surface of basic unit smear photosensitive film, be used for limiting plating corresponding to being formed at the position of via on the photosensitive film
The thin film perforate of metallic region；
S2. in the first face of basic unit, using the thin film perforate of the restriction plating metallic region formed in step of membrane sticking, by magnetic control
Splash-proofing sputtering metal technique closes the orifice end by the face of basic unit first of the via；
S3. magnetron sputtering technique is adopted, through hole is filled up completely with into full rare metal, and make filling rare metal and the face of basic unit second
Plating it is metal faced be connected, so as to using filling rare metal realize it is solid between the neighbouring circuit layer pattern of basic unit
Via connects；
S4. subsequent treatment is implemented respectively to the face of basic unit first, the second face, to take off photosensitive film, that is, obtain can it is convenient to carry out after
The planar conductive face of continuous figure circuit manufacturing process；
The rare metal that the magnetron sputtering is adopted for tungsten, molybdenum, tantalum, hafnium, any one in niobium；It is described plating metal be silver, platinum,
Any one metal in gold.
In the processing technique of the present invention, the metal of plating electroplating region can be accurately controlled in the plating mode of step S2
In domain, electroless plated metal surface layer comes out in the thin film perforate in the face of basic unit second, and addition removes technique, saves operation.And
And the rare metal of the plating in via can accomplish the thickness of precise control coating and the area of plating, filler metal
It can be controlled in basic unit and electroplates metal faced following, saving prior art needs removal to be higher by the metal faced plating of basic unit's plating
The operation of metal.Meanwhile, also effectively reduce production cost.
In step S1, when being attached on the metal faced surface of basic unit's plating using sensitive film material, using mask, expose
The figure transfer techniques that light, development are characterized are on photosensitive film corresponding to formation at the position of via for limiting plating metal
The thin film perforate in region.
Magnetron sputtering technique in step S3 is：A diameter of 20mm of the target metal of sputtering, thickness are 3mm；Target and
The distance between insulating body is 6cm, and working gas is high-purity nitrogen of the purity more than or equal to 99. 99wt% and purity
More than or equal to the high purity argon of 99. 99wt%, respectively use quality effusion meter control；Insulating body is being put into vacuum chamber
Before, respectively gas pressure in vacuum is extracted into into 1.25 × 10 before sputtering with acetone, ethanol, deionized water ultrasonic cleaning-3-4.48×
10-3Pa, and argon pre-sputtering 30s is filled with to clean target surface；Nitrogen is subsequently passed, total sputtering pressure is controlled in 3-4Pa, nitrogen is controlled
Gas is 2 with the volume ratio of argon:1, sputtering power is controlled in 1.1-1.3Kw, and sputtering time is 5-10min.Using the present invention
Magnetically controlled sputter method, highly shortened the time of processing, improve the efficiency of processing.
The photosensitive film is by following weight portion meter into being grouped into：Polyacrylic acid 13, polyamide 14.7, tetramethylolmethane
6.6th, Sorbitol 3.8, methylene blue 5.2, thiophene carbon cyanine dye 7.1, BeO 2.9, Al2O3 4.2nd, tributyl phosphate 5.4, two
Ethylene diacetate 3.5, lauroylamidopropyl betaine 12.5, babassu oil amido propyl amine oxide 3.2, m- four
Hydroxy phenyl chlorin 4.7, etioporphyrin (ETIO) stannum 2.1.By the synergistic function of photosensitive film each component, greatly improve
The sensitivity of photosensitive film, is further produce high-precision image to provide safeguard.
The beneficial effects of the present invention is：The inventive method can not only realize IC substrate package wire interlayer
Solid via connection, and this method is compared with the hollow via connected mode of the insertion that traditional mechanical hole creating technology is formed,
Area occupancy is less, and the upper and lower corresponding line racket in hole retains complete, is not destroyed by via, and corresponding electric property is showed also more
For excellent, and there is height reliability, can directly in the enterprising line lead bonding operation of via.This invention simplifies production work
Sequence, saves production cost, improves working (machining) efficiency, can provide safeguard subsequently to produce high-precision image.
Specific embodiment
Technical scheme is clearly and completely described below in conjunction with the embodiment of the present invention, it is clear that retouched
The embodiment stated is only a part of embodiment of the invention, rather than the embodiment of whole.
Embodiment
A kind of method of flexible circuit board molding via hole, it comprises the steps：
S1. in the basic unit of the double-faced flexible wiring board for being provided with through hole by the way of laser drill in advance, conducting connection is needed
The upper and lower upper and lower surface of basic unit smear photosensitive film, be used for limiting plating corresponding to being formed at the position of via on the photosensitive film
The thin film perforate of metallic region；
S2. in the first face of basic unit, using the thin film perforate of the restriction plating metallic region formed in step of membrane sticking, by magnetic control
Splash-proofing sputtering metal technique closes the orifice end by the face of basic unit first of the via；
S3. magnetron sputtering technique is adopted, through hole is filled up completely with into full rare metal, and make filling rare metal and the face of basic unit second
Plating it is metal faced be connected, so as to using filling rare metal realize it is solid between the neighbouring circuit layer pattern of basic unit
Via connects；
S4. subsequent treatment is implemented respectively to the face of basic unit first, the second face, to take off photosensitive film, that is, obtain can it is convenient to carry out after
The planar conductive face of continuous figure circuit manufacturing process；
The rare metal that the magnetron sputtering is adopted for tungsten, molybdenum, tantalum, hafnium, any one in niobium；It is described plating metal be silver, platinum,
Any one metal in gold.
In the processing technique of the present invention, the metal of plating electroplating region can be accurately controlled in the plating mode of step S2
In domain, electroless plated metal surface layer comes out in the thin film perforate in the face of basic unit second, and addition removes technique, saves operation.And
And the rare metal of the plating in via can accomplish the thickness of precise control coating and the area of plating, filler metal
It can be controlled in basic unit and electroplates metal faced following, saving prior art needs removal to be higher by the metal faced plating of basic unit's plating
The operation of metal.Meanwhile, also effectively reduce production cost.
In step S1, when being attached on the metal faced surface of basic unit's plating using sensitive film material, using mask, expose
The figure transfer techniques that light, development are characterized are on photosensitive film corresponding to formation at the position of via for limiting plating metal
The thin film perforate in region.
Magnetron sputtering technique in step S3 is：A diameter of 20mm of the target metal of sputtering, thickness are 3mm；Target and
The distance between insulating body is 6cm, and working gas is high-purity nitrogen of the purity more than or equal to 99. 99wt% and purity
More than or equal to the high purity argon of 99. 99wt%, respectively use quality effusion meter control；Insulating body is being put into vacuum chamber
Before, respectively gas pressure in vacuum is extracted into into 1.25 × 10 before sputtering with acetone, ethanol, deionized water ultrasonic cleaning-3-4.48×
10-3Pa, and argon pre-sputtering 30s is filled with to clean target surface；Nitrogen is subsequently passed, total sputtering pressure is controlled in 3-4Pa, nitrogen is controlled
Gas is 2 with the volume ratio of argon:1, sputtering power is controlled in 1.1-1.3Kw, and sputtering time is 5-10min.Using the present invention
Magnetically controlled sputter method, highly shortened the time of processing, improve the efficiency of processing.
The photosensitive film is by following weight portion meter into being grouped into：Polyacrylic acid 13, polyamide 14.7, tetramethylolmethane
6.6th, Sorbitol 3.8, methylene blue 5.2, thiophene carbon cyanine dye 7.1, BeO 2.9, Al2O3 4.2nd, tributyl phosphate 5.4, two
Ethylene diacetate 3.5, lauroylamidopropyl betaine 12.5, babassu oil amido propyl amine oxide 3.2, m- four
Hydroxy phenyl chlorin 4.7, etioporphyrin (ETIO) stannum 2.1.By the synergistic function of photosensitive film each component, greatly improve
The sensitivity of photosensitive film, is further produce high-precision image to provide safeguard.
It is obvious to a person skilled in the art that the invention is not restricted to the details of above-mentioned one exemplary embodiment, Er Qie
In the case of spirit or essential attributes without departing substantially from the present invention, the present invention can be in other specific forms realized.Therefore, no matter
From the point of view of which point, embodiment all should be regarded as exemplary, and be nonrestrictive, the scope of the present invention is by appended power
Profit is required rather than described above is limited, it is intended that all in the implication and scope of the equivalency of claim by falling
Change is included in the present invention.
Moreover, it will be appreciated that although this specification is been described by according to embodiment, not each embodiment is only wrapped
Containing an independent technical scheme, this narrating mode of description is only that for clarity those skilled in the art should
Using description as an entirety, the technical scheme in each embodiment can also Jing it is appropriately combined, form those skilled in the art
Understandable other embodiment.The ins and outs not described in detail in the present invention, can pass through arbitrary in this area
Prior art is realized.Particularly, all technical characterstics not described in detail can be realized by any prior art in the present invention.
Claims (4)
1. a kind of method of flexible circuit board molding via hole, it is characterised in that it comprises the steps：
S1. in the basic unit of the double-faced flexible wiring board for being provided with through hole by the way of laser drill in advance, conducting connection is needed
The upper and lower upper and lower surface of basic unit smear photosensitive film, be used for limiting plating corresponding to being formed at the position of via on the photosensitive film
The thin film perforate of metallic region；
S2. in the first face of basic unit, using the thin film perforate of the restriction plating metallic region formed in step of membrane sticking, by magnetic control
Splash-proofing sputtering metal technique closes the orifice end by the face of basic unit first of the via；
S3. magnetron sputtering technique is adopted, through hole is filled up completely with into full rare metal, and make filling rare metal and the face of basic unit second
Plating it is metal faced be connected, so as to using filling rare metal realize it is solid between the neighbouring circuit layer pattern of basic unit
Via connects；
S4. subsequent treatment is implemented respectively to the face of basic unit first, the second face, to take off photosensitive film, that is, obtain can it is convenient to carry out after
The planar conductive face of continuous figure circuit manufacturing process；
The rare metal that the magnetron sputtering is adopted for tungsten, molybdenum, tantalum, hafnium, any one in niobium；It is described plating metal be silver, platinum,
Any one metal in gold.
2. the method for the flexible circuit board molding via hole according to claim 1, it is characterised in that in step S1, adopt
When being attached on the metal faced surface of basic unit's plating with sensitive film material, the figure being characterized using mask, exposure, development is turned
Shifting technology is used for limiting the thin film perforate for electroplating metallic region on photosensitive film corresponding to being formed at the position of via.
3. the method for the flexible circuit board molding via hole according to claim 1, it is characterised in that the magnetic in step S3
Controlling sputtering technology is：A diameter of 20mm of the target metal of sputtering, thickness are 3mm；The distance between target and insulating body are
6cm, working gas is that high-purity nitrogen of the purity more than or equal to 99. 99wt% and purity are more than or equal to 99. 99wt%
High purity argon, respectively use quality effusion meter control；Insulating body before vacuum chamber is put into, respectively with acetone, ethanol,
Deionized water is cleaned by ultrasonic, and gas pressure in vacuum is extracted into into 1.25 × 10 before sputtering-3-4.48×10-3Pa, and be filled with argon and splash in advance
Penetrate 30s to clean target surface；Nitrogen is subsequently passed, total sputtering pressure is controlled in 3-4Pa, control nitrogen is with the volume ratio of argon
2:1, sputtering power is controlled in 1.1-1.3Kw, and sputtering time is 5-10min.
4. the method for flexible circuit board molding via hole according to claim 2, it is characterised in that the photosensitive film
By following weight portion meter into being grouped into：Polyacrylic acid 13, polyamide 14.7, tetramethylolmethane 6.6, Sorbitol 3.8, methylene blue
5.2nd, thiophene carbon cyanine dye 7.1, BeO 2.9, Al2O3 4.2nd, tributyl phosphate 5.4, diethylene glycol diacetate 3.5, Laurel
Amido propyl betaine 12.5, babassu oil amido propyl amine oxide 3.2, m- tetrahydroxy phenyl chlorin 4.7, just
Porphyrin stannum 2.1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610996073.XA CN106572610A (en) | 2016-11-12 | 2016-11-12 | Flexible circuit board via hole forming method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610996073.XA CN106572610A (en) | 2016-11-12 | 2016-11-12 | Flexible circuit board via hole forming method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106572610A true CN106572610A (en) | 2017-04-19 |
Family
ID=58542455
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610996073.XA Pending CN106572610A (en) | 2016-11-12 | 2016-11-12 | Flexible circuit board via hole forming method |
Country Status (1)
| Country | Link |
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| CN (1) | CN106572610A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109259795A (en) * | 2017-07-18 | 2019-01-25 | 三星电子株式会社 | Engage the method for middleware and IC chip and the ultrasonic probe with the method |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1527656A (en) * | 2003-09-19 | 2004-09-08 | 波 曹 | Magnetically controlled sputtering process of making printed circuit board |
| CN101605434A (en) * | 2009-07-16 | 2009-12-16 | 美龙翔微电子科技（深圳）有限公司 | Method for molding via hole of printed circuit board |
| CN103052916A (en) * | 2010-08-03 | 2013-04-17 | 株式会社东进世美肯 | Negative photosensitive resin composition |
| CN105531260A (en) * | 2013-09-10 | 2016-04-27 | 巴斯夫欧洲公司 | Oxime ester photoinitiators |
| CN106102348A (en) * | 2016-07-01 | 2016-11-09 | 双鸿电子(惠州)有限公司 | Flexible circuit board method for molding via hole |
-
2016
- 2016-11-12 CN CN201610996073.XA patent/CN106572610A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1527656A (en) * | 2003-09-19 | 2004-09-08 | 波 曹 | Magnetically controlled sputtering process of making printed circuit board |
| CN101605434A (en) * | 2009-07-16 | 2009-12-16 | 美龙翔微电子科技（深圳）有限公司 | Method for molding via hole of printed circuit board |
| CN103052916A (en) * | 2010-08-03 | 2013-04-17 | 株式会社东进世美肯 | Negative photosensitive resin composition |
| CN105531260A (en) * | 2013-09-10 | 2016-04-27 | 巴斯夫欧洲公司 | Oxime ester photoinitiators |
| CN106102348A (en) * | 2016-07-01 | 2016-11-09 | 双鸿电子(惠州)有限公司 | Flexible circuit board method for molding via hole |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109259795A (en) * | 2017-07-18 | 2019-01-25 | 三星电子株式会社 | Engage the method for middleware and IC chip and the ultrasonic probe with the method |
| US11631798B2 (en) | 2017-07-18 | 2023-04-18 | Samsung Electronics Co., Ltd. | Bonding interposer and integrated circuit chip, and ultrasound probe using the same |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Address after: 516000 No. 9, Longshan Eighth Road, Daya Bay West District, Huizhou City, Guangdong Province Applicant after: Guangdong Kexiang Electronic Technology Co., Ltd. Address before: 516000 No. 9, Longshan Eighth Road, Daya Bay West District, Huizhou City, Guangdong Province Applicant before: Guangdong Kexiang Electronic Technology Co., Ltd. |
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| CB02 | Change of applicant information | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170419 |
|
| RJ01 | Rejection of invention patent application after publication |