CN106571355B - 芯片封装基板的制作方法及芯片封装基板 - Google Patents
芯片封装基板的制作方法及芯片封装基板 Download PDFInfo
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- CN106571355B CN106571355B CN201510657115.2A CN201510657115A CN106571355B CN 106571355 B CN106571355 B CN 106571355B CN 201510657115 A CN201510657115 A CN 201510657115A CN 106571355 B CN106571355 B CN 106571355B
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 28
- 229910052802 copper Inorganic materials 0.000 claims abstract description 73
- 239000010949 copper Substances 0.000 claims abstract description 73
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 72
- 229910000679 solder Inorganic materials 0.000 claims abstract description 65
- 238000009713 electroplating Methods 0.000 claims abstract description 34
- 239000000758 substrate Substances 0.000 claims abstract description 15
- 230000004888 barrier function Effects 0.000 claims description 23
- 238000005530 etching Methods 0.000 claims description 23
- 238000003466 welding Methods 0.000 claims description 5
- 230000015572 biosynthetic process Effects 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims description 4
- 238000004140 cleaning Methods 0.000 claims description 3
- 238000000227 grinding Methods 0.000 claims description 3
- 238000004381 surface treatment Methods 0.000 claims description 2
- 150000001879 copper Chemical class 0.000 claims 1
- 230000003628 erosive effect Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 5
- 238000007747 plating Methods 0.000 description 5
- 238000007654 immersion Methods 0.000 description 4
- 239000010931 gold Substances 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 238000011010 flushing procedure Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 230000002950 deficient Effects 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000003755 preservative agent Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Ceramic Engineering (AREA)
Abstract
Description
Claims (9)
Priority Applications (1)
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CN201510657115.2A CN106571355B (zh) | 2015-10-12 | 2015-10-12 | 芯片封装基板的制作方法及芯片封装基板 |
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CN201510657115.2A CN106571355B (zh) | 2015-10-12 | 2015-10-12 | 芯片封装基板的制作方法及芯片封装基板 |
Publications (2)
Publication Number | Publication Date |
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CN106571355A CN106571355A (zh) | 2017-04-19 |
CN106571355B true CN106571355B (zh) | 2019-03-19 |
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CN201510657115.2A Active CN106571355B (zh) | 2015-10-12 | 2015-10-12 | 芯片封装基板的制作方法及芯片封装基板 |
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CN (1) | CN106571355B (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN112349599A (zh) * | 2020-11-10 | 2021-02-09 | 南方电网科学研究院有限责任公司 | 一种芯片基板的制作方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101853835A (zh) * | 2009-04-03 | 2010-10-06 | 南茂科技股份有限公司 | 倒装芯片封装及其制造方法 |
CN102915995A (zh) * | 2012-11-02 | 2013-02-06 | 日月光半导体制造股份有限公司 | 半导体封装件、基板及其制造方法 |
CN103489841A (zh) * | 2013-08-08 | 2014-01-01 | 华进半导体封装先导技术研发中心有限公司 | 同时埋入电容、电感、电阻的pcb板及其制备方法 |
TWI434386B (zh) * | 2009-10-13 | 2014-04-11 | Unimicron Technology Corp | 封裝結構之製法 |
CN104091790A (zh) * | 2014-07-25 | 2014-10-08 | 华进半导体封装先导技术研发中心有限公司 | 一种半导体封装基板结构及其制作方法 |
CN104427740A (zh) * | 2013-08-22 | 2015-03-18 | 富葵精密组件(深圳)有限公司 | 电路板及其制作方法 |
-
2015
- 2015-10-12 CN CN201510657115.2A patent/CN106571355B/zh active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101853835A (zh) * | 2009-04-03 | 2010-10-06 | 南茂科技股份有限公司 | 倒装芯片封装及其制造方法 |
TWI434386B (zh) * | 2009-10-13 | 2014-04-11 | Unimicron Technology Corp | 封裝結構之製法 |
CN102915995A (zh) * | 2012-11-02 | 2013-02-06 | 日月光半导体制造股份有限公司 | 半导体封装件、基板及其制造方法 |
CN103489841A (zh) * | 2013-08-08 | 2014-01-01 | 华进半导体封装先导技术研发中心有限公司 | 同时埋入电容、电感、电阻的pcb板及其制备方法 |
CN104427740A (zh) * | 2013-08-22 | 2015-03-18 | 富葵精密组件(深圳)有限公司 | 电路板及其制作方法 |
CN104091790A (zh) * | 2014-07-25 | 2014-10-08 | 华进半导体封装先导技术研发中心有限公司 | 一种半导体封装基板结构及其制作方法 |
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Effective date of registration: 20240209 Address after: SL11, No. 8 Langdong Road, Yanchuan Community, Yanluo Street, Bao'an District, Shenzhen City, Guangdong Province, 518105 Patentee after: Liding semiconductor technology (Shenzhen) Co.,Ltd. Country or region after: China Patentee after: Liding semiconductor technology Qinhuangdao Co.,Ltd. Patentee after: Zhen Ding Technology Co.,Ltd. Country or region after: Taiwan, China Address before: 518105 area B, Room 403, block B, Rongchao Binhai building, No. 2021, haixiu Road, n26 District, Haiwang community, Xin'an street, Bao'an District, Shenzhen City, Guangdong Province Patentee before: Liding semiconductor technology (Shenzhen) Co.,Ltd. Country or region before: China Patentee before: Qi Ding Technology Qinhuangdao Co.,Ltd. Patentee before: Zhen Ding Technology Co.,Ltd. Country or region before: Taiwan, China |