CN106565951B - Poly- (2,6 dimethyl phenylate) oligomer of phosphorus system and preparation method thereof and thermosetting compound - Google Patents

Poly- (2,6 dimethyl phenylate) oligomer of phosphorus system and preparation method thereof and thermosetting compound Download PDF

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CN106565951B
CN106565951B CN201510644048.0A CN201510644048A CN106565951B CN 106565951 B CN106565951 B CN 106565951B CN 201510644048 A CN201510644048 A CN 201510644048A CN 106565951 B CN106565951 B CN 106565951B
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phosphorus
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CN106565951A (en
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林庆炫
王炳杰
杜安邦
黄坤源
曾君玉
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CHANGCHUN ARTIFICIAL RESIN FACTORY Co Ltd
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CHANGCHUN ARTIFICIAL RESIN FACTORY Co Ltd
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Abstract

The present disclosure generally relates to poly- (2,6 dimethyl phenylate) oligomers of phosphorus system and preparation method thereof and thermosetting compound.Wherein, poly- (2, the 6 dimethyl phenylate) oligomer of double bond phosphorus system of the present invention containing unsaturated group can be further used for preparing fire retardant thermosetting compound, and the thermosetting compound has anti-flammability, low-k, low dielectric absorption and high glass transition temperature.

Description

Poly- (2,6 dimethyl phenylate) oligomer of phosphorus system and preparation method thereof and thermosetting compound
Technical field
The present disclosure generally relates to poly- (the 2,6 dimethyl phenylate) oligomer of phosphorus system and preparation methods.Wherein, the present invention contains insatiable hunger It can further harden with the double bond phosphorus system of base poly- (2,6 dimethyl phenylate) oligomer to prepare fire retardant thermosetting compound, the heat Solidfied material has anti-flammability, low-k, low dielectric absorption and high glass transition temperature.
Background technique
With the progress of semiconductor technology, the size of component also constantly reduces, and enters in micron field, then simple layer Conducting wire is not applied and is used, it is necessary to develops towards three-dimensional space, thus it is online in necessary construction multiple layer metal, just it is able to satisfy development Demand.It is main to will affect its efficiency there are two problem in the inline mechanism journey of multiple layer metal: one, to be plain conductor and dielectric Signal propagation delays caused by matter layer (RC delay);Two, the signal between plain conductor interferes (cross talk), separately The speed and dielectric constant square of outer signal transmitting are inversely proportional proportional with dielectric absorption, therefore develop dielectric materials and are Project important now.
Poly- (2,6 benzyl ether) (poly (2,6-dimethyl-1,4-phenylene oxide) or abbreviation PPO) is one Kind engineering plastics, the thermoplasticity developed in 1956 by the A.S.Hay of unusual (General Electric) company of the U.S. Macromolecule [1].PPO structure is firm, and cause makes it have high glass transition temperature (about 210 DEG C of Tg), high-tensile, rigid, resistance to Impact strength, creep resistance and low-expansion coefficient (CTE:2.9 × 10-5In/ ℉, -20 ℉~150 ℉) etc. characteristics, remove this, PPO has good resistance to solvent, acidproof, alkaline-resisting, and low water absorption.Macromolecule is often formed in the method for injection, and PPO With low molding shrinkage.In terms of electrical characteristic, PPO has low-k.
For the requirement for reaching high-performance and high dimensional stability, copper clad laminate resin needs to seek thermosetting property.But for fear of PPO sheet Body structure relationship limits PPO and develops and apply, scholar Ueda et al. [2] in substrate so that self-crosslinking hardens having any problem property With oxidative coupling by 2,6- xylenol (2,6-Dimethylphenol) and 2- allyl -6- cresols (2-Allyl- It 6-methylphenol) is copolymerized, obtains PPO, the PPO after modification that side chain has allyl, itself can become thermosetting property high score Son still has high Tg and low dielectric constant after modified PPO hardening.So, since PPO has high molecular weight, make It is with quite high stickiness, and solubility is bad, bad to the impregnation of glass fibre, and limits its answering in copper clad laminate With.
2006, Ishii et al. synthesized distant chela PPE giant molecule monomer (the telechelic PPE of low molecular weight Macromonomers, PPE-M), and the phenol terminal groups of the giant molecule monomer and 4- 1-chloro-4-methyl-benzene are reacted, And the PPO compound of styrene end is arrived, vinyl phenyl PPE giant molecule monomer (VB-PPE-M) institute of structure such as formula (1) Show [3].PPE-M and epoxy resin and cyanate are copolymerized by Peters in 2007 et al., keep the performance of its thermosetting compound big Width promotes [4].2011, Peters et al. [5] by commodity PPE-M under SABIC house flag (orSA90 end) Phenolic group is modified, and so that its end is had unsaturated double-bond structure, as shown in formula (1).Contain methacrylic acid when importing PPE-M When ester (methacrylate) terminal groups, the methylpropenyl PPE giant molecule monomer (M-PPO-M) of structural formula such as formula (1), Its trade name NORYLTMResin SA 9000。
Due to the development of printed circuit board now, for the electrical properties, thermal property and flame retardancy etc. of high frequency substrate Requirement it is very high, especially must reach V-0 grade, therefore the space that material still makes progress in this regard in the fire retardant test of UL-94, PPO can be made to meet the demand of market today, increase its application value.However, PPO has flammability, electron level can not be reached The requirement of product UL-94V-0.In recent years, organic phosphorus compound has been studied for high molecular polymer with preferred resistance to Characteristic is fired, and compared to flame retardant containing halogen, organic phosphorus compound is that solid phase is fire-retardant, less likely generates smog and has poison gas Body.Known addition type flame retardant, other than it can reduce the engineering properties of material, as the migration of flame retardant molecule or Volatilize and cause the decline of its resistance to fuel efficiency fruit.In early stage research, the additional incombustible agent that adds makes it possible to reach preferred difficulty Fuel efficiency fruit.Such as scholar Leu et al. [6] is added in PPO using nitrogenous phosphorus flame retardant, because the nitrogen phosphorus of fire retardant multiplies effect altogether It answers, is allowed to UL-94 and reaches V-0 grade.In addition in PPO and polystyrene (PS) blending system, though the impact resistance of enhancing PPO is strong Degree, but the case where fire retardant aspect is downslide, incombustible agent need to be added, again to reach preferred fire retardant effect, therefore scholar Takeda et al. [7] utilizes different phosphorous aromatic series incombustible agents, inquires into the fire retardant effect to PPO/PS.It was found that the phosphorous difficulty of addition Agent is fired, the self-extinguishing time of burning can be effectively reduced, promote its flame resistance.In addition, woods et al. disclosed a series of phosphorus in 2014 It is derivative, is with the miscellaneous -10- phosphorus phenanthrene -10- oxide (9,10-dihydro-9-oxa-10- of 9,10- dihydro-9-oxy Phosphaphenanthrene10-oxide, hereinafter referred to as DOPO), the phosphorus group for having fire-retardant is introduced directly into the structure of PPO, To replace additional addition incombustible agent [8].Its result reaches VTM-0 grade in UL-94 when phosphorus content is 1%, and display is by containing The importing of phosphorus group can effectively promote its flame retardancy really.
Bibliography:
1.Hay,A.S.J.Polym Sci Part A:Polym Chem 1998,36,505.
2.Fukuhara,T.;Shibasaki,Y.;Ando,S.;Ueda,M.Polymer 2004,45,843
3.US 6,995,195B2
4.E.N.Peters,A.K.,E.Delsman,H.Guo,A.Carrillo,G.Rocha In Society of Plastics Engineers Annual Technical Conference(ANTEC 2007):Plastics Encounter,Cincinnati,Ohio.,6-11May,2007;Curran Associates,Inc.;pp 2125-2128.
5.S.Fisher,H.G.,M.Jeevanath,E.Peters,SABIC Innovative Plastics In Polyphenylene Ether Macromonomer:X.Vinyl Terminated Telechelic Macromers,69th Annual Technical Conference of the Society of Plastics Engineers 2011(ANTEC 2011),Boston,Massachusetts,USA,1-5May,2011;pp 2819-2822.
6.Leu,T.S.;Wang,C.S.J Appl Polym Sci 2004,92,410
7.Kunihiko,T.;Fumiko,A.;Masao,K.;Shigeki,T.J Appl Polym Sci 1997,64, 1175.
8.Lin,C.H.,Tsai,Y.J.,Shih,Y.S.,Chang,H.C.Polym Degradation and Stability2014,99,105
Summary of the invention
The present disclosure generally relates to poly- (2, the 6 dimethyl phenylate) oligomers of phosphorus system, specifically, the present invention includes two kinds of aspects, Phosphorus group is imported into PPO first, obtains poly- (2,6 dimethyl benzenes of the bis-phenol oligomer with phosphorus group, especially phosphorus system Ether) bis-phenol oligomer.Then poly- (2,6 dimethyl phenylate) the bis-phenol oligomer of phosphorus system obtained is modified again, imports three kinds Poly- (2, the 6 dimethyl phenylate) oligomer of double bond phosphorus system containing unsaturated group is further made in unsaturated double-bond.Such as phosphorus system is gathered (2,6 dimethyl phenylate) bis-phenol oligomer reacts to obtain the phosphorus system PPO of styrol with 4- 1-chloro-4-methyl-benzene, due to styrene Group is low polarity and hydrophobic structure, will have low-k and low dielectric absorption, has the low dielectric of flame retardancy to obtain Thermosetting compound.
Poly- (the 2,6 dimethyl phenylate) oligomer of phosphorus system
Therefore, poly- (2, the 6 dimethyl phenylate) oligomer of phosphorus system of the invention, it includes the structures of such as following formula (2):
Wherein group out of the ordinary has following meanings:
P1Expression be not present or
P2It indicates
R1、R2、R3Each expression H or straight chain or branched-chain alkyl with 1 to 6 C atom independently of one another, preferably H, Methyl or ethyl;
R4Indicate H or the alkenyl with 1 to 10 C atom and comprising 0 to 3 oxygen atom, aryl or combinations thereof, preferably
M, n respectively indicates 0 to 30 integer, preferably 0 to 20 integer independently of one another.
Poly- (2,6 dimethyl phenylate) the bis-phenol oligomer of phosphorus system
In above-mentioned poly- (2, the 6 dimethyl phenylate) oligomer of phosphorus system of the present invention, wherein working as R4When for H, formula (2) is poly- for phosphorus system (2,6 dimethyl phenylate) bis-phenol oligomer, and an at least formula (2) oligomer system is indicated with the oligomer of such as formula (3):
Wherein group out of the ordinary has following meanings:
P1Expression be not present or
P2It indicates
R1、R2、R3Each expression H or straight chain or branched-chain alkyl with 1 to 6 C atom independently of one another, preferably H, Methyl or ethyl;
M, n respectively indicates 0 to 30 integer, preferably 0 to 20 integer independently of one another.
Specifically, an at least formula (3) oligomer system is indicated with the oligomer of such as formula (IIa) or formula (IIc):
Wherein group out of the ordinary has following meanings:
R1、R2、R3Each expression H or straight chain or branched-chain alkyl with 1 to 6 C atom independently of one another, preferably H, Methyl or ethyl;
M, n respectively indicates 0 to 30 integer, preferably 0 to 20 integer independently of one another.
Specifically, formula (IIa) is preferred are as follows:
Wherein, R1For H, CH3Or C2H5And R3For H or CH3
Specifically, formula (IIc) is preferred are as follows:
Wherein, R1For H, CH3Or C2H5、R2For H or CH3And R3 is H or CH3;Or
Wherein, R1For H, CH3Or C2H5And R3For H or CH3
Poly- (the 2,6 dimethyl phenylate) oligomer of double bond phosphorus system containing unsaturated group
In above-mentioned poly- (2, the 6 dimethyl phenylate) oligomer of phosphorus system of the present invention, wherein working as R4When not being H, formula (2) is containing not It is saturated poly- (2, the 6 dimethyl phenylate) oligomer of double bond phosphorus system of base, a wherein at least formula (2) oligomer system is with the widow of such as formula (4) Polymers indicates:
Wherein group out of the ordinary has following meanings:
P1Expression be not present or
P2It indicates
R1、R2、R3Each expression H or straight chain or branched-chain alkyl with 1 to 6 C atom independently of one another, preferably H, Methyl or ethyl;
R’4When the alkenyl with 1 to 10 C atom and comprising 0 to 3 oxygen atom, aryl or combinations thereof, preferably
M, n respectively indicates 0 to 30 integer, preferably 0 to 20 integer independently of one another.
Specifically, a wherein at least formula (4) oligomer system is indicated with the oligomer of such as formula (IIIa) or formula (IIIc):
Wherein group out of the ordinary has following meanings:
R1、R2、R3Each expression H or straight chain or branched-chain alkyl with 1 to 6 C atom independently of one another, preferably H, Methyl or ethyl;
R4Indicate H or the alkenyl with 1 to 10 C atom and comprising 0 to 3 oxygen atom, aryl or combinations thereof, preferably
M, n respectively indicates 0 to 30 integer, preferably 0 to 20 integer independently of one another.
Specifically, formula (IIIa) is preferred are as follows:
Wherein, R1For H, CH3Or C2H5、R3For H or CH3, and R4For
Specifically, formula (IIIc) is preferred are as follows:
Wherein, R1For H, CH3Or C2H5、R2For H or CH3、R3For H or CH3, and R4For
Wherein, R1For H, CH3Or C2H5、R3For H or CH3, and R4For
Specifically, formula described in wherein at least one (4) oligomer system is with such as formula (IIIc-M), formula (IIIc-A) or formula (IIIc-VB) poly- (2,6 dimethyl phenylate) the oligomer expression of double bond phosphorus system containing unsaturated group,
Wherein m and n respectively indicates 0 to 30 integer, preferably 0 to 20 integer independently of one another.
The implementation of above related invention, will be with the specific embodiment explanation in following embodiments.
The preparation method of poly- (2,6 dimethyl phenylate) the bis-phenol oligomer of phosphorus system
In the present invention, synthesis phosphorus series bisphenols compound (I) first,
Wherein, R1、R2Or R3H or straight chain or branched-chain alkyl with 1 to 6 C atom are respectively indicated independently of one another, Preferably H, methyl or ethyl;Then with bisphenol compound (I) and 2,6- xylenol in CuCl and aminated compounds (such as two Butylamine (dibutylamine, DBA) or 4- dimethylaminopyridine (4-dimethylaminopyridine, DMAP)) catalysis under, Synthesize poly- (2,6 dimethyl phenylate) the bis-phenol oligomer of phosphorus system.
Specifically, the method for synthesizing poly- (2,6 dimethyl phenylate) the bis-phenol oligomer of phosphorus system in formula (2) comprising making Object (I) and 2,6- xylenol are closed, in CuCl and aminated compounds (such as dibutyl amine (dibutylamine) or 4- dimethylamino Pyridine (4-dimethylaminopyridine)) catalysis under reacted, be made poly- (2, the 6 dimethyl phenylate) bis-phenol of phosphorus system Oligomer, wherein R1And R2Each expression H or straight chain or branched-chain alkyl with 1 to 6 C atom independently of one another, preferably H, Methyl or ethyl;
In the above method of the present invention, wherein obtained poly- (2,6 dimethyl phenylate) bis-phenol oligomer system of phosphorus system includes extremely A kind of oligomer of few formula (3).
Specifically, in the above method of the present invention, wherein obtained poly- (2,6 dimethyl phenylate) the bis-phenol oligomer of phosphorus system System includes the oligomer of at least one formula (IIa) or formula (IIc').
In the above method of the present invention, work as R2When for hydrogen, poly- (2,6 dimethyl phenylate) the bis-phenol oligomer packet of obtained phosphorus system Containing the structure as shown in following formula (IIa):
Wherein, R1For H, CH3Or C2H5And R3For H or CH3
In the above method of the present invention, work as R2For CH3When, poly- (2,6 dimethyl phenylate) the bis-phenol oligomer packet of obtained phosphorus system Containing the structure as shown in following formula (IIc'):
Wherein, R1For H, CH3Or C2H5And R3For H or CH3
Carrying out rearrangement reaction (redistribution) again with bis-phenol and high molecular weight type PPO is a manufacture bis-phenol functional group PPO method.However, rearrangement reaction again, often leads to the double distribution molecular weight of height because of side reaction.And the production of high molecular weight Object, then because dissolubility is bad, impregnation is bad and influences it in the application of copper clad laminate.Good to obtain dissolubility, impregnation is good Product, escape Traditional Thinking of the present invention, using PPO oligomer (SA-90 of such as SABIC) be starting material, by phosphorus system diphenol Rearrangement reaction again is carried out with SA-90, and it is good to obtain dissolubility, it is good to glass impregnation, and there is the phosphorus system of flame-retarding characteristic simultaneously Poly- (2,6 dimethyl phenylate) bis-phenol oligomer.
In the above method of the present invention, including making formula (I) and formula (5) poly- (2,6 dimethyl phenylate) oligomer:
Rearrangement reaction again is carried out under catalyzed, it is few poly- (2, the 6 dimethyl phenylate) bis-phenol of phosphorus system is made Polymers, wherein
Y is indicated
P, q respectively indicates 0 to 50 integer independently of one another.
In the above method of the present invention, wherein obtained poly- (2,6 dimethyl phenylate) bis-phenol oligomer system of phosphorus system includes extremely A kind of oligomer of few formula (3).
Specifically, in the above method of the present invention, wherein obtained poly- (2,6 dimethyl phenylate) the bis-phenol oligomer of phosphorus system System includes the oligomer of at least one formula (IIc).
In the above method of the present invention, poly- (2,6 dimethyl phenylate) the bis-phenol oligomer of obtained phosphorus system includes such as following formula (IIc) structure shown in:
Wherein, R1For H, CH3Or C2H5、R2For H or CH3And R3 is H or CH3
The method for preparing poly- (the 2,6 dimethyl phenylate) oligomer of double bond phosphorus system containing unsaturated group
The method for preparing poly- (2, the 6 dimethyl phenylate) oligomer of double bond phosphorus system containing unsaturated group comprising by aforementioned system Poly- (2,6 dimethyl phenylate) the bis-phenol oligomer of phosphorus system by terminal hydroxyl structure alkali catalyst catalysis under, with metering system Acid anhydride (methacrylic anhydride), allyl bromide, bromoallylene (allyl bromine) or 4- 1-chloro-4-methyl-benzene (4- Chloromethylstyrene it) reacts, and poly- (2, the 6 dimethyl phenylate) oligomer of double bond phosphorus system containing unsaturated group is made.
In the above method of the present invention, wherein obtained poly- (2,6 dimethyl benzenes of double bond phosphorus system containing unsaturated group Ether) oligomer of the oligomer system including at least one formula (4).
Specifically, the obtained double bond phosphorus system poly- (2,6 dimethyl phenylate) containing unsaturated group of the above method of the present invention is few Polymers comprising one of at least such as the oligomer of formula (IIIa) and formula (IIIc):
Wherein, R1、R2Or R3H or straight chain or branched-chain alkyl with 1 to 6 C atom are respectively indicated independently of one another, Preferably H, methyl or ethyl and R4Indicate H or alkenyl with 1 to 10 C atom, aryl or combinations thereof, wherein comprising 0 to 3 O atoms, preferably
Specifically, the obtained double bond phosphorus system poly- (2,6 dimethyl phenylate) containing unsaturated group of the above method of the present invention is few Polymers comprising such as the oligomer of formula (IIIa):
Wherein, R1For H, CH3Or C2H5、R3For H or CH3, and R4For
Specifically, the obtained double bond phosphorus system poly- (2,6 dimethyl phenylate) containing unsaturated group of the above method of the present invention is few Polymers comprising such as formula (IIIc) or the oligomer of (IIIc'):
Wherein, R1For H, CH3Or C2H5、R2For H or CH3、R3For H or CH3, and R4For
Wherein, R1For H, CH3Or C2H5、R3For H or CH3, and R4For
In the above method of the present invention, wherein the alkali catalyst system is selected from by potassium carbonate (K2CO3), sodium carbonate (Na2CO3)、 Potassium hydroxide (KOH), sodium hydroxide (NaOH), sodium bicarbonate (NaHCO3), or combinations thereof composed by group.
In the above method of the present invention, wherein obtained poly- (2, the 6 dimethyl phenylate) oligomerization of double bond phosphorus system containing unsaturated group Object system is indicated with the oligomer of formula (IIIc-M):
Wherein m or n respectively indicates 0 to 30 integer, preferably 0 to 20 integer independently of one another.
In the above method of the present invention, wherein obtained poly- (2, the 6 dimethyl phenylate) oligomerization of double bond phosphorus system containing unsaturated group Object system is indicated with the oligomer of formula (IIIc-A):
Wherein m or n respectively indicates 0 to 30 integer, preferably 0 to 20 integer independently of one another.
In the above method of the present invention, wherein obtained poly- (2, the 6 dimethyl phenylate) oligomerization of double bond phosphorus system containing unsaturated group Object system is indicated with the oligomer of formula (IIIc-VB):
Wherein m or n respectively indicates 0 to 30 integer, preferably 0 to 20 integer independently of one another.
The thermosetting compound and preparation method of poly- (the 2,6 dimethyl phenylate) oligomer of double bond phosphorus system containing unsaturated group
Poly- (the 2,6 dimethyl phenylate) oligomer of double bond phosphorus system by formula (4) containing unsaturated group is using peroxide as free radical Under initiator, the reaction of unsaturated group is carried out, can obtain that there is fire-retardant, low-k, low dielectric absorption and the transfer of high glass The thermosetting compound of temperature.
In the above-mentioned preparation heat cure object space method of the present invention comprising anti-solidify with free radical starting agent by formula (4) It answers, can obtain that there is fire-retardant, low-k, the thermosetting compound of low dielectric absorption and high glass transition temperature.
The present invention is above-mentioned to be prepared in solidfied material heat cure object space method, wherein the free radical starting agent includes peroxidating Object, preferably three-level butyl peroxy isopropylbenzene (t-butyl cumyl peroxide, (TBCP)).
In the above-mentioned preparation heat cure object space method of the present invention comprising by the double bond phosphorus containing unsaturated group of such as formula (IIIc-M) It is poly- (2,6 dimethyl phenylate) oligomer, and free radical starting agent, such as three-level butyl peroxy isopropylbenzene (t-butyl cumyl Peroxide, (TBCP)), curing reaction is carried out, can obtain that there is fire-retardant, low-k, low dielectric absorption and high glass turn Move the thermosetting compound of temperature.
In the above-mentioned preparation heat cure object space method of the present invention comprising by the double bond phosphorus containing unsaturated group of such as formula (IIIc-A) It is poly- (2,6 dimethyl phenylate) oligomer, and free radical starting agent, such as three-level butyl peroxy isopropylbenzene (t-butyl cumyl Peroxide, (TBCP)), curing reaction is carried out, can obtain that there is fire-retardant, low-k, low dielectric absorption and high glass turn Move the thermosetting compound of temperature.
In the above-mentioned preparation heat cure object space method of the present invention comprising by the double bond containing unsaturated group of such as formula (IIIc-VB) Poly- (2, the 6 dimethyl phenylate) oligomer of phosphorus system, and free radical starting agent, such as three-level butyl peroxy isopropylbenzene (t-butyl cumyl Peroxide, (TBCP)), curing reaction is carried out, can obtain that there is fire-retardant, low-k, low dielectric absorption and high glass turn Move the thermosetting compound of temperature.
Detailed description of the invention
Fig. 1 is the phosphorus system methylphenol of synthesis1H-NMR spectrum.
Fig. 2 is that the LC/MS of formula (IIa) oligomer schemes.
Fig. 3 is formula (IIc) oligomer and (IIIc-VB) oligomer1H-NMR spectrum is repeatedly schemed.
Fig. 4 is formula (IIIc-VB) oligomer with initiator (t-butyl cumyl peroxide (TBCP)) cured heat The DMA of solidfied material schemes
Fig. 5 is formula (IIIc-VB) oligomer with initiator (t-butyl cumyl peroxide (TBCP)) cured heat The TMA of solidfied material schemes
Fig. 6 is formula (IIIc-VB) oligomer with initiator (t-butyl cumyl peroxide (TBCP)) cured heat The elliptical polarized light curve graph of solidfied material.
Specific embodiment
The present invention is further illustrated for following embodiment, only non-to limit the scope of the invention, any to be familiar with Technical field person belongs to model of the invention without prejudice to the modification and transformation reached is able under spirit of the invention It encloses.
The synthesis of 1 phosphorus system methylphenol of embodiment
Take the miscellaneous -10- phosphorus phenanthrene -10- oxide 15.9g of parahydroxyacet-ophenone 10.0g (73.4mmol), 9,10- dihydro-9-oxy (73.4mmol), 2,6- xylenol 44.40g (73.4*5mmol), p-methyl benzenesulfonic acid 0.64g (9,10- dihydro-9-oxy is miscellaneous- The 4wt% of 10- phosphorus phenanthrene -10- oxide), it reacts 24 hours for 130 DEG C in a nitrogen environment, pumping filtering while hot after reaction Filter cake is taken, filter cake is cleaned with methanol obtains white powder for several times, and filter cake is placed in 80 DEG C of vacuum drying ovens dryings, yield after pumping filtering About 85%.
Fig. 1 is monomer (1)1H NMR figure, it is possible to find CH3(a) in 1.6ppm, CH3(b) in 2.0ppm.The feature of Ar-OH Peak 9.4ppm.In addition,3138.0ppm signal can be seen in P NMR, can confirm that structure is correct.
The synthesis (IIa) of 2 phosphorus system methyl polyoxy dimethylbenzene of embodiment
Take CuCl 0.079g (0.8mmole), DMAP 0.095g (0.78mmole) with N- crassitude (1- Methyl-2-pyrrolidone, NMP) 25mL as solvent, be passed through at room temperature oxygen reaction after ten minutes be added monomer (1) 0.739g(1.62mmole)、2,6- xylenol0.979g (8.01mmole) reacts 4 hours for 40 DEG C under oxygen atmosphere, Filtrate is filtered to take in pumping after reaction, and filtrate with methanol precipitation and is cleaned for several times, after pumping filtering, filter cake vacuum drying oven Vacuum drying obtains khaki product IIa at 80 DEG C.The LC/MS that Fig. 2 is IIa schemes.It can be observed that 697.5m/z is n=1 Molecular weight.The molecular structure of n=2 to n=11 is also found in Fig. 2.
The synthesis of embodiment 3 formula (IIc) phosphorus system methyl polyoxy dimethylbenzene
Bis-phenol 4.0g (8.76mmol), the SABIC SA904g (8.76x 3.8mmol), benzoyl peroxide first of Example 1 Acyl (benzoyl peroxide) 0.404g (1/40mol of SA90), using NMP as solvent, 130 DEG C of reactions in a nitrogen environment 12 hours, reaction terminated to be precipitated and cleaned for several times with methanol/water, obtains coffee-like powder, filter cake is placed in 70 DEG C after pumping filtering Vacuum drying oven is dry, yield about 90%.According to1H NMR figure, it is possible to find in 6-8.5ppm it can be seen that two stretch benzene phosphinate The hydrogen signal of biphenyl in (biphenylene phosphinate) structure.GPC data analysis (is to purge with tetrahydrofuran (THF) Liquid, using polystyrene as standard items), it is possible to find the number average molecular weight and weight average molecular weight of SA-90 is respectively 1508 Hes 3978 grams/mole, and the number average molecular weight of formula (IIIc) and weight average molecular weight are respectively 787 and 2625 grams/mole. Again after rearrangement reaction, average molecular weight has the tendency that reduction, is conducive to dissolubility and impregnation for display.
The phosphorus system ethyl polyoxy dimethylbenzene of synthesis formula (IIIc-M) metering system (MMA) base of embodiment 4
Synthesized 1.0 grams of the formula (IIc) out of Example 3, DMAP 0.01g (2mol%of metering system acid anhydride) are with diformazan Yl acetamide (DMAc) 15mL reacts at room temperature 1 hour under ar gas environment as solvent, is subsequently added into metering system acid anhydride 0.665g It is warming up to 45 DEG C after reacting 3 hours at room temperature, reacts 24 hours, reaction terminates to be saturated NaHCO3(washing off acid) is precipitated in aqueous solution And wash with water for several times, filter cake is placed in 50 DEG C of vacuum drying ovens dryings, yield about 85% after pumping filtering.It is red by Fourier transform It can be seen that in-O-C=O- characteristic peak 1735cm in the analysis of external spectrum (FTIR) data-1With-C=C- characteristic peak in 1649cm-1
Wherein m and n respectively indicates 0 to 30 integer, preferably 0 to 20 integer independently of one another.
Via formula (IIIc-M) oligomer1H NMR figure can find there is acrylic group in 2.0,5.9 and 6.3ppm (acrylate) characteristic peak, display structure are correct.
The phosphorus system ethyl polyoxy dimethylbenzene of synthesis formula (IIIc-A) allylation of embodiment 5
Synthesized 1.0 grams of the formula (IIc) out of Example 3,0.23 gram of allyl bromide, bromoallylene, K2CO30.1 gram is worked as with DMAc 15mL Make solvent, be warming up to 65 DEG C in a nitrogen environment, react 24 hours, be cooled to room temperature after reaction, filter salt, collects filter Filtrate is poured into the full conjunction saline solution of ice, takes filter cake after pumping filtering by liquid, is put into 60 DEG C of vacuum drying ovens drying, it is micro- to obtain khaki Cemented body, yield 70%.By can see in the analysis of FTIR data in 915cm-1Acrylic characteristic peak.
Wherein m and n respectively indicates 0 to 30 integer, preferably 0 to 20 integer independently of one another.
Via formula (IIIc-A) oligomer1H NMR figure can find there is allyl in 4.8,5.3 and 6.1ppm (allylic) characteristic peak, display structure are correct.
The phosphorus system ethyl polyoxy dimethylbenzene of synthesis formula (IIIc-VB) vinyl phenyl of embodiment 6
Synthesized 1.0 grams of formula (IIc) oligomer out of Example 3,1.4 grams of 4- 1-chloro-4-methyl-benzene, K2CO30.1 gram with DMAc 15mL is reacted 12 hours for 120 DEG C in a nitrogen environment as solvent, is precipitated and is cleaned for several times with ethyl alcohol after reaction Khaki powder is obtained, filter cake is placed in 80 DEG C of vacuum drying ovens dryings, yield about 88% after pumping filtering.
Wherein m and n respectively indicates 0 to 30 integer, preferably 0 to 20 integer independently of one another.
Fig. 3 is formula (IIc) oligomer and formula (IIIc-VB) oligomer1H NMR figure.It can discoverable type (IIc) widow by Fig. 3 The disappearance of polymers OH functional group signal (4.3-4.6ppm), with formula (IIIc-VB) oligomer end 4- 1-chloro-4-methyl-benzene knot Structure 5.2 (=CH, be denoted as 1), 5.8 (=CH1, be denoted as 1 ') and 4.8 (CH2, it is denoted as 3) number characteristic peak.
The preparation of the phosphorus system ethyl polyoxy dimethylbenzene thermosetting compound of 7 formula of embodiment (IIIc-M) metering system (MMA) base With analysis
It is the molten of 30wt% that 1.0 grams of formula (IIIc-M) oligomer of Example 4, which prepare solid content as solvent with NMP, Liquid after being completely dissolved, and is added three-level butyl peroxy isopropylbenzene (t-butyl cumyl peroxide, TBCP) (additive amount is 1wt%) progress radical reaction can be obtained film and be placed in circulation baking oven with the most of solvent of 110 DEG C of heating drying in 12 hours Afterwards, regeneration temperature to 180 DEG C, 200 DEG C, 220 DEG C it is two hours each.Glass substrate is finally dipped to phenol film in water to be detached from, and is surveyed Its fixed related thermal properties.Using the glass transition temperature of thermosetting compound measured by Dynamic Mechanical Analyzer (DMA) in Fig. 4, Glass transition temperature is 277 DEG C.The part dielectric constant (Dk) measures n when wavelength is 633nm by ellipsograph (Refractive index) is 1.55, utilizes Dk=1.1n2Obtaining formula (IIIc-M) thermosetting compound is 2.64 (U), shows its tool There is rather low dielectric property.
The preparation and analysis of the phosphorus system ethyl polyoxy dimethylbenzene thermosetting compound of 8 formula of embodiment (IIIc-A) allylation
It is the molten of 30wt% that 1.0 grams of formula (IIIc-A) oligomer of Example 6, which prepare solid content as solvent with NMP, Liquid after being completely dissolved, and is added three-level butyl peroxy isopropylbenzene (t-butyl cumyl peroxide, TBCP) (additive amount is 1wt%) progress radical reaction can be obtained film and be placed in circulation baking oven with the most of solvent of 110 DEG C of heating drying in 12 hours Afterwards, regeneration temperature to 180 DEG C, 200 DEG C, 220 DEG C it is two hours each.Glass substrate is finally dipped to phenol film in water to be detached from, and is surveyed Its fixed related thermal properties.Glass transition temperature using thermosetting compound measured by Dynamic Mechanical Analyzer (DMA) is 294 DEG C;It is situated between The part electric constant (Dk), measuring n (Refractive index) when wavelength is 633nm by ellipsograph is 1.59, utilizes Dk =1.1n2Obtaining formula (IIIc-A) thermosetting compound is 2.78 (U)
The preparation and analysis of the phosphorus system ethyl polyoxy dimethylbenzene thermosetting compound of 9 formula of embodiment (IIIc-VB) vinyl phenyl
It is the molten of 30wt% that 1.0 grams of formula (IIIc-VB) oligomer of Example 6, which prepare solid content as solvent with NMP, Liquid after being completely dissolved, and is added three-level butyl peroxy isopropylbenzene (t-butyl cumyl peroxide, TBCP) (additive amount is 1wt%) progress radical reaction can be obtained film and be placed in circulation baking oven with the most of solvent of 110 DEG C of heating drying in 12 hours Afterwards, regeneration temperature to 180 DEG C, 200 DEG C, 220 DEG C it is two hours each.Glass substrate is finally dipped to phenol film in water to be detached from, and is surveyed Its fixed related thermal properties.Using the glass transition temperature of thermosetting compound measured by Dynamic Mechanical Analyzer (DMA) in Fig. 4, Glass transition temperature is 314 DEG C;In addition, the glass transition temperature of thermosetting compound is measured in Fig. 5 by thermal analyzer (TMA), Glass transition temperature is 302 DEG C, shows that material possesses excellent thermal property.The part dielectric constant (Dk), exists by ellipsograph Wavelength measures n (Refractive index) when being 633nm be 1.50, utilizes Dk=1.1n2Obtain formula (IIIc-VB) thermosetting compound For 2.48 (U), it is shown with rather low dielectric property, referring to Fig. 6.

Claims (24)

1. a kind of poly- (2,6 dimethyl phenylate) oligomer of phosphorus system, it includes the structures of such as following formula (2):
Wherein group out of the ordinary has following meanings:
P1Expression be not present or
P2It indicates
R1、R2、R3H or straight chain or branched-chain alkyl with 1 to 6 C atom are respectively indicated independently of one another;
R4Indicate H or the alkenyl with 1 to 10 C atom and comprising 0 to 3 oxygen atom, aryl or combinations thereof;
M, n respectively indicates 0 to 30 integer independently of one another.
2. oligomer as claimed in claim 1, formula described in wherein at least one (2) oligomer system is with such as formula (3) phosphorus system poly- (2,6 two Methyl phenylate) expression of bis-phenol oligomer,
Wherein P1、P2、R1、R2、R3, m and n system it is as defined in claim 1.
3. oligomer as claimed in claim 2, formula described in wherein at least one (3) oligomer system is with such as formula (IIa) or formula (IIc) phosphorus It is that poly- (2,6 dimethyl phenylate) bis-phenol oligomer indicates,
Wherein R1、R2、R3, m and n system it is as defined in claim 1.
4. oligomer as claimed in claim 3, (IIc) the oligomer system of formula described in wherein at least one is poly- with such as formula (IIc') phosphorus system The expression of (2,6 dimethyl phenylate) bis-phenol oligomer,
Wherein R1、R3, m and n system it is as defined in claim 1.
5. oligomer as claimed in claim 1, wherein formula (2) oligomer system described in described at least one contains insatiable hunger with such as formula (4) It is indicated with the double bond phosphorus system of base poly- (2,6 dimethyl phenylate) oligomer,
Wherein P1、P2、R1、R2、R3, m and n system it is as defined in claim 1;And
R’4Indicate the alkenyl with 1 to 10 C atom and comprising 0 to 3 oxygen atom, aryl or combinations thereof.
6. oligomer as claimed in claim 5, wherein R '4For
7. oligomer as claimed in claim 5, formula described in wherein at least one (4) oligomer system is with such as formula (IIIa) or formula (IIIc) Poly- (2,6 dimethyl phenylate) the oligomer expression of double bond phosphorus system containing unsaturated group,
Wherein R1、R2、R3, m and n system as defined in claim 1, and
R4It indicates
8. oligomer as claimed in claim 7, (IIIc) the oligomer system of formula described in wherein at least one contains insatiable hunger with such as formula (IIIc') It is indicated with the double bond phosphorus system of base poly- (2,6 dimethyl phenylate) oligomer,
Wherein, R1、R3, m and n system as defined in claim 1, and
R4 is indicated
9. such as the oligomer of any one of claims 1 to 8, wherein the R1、R2Or R3H, CH are respectively indicated independently of one another3Or C2H5, and m and n respectively indicate 0 to 20 integer independently of one another.
10. oligomer as claimed in claim 5, formula described in wherein at least one (4) oligomer system is with such as formula (IIIc-M), formula (IIIc-A) or double bond phosphorus system poly- (2,6 dimethyl phenylate) oligomer of the formula (IIIc-VB) containing unsaturated group indicates,
Wherein m and n system is as defined in claim 1.
11. a kind of method for preparing formula as claimed in claim 2 (3) oligomer comprising make formula (I)
With 2,6 xylenols are reacted at CuCl and aminated compounds catalysis, poly- with formula (3) the phosphorus system for being made described (2,6 dimethyl phenylate) bis-phenol oligomer, wherein R1, R2And R3System is as defined in claim 1.
12. such as the method for claim 11, wherein the aminated compounds system includes dibutyl amine or 4- dimethylaminopyridine.
13. such as the method for claim 11 or 12, wherein obtained described formula (3) phosphorus system poly- (2,6 dimethyl phenylate) is few Polymers system includes at least one formula (IIa) as claimed in claim 3 or (IIc') oligomer as claimed in claim 4.
14. a kind of method for preparing formula as claimed in claim 2 (3) oligomer, including making formula (I):
Wherein, R1, R2And R3System is as defined in claim 1;
With poly- (the 2,6 dimethyl phenylate) oligomer of formula (5):
Wherein,
Y is indicated With
P, q respectively indicates 0 to 50 integer independently of one another;
Rearrangement reaction again is carried out under catalyzed, it is poly- with formula as claimed in claim 2 (3) the phosphorus system for being made described (2,6 dimethyl phenylate) bis-phenol oligomer.
15. such as the method for claim 14, wherein obtained described formula (3) bis-phenol phosphorus system poly- (2,6 dimethyl phenylate) is few Polymers system includes at least one described formula (IIc) oligomer as claimed in claim 3.
16. a kind of method for preparing formula as claimed in claim 5 (4) comprising by described formula (3) the phosphorus system as claimed in claim 2 Poly- (2,6 dimethyl phenylate) bis-phenol oligomer, under the catalysis of alkali catalyst, with methacrylic anhydride, allyl bromide, bromoallylene or 4- chloromethyl Styrene reaction, and double bond phosphorus system poly- (2, the 6 dimethyl phenylate) oligomer of the formula (4) containing unsaturated group is made.
17. such as the method for claim 16, wherein poly- (2,6 dimethyl phenylate) the bis-phenol oligomer of formula (3) phosphorus system includes Formula (IIc) as claimed in claim 3.
18. such as the method for claim 16 or 17, wherein the alkali catalyst system is selected from by potassium carbonate (K2CO3), sodium carbonate (Na2CO3), potassium hydroxide (KOH), sodium hydroxide (NaOH), sodium bicarbonate (NaHCO3) or combinations thereof composed by group.
19. such as the method for claim 16 or 17, wherein the obtained double bond phosphorus system of the formula (4) containing unsaturated group is poly- (2,6 dimethyl phenylate) oligomer system includes at least one formula (IIIa) as claimed in claim 7 or the oligomer of (IIIc).
20. such as the method for claim 19, wherein obtained double bond phosphorus system poly- (2,6 two of the formula (4) containing unsaturated group Methyl phenylate) oligomer include formula (IIIc-M) such as claim 10, formula (IIIc-A) or formula (IIIc-VB) oligomer.
21. a kind of thermosetting compound comprising carry out curing reaction with free radical starting agent by formula as claimed in claim 5 (4) and given birth to At thermosetting compound.
22. such as the thermosetting compound of claim 21, wherein formula as claimed in claim 5 (4) includes the formula such as claim 10 (IIIc-M), formula (IIIc-A) or formula (IIIc-VB).
23. such as the thermosetting compound of claim 21 or 22, wherein the free radical starting agent includes peroxide.
24. such as the thermosetting compound of claim 21 or 22, wherein the free radical starting agent includes three-level butyl peroxy isopropylbenzene (t-butyl cumyl peroxide,TBCP)。
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