CN106557246B - Three-dimensional input module - Google Patents
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- CN106557246B CN106557246B CN201510642335.8A CN201510642335A CN106557246B CN 106557246 B CN106557246 B CN 106557246B CN 201510642335 A CN201510642335 A CN 201510642335A CN 106557246 B CN106557246 B CN 106557246B
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Abstract
The invention provides a three-dimensional input module, which comprises a first touch electrode layer and a second touch electrode layer, wherein a plurality of first-direction touch electrodes are arranged on the first touch electrode layer, a plurality of second-direction touch electrodes are arranged on the second touch electrode layer, the three-dimensional input module further comprises a flexible composite pressure sensing layer, the composite pressure sensing layer comprises a flexible substrate layer, a first pressure sensing layer and a second pressure sensing layer are respectively arranged on two opposite sides of the flexible substrate layer, at least one first pressure sensing unit and at least one second pressure sensing unit are respectively arranged on the first pressure sensing layer and the second pressure sensing layer, the first pressure sensing unit and the second pressure sensing unit respond to touch operation to generate pressure signals, and the three-dimensional input module adopts a self-capacitance mode to detect the pressure signals. The three-dimensional input module provided by the invention has the advantages of high pressure detection sensitivity, good noise resistance and the like.
Description
[ field of technology ]
The present invention relates to the field of touch and pressure sensing, and in particular, to a three-dimensional input module.
[ background Art ]
With the development of technology, the touch assembly (touch Screen assembly) has been widely used in various consumer electronic devices, such as: portable electronic products such as smart phones, tablet computers, cameras, electronic books, MP3 players, etc., or display screens applied to operation control devices.
The existing electronic devices mostly adopt capacitive touch assemblies, and the capacitive touch assemblies work by utilizing current induction of a human body. A two-dimensional coordinate system (X, Y) is established by the surface of the touch surface, and a common capacitive touch assembly is provided with touch electrodes in the X direction and the Y direction in the plane. The coordinate positions of the touch points in the X direction and the Y direction are obtained through accurate calculation of the electric signal change at the touch points in the electronic equipment, namely, the two-dimensional positions of the touch points are determined, and then the operations of display, jump and the like of the electronic equipment are controlled.
In order to further enrich the functions of the touch assembly, some touch assemblies are currently provided with independent pressure sensors, each pressure sensor comprises a plurality of pressure sensing units, the pressure sensing units at the touch points sense a pressing force perpendicular to a touch surface (corresponding to the Z-axis direction) and generate certain deformation so as to change an electric signal of the pressure sensing unit, and the pressure of the pressure sensing unit can be determined by detecting the electric signal. By detecting the pressure value, the device functions matched with different pressure values can be designed, for example, the same touch point can be matched with multiple functions under different forces. I.e. we can enrich the design from the three-dimensional angle defined by the touch points (X, Y) and the pressure (Z).
However, at present, the electronic devices with pressure sensors generally use a single-layer pressure sensing unit, so that the pressure detection accuracy is poor, especially the anti-environmental interference capability is poor (i.e. the pressure sensing signal is weak and the environmental noise is excessive), especially the pressure detection accuracy is reduced due to the temperature effect signal generated by the pressure sensor under the change of temperature; also, a solution for compensating the pressure sensing signal and eliminating the environmental noise (i.e., noise particularly for temperature compensation, etc.) is needed in the industry.
[ invention ]
In order to solve the problem of low detection precision of the existing electronic equipment with the pressure sensor, the invention provides a three-dimensional input module with higher detection precision.
The invention provides a technical scheme for solving the technical problems: the three-dimensional input module comprises a first touch electrode layer and a second touch electrode layer, wherein a plurality of first-direction touch electrodes are arranged on the first touch electrode layer, a plurality of second-direction touch electrodes are arranged on the second touch electrode layer, the three-dimensional input module adopts a mutual capacitance mode to detect and respond to touch operation to generate touch signals, the three-dimensional input module further comprises a flexible composite pressure sensing layer, the composite pressure sensing layer comprises a flexible substrate layer, a first pressure sensing layer and a second pressure sensing layer are respectively arranged on two opposite sides of the flexible substrate layer, at least one first pressure sensing unit and at least one second pressure sensing unit are respectively arranged on the first pressure sensing layer and the second pressure sensing layer, the first pressure sensing unit and the second pressure sensing unit respond to touch operation to generate pressure signals, and the three-dimensional input module adopts a self-capacitance mode to detect the pressure signals.
Preferably, in the pressure signal detection process, the second pressure sensing unit is a temperature compensation target of the first pressure sensing unit.
Preferably, the three-dimensional input module further includes a three-dimensional signal processing circuit, the first pressure sensing unit is linearly related to the heat dryness signals generated by the corresponding second pressure sensing units, and the heat dryness signals of the first pressure sensing unit and the second pressure sensing unit are mutually counteracted by an operation circuit arranged in the three-dimensional signal processing circuit so as to eliminate pressure signal errors.
Preferably, the operation circuit is one or a combination of an addition and subtraction operation circuit, a proportional operation circuit and a calculus operation circuit.
Preferably, in the pressure signal superposition mode, noise signals of the first pressure sensing layer and the second pressure sensing layer are counteracted, and the pressure signals are doubly enhanced.
Preferably, the first pressure sensing layer is a positive temperature coefficient pressure sensing layer made of a pressure sensing material with a positive temperature coefficient, and the second pressure sensing layer is a negative temperature coefficient pressure sensing layer made of a pressure sensing material with a negative temperature coefficient.
Preferably, the absolute value of positive temperature coefficient of the positive temperature coefficient pressure sensing layer is equal to or in linear relation with the absolute value of negative temperature coefficient of the negative temperature coefficient pressure sensing layer.
Preferably, the materials of the second pressure sensing units as the temperature compensation objects of the first pressure sensing units are the same, and the shapes, the positions and the sizes of the second pressure sensing units correspond to each other.
Preferably, the first pressure sensing layer and/or the second pressure sensing layer is made of piezoelectric material, and is selected from one or more of single crystal, thin film, ceramic or polymer piezoelectric materials.
Preferably, the three-dimensional input module further comprises at least one heat insulating layer, and the at least one heat insulating layer is arranged on one side of the composite pressure sensing layer.
Compared with the prior art, the three-dimensional input module provided by the invention has the following advantages:
the three-dimensional input module can detect the position of the touch point and the pressure value of the touch point, and is provided with a composite pressure sensing layer which can be used for detecting the pressing force value at the touch point. The composite pressure sensing layer at least comprises a flexible substrate layer, the flexible substrate layer is made of flexible materials, and can sensitively sense pressure generated by a touch point to deform, so that the pressure detection precision of the three-dimensional input module is improved to a certain extent.
The two sides of the flexible substrate layer are provided with a first pressure sensing layer and a second pressure sensing layer, the size positions of the first pressure sensing unit and the second pressure sensing unit which are respectively positioned on the first pressure sensing layer and the second pressure sensing layer are in one-to-one correspondence, when the first pressure sensing unit and the second pressure sensing unit are reference objects for temperature compensation, due to the correspondence of the size positions, the noise signals caused by temperature and other interference are consistent, and other noise signals generated in the pressure signal detection process can be eliminated better after the processing of an operation circuit and the like. Improving the pressure detection precision; especially when the first pressure sensing layer is made of the pressure sensing material with positive temperature coefficient and the second pressure sensing layer is made of the pressure sensing material with negative temperature coefficient, the temperature compensation and the pressure signal superposition effects can be achieved. The whole has the advantages of flexible design, reasonable structure and the like.
[ description of the drawings ]
Fig. 1 is a schematic view of a layered structure of a three-dimensional input module according to a first embodiment of the present invention.
Fig. 2A is a schematic plan view of a first touch electrode layer of a three-dimensional input module according to a first embodiment of the invention.
Fig. 2B is a schematic diagram illustrating a superposition effect of the first touch electrode layer and the second touch electrode layer of the three-dimensional input module according to the first embodiment of the present invention.
Fig. 3A is a schematic plan view of a first pressure sensing layer of a three-dimensional input module according to a first embodiment of the present invention.
FIG. 3B is a schematic cross-sectional view of the composite pressure sensitive layer of the three-dimensional input module of the first embodiment of the present invention at IV-IV in FIG. 3A.
FIG. 4 is a schematic diagram of a deformation structure of a composite pressure-sensitive layer of a three-dimensional input module according to a first embodiment of the present invention.
Fig. 5 is a schematic view of a layered structure of a three-dimensional input module according to a second embodiment of the present invention.
Fig. 6A-6B are schematic structural diagrams of a modified embodiment of a pressure sensing unit in a three-dimensional input module according to a third embodiment of the present invention.
[ detailed description ] of the invention
For the purpose of making the technical solution and advantages of the present invention more apparent, the present invention will be further described in detail below with reference to the accompanying drawings and examples of implementation. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.
Referring to fig. 1, the three-dimensional input module 10 according to the first embodiment of the present invention includes, in order from top to bottom (in the present invention, the terms of top, bottom, left, right, top, bottom, etc. are only used to define the relative positions on the designated view, and not the absolute positions), an upper substrate 11, a bonding layer 12, a first touch electrode layer 131, a first insulating layer 14, a composite pressure-sensitive layer 10s, a second insulating layer 14', a second touch electrode layer 132, and a three-dimensional signal processing circuit 18.
The first insulating layer 14 and the second insulating layer 14' serve as the carrier layers of the first touch electrode layer 131 and the second touch electrode layer 132, respectively, and serve as insulation between the touch electrode layer 13 (including the first touch electrode layer 131 and the second touch electrode layer 132) and the composite pressure-sensitive layer 10 s. The mutual capacitance effect between the first touch electrode layer 131 and the second touch electrode layer 132 caused by the touch operation can be used for detecting two-dimensional positions (i.e. X and Y directions), and the composite pressure sensing layer 10s is used for detecting a pressure value in another dimension (i.e. Z direction). The touch electrode layer 13 and the composite pressure sensing layer 10s are electrically connected to the three-dimensional signal processing circuit 18 through conductive wires (not shown).
The upper substrate 11 may be considered as a touch cover of an electronic device, and the cover includes a touch operation surface for performing a touch operation by a finger or a stylus pen, and a component mounting surface for mounting a touch electrode component or a display module. The upper substrate 11 may be made of PEEK (polyethylenteroethyl polyether ether ketone), PI (Polyimide), PET (polyethylene terephthalate), PC (polycarbonate), PES (polyethylene succinate), PMMA (polymethyl methacrylate), or a composite of any two thereof, but not limited thereto, soft glass or a thinned glass cover plate may be used.
The adhesive layer 12 may be OCA (optically clear adhesive, optical Clear Adhesive) or LOCA (liquid optically clear adhesive, liquid Optical Clear Adhesive).
The three-dimensional signal processing circuit 18 is disposed below the second touch electrode layer 132, and its position is not limited, and it may also be disposed above the second touch electrode layer 132 or at other positions such as one side thereof.
The material of the insulating layer (the first insulating layer 14 and the second insulating layer 14') is preferably SiO2 (silicon dioxide) or Si3N4 (silicon nitride), and in other embodiments, a flexible substrate may be selected, and further preferably a transparent flexible material, which may also be a rigid substrate, such as ultra-thin glass, sapphire glass, PI (polyimide), PC (polycarbonate), polyethersulfone (PES), polymethyl methacrylate (PMMA), acryl, polyacrylonitrile-butadiene-styrene (ABS), polyamide (PA), polybenzimidazole Polybutene (PB), polybutylene terephthalate (PBT), polyester (PE), polyetheretherketone (PEEK), polyetherimide (PEI), polyetherimide, polyethylene (PE), polyethylene terephthalate (PET), polystyrene (PS), polytetrafluoroethylene (PTFE), polyurethane (PU), polyvinyl chloride (PVC) L-type polylactic acid (PLLA), and the like, without limitation.
Referring to fig. 2A and 2B, the first touch electrode layer 131 includes a plurality of first direction touch electrodes 134 arranged in parallel and equidistant along a first direction (X direction), and the second touch electrode layer 132 includes a plurality of second direction touch electrodes 135 arranged in parallel and equidistant along a second direction (Y direction), wherein the X direction is orthogonal to the Y direction. The first direction touch electrode 134 and the second direction touch electrode 135 define an array arrangement of a plurality of touch units, and when the touch units detect a touch operation from the upper substrate 11, corresponding electrical signals are generated and transmitted to the three-dimensional signal processing circuit 18.
In fig. 2A and 2B, 4 first direction touch electrodes 134 and 4 second direction touch electrodes 135 are respectively illustrated as examples, and in practice, the number is not limited. Optimally, the first direction touch electrode 134 is complementary to the second direction touch electrode 135. In this embodiment, the X direction is orthogonal to the Y direction, but the included angle between the X and Y directions is not limited. In the illustration, only the diamond-shaped touch electrodes (the first direction touch electrode 134 and the second direction touch electrode 135) are taken as an example, and in practice, the shape of the touch electrodes may be triangle, circle, rectangle, wave, etc. which are connected in series, and the shape is not limited. The touch electrode material may be indium-tin oxide (ITO), carbon nanotubes, graphene, nano silver wires, metal grids, and the like.
As shown in fig. 1, the composite pressure-sensitive layer 10s includes, from top to bottom, at least a first pressure-sensitive layer 15, a flexible substrate layer 16 and a second pressure-sensitive layer 17, where the first pressure-sensitive layer 15 and the second pressure-sensitive layer 17 are disposed on two sides of the flexible substrate layer 16 and use the flexible substrate layer 16 as a carrier layer.
Referring to fig. 3A, the first pressure sensing layer 15 is provided with at least one first pressure sensing unit 151, and fig. 3A only illustrates the first pressure sensing unit 151 in an array of 5 columns×8 rows as an example, and the number and the array design are not limited, depending on the specific requirements. The first pressure sensing unit 151 may be rectangular, and may be one or more of irregular shapes such as other polygons, circles, trapezoids, etc.
It should be noted that, for example, each first pressure sensing unit 151 on the first pressure sensing layer 15 may be connected to the integrated circuit through two conductive wires to form a closed electrical loop, so that each first pressure sensing unit 151 performs self-capacitance pressure sensing detection, and the plurality of conductive wires on the first pressure sensing layer 15 may firstly conduct signal derivation through the corresponding flexible circuit board (not shown) of the layer; similarly, each second pressure sensing unit 171 of the second pressure sensing layer 17 may also form a closed electrical loop for self-capacitance pressure sensing detection, and signal derivation is performed through a flexible circuit board (not shown) corresponding to the layer.
Referring to fig. 3B, fig. 3B is a sectional view taken along the line iv-iv in fig. 3A, the first pressure sensing layer 15 and the second pressure sensing layer 17 on the upper and lower surfaces of the flexible substrate layer 16 are corresponding in shape, size and position to each other, and the second pressure sensing units 171 are disposed on the second pressure sensing layer 17, and the positions between the first pressure sensing units 151 and the second pressure sensing units 171 are in one-to-one correspondence. The first and second pressure sensing units 151 and 171 are preferably the same material. When the touch operator performs a touch operation on the upper surface of the upper substrate 11, at least one first pressure sensing unit 151 or at least one first pressure sensing unit 151 and at least one second pressure sensing unit 171 corresponding to the touch point will receive pressure at the same time.
Referring to fig. 4, as a modified embodiment of the first and second pressure-sensitive layers 15, 17: the first pressure sensing layer 15 'is made of a plurality of PVDF (Polyvinylidene Fluoride polyvinylidene fluoride) piezoelectric strips 151' (corresponding to the first pressure sensing unit) arranged along a first direction (for example, the X direction), and the second pressure sensing layer 17 'is made of a plurality of PVDF piezoelectric strips 171' (corresponding to the second pressure sensing unit) arranged along a second direction (for example, the Y direction); in fact, the first pressure sensing cells on the first pressure sensing layer 15 'and the second pressure sensing cells on the second pressure sensing layer 17' may be alternatively staggered or complementarily arranged, which is not limited.
The first pressure sensing unit 151 and/or the second pressure sensing unit 171 are piezoelectric materials that are deformed, deflected or sheared by pressure generated by touch operation, so as to change at least one electrical property, and are selected from one or more combinations of piezoelectric materials such as single crystals, films, ceramics or polymers. The piezoelectric material may be nano Indium Tin Oxide (ITO), tin antimony Oxide (Antimony Doped Tin Oxide, ATO), znO (zinc Oxide), titanium zirconium Oxide, indium Zinc Oxide (IZO), zinc aluminum Oxide (Aluminum Zinc Oxide, AZO), or the like, and one or more materials having piezoelectric or piezoresistive properties, such as quartz, barium titanate or lead zirconate titanate (PZT), piezoelectric ceramics, or the like. It may also be particles of Indium Tin Oxide (ITO), antimony doped tin oxide (ATO), aluminum doped zinc oxide (AZO) or other transparent conductive oxide dispersed in an insulating, transparent, deformable matrix, which may comprise a polymeric material, such as any of a copolymer or terpolymer, preferably a transparent piezoelectric material having a light transmittance above 70% (optimal light transmittance above 90%).
The flexible substrate layer 16 is a flexible material, preferably having a thickness of less than 500 μm, more preferably having a thickness of less than 200 μm. The flexible substrate layer 16 may be a polymer film such as a film comprising polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polymethyl methacrylate (PMMA), or polycarbonate, a thin glass sheet (e.g., 100 μm thick or less), or soda lime silica glass. Further preferably, the transparent flexible material has a light transmittance of 80% or more (preferably, a light transmittance of 90% or more).
The three-dimensional signal processing circuit 18 is integrated on a chip, and the three-dimensional signal processing circuit 18 has the functions of processing pressure signals and touch signals. The touch signal and the pressure signal of the touch unit and the pressure sensing unit (the first pressure sensing unit 151 and the second pressure sensing unit 171) are detected in various manners, and in the present invention, the touch signal is detected by a mutual capacitance manner, and the pressure signal is detected by a self-capacitance manner.
The mutual capacitance mode detection touch signal specifically comprises the following steps: the touch unit is defined by a first direction touch electrode 131 and a second direction touch electrode 132, and has a capacitive effect, that is, a capacitance is formed between the first direction touch electrode 131 and the second direction touch electrode 132, the first direction touch electrode 131 corresponds to an upper plate of the capacitance, the second direction touch electrode 132 corresponds to a lower plate of the capacitance, and when a user's finger or a stylus pen performs a touch operation on the upper substrate 11, the coupling (i.e., mutual capacitance effect) between the upper plate and the lower plate of the touch unit of the touch point is affected, so as to change the capacitance between the two plates. The change of the capacitance forms a touch signal which is transmitted to the three-dimensional signal processing circuit 18, and the three-dimensional signal processing circuit 18 confirms the position of the touch point after signal processing.
The self-capacitance mode detection pressure signal specifically comprises: each pressure sensing unit at least comprises two electrodes, the pressure signals generated by the pressure sensing units due to the pressing action can be measured through the two electrodes, the two electrodes are a pressure driving electrode and a pressure receiving electrode (both are not shown, namely, the two electrodes construct the input electrode and the output electrode of each pressure sensing unit as complete loops), the pressure driving electrodes receive driving pulses, namely, the pressure driving electrodes send out excitation signals, the pressure receiving electrodes receive the pressure signals and transmit the pressure signals to the three-dimensional signal processing circuit 18 through lines, and the three-dimensional signal processing circuit 18 processes the pressure signals to determine the pressing force values.
The piezoelectric material is selected as the pressure sensing layers (the first pressure sensing layer 15 and the second pressure sensing layer 17), and the piezoelectric characteristics of the pressure sensing layers are different according to the different environments. Taking the first pressure sensing unit 151 as an example, when the first pressure sensing unit 151 is pressed at normal temperature, the first pressure sensing unit 151 should theoretically generate a pressure signal with a magnitude D, but due to the influence of temperature change, the pressure signal d=d+s actually generated by the first pressure sensing unit 151 is a thermal dryness signal brought about by temperature to the first pressure sensing unit 151, and the thermal dryness signal s changes due to the difference of temperature, which causes that the actually detected pressure signal and the actual pressure signal generated by the first pressure sensing unit 151 only by pressure have errors, which is undesirable, when the first pressure sensing unit 151 on the first pressure sensing layer 15 has a thermal expansion coefficient substantially the same as or similar to that of the corresponding second pressure sensing unit 171 on the second pressure sensing layer 17, respectively, the difference of the pressure signals brought about by the temperature is equal or similar (in an approximation amount increase or a linear correlation increase or decrease). Therefore, the first pressure sensing unit 151 on the first pressure sensing layer 15 and the corresponding second pressure sensing unit 171 on the second pressure sensing layer 17 can be used as the reference object for temperature compensation to eliminate the pressure signal detection error caused by the heat dryness signal.
As a standard embodiment for eliminating heat-up signals: the heat signals generated by the first pressure sensing unit 151 and the corresponding second pressure sensing unit 171 are the same or similar, and the heat signals of the two units are cancelled by an arithmetic circuit (a differential circuit, an arithmetic circuit or a combination of arithmetic circuits, such as an addition and subtraction arithmetic circuit, a proportional arithmetic circuit, a calculus arithmetic circuit, etc.) disposed in the three-dimensional signal processing circuit 18 to eliminate the pressure signal error. Any signal processing method for canceling the heat signal by using the same heat signal received by the first pressure sensing unit 151 and the second pressure sensing unit 171 falls within the design concept of temperature compensation in the present embodiment. In the actual detection process of the pressure signal, not only the heat-dry signal is generated, but also other interference signals are generated, and the heat-dry signal is taken as an example for illustration in the invention.
As a preferred option, the first pressure sensing layer 15 and the second pressure sensing layer 17 are made of different materials, specifically, the first pressure sensing layer 15 is a positive temperature coefficient pressure sensing layer made of a positive temperature coefficient pressure sensing material, the second pressure sensing layer 17 is a negative temperature coefficient pressure sensing layer made of a negative temperature coefficient pressure sensing material, and the positive temperature coefficient absolute value of the positive temperature coefficient pressure sensing layer and the negative temperature coefficient absolute value of the negative temperature coefficient pressure sensing layer are in a linear relationship (including equal). The noise signals generated by the positive temperature coefficient pressure sensing layer and the negative temperature coefficient pressure sensing layer under the same environmental influence are the same or proportional, but the polarities thereof are opposite, so that in the pressure signal superposition mode, the noise signals of the first pressure sensing layer 15 and the second pressure sensing layer 17 can be directly counteracted by a summation operation circuit (the situation that the positive temperature coefficient is the same as the negative temperature coefficient) or by a combination of the proportional operation circuit and the summation operation, etc. (i.e. for example, the pressure signal d1=d+s actually generated by the first pressure sensing unit 151, and the pressure signal d2=d-s actually generated by the second pressure sensing unit 171 are at least doubly enhanced in the pressure signal superposition mode. The matching of the positive temperature coefficient pressure sensing material and the negative temperature coefficient pressure sensing material can achieve the noise reduction effect caused by temperature compensation and the pressure signal enhancement effect caused by pressure signal superposition.
Compared with the prior art, the three-dimensional input module 10 provided by the invention has at least the following advantages:
1. the three-dimensional input module 10 of the present invention can detect not only the position of a touch point but also the pressure value of the touch point, and the three-dimensional input module 10 is provided with a composite pressure sensing layer 10s which can be used for detecting the pressing force value at the touch point. The composite pressure sensing layer 10s at least comprises a flexible substrate layer 16, and the flexible substrate layer 16 is made of flexible materials, and can sensitively sense the pressure generated by the touch point to deform, so that the pressure detection accuracy of the three-dimensional input module 10 is improved to a certain extent. The first pressure sensing layer 15 and the second pressure sensing layer 17 are disposed on two sides of the flexible substrate layer 16, the first pressure sensing unit 151 and the second pressure sensing unit 171 respectively located on the first pressure sensing layer 15 and the second pressure sensing layer 17 are in one-to-one correspondence with each other in size and position, and when the first pressure sensing unit 151 and the second pressure sensing unit 171 are reference objects for temperature compensation, due to the correspondence between the size and position, the noise signals caused by temperature and other interference are consistent, and other noise signals generated in the pressure signal detection process can be eliminated well after being processed by an arithmetic circuit and the like. Improving the pressure detection precision; especially, when the first pressure sensing layer 15 is made of a pressure sensing material with a positive temperature coefficient and the second pressure sensing layer 17 is made of a pressure sensing material with a negative temperature coefficient, the temperature compensation and the pressure signal superposition effects can be achieved. The whole has the advantages of flexible design, reasonable structure and the like.
2. In the present invention, the touch point position is detected by adopting a mutual capacitance mode, the type of the touch signal generated in response to the pressing action is a capacitance signal, the first pressure sensing layer 15 and the second pressure sensing layer 17 are made of piezoelectric materials, the type of the pressure signal generated in response to the pressing action is also a capacitance signal, the type of the touch signal and the type of the response signal of the pressure signal are the same (namely, both the touch signal and the pressure signal are capacitance signals), and the detection and the processing of the signals are facilitated. Especially, in the signal processing, since the two types of signals are the same, the manufacturer of the three-dimensional input module 10 does not need to design two independent hardware devices to process the pressure signal and the touch signal, and the three-dimensional signal processing circuit 18 integrated on a chip can be used to process the touch signal and the pressure signal (i.e. the capacitive signal detection such as mutual capacitance measurement during supporting touch and self capacitance measurement during pressure sensing). This increases the integration of the three-dimensional input module 10 and reduces the cost of hardware devices. The signal detection mode is equally applicable to other embodiments of the present invention.
Referring to fig. 5, the three-dimensional input module 50 of the second embodiment of the present invention sequentially includes, from top to bottom, an upper substrate 511, a first touch electrode layer 512, a substrate layer 513, a second touch electrode layer 514, a bonding layer 52, a composite pressure-sensitive layer 50s and a three-dimensional signal processing circuit 58, wherein the substrate layer 513 is made of transparent insulating material, and the upper and lower surfaces thereof are respectively used as the bearing layers of the first touch electrode layer 512 and the second touch electrode layer 514. The composite pressure sensing layer 50s is consistent with the structure and the pressure signal detection principle of the composite pressure sensing layer 10s in the first embodiment, and includes, from top to bottom, a first pressure sensing layer 55, a flexible substrate layer 56 and a second pressure sensing layer 57, where the first pressure sensing layer 55 and the second pressure sensing layer 57 are disposed on two sides of the flexible substrate layer 56 and use the flexible substrate layer 56 as a carrier layer. This embodiment differs from the first implementation only in that: the composite pressure-sensing layer 50s is not embedded between the first touch electrode layer 512 and the second touch electrode layer 514, but is positioned on the same side of the first touch electrode layer 512 and the second touch electrode layer 514. Namely, the first touch electrode layer 512 and the second touch electrode layer 514 are located between the upper substrate 511 and the composite pressure-sensitive layer 50 s.
The composite pressure sensing layer 50s of the three-dimensional input module 50 proposed in the present embodiment is located at one side of the touch electrode layer (including the first touch electrode layer 512 and the second touch electrode layer 514), and the touch electrode layer and the composite pressure sensing layer 10s are relatively independent, so that they can be manufactured by different manufacturers separately, and then the three-dimensional input module 50 with touch detection and pressure detection can be manufactured through simple lamination, and the mutual independence in manufacturing can reduce the reject ratio of the final product to a certain extent. The external hanging structure enables the maintenance of the three-dimensional input module 50 to be possible, and when a part of the touch electrode layer or the composite pressure sensing layer 50s is in a problem, the replacement operation of the corresponding parts can be conveniently performed. In order to meet the market demand, the conventional touch panel with single function is eliminated, but the three-dimensional input module 50 provided by the invention is otherwise adopted, and a composite pressure sensing layer 50s is conveniently hung on one side of the conventional touch panel by means of lamination and other operations to realize the upgrading of the conventional touch panel, so that the energy waste caused by eliminating the conventional touch panel which is manufactured is avoided, and the upgrading can be realized by means of the externally hung design no matter what structure the conventional touch panel has.
The first touch electrode layer 512 and the second touch electrode layer 514 may be disposed on opposite sides of the substrate layer 513, i.e., e.g., a Glass film (GF 2) structure, and may also be disposed on different substrate layers, i.e., e.g., a Glass film (GFF), or the first touch electrode layer 512 and the second touch electrode layer 514 may be interlaced, i.e., e.g., a bridging touch (SITO) structure, or may not overlap each other, i.e., may be disposed in the same plane, i.e., in the form of a single-layer multi-touch (non-cross type).
Referring to fig. 6A, a three-dimensional input module (not numbered) according to a third embodiment of the present invention is different from the three-dimensional input module 10 according to the first embodiment only in that: the first pressure-sensing unit 751a is different from the first pressure-sensing unit 151 (refer to fig. 3A) in the first embodiment, specifically, the first pressure-sensing unit 751a is square-wave-shaped, and since the edge portion of the pressure-sensing material is more easily sensed to be deformed by pressure at the time of pressing, which results in the occurrence of a pressure signal, the first pressure-sensing unit 751a is provided in a square wave shape, and since the size of the edge portion of the square-wave-shaped first pressure-sensing unit 751a is significantly increased, the first pressure-sensing unit 751a has a better pressure detection sensitivity. The first pressure sensing unit 751a may also have a shape of a broken line (as in the case of the first pressure sensing unit 751B of fig. 6B), a convoluted shape, or other irregular shape. The first pressure sensing unit 751a and/or the second pressure sensing unit are preferably 1 square centimeter or less in size so as to obtain a good pressure detection density.
More specifically, when the first pressure sensing unit 751a employs a directional pressure-sensitive material having directional characteristics: when a strain reaction occurs in one or more specific directions (effective strain reaction, for example, a sliding pressure action in a specific direction is detected), the corresponding pressure signal can be detected, whereas when a strain reaction is difficult to occur in a non-specific direction or a strain reaction occurs (ineffective strain reaction), the occurrence of the pressure signal can be hardly detected or the probability that the pressure signal can be detected is low. If the directional pressure-sensitive material in the Y direction can be used in fig. 6A, the pressure signal generated by the first pressure-sensitive unit 751a can be detected when the strain reaction occurs in the Y direction, whereas the pressure signal is difficult to generate when the strain reaction occurs in the X direction (non-specific direction). The beneficial effect of selecting these material properties is that finer detection of pressure directionality can be achieved.
As shown in fig. 6B, the first pressure sensing unit 751B uses a directional pressure-sensitive material having an effective strain reaction on a path of 45 ° (only 45 ° (which may be any other angle) is illustrated as an example); of course, the first pressure sensing unit 751a may also be configured to direct pressure responsive pressure sensitive materials in which an effective strain response occurs in at least 2 directions (the average of the pressure signals in multiple directions may be taken to calculate the total pressure signal). Thus, the first pressure sensing unit 751a and the modification thereof can be configured at a specific touch point to enrich the functions at a single touch point or to improve the touch sensitivity so as to avoid signal misjudgment caused by misoperation.
The three-dimensional input module (neither of which is shown) of the fourth embodiment of the present invention differs from the three-dimensional input module 10 of the first embodiment only in that: the three-dimensional input module is characterized in that at least one heat insulation layer is selectively arranged between the composite pressure sensing layer and the upper substrate, and as the three-dimensional input module is applied to electronic products such as consumer electronic products and industrial electronic products, the upper substrate is used as a touch control operation surface, the upper substrate is exposed to the air, and heat is easily transferred from the upper substrate to the inside of the three-dimensional input module. The heat insulation layer is used for transmitting resistance heat to the composite pressure sensing layer from the direction of the upper substrate, and avoiding heat dryness effect brought by temperature change to the composite pressure sensing layer. Furthermore, another heat insulation layer can be arranged below the composite pressure sensing layer to prevent heat generated by the display device and the like from affecting the detection precision of the pressure signal.
The above description is only of the preferred embodiments of the present invention and is not intended to limit the invention, but any modifications, equivalents, improvements, etc. within the principles of the present invention should be included in the scope of the present invention.
Claims (10)
1. The utility model provides a three-dimensional input module, includes a first touch electrode layer and a second touch electrode layer, be provided with many first direction touch electrode on the first touch electrode layer, be provided with many second direction touch electrode on the second touch electrode layer, three-dimensional input module adopts mutual capacitance mode to detect and responds to touch operation and produce touch signal, its characterized in that: the three-dimensional input module further comprises a flexible composite pressure sensing layer, the composite pressure sensing layer is located below the second touch electrode layer, the composite pressure sensing layer comprises a flexible substrate layer, a first pressure sensing layer and a second pressure sensing layer are respectively arranged on two opposite sides of the flexible substrate layer, at least one first pressure sensing unit and at least one second pressure sensing unit are respectively arranged on the first pressure sensing layer and the second pressure sensing layer, the first pressure sensing unit and the second pressure sensing unit respond to touch operation to generate pressure signals, and the three-dimensional input module detects the pressure signals in a self-capacitance mode.
2. The three-dimensional input module of claim 1, wherein: in the pressure signal detection process, the second pressure sensing unit is used as a temperature compensation object of the first pressure sensing unit.
3. The three-dimensional input module of claim 2, wherein: the three-dimensional input module further comprises a three-dimensional signal processing circuit, the first pressure sensing unit is in linear correlation with the heat dryness signals generated by the corresponding second pressure sensing units, and the heat dryness signals of the first pressure sensing unit and the heat dryness signals generated by the corresponding second pressure sensing units are mutually counteracted by arranging an operation circuit in the three-dimensional signal processing circuit so as to eliminate pressure signal errors.
4. A three-dimensional input module as defined in claim 3, wherein: the operation circuit is one or a combination of more of an addition and subtraction operation circuit, a proportional operation circuit and a calculus operation circuit.
5. The three-dimensional input module of claim 2, wherein: and under the pressure signal superposition mode, noise signals of the first pressure sensing layer and the second pressure sensing layer are counteracted, and the pressure signals are doubly enhanced.
6. The three-dimensional input module of claim 5, wherein: the first pressure sensing layer is a positive temperature coefficient pressure sensing layer made of a pressure sensing material with a positive temperature coefficient, and the second pressure sensing layer is a negative temperature coefficient pressure sensing layer made of a pressure sensing material with a negative temperature coefficient.
7. The three-dimensional input module of claim 6, wherein: the absolute value of positive temperature coefficient of the positive temperature coefficient pressure sensing layer is equal to or in linear relation with the absolute value of negative temperature coefficient of the negative temperature coefficient pressure sensing layer.
8. The three-dimensional input module of claim 2, wherein: the second pressure sensing units as the temperature compensation targets of the first pressure sensing units are the same in material, and correspond to each other in shape, position and size.
9. The three-dimensional input module of claim 1, wherein: the first pressure sensing layer and/or the second pressure sensing layer is/are made of piezoelectric material, and is/are selected from one or more of single crystal, thin film, ceramic or polymer piezoelectric material.
10. The three-dimensional input module of claim 1, wherein: the three-dimensional input module further comprises at least one heat insulation layer, and the at least one heat insulation layer is arranged on one side of the composite pressure sensing layer.
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| CN201510642335.8A CN106557246B (en) | 2015-09-30 | 2015-09-30 | Three-dimensional input module |
| TW105206262U TWM526125U (en) | 2015-09-30 | 2016-05-02 | Three-dimensional input module |
| TW105113663A TWI579756B (en) | 2015-09-30 | 2016-05-02 | Three-dimensional input module |
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| CN106557246B (en) * | 2015-09-30 | 2023-07-21 | 宸鸿科技(厦门)有限公司 | Three-dimensional input module |
| CN107728356B (en) * | 2016-08-12 | 2020-11-03 | 鸿富锦精密工业（深圳）有限公司 | Embedded touch liquid crystal display panel and embedded touch liquid crystal display module |
| TWI680389B (en) * | 2017-04-20 | 2019-12-21 | 宏達國際電子股份有限公司 | Handheld electronic apparatus, touch sensor and touch detection method thereof |
| CN107193425A (en) * | 2017-07-01 | 2017-09-22 | 苏州能斯达电子科技有限公司 | A kind of pressure-sensitive 3D contactor control devices |
| CN109901769B (en) * | 2017-12-07 | 2021-03-02 | 京东方科技集团股份有限公司 | Feature recognition structure, manufacturing method, driving method and related device |
| CN113110765A (en) * | 2021-05-21 | 2021-07-13 | 业成科技（成都）有限公司 | Touch panel |
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| CN106557246B (en) * | 2015-09-30 | 2023-07-21 | 宸鸿科技(厦门)有限公司 | Three-dimensional input module |
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| CN101604219A (en) * | 2008-06-11 | 2009-12-16 | 胜华科技股份有限公司 | Contact panel |
| CN102004011A (en) * | 2009-08-31 | 2011-04-06 | 财团法人工业技术研究院 | Pressure sensor and boxing machine using the same |
| CN104423740A (en) * | 2013-08-30 | 2015-03-18 | 天津富纳源创科技有限公司 | Capacitive touch device based sensing method |
| CN205068358U (en) * | 2015-09-30 | 2016-03-02 | 宸鸿科技(厦门)有限公司 | Three -dimensional input module |
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| CN106557246A (en) | 2017-04-05 |
| TWM526125U (en) | 2016-07-21 |
| TWI579756B (en) | 2017-04-21 |
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