CN106554724A - A kind of water-filled radiator heat-conducting glue and preparation method thereof - Google Patents
A kind of water-filled radiator heat-conducting glue and preparation method thereof Download PDFInfo
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- CN106554724A CN106554724A CN201610916730.5A CN201610916730A CN106554724A CN 106554724 A CN106554724 A CN 106554724A CN 201610916730 A CN201610916730 A CN 201610916730A CN 106554724 A CN106554724 A CN 106554724A
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- Prior art keywords
- heat
- conducting glue
- conducting
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- following component
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
- C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention discloses a kind of water-filled radiator heat-conducting glue, the heat-conducting glue is made up of matrix, heat-conducting filler, firming agent；Described matrix is by following component into being grouped into：Hydroxypropyl methacrylate 15 80,2 hydroxyl ethyl ester 15 80 of methacrylic acid, THFMA 60 300；The heat-conducting filler is by following component into being grouped into：Aluminium oxide 200 340, carborundum 50 85, silicon dioxide 200 340, carbon dust 50 85；Firming agent is by following component into being grouped into：Benzoyl peroxide 10 50.Heat-conducting glue of the present invention belongs to one pack system heat-conducting glue, using convenient compared with two component, it is not necessary to be stirred when in use, avoid the uneven hidden danger of quality for causing of stirring, polar substrates surface can be applied to, for example metal, ceramics, glass etc., shear strength after solidification is high, and curing rate is fast, is filled between the copper pipe of radiator and aluminium block, firmly copper pipe can be fixed on aluminium block, and heat transfer efficiency is high.
Description
Technical field
The present invention relates to adhesive field, more particularly to a kind of water-filled radiator heat-conducting glue.
Background technology
Power Electronic Technique due to the advantage of its own, in Power System Flexible direct current (exchange) transmission of electricity, high-voltage dc transmission
The multiple fields such as electricity and reactive-load compensation are widely applied, and development potentiality is huge.In power electronic equipment, power component exists
Substantial amounts of heat can be produced in operation, therefore power electronic equipment heat dissipation problem becomes increasingly to project, particularly high-power
Field, traditional wind-cooling heat dissipating cannot meet its primary demand, progressively be water cooled technology replacement.
, generally using aluminium sheet as substrate, built-in casting is solid or is embedded in copper pipe, cooling water on surface for existing water-filled radiator
It is circulated by copper pipe, takes away the heat that heater is passed over by aluminium sheet, realizes radiating.It is clear that built-in casting is solid
The water-filled radiator of copper pipe, processing technique are more complicated, it is even more important that difference of the heat-conducting effect of aluminum than copper, cause this
Than relatively low, the water-filled radiator radiating effect for being embedded in copper pipe is relatively preferable for the radiating efficiency of the radiator of construction, but needs in aluminum
Heat-conducting glue is filled between plate and copper pipe, effect that is fixed and transmitting radiating is played.Existing heat-conducting glue heat conductivity is high not only
It is expensive, and long cementation coefficient is poor, and the time one is grown, and easily causes copper pipe and comes off with aluminium sheet.
The content of the invention
In order to overcome the deficiencies in the prior art, it is an object of the invention to provide a kind of good heat conduction effect, cementation performance are strong
And the water-filled radiator heat-conducting glue of low cost and preparation method thereof.
A kind of water-filled radiator heat-conducting glue, the heat-conducting glue are made up of matrix, heat-conducting filler, firming agent；
Described matrix is by following component into being grouped into：Hydroxypropyl methacrylate 15-80,2-hydroxyethyl methacry-late 15-
80th, THFMA 60-300；
The heat-conducting filler is by following component into being grouped into：Aluminium oxide 200-340, carborundum 50-85, silicon dioxide 200-
340th, carbon dust 50-85；
Firming agent is by following component into being grouped into：Benzoyl peroxide 10-50.
The additional resin of 50-200 is included in the matrix of the heat-conducting glue also, described additional resin is epoxy resin, phenol
Urea formaldehyde, melamine-formaldehyde resin, organic siliconresin, furane resins, polyimides, polybenzimidazoles, phenolic aldehyde-polyvinyl alcohol
It is acetal, phenolic aldehyde-polyamide, phenolic aldehyde-epoxy resin, epoxy-polyamide, butyl nitrile EP rubbers, fluorubber, polyisobutylene, poly-
One kind or several mixture in sulphur rubber.
Preparation method is comprised the following steps：
（1）Described Hydroxypropyl methacrylate, 2-hydroxyethyl methacry-late, THFMA are poured into
It is mixed and stirred in reactor uniform；
（2）Aluminium oxide, carborundum, silicon dioxide, carbon dust is poured into and be mixed and stirred in reactor uniformly；
（3）By step（2）The mixture for obtaining is by being ground to the continuous paste of Uniform Flow；
（4）In step（3）Benzoyl peroxide is added in the paste for obtaining and is stirred；
（5）The heat-conducting glue, and filling and sealing are obtained after vacuum de-soak.
Compared with the prior art, beneficial effects of the present invention are embodied in：Heat-conducting glue of the present invention belongs to one pack system heat-conducting glue, makes
With convenient compared with two component, it is not necessary to be stirred when in use, it is to avoid the uneven hidden danger of quality for causing of stirring, energy
Enough it is applied to polar substrates surface, for example metal, ceramics, glass etc., the shear strength after solidification is high, and curing rate is fast, fills out
Fill between the copper pipe and aluminium block of radiator, firmly copper pipe can be fixed on aluminium block, and heat transfer efficiency is high, during use, will lead
Hot glue is coated in the groove on aluminium block, then by copper pipe embedded groove, puts out the heat-conducting glue of spilling on the skin, it is ensured that copper pipe, glue, aluminium sheet
In the same plane, after heat-conducting glue is fully cured by use radiator.
Specific embodiment
With reference to specific embodiment, the present invention is described in further detail, but protection scope of the present invention not office
It is limited to this.
Embodiment 1：
（1）By described Hydroxypropyl methacrylate 15,2-hydroxyethyl methacry-late 15, THFMA
60 pour into be mixed and stirred in reactor it is uniform；
（2）Aluminium oxide 340, carborundum 85, silicon dioxide 340, carbon dust 85 is poured into and be mixed and stirred in reactor uniformly；
（3）By step（2）The mixture for obtaining is by being ground to the continuous paste of Uniform Flow；
（4）In step（3）Benzoyl peroxide 50 is added in the paste for obtaining and is stirred；
（5）The heat-conducting glue, and filling and sealing are obtained after vacuum de-soak.
Embodiment 2：
（1）By described Hydroxypropyl methacrylate 80,2-hydroxyethyl methacry-late 80, THFMA
300 pour into be mixed and stirred in reactor it is uniform；
（2）Aluminium oxide 200, carborundum 50, silicon dioxide 200, carbon dust 20 is poured into and be mixed and stirred in reactor uniformly；
（3）By step（2）The mixture for obtaining is by being ground to the continuous paste of Uniform Flow；
（4）In step（3）Benzoyl peroxide 10 is added in the paste for obtaining and is stirred；
（5）The heat-conducting glue, and filling and sealing are obtained after vacuum de-soak.
Embodiment 3：
Radiator made by heat-conducting glue of the present invention filling is carried out into temperature comparisons' test with radiator made by common heat-conducting glue,
Data result is as shown in table 1：
Table 1
By table 1, as the working time of electronic component is longer, the heat that electronic component is distributed is more and more, the present invention
Heat-conducting glue quickly heat can be conducted, heat is taken away by Jing cooling waters, and contrast common heat-conducting glue heat transfer efficiency it is poor,
Heat is caused constantly to be assembled, the temperature of electronic component is constantly raised.
Heat-conducting glue of the present invention belongs to one pack system heat-conducting glue, using convenient compared with two component, it is not necessary to enter when in use
Row stirring, it is to avoid the stirring uneven hidden danger of quality for causing, can be applied to polar substrates surface, for example metal, ceramics, glass
Glass etc., the shear strength after solidification are high, and curing rate is fast, is filled between the copper pipe of radiator and aluminium block, can firmly by copper
Pipe is fixed on aluminium block, and heat transfer efficiency is high, during use, heat-conducting glue is coated in the groove on aluminium block, then copper pipe is embedded in
In groove, put out the heat-conducting glue of spilling on the skin, it is ensured that copper pipe, glue, aluminium sheet in the same plane, after heat-conducting glue is fully cured by make
Use radiator.
Claims (3)
1. a kind of water-filled radiator heat-conducting glue, it is characterised in that：The heat-conducting glue is by matrix, heat-conducting filler, firming agent group
Into；
Described matrix is by following component into being grouped into：Hydroxypropyl methacrylate 15-80,2-hydroxyethyl methacry-late 15-
80th, THFMA 60-300；
The heat-conducting filler is by following component into being grouped into：Aluminium oxide 200-340, carborundum 50-85, silicon dioxide 200-
340th, carbon dust 50-85；
Firming agent is by following component into being grouped into：Benzoyl peroxide 10-50.
2. a kind of water-filled radiator heat-conducting glue as claimed in claim 1, it is characterised in that：In the matrix of the heat-conducting glue also
Additional resin comprising 50-200, described additional resin are epoxy resin, phenolic resin, melamine-formaldehyde resin, organosilicon
Resin, furane resins, polyimides, polybenzimidazoles, phenolic aldehyde-Pioloform, polyvinyl acetal, phenolic aldehyde-polyamide, phenolic aldehyde-asphalt mixtures modified by epoxy resin
One kind or several mixing in fat, epoxy-polyamide, butyl nitrile EP rubbers, fluorubber, polyisobutylene, thiorubber.
Thing.
3. the preparation method of water-filled radiator heat-conducting glue described in a kind of claim 1, it is characterised in that：Preparation method include with
Lower step：
（1）Described Hydroxypropyl methacrylate, 2-hydroxyethyl methacry-late, THFMA are poured into
It is mixed and stirred in reactor uniform；
（2）Aluminium oxide, carborundum, silicon dioxide, carbon dust is poured into and be mixed and stirred in reactor uniformly；
（3）By step（2）The mixture for obtaining is by being ground to the continuous paste of Uniform Flow；
（4）In step（3）Benzoyl peroxide is added in the paste for obtaining and is stirred；
（5）The heat-conducting glue, and filling and sealing are obtained after vacuum de-soak.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610916730.5A CN106554724A (en) | 2016-10-21 | 2016-10-21 | A kind of water-filled radiator heat-conducting glue and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610916730.5A CN106554724A (en) | 2016-10-21 | 2016-10-21 | A kind of water-filled radiator heat-conducting glue and preparation method thereof |
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| Publication Number | Publication Date |
|---|---|
| CN106554724A true CN106554724A (en) | 2017-04-05 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201610916730.5A Pending CN106554724A (en) | 2016-10-21 | 2016-10-21 | A kind of water-filled radiator heat-conducting glue and preparation method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108770303A (en) * | 2018-06-25 | 2018-11-06 | 河南孚点电子科技有限公司 | A kind of heat radiation chip and preparation method thereof |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102504707A (en) * | 2011-11-01 | 2012-06-20 | 特艾弗新材料科技（上海）有限公司 | Fast cured thermal conductive adhesive and preparation method thereof |
-
2016
- 2016-10-21 CN CN201610916730.5A patent/CN106554724A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102504707A (en) * | 2011-11-01 | 2012-06-20 | 特艾弗新材料科技（上海）有限公司 | Fast cured thermal conductive adhesive and preparation method thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108770303A (en) * | 2018-06-25 | 2018-11-06 | 河南孚点电子科技有限公司 | A kind of heat radiation chip and preparation method thereof |
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Application publication date: 20170405 |
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