CN105001820A - High-temperature-resisting heat-conducting insulating rubber material and preparation method therefor - Google Patents
High-temperature-resisting heat-conducting insulating rubber material and preparation method therefor Download PDFInfo
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- CN105001820A CN105001820A CN201510392940.4A CN201510392940A CN105001820A CN 105001820 A CN105001820 A CN 105001820A CN 201510392940 A CN201510392940 A CN 201510392940A CN 105001820 A CN105001820 A CN 105001820A
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Abstract
The present invention discloses a high-temperature-resisting heat-conducting insulating rubber material and a preparation method therefor. The high-temperature-resisting heat-conducting insulating rubber material is mainly prepared from 12-15 parts of epoxy resin, 5-10 parts of organic silicon resin, 3-5 parts of butadiene-acrylonitrile rubber, 0.05-0.1 part of polyvinyl butyral resin, 5-9 parts of an epoxy active diluting agent, 0.5-5 parts of anhydride, 1-3 parts of 4,4'-diamino-3,3'-dichlorodiphenylmethane, 50-60 parts of heat-conducting fillers, 0.1-0.2 part of an antioxidant, 0.01-0.05 part of a curing agent, 1-2 parts of a double-functional-group active diluting agent, 0.3-1 part of a plasticizer and 4-6 parts of a solvent. The high-temperature-resisting heat-conducting insulating rubber material prepared by the method has high splicing performance and high insulating performance; after the high-temperature-resisting heat-conducting insulating rubber material is cured, the impact-resistance strength is high; meanwhile, a cured product has good heat-conducting and heat-dissipating functions and can be used at 150-200 DEG C for a long period; and no gas is discharged in a curing process so that the safety performance is high.
Description
Technical field
The invention belongs to technical field of polymer materials, be specifically related to a kind of thermostable heat-conductive insulation paste material.
Background technology
Along with the development of large-scale integrated circuit and micro-packaging technology, the volume of electronic component, logical circuit is in the reduction becoming thousands of times, and thus the requirement of their radiating insulating is also corresponding more and more higher.It will directly have influence on the life and reliability of the various high-precision equipments using them.The medium padding one deck insulation between past people heating element (power tube) and radiator is thermally conductive material, as: sheet mica, polyester film, tetrafluoroethylene, and beryllium oxide ceramics, play certain effect, but also have that heat conductivility difference, mechanical property are low, a toxicity also shortcoming such as large.
Thus research and develop one and there is high insulating property, excellent in cushion effect after solidification, and the low thermal isolation glue material of toxicity will have great application prospect.
Summary of the invention
The object of the present invention is to provide a kind of thermostable heat-conductive insulation paste material and preparation method thereof.
The technical solution used in the present invention is:
A kind of thermostable heat-conductive insulation paste material, its raw material primarily of following weight proportion is prepared from: epoxy resin 12-15 part, silicone resin 5-10 part, paracril 3-5 part, polyvinyl butyral resin 0.05-0.1 part, epoxy active diluent 5-9 part, acid anhydrides 0.5-5 part, 4,4'-diamino-3,3'-dichloro diphenyl methane 1-3 part, heat conductive filler 50-60 part, antioxidant 0.1-0.2 part, solidifying agent 0.01-0.05 part, di-functional reactive's thinner 1-2 part, softening agent 0.3-1 part, solvent 4-6 part.
As preferably, described silicone resin is organic hydroxy silicate resin, and content of polysiloxane is 20-60%.
As preferably, described epoxy active diluent is bisphenol A diglycidyl ether.
As preferably, described heat conductive filler is at least one in aluminum oxide, zinc oxide, boron nitride, aluminium nitride, magnesium oxide.
As preferably, described antioxidant is at least one in butylated hydroxytoluene, Hypophosporous Acid, 50.
As preferably, described solidifying agent is chloroaniline.
As preferably, described di-functional reactive's thinner is at least one in 1,6-hexylene glycol double methacrylate, two contracting propylene glycol double methacrylates, tripropylene glycol double methacrylate.
As preferably, described softening agent is dioctyl terephthalate.
As preferably, described solvent is at least one in acetone, DMF.
A preparation method for thermostable heat-conductive insulation paste material, comprises the steps:
(1) by paracril dissolution with solvents, epoxy resin, silicone resin, polyvinyl butyral resin, epoxy active diluent, acid anhydrides is then added;
(2) be uniformly dispersed under the rotating speed of 1500 revs/min, slowly add heat conductive filler afterwards, added in 20 minutes, rise rotating speed to 2000 revs/min, be fully uniformly dispersed;
(3) fall rotating speed to 1000 revs/min, be sequentially added into 4,4'-diamino-3,3'-dichloro diphenyl methane, antioxidant, solidifying agent, di-functional reactive's thinner, softening agent, solvent, continue to be uniformly dispersed after reinforced, filter discharging.
The invention has the beneficial effects as follows:
The thermostable heat-conductive insulation paste material that the present invention prepares has high adhesion energy, high insulating property, excellent in cushion effect after solidification, simultaneously cured article has good heat conduction, heat sinking function, can under 150-200 DEG C of condition life-time service, release without gas during solidification, safety performance is high.
Embodiment
Below in conjunction with embodiment, the present invention is further illustrated, but be not limited thereto.
embodiment 1
A kind of thermostable heat-conductive insulation paste material, be made up according to following weight proportion of following raw materials according: epoxy resin Eponol 53J-32 13.9 parts, organic hydroxy silicate resin (content of polysiloxane 20-60%) 5 parts, paracril 4.2 parts, polyvinyl butyral resin Butvar-B-72 0.07 part, bisphenol A diglycidyl ether 7.7 parts, 1 part, acid anhydrides, 4, 4'-diamino-3, 3'-dichloro diphenyl methane 1.7 parts, 59 parts, aluminum oxide, butylated hydroxytoluene 0.2 part, m-chloro aniline 0.03 part, tripropylene glycol double methacrylate 1.5 parts, dioctyl terephthalate 0.6 part, 2.5 parts, acetone, N, dinethylformamide 2.6 parts.
embodiment 2
A kind of thermostable heat-conductive insulation paste material, be made up according to following weight proportion of following raw materials according: epoxy resin Eponol 53J-32 15 parts, organic hydroxy silicate resin (content of polysiloxane 20-60%) 8 parts, paracril 4.5 parts, polyvinyl butyral resin Butvar-B-72 0.1 part, bisphenol A diglycidyl ether 7.75 parts, 4 parts, acid anhydrides, 4, 4'-diamino-3, 3'-dichloro diphenyl methane 1.8 parts, 50 parts, aluminum oxide, butylated hydroxytoluene 0.2 part, p-Chlorobenzoic acid amide 0.05 part, tripropylene glycol double methacrylate 2 parts, dioctyl terephthalate 0.8 part, 3 parts, acetone, N, dinethylformamide 2.8 parts.
embodiment 3
A kind of thermostable heat-conductive insulation paste material, be made up according to following weight proportion of following raw materials according: epoxy resin NPEB-450A80 14.6 parts, organic hydroxy silicate resin (content of polysiloxane 20-60%) 10 parts, paracril 3.5 parts, polyvinyl butyral resin Butvar-B-72 0.05 part, bisphenol A diglycidyl ether 5.9 parts, 2 parts, acid anhydrides, 4, 4'-diamino-3, 3'-dichloro diphenyl methane 2.5 parts, 55 parts, aluminum oxide, butylated hydroxytoluene 0.1 part, m-chloro aniline 0.01 part, tripropylene glycol double methacrylate 1 part, dioctyl terephthalate 0.34 part, 2.5 parts, acetone, N, dinethylformamide 2.5 parts.
embodiment 4
A kind of thermostable heat-conductive insulation paste material, be made up according to following weight proportion of following raw materials according: epoxy resin 12 parts, silicone resin 10 parts, paracril 3 parts, polyvinyl butyral resin 0.05 part, bisphenol A diglycidyl ether 9 parts, 5 parts, acid anhydrides, 4,4'-diamino-3,3'-dichloro diphenyl methane 1 part, 60 parts, zinc oxide, Hypophosporous Acid, 50 0.2 part, p-Chlorobenzoic acid amide 0.05 part, 1,6-hexylene glycol double methacrylate 2 parts, dioctyl terephthalate 1 part, 3 parts, acetone, DMF 3 parts.
embodiment 5
A kind of thermostable heat-conductive insulation paste material, be made up according to following weight proportion of following raw materials according: epoxy resin 15 parts, silicone resin 5 parts, paracril 5 parts, polyvinyl butyral resin 0.1 part, bisphenol A diglycidyl ether 9 parts, 5 parts, acid anhydrides, 4,4'-diamino-3,3'-dichloro diphenyl methane 3 parts, boron nitride 55 parts, Hypophosporous Acid, 50 0.1 part, m-chloro aniline 0.05 part, two contracting propylene glycol double methacrylates 2 parts, dioctyl terephthalate 0.5 part, 2 parts, acetone, DMF 2 parts.
embodiment 6
The composition of claim 1-5 is prepared into thermostable heat-conductive insulation paste material, step is as follows:
The appropriate solvent of paracril is dissolved in advance, then add in the disc type dispersion compounding jar of band circulating water, quantitative epoxy resin is sequentially added into afterwards in compounding jar, silicone resin, polyvinyl butyral resin, epoxy active diluent, acid anhydrides, then disperse 30 minutes under the rotating speed of 1500 revs/min, slowly add heat conductive filler afterwards, added in 20 minutes, rise rotating speed to 2000 revs/min, disperse 1 hour, rotating speed falls to 1000 revs/min, be sequentially added into 4, 4'-diamino-3, 3'-dichloro diphenyl methane, antioxidant, solidifying agent, di-functional reactive's thinner, softening agent, solvent, dispersion is continued 30 minutes after reinforced, filter discharging.
embodiment 7
The performance perameter of the thermostable heat-conductive insulation paste material that embodiment 1-5 prepares is as shown in table 1:
Table 1
Above embodiment is only introduces preferred case of the present invention, to those skilled in the art, not deviating from any apparent changes and improvements of carrying out in the scope of spirit of the present invention, all should be regarded as a part of the present invention.
Claims (10)
1. a thermostable heat-conductive insulation paste material, its raw material primarily of following weight proportion is prepared from: epoxy resin 12-15 part, silicone resin 5-10 part, paracril 3-5 part, polyvinyl butyral resin 0.05-0.1 part, epoxy active diluent 5-9 part, acid anhydrides 0.5-5 part, 4,4'-diamino-3,3'-dichloro diphenyl methane 1-3 part, heat conductive filler 50-60 part, antioxidant 0.1-0.2 part, solidifying agent 0.01-0.05 part, di-functional reactive's thinner 1-2 part, softening agent 0.3-1 part, solvent 4-6 part.
2. thermostable heat-conductive insulation paste material according to claim 1, is characterized in that, described silicone resin is organic hydroxy silicate resin, and content of polysiloxane is 20-60%.
3. thermostable heat-conductive insulation paste material according to claim 1, is characterized in that, described epoxy active diluent is bisphenol A diglycidyl ether.
4. thermostable heat-conductive insulation paste material according to claim 1, is characterized in that, described heat conductive filler is at least one in aluminum oxide, zinc oxide, boron nitride, aluminium nitride, magnesium oxide.
5. thermostable heat-conductive insulation paste material according to claim 1, is characterized in that, described antioxidant is at least one in butylated hydroxytoluene, Hypophosporous Acid, 50.
6. thermostable heat-conductive insulation paste material according to claim 1, is characterized in that, described solidifying agent is chloroaniline.
7. thermostable heat-conductive insulation paste material according to claim 1, is characterized in that, described di-functional reactive's thinner is at least one in 1,6-hexylene glycol double methacrylate, two contracting propylene glycol double methacrylates, tripropylene glycol double methacrylate.
8. thermostable heat-conductive insulation paste material according to claim 1, is characterized in that, described softening agent is dioctyl terephthalate.
9. thermostable heat-conductive insulation paste material according to claim 1, is characterized in that, described solvent is at least one in acetone, DMF.
10. a preparation method for thermostable heat-conductive insulation paste material, comprises the steps:
(1) by paracril dissolution with solvents, epoxy resin, silicone resin, polyvinyl butyral resin, epoxy active diluent, acid anhydrides is then added;
(2) be uniformly dispersed under the rotating speed of 1500 revs/min, slowly add heat conductive filler afterwards, added in 20 minutes, rise rotating speed to 2000 revs/min, be fully uniformly dispersed;
(3) fall rotating speed to 1000 revs/min, be sequentially added into 4,4'-diamino-3,3'-dichloro diphenyl methane, antioxidant, solidifying agent, di-functional reactive's thinner, softening agent, solvent, continue to be uniformly dispersed after reinforced, filter discharging.
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105482741A (en) * | 2015-12-15 | 2016-04-13 | 苏州鑫德杰电子有限公司 | High strength heat dissipation binding material for electronic products and preparation method thereof |
| CN105602485A (en) * | 2016-01-26 | 2016-05-25 | 河北工业大学 | High-infrared-radiance insulating heat conduction adhesive and preparing method thereof |
| CN106280280A (en) * | 2016-08-11 | 2017-01-04 | 李红玉 | A kind of multifunction power safeguards glove material |
| CN106634718A (en) * | 2016-12-29 | 2017-05-10 | 安徽浩丰特种电子材料有限公司 | Epoxy resin casting glue with long storage time and excellent impregnability |
| CN108587542A (en) * | 2018-05-15 | 2018-09-28 | 苏州盛达胶粘制品有限公司 | A kind of high-temperature insulating glue and preparation method thereof |
| CN109777346A (en) * | 2019-01-28 | 2019-05-21 | 江西省航宇新材料股份有限公司 | A kind of copper-clad plate heat-conducting glue and its production technology |
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| CN1206034A (en) * | 1997-07-21 | 1999-01-27 | 贾剑珉 | High-strength flexible structure adhesive |
| CN101805575A (en) * | 2010-04-09 | 2010-08-18 | 连云港昭华科技有限公司 | High-performance conductive silver paste and preparation method thereof |
| CN103694644A (en) * | 2013-12-30 | 2014-04-02 | 景旺电子科技(龙川)有限公司 | Epoxy resin composition, metal-based copper-clad plate and manufacturing method thereof |
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2015
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| CN1206034A (en) * | 1997-07-21 | 1999-01-27 | 贾剑珉 | High-strength flexible structure adhesive |
| CN101805575A (en) * | 2010-04-09 | 2010-08-18 | 连云港昭华科技有限公司 | High-performance conductive silver paste and preparation method thereof |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105482741A (en) * | 2015-12-15 | 2016-04-13 | 苏州鑫德杰电子有限公司 | High strength heat dissipation binding material for electronic products and preparation method thereof |
| CN105602485A (en) * | 2016-01-26 | 2016-05-25 | 河北工业大学 | High-infrared-radiance insulating heat conduction adhesive and preparing method thereof |
| CN105602485B (en) * | 2016-01-26 | 2017-06-23 | 河北工业大学 | A kind of insulating heat-conductive adhesive of high infrared radiance and preparation method thereof |
| CN106280280A (en) * | 2016-08-11 | 2017-01-04 | 李红玉 | A kind of multifunction power safeguards glove material |
| CN106634718A (en) * | 2016-12-29 | 2017-05-10 | 安徽浩丰特种电子材料有限公司 | Epoxy resin casting glue with long storage time and excellent impregnability |
| CN108587542A (en) * | 2018-05-15 | 2018-09-28 | 苏州盛达胶粘制品有限公司 | A kind of high-temperature insulating glue and preparation method thereof |
| CN109777346A (en) * | 2019-01-28 | 2019-05-21 | 江西省航宇新材料股份有限公司 | A kind of copper-clad plate heat-conducting glue and its production technology |
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| CN105001820B (en) | 2017-05-24 |
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Effective date of registration: 20211224 Address after: 529400 Room 102, 1f, Daoshi technology complex building, Sanlian fozi'ao, Shengtang Town, Enping City, Jiangmen City, Guangdong Province Patentee after: Guangdong Dow ceramic materials Co.,Ltd. Address before: 529441 Sanlian fo Tsao, Enping, Guangdong, Jiangmen Patentee before: GUANGDONG DOWSTONE TECHNOLOGY Co.,Ltd. |
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