CN106554621B - Organic silicon resin composition and application thereof - Google Patents
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Abstract
The invention relates to a silicone resin composition and application thereof. The organic silicon resin composition comprises the following components in parts by weight: 100 parts of organic silicon resin, 3-20 parts of epoxy modified organic silicon polymer, 0.0001-2.0 parts of catalyst and 0.1-10 parts of assistant; the number average molecular weight of the epoxy modified organic silicon polymer is 2200-50000. According to the invention, the epoxy modified organic silicon polymer is added as a toughening modifier, so that the toughness of the silicone resin composition is improved, and cracks generated after the silicone resin laminated board is cured are reduced and eliminated. The epoxy modified organic silicon polymer has the advantages that the molecular chain contains silicon-oxygen groups, so that good compatibility with the silicon resin is guaranteed, the internal stress of the silicon resin can be reduced, cracks generated after the silicon resin is cured can be reduced and eliminated, the molecular chain simultaneously contains the epoxy groups, the peeling strength of the laminated board and the copper foil can be improved, and the performances of the silicon resin composition such as acid and alkali resistance, chemical solvent resistance and the like are enhanced.
Description
Technical Field
The invention belongs to the technical field of copper-clad plates, relates to an organic silicon resin composition and application thereof, and particularly relates to an organic silicon resin composition, a prepreg containing the same, a laminated plate and a copper-clad plate
Background
When the silicone resin is used for preparing the laminated board or the copper clad board, although the silicone resin laminated board has the advantages that the common epoxy resin laminated board does not have: excellent hydrophobicity, high and low temperature resistance, weather aging resistance, electric insulation and weather resistance, and halogen-free, phosphorus-free and flame retardant. However, silicone laminates also have some disadvantages arising from their chemical composition: long curing time, high curing temperature, low mechanical strength, poor peel strength with copper foil, poor bonding strength between layers, low bending strength and the like. Meanwhile, the organic silicon resin has a three-dimensional network structure, the crosslinking points are dense, and the organic silicon resin is easy to crack after being cured along with the increase of the crosslinking density.
Currently, the hardness and toughness of silicone resins are generally adjusted by mixing methyl, methylphenyl, or phenyl silicone resins of different R/Si. The high R/Si methyl phenyl silicone resin or phenyl silicone resin is a good toughening agent for the silicone resin, but the high R/Si silicone resin has long curing time, high curing temperature, poor thermosetting property and low heat resistance. By mixing two or more kinds of silicone resins with different R/Si, the crosslinking density of the cured resin can be reduced, and cracking can be reduced, but the peel strength between the silicone resin and the copper foil is still low. Moreover, the addition of the high R/Si silicone resin causes poor solvent resistance and chemical resistance, and meanwhile, the curing time is prolonged, the curing temperature is increased, the energy consumption is increased, and the production efficiency is reduced. CN 101525467A discloses an epoxy/organosilicon hybrid material and a preparation method thereof. The epoxy/silicone hybrid material comprises: epoxy resin, organic silicon resin, acid curing agent, optional organic epoxy silane, optional auxiliary agent and the like. However, in the prior art, the organic epoxy silane is a coupling agent with low molecular weight, the molecular weight is 100-2000, the main purpose is to improve the compatibility of epoxy resin and organic silicon resin, and the improvement of the toughness of the organic silicon resin composition is not mentioned.
Disclosure of Invention
In view of the problems in the prior art, an object of the present invention is to provide a silicone resin composition, which can reduce the brittleness of the resin composition and improve the toughness and peel strength of the resin composition on the premise of maintaining excellent properties of halogen-free, phosphorus-free, flame retardant, heat resistance, weather resistance, etc. by adding an epoxy modified silicone polymer toughening agent.
In order to achieve the purpose, the invention adopts the following technical scheme:
a silicone resin composition comprises the following components in parts by weight:
the epoxy-modified silicone polymer has a number average molecular weight of 2200 to 50000, for example 2500, 3000, 4000, 6000, 8000, 10000, 12000, 15000, 18000, 21000, 24000, 27000, 30000, 33000, 36000, 39000, 42000, 45000, or 48000.
In the present invention, the content of the epoxy-modified silicone polymer is, for example, 4 parts, 5 parts, 6 parts, 7 parts, 8 parts, 9 parts, 10 parts, 11 parts, 12 parts, 13 parts, 14 parts, 15 parts, 16 parts, 17 parts, 18 parts, or 19 parts.
The content of the catalyst is, for example, 0.0005 parts, 0.001 parts, 0.005 parts, 0.1 parts, 0.3 parts, 0.5 parts, 0.7 parts, 0.9 parts, 1.1 parts, 1.3 parts, 1.5 parts, 1.7 parts or 1.9 parts.
The content of the auxiliary is, for example, 0.5 part, 1 part, 1.5 part, 2 parts, 2.5 parts, 3 parts, 3.5 parts, 4 parts, 4.5 parts, 5 parts, 5.5 parts, 6 parts, 6.5 parts, 7 parts, 7.5 parts, 8 parts, 8.5 parts, 9 parts or 9.5 parts.
According to the invention, the epoxy modified organic silicon polymer is added as a toughening modifier, so that the toughness of the silicone resin composition is improved, and cracks generated after the silicone resin laminated board is cured are reduced and eliminated. The epoxy modified organosilicon polymer is a flexible molecular chain which contains both a silica chain segment and an epoxy group on a molecular chain by introducing the epoxy group on a polysiloxane chain by a chemical modification method. The epoxy modified organic silicon polymer has the advantages that the molecular chain contains silicon-oxygen groups, so that good compatibility with the silicon resin is guaranteed, the internal stress of the silicon resin can be reduced, cracks generated after the silicon resin is cured can be reduced and eliminated, the molecular chain simultaneously contains the epoxy groups, the peeling strength of the laminated board and the copper foil can be improved, and the performances of the silicon resin composition such as acid and alkali resistance, chemical solvent resistance and the like are enhanced. Thus, epoxy-modified silicone polymers are good tougheners for silicone resin compositions.
Preferably, the number average molecular weight of the epoxy modified organic silicon polymer is 2500-35000.
In the invention, the epoxy modified organic silicon polymer contains molecular chains
Or
Either one or a combination of both and
the polymer of (1).
Preferably, the silicone resin is a condensed type silicone resin, preferably a methyl silicone resin or/and a methyl phenyl silicone resin.
In the invention, the condensed silicone resin is any one or more than two of dehydration condensation, dealcoholization condensation or dehydrogenation condensation, and the reaction structure is as follows:
in the present invention, the condensation-type silicone resin has a structure represented by:
wherein R is1、R2、R3And R4Are the same or different and are each independently-CH3、-Ph、-OCH3、-OCH2CH3Or any one or a combination of at least two of-OH, n represents the degree of polymerization, and n represents the degree of polymerization>5, e.g. 6, 8, 10, 12, 15, 20, 25, 30 or 35.
Preferably, the condensed silicone resin is a methyl silicone resin or/and a methyl phenyl silicone resin having a molar ratio of R/Si of 1.0 to 1.7 (e.g., 1.1, 1.2, 1.3, 1.4, 1.5, 1.6, or 1.7) and Ph/(Me + Ph) of 0 to 0.8 (e.g., 0.1, 0.2, 0.3, 0.4, 0.5, 0.6, or 0.7), wherein Ph represents a phenyl group, Me represents a methyl group, and R represents an organofunctional group-CH3、-Ph、-OCH3、-OCH2CH3Any one of or a combination of at least two of-H or-OH. In the condensation type silicone resin, R/Si (molar ratio) is too small, Ph/Si (molar ratio) is too small, flexibility after curing of the silicone resin is poor, a paint film becomes hard, R/Si (molar ratio) is too large, and Ph/Si (molar ratio) is too large) If the ratio is too high, the hardness of the laminate is low, the curing is slow, and the thermosetting property is low, so that the condensation-type silicone resin is preferably a methylphenyl silicone resin with the R/Si ratio of 1.2-1.7 (molar ratio) and the Ph/(Me + Ph) of 0.2-0.6 (molar ratio).
Preferably, the catalyst is any one or a mixture of at least two of zinc naphthenate, tin naphthenate, cobalt naphthenate, iron naphthenate, cerium naphthenate, zinc carboxylate, tin carboxylate, cobalt carboxylate, iron carboxylate, cerium carboxylate, perfluorosulfonic acid, phosphonitrile chloride, amines, quaternary ammonium bases, titanate or guanidine compounds.
Preferably, the auxiliary agent is a coupling agent or/and a dispersing agent, and the coupling agent is any one of a silane coupling agent, a titanate coupling agent or an aluminate coupling agent or a mixture of at least two of the silane coupling agent, the titanate coupling agent and the aluminate coupling agent.
Preferably, the silicone resin composition further comprises a filler.
Preferably, the filler is any one of alumina, aluminum hydroxide, silica, zinc oxide, mica, talc, magnesium hydroxide, boehmite, titanium dioxide, silicon nitride, silicon carbide, boron nitride, calcium carbonate or kaolin, or a mixture of at least two thereof.
Preferably, the filler content is 0 to 200 parts by weight.
An exemplary silicone resin composition comprises, in parts by weight:
another object of the present invention is to provide a resin paste obtained by dissolving or dispersing the silicone resin composition in a solvent.
The solvent in the present invention is not particularly limited, and specific examples thereof include toluene, xylene, n-hexane, cyclohexane, isopropanol, and the like.
The invention also aims to provide a silicone resin prepreg which comprises a reinforcing material and the silicone resin composition attached to the reinforcing material after impregnation and drying.
The organic silicon resin prepreg is in a net structure formed by polymerizing and crosslinking organic silicon resin through condensation reaction.
An exemplary prepreg preparation method is:
the organic silicon resin adhesive liquid is prepared by impregnating organic silicon resin, epoxy modified organic silicon polymer, catalyst, auxiliary agent, filler, solvent and optional other components into a reinforcing material such as flaky glass fiber base material and then drying.
The fourth purpose of the present invention is to provide a silicone resin laminated board, which contains at least one sheet of the above-described silicone resin prepreg, and which is obtained by heating and pressing at least one sheet of the above-described prepreg.
The fifth purpose of the invention is to provide a silicone resin copper clad laminate, which comprises at least one sheet of the silicone resin prepreg and copper foil laminated on one side or two sides of the prepreg.
The laminated board and the copper clad laminated board manufactured by the organic silicon resin composition have the advantages that the bending strength and the impact strength of the organic silicon resin laminated board and the copper clad laminated board are improved under the condition that the good performances of the organic silicon resin laminated board and the copper clad laminated board are ensured, and the peeling strength of the organic silicon resin laminated board and the copper clad laminated board is improved due to the introduction of the epoxy group, so that the use requirements in the processing and assembling of a printed circuit board are met.
Compared with the prior art, the invention has the following beneficial effects:
according to the invention, the epoxy modified organic silicon polymer is added as a toughening modifier, so that the toughness of the silicone resin composition is improved, and cracks generated after the silicone resin laminated board is cured are reduced and eliminated. The epoxy modified organosilicon polymer is a flexible molecular chain which contains both a silica chain segment and an epoxy group on a molecular chain by introducing the epoxy group on a polysiloxane chain by a chemical modification method. The epoxy modified organic silicon polymer has the advantages that the molecular chain contains silicon-oxygen groups, so that good compatibility with the silicon resin is guaranteed, the internal stress of the silicon resin can be reduced, cracks generated after the silicon resin is cured can be reduced and eliminated, the molecular chain simultaneously contains the epoxy groups, the peeling strength of the laminated board and the copper foil can be improved, and the performances of the silicon resin composition such as acid and alkali resistance, chemical solvent resistance and the like are enhanced.
Drawings
FIG. 1 is an electron micrograph of a copper clad laminate according to example 1.
FIG. 2 is an electron micrograph of a copper clad laminate according to example 2
FIG. 3 is an electron micrograph of a copper clad laminate of example 3
FIG. 4 is an electron micrograph of a copper clad laminate of comparative example 1
FIG. 5 is an electron micrograph of a copper clad laminate of comparative example 2
FIG. 6 is an electron micrograph of a copper clad laminate of comparative example 3.
FIG. 7 is an electron micrograph of a copper clad laminate of comparative example 4.
FIG. 8 is an electron micrograph of a copper clad laminate of comparative example 5.
Fig. 9 is an electron micrograph of the copper clad laminate of comparative example 6.
Detailed Description
The technical solution of the present invention is further explained by the following embodiments.
Example 1
100 parts of methyl phenyl silicone resin with the R/Si ratio of 1.6 (mol ratio) and the Ph/(Me + Ph) of 0.7 (mol ratio) are weighed and dissolved in 100 parts of toluene solvent, after the methyl phenyl silicone resin is completely dissolved, 0.0001 part of zinc isooctanoate catalyst, 0.5 part of Z-6040 (manufactured by Dow Corning, USA) and 4.0 parts of epoxy modified organic silicon polymer with the average molecular weight of 2300 are weighed and put into the silicone resin solution, and after the methyl phenyl silicone resin is evenly stirred for 2 hours, the silicone resin glue solution is obtained.
The impregnation weight of the silicone resin glue solution is 104g/cm2The glass fiber cloth of (2) was dried at 110 ℃ for 10min to obtain a prepreg having a resin content of 58%. Stacking 4 sheets of prepreg, arranging 35 μ electrolytic copper foil on the upper and lower surfaces of the laminate, and applying a surface pressure of 30kgf/cm at 200 deg.C2And pressure molding under vacuum of 30mmHg or less for 120min to obtain a double-sided copper clad laminate having a thickness of 0.5 mm.
Example 2
100 parts of methylphenyl silicone resin with the R/Si ratio of 1.3 (mol ratio) and the Ph/(Me + Ph) of 0.3 (mol ratio) is weighed and dissolved in 100 parts of toluene solvent, after the methyl phenyl silicone resin is completely dissolved, 0.13g of aluminum acetylacetonate, 1.0 part of KBM-503 (manufactured by shin-Etsu chemical Co., Ltd.), 0.5 part of BYK-903 (manufactured by BYK, Germany) and 10 parts of epoxy modified silicone polymer with the average molecular weight of 10000 are weighed and put into the silicone resin solution, after the mixture is uniformly stirred, 30.0 parts of silicon dioxide is added, the mixture is stirred for 2 hours at room temperature and emulsified for 20 minutes, and silicone resin glue solution is obtained.
A prepreg and a double-sided copper clad laminate having a thickness of 0.5mm were obtained in the same manner as in example 1, except that the resin paste was used.
Example 3
100 parts of methyl silicone resin with the ratio of R/Si being 1.1 (molar ratio) and the ratio of Ph/(Me + Ph) being 0 (molar ratio) is weighed and dissolved in 100 parts of toluene solvent, after the methyl silicone resin is completely dissolved, 0.3g of KH-550 (China, Shanbei Wuda New Silicone materials Co., Ltd.), 2.0 parts of Z-6040 (manufactured by Dow Corning, USA), 1.0 part of BYK-903 (manufactured by Germany and BYK) and 20.0 parts of epoxy modified silicone polymer with the average molecular weight of 45000 are weighed and put into a silicone resin solution, after the mixture is uniformly stirred, 100 parts of fused silica powder and 80.0 parts of alumina are added, and the mixture is stirred for 2 hours at room temperature and emulsified for 20 minutes to obtain a silicone resin glue solution.
A prepreg and a double-sided copper-clad laminate having a thickness of 0.5mm were obtained in the same manner as in example 1, except that the resin paste was used.
Comparative example 1
100 parts of methyl phenyl silicone resin with the R/Si ratio of 1.6 (mol ratio) and the Ph/(Me + Ph) of 0.7 (mol ratio) is weighed and dissolved in 100 parts of toluene solvent, after the methyl phenyl silicone resin is completely dissolved, 0.0001 part of zinc isooctanoate catalyst, 0.5 part of Z-6040 (manufactured by Dow Corning, USA) and 4.0 parts of epoxy modified organic silicon polymer with the average molecular weight of 1500 are weighed and put into the silicone resin solution, and after the mixture is uniformly stirred for 2 hours, the silicone resin glue solution is obtained.
A prepreg and a double-sided copper clad laminate having a thickness of 0.5mm were obtained in the same manner as in example 1, except that the resin paste was used.
Comparative example 2
100 parts of methyl phenyl silicone resin with the R/Si ratio of 1.6 (mol ratio) and the Ph/(Me + Ph) of 0.7 (mol ratio) is weighed and dissolved in 100 parts of toluene solvent, after the methyl phenyl silicone resin is completely dissolved, 0.0001 part of zinc isooctanoate catalyst, 0.5 part of Z-6040 (manufactured by Dow Corning, USA) and 25.0 parts of epoxy modified organic silicon polymer with the average molecular weight of 2300 are weighed and put into the silicone resin solution, and after the mixture is uniformly stirred for 2 hours, the silicone resin glue solution is obtained.
A prepreg and a double-sided copper clad laminate having a thickness of 0.5mm were obtained in the same manner as in example 1, except that the resin paste was used.
Comparative example 3
100 parts of methyl silicone resin with the ratio of R/Si being 1.1 (molar ratio) and the ratio of Ph/(Me + Ph) being 0 (molar ratio) is weighed and dissolved in 100 parts of toluene solvent, after complete dissolution, 0.3g of KH-550 (China, Nippon Wuda Silicone New materials Co., Ltd.), 2.0 parts of Z-6040 (manufactured by Dow Corning, USA), 1.0 part of BYK-903 (manufactured by Germany and BYK), 1.0 part of epoxy modified silicone polymer with the average molecular weight of 45000 is weighed and put into a silicone resin solution, after uniform stirring, 100 parts of fused silica powder and 80.0 parts of alumina are added, and after uniform stirring, stirring is carried out for 2 hours at room temperature, emulsification is carried out for 20 minutes, and silicone resin glue solution is obtained.
A prepreg and a double-sided copper clad laminate having a thickness of 0.5mm were obtained in the same manner as in example 1, except that the resin paste was used.
Comparative example 4
100 parts of methylphenyl silicone resin with the molar ratio of R/Si being 1.6 (molar ratio) and the molar ratio of Ph/(Me + Ph) being 0.7 (molar ratio) was weighed and dissolved in 100 parts of toluene solvent, and after complete dissolution, 0.0001 part of zinc isooctanoate catalyst, 0.5 part of Z-6040 (manufactured by Dow Corning, USA) and 4.0 parts of organosilane (KBM-303 manufactured by Nippon shin-Etsu chemical Co., Ltd.) were weighed and put into the silicone resin solution, and after stirring uniformly for 2 hours, a silicone resin adhesive solution was obtained.
A prepreg and a double-sided copper clad laminate having a thickness of 0.5mm were obtained in the same manner as in example 1, except that the resin paste was used.
Comparative example 5
The epoxy/organosilicon hybrid material obtained in CN 101525467A example 1 before in-situ curing is used as resin glue solution, and glass fiber cloth is impregnated by the same method as the example 1 to obtain prepreg and a double-sided copper clad laminate with the thickness of 0.5 mm.
Comparative example 6
100 parts of methyl phenyl silicone resin with the R/Si ratio of 1.8 (molar ratio) and the Ph/(Me + Ph) of 0.7 are weighed and dissolved in 100 parts of toluene solvent, after the methyl phenyl silicone resin is completely dissolved, 0.0001 part of zinc isooctanoate catalyst, 0.5 part of Z-6040 (manufactured by Dow Corning, USA) and 4.0 parts of epoxy modified organic silicon polymer with the average molecular weight of 2300 are weighed and put into the silicone resin solution, and after the mixture is uniformly stirred for 2 hours, the silicone resin glue solution is obtained.
The impregnation weight of the silicone resin glue solution is 104g/cm2The glass fiber cloth of (2) was dried at 110 ℃ for 10min to obtain a prepreg having a resin content of 58%. Stacking 4 sheets of prepreg, arranging 35 μ electrolytic copper foil on the upper and lower surfaces of the laminate, and applying a surface pressure of 30kgf/cm at 200 deg.C2And pressure molding under vacuum of 30mmHg or less for 120min to obtain a double-sided copper clad laminate having a thickness of 0.5 mm.
The measurement method and evaluation method of each test method are as follows.
Effect confirmation test:
and (3) testing the peel strength:
the test method comprises the following steps: the test was carried out using IPC-TM-6502.4.8 method.
Thermal decomposition temperature test (Td 5%):
the test method comprises the following steps: thermogravimetric change measurement (TG-DTA) was carried out under a nitrogen atmosphere at a heating rate of 10 ℃ per minute to measure the temperature of 5% decomposition.
In addition, fig. 1 to 9 are electron microscope images of the copper-clad plates of examples 1 to 3 and comparative examples 1 to 6, respectively.
The analysis of the test results can show that the sheets of examples 1-3 have good performance and heat resistance and higher peel strength, and the laminated sheet does not crack under the observation of an electron microscope. The epoxy modified silicone resin added in comparative example 1 has low molecular weight and poor toughening effect, and the laminated board cracks. The epoxy-modified silicone resin added in comparative example 2 was too much, resulting in a decrease in heat resistance of the laminate. The epoxy modified silicone resin added in comparative example 3 has too low content, which results in insufficient toughening effect of the laminated board and cracking of the laminated board. In comparative example 4, epoxy silane is added in the same parts as in comparative example 1, but the epoxy silane is small molecules, so that the epoxy silane cannot play a toughening role, and the manufactured laminated board has a cracking phenomenon; in comparative example 5, CN 101525467a, example 1, was used to make a laminate, and compared with the present invention, the epoxy resin was added in a larger amount, so that the heat resistance, yellowing resistance and weather resistance were inferior, and the decomposition temperature Td (5%) was significantly lowered. Comparative example 6 compared to example 1, the use of a silicone resin R/Si of 1.8 resulted in incomplete curing of the resin under the same curing conditions, a lower Td (2%) temperature, and poor heat resistance.
The applicant states that the present invention is illustrated in detail by the above examples, but the present invention is not limited to the above detailed methods, i.e. it is not meant that the present invention must rely on the above detailed methods for its implementation. It should be understood by those skilled in the art that any modification of the present invention, equivalent substitutions of the raw materials of the product of the present invention, addition of auxiliary components, selection of specific modes, etc., are within the scope and disclosure of the present invention.
Claims (14)
1. A silicone resin composition comprises the following components in parts by weight:
the number average molecular weight of the epoxy modified organic silicon polymer is 2200-50000;
the organic silicon resin is condensed type silicon resin;
the condensed silicone resin is methyl silicone resin or/and methyl phenyl silicone resin with R/Si of 1.0-1.7 and Ph/(Me + Ph) of 0-0.8, wherein Ph represents phenyl group, Me represents methyl group, and R represents organic functional group-CH3、-Ph、-OCH3、-OCH2CH3Any one or a combination of at least two of-H or-OH; R/Si and Ph/(Me + Ph) represent molar ratios;
the auxiliary agent is a coupling agent or/and a dispersing agent, and the coupling agent is any one of or a mixture of at least two of a silane coupling agent, a titanate coupling agent or an aluminate coupling agent.
2. The silicone resin composition of claim 1, wherein the epoxy-modified silicone polymer has a number average molecular weight of 2500 to 35000.
3. The silicone resin composition according to claim 1, wherein the epoxy-modified silicone polymer is a silicone resin composition containing an epoxy-modified silicone polymer in a molecular chain
Either one or a combination of both and
the macromolecular polymer of (1).
4. The silicone resin composition according to claim 1, wherein the condensed-type silicone resin has a structure represented by:
wherein R is1、R2、R3And R4Are the same or different and are each independently-CH3、-Ph、-OCH3、-OCH2CH3Or any one or a combination of at least two of-OH, n represents the degree of polymerization, and n represents the degree of polymerization>5。
5. The silicone resin composition according to claim 1, wherein the condensed silicone resin is a methylphenyl silicone resin having an R/Si value of 1.2 to 1.7 and a Ph/(Me + Ph) of 0.2 to 0.6.
6. The silicone resin composition of claim 1, wherein the catalyst is any one of zinc naphthenate, tin naphthenate, cobalt naphthenate, iron naphthenate, cerium naphthenate, zinc carboxylate, tin carboxylate, cobalt carboxylate, iron carboxylate, cerium carboxylate, perfluorosulfonic acid, phosphonitrile chloride, amine, titanate, or guanidine compounds, or a mixture of at least two thereof.
7. The silicone resin composition of claim 6, wherein the amine is a quaternary ammonium base.
8. The silicone resin composition of claim 1, wherein the silicone resin composition further comprises a filler.
9. The silicone resin composition of claim 8, wherein the filler is any one of alumina, aluminum hydroxide, silica, zinc oxide, mica, talc, magnesium hydroxide, boehmite, titanium dioxide, silicon nitride, silicon carbide, boron nitride, calcium carbonate, or kaolin, or a mixture of at least two thereof.
10. The silicone resin composition of claim 8, wherein the filler is present in an amount of 0 to 200 parts by weight.
11. A resin cement obtained by dissolving or dispersing the silicone resin composition according to any one of claims 1 to 10 in a solvent.
12. A silicone resin prepreg comprising a reinforcing material and the silicone resin composition according to any one of claims 1 to 10 attached to the reinforcing material after drying by impregnation.
13. A silicone resin laminate comprising at least one silicone resin prepreg according to claim 12.
14. A silicone resin copper clad laminate comprising at least one sheet of the silicone resin prepreg of claim 12 laminated and a copper foil laminated to one or both sides of the laminated prepreg.
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| CN111100463A (en) * | 2019-12-26 | 2020-05-05 | 广东盈骅新材料科技有限公司 | Epoxy modified silicone resin composition and application thereof |
| CN111040168A (en) * | 2019-12-26 | 2020-04-21 | 广东盈骅新材料科技有限公司 | Epoxy modified organic silicon resin and preparation method thereof |
| CN114656771B (en) * | 2020-12-24 | 2023-09-12 | 广东生益科技股份有限公司 | Resin composition and application thereof |
| CN113736383B (en) * | 2021-08-26 | 2022-08-12 | 深圳市明粤科技有限公司 | Organic silicon heat-conducting adhesive film and preparation method and application thereof |
| CN115181495B (en) * | 2022-07-07 | 2023-07-18 | 江苏苏博特新材料股份有限公司 | Super-amphiphobic super-weather-resistant organic silicon protective coating and preparation method thereof |
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