CN1065475C - Transfer molding apparatus having laminated chase block - Google Patents

Transfer molding apparatus having laminated chase block Download PDF

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Publication number
CN1065475C
CN1065475C CN96114097A CN96114097A CN1065475C CN 1065475 C CN1065475 C CN 1065475C CN 96114097 A CN96114097 A CN 96114097A CN 96114097 A CN96114097 A CN 96114097A CN 1065475 C CN1065475 C CN 1065475C
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CN
China
Prior art keywords
mentioned
many
small pieces
pillar
loader
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN96114097A
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Chinese (zh)
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CN1158499A (en
Inventor
崔信
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SK Hynix Inc
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LG Semicon Co Ltd
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Publication date
Application filed by LG Semicon Co Ltd filed Critical LG Semicon Co Ltd
Publication of CN1158499A publication Critical patent/CN1158499A/en
Application granted granted Critical
Publication of CN1065475C publication Critical patent/CN1065475C/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/40—Removing or ejecting moulded articles
    • B29C45/4005—Ejector constructions; Ejector operating mechanisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S425/00—Plastic article or earthenware shaping or treating: apparatus
    • Y10S425/005—Cammed
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S425/00—Plastic article or earthenware shaping or treating: apparatus
    • Y10S425/228—Injection plunger or ram: transfer molding type

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

An improved transfer molding apparatus has a laminated chase block with many sets, which is capable of fabricating a plurality of semiconductor packages. The apparatus includes an upper plate and a movable lower plate and a plurality of posts disposed between the upper and lower plates. A plurality of laminated chase blocks is fixed to the posts. A plurality of ejecting means are disposed at one side of the chase blocks and supply means concurrently supplies a molding compound to the plurality of chase blocks.

Description

Portable molded device
The present invention relates to the molded device of a kind of movable type, more particularly, relate to a kind of improved stacked portable molded device of inserting that has.
Fig. 1 represents a kind of end view of portable molded device usually.This device is provided with down flat board 1 and upper flat plate 2.Following dull and stereotyped 1 can move up and down.The pillar of label 4 these times of expression dull and stereotyped 1 and upper flat plate 2.On this time dull and stereotyped 1 and upper flat plate 2, the following main mould 3 of band heater 9 ' and last main mould 3 is housed respectively.
On this main mould 3 and down main mould 3 ' in be provided with and insert 20, solidify a kind of epoxy molding mixture in 20 inserting, to form the semiconductor capsule.This is inserted and 20 has many shapes pit 22 the same with the semiconductor package housing.Label 11 and 12 is represented mobile putter and hydraulic cylinder respectively.
Insert 20 be contained in down main mould 3 ' on.Go up on the main mould 3 and also have same inserting, it be placed on down main mould 3 ' on 20 symmetries of inserting, spaced apart.Above-mentioned upper and lower inserting 20 is configured as an assembly with the semiconductor capsule.
Shown in Fig. 2 and 3, which floor the first, the second and the 3rd flat board 25,23 and 27 is top to bottm to be divided into successively.Make a pit 22 on the upper surface of first flat board 25, it is shaped as half of shape of the semiconductor capsule housing 30 that will form.Extend runner 21 from pit 22, epoxy resin moulding mixture flows in this runner 21.
Second flat board 23 is called liftout plate.It is contained between first dull and stereotyped the 25 and the 3rd flat board 27, can move up and down.Many knock pin 24 usefulness screw threads and first and second dull and stereotyped 25 and 23 link together.The top of knock pin 24 is communicated with the pit 22 and the runner 21 of first flat board 25.Along with moving up and down of second flat board 23, these knock pins 24 can protrude into outside the upper surface of pit 22 and runner 21, so just molded good semiconductor capsule can be ejected.
At first, heater 9 is arranged on down dull and stereotyped 1 and the last main mould 3 of upper flat plate 2 and time main mould 3 ' in, and be heated to suitable molding temperature.When reaching molded working temperature, lead frame is contained in down inserts on 20.The main mould 3 of this time ' rising compresses with last main mould 3 then.
After this, a small pieces epoxy molding mixture (EMC) is placed in the through hole of main mould 3 and main mould 3 ' interior formation down.Along with the action of mobile putter 11, the epoxy molding mixture (EMC) with the gel-like that is predetermined pressure is admitted in the pit 22.When being full of this EMC that inserts the pit 22 in 20 and solidifying basically, above-mentioned many knock pins 24 just with eject dull and stereotyped 23 co-operatings, molded good semiconductor capsule 30 is ejected.These many knock pins 24 drive by ejecting dull and stereotyped 23, eject dull and stereotyped 23 and then can move up and down under the hydraulic pressure effect.
Yet because common portable styling apparatus is to use a molded structure of main mould and time main mould to come the molded semiconductor capsule, so the number of semiconductor capsule is restricted.In addition, after molded finishing, also must drive and eject flat board, molded good semiconductor capsule is ejected from this is inserted, so just very inconvenient.
Simultaneously, Fig. 4 represents the device for molding of a multiport type, and Fig. 5 represents inserting of this device for molding.As shown in the figure, the 20a that inserts has many pit 22a (having represented 8 pits in the drawings), and these pits are coupled together by runner 21a.This method will be used tiny small pieces EMC and many mobile putters 17, and runner is short.When making in this way, because last main mould and down main mould form a molded structure, being molded into the semiconductor capsule then, is limited with the number of this semiconductor capsule of a molding process manufacturing, therefore a large amount of produce very difficult.
Therefore, the purpose of this invention is to provide and have the device for molding that multilayer is inserted, can increase the molded ability of semiconductor capsule like this, and can carry out a large amount of productions of semiconductor capsule.
The present invention is to realize that by the device for molding of a movable type this device comprises to small part: one first dull and stereotyped and second movable flat board; Many pillars that are arranged between first dull and stereotyped and movable second flat board; Manyly be fixed on inserting on the pillar, which floor this many inserting can be divided into by the second movable flat board; Be arranged on the polylith a plurality of liftout attachments of a side of inserting; And be used for simultaneously molded mixture being sent to a plurality of feedwaies of inserting.
Other advantage of the present invention, purpose and other characteristics will be stated that in the following description for this technical field technical staff, it is clearer to become, and perhaps can recognize from put into practice the present invention after having investigated following explanation.Objects and advantages of the present invention can the accessory rights claim in specifically noted understand like that and reach.
Describe the present invention with reference to the accompanying drawings in detail, identical in the accompanying drawings label is represented components identical.In the accompanying drawing:
Fig. 1 is a schematic end view, and it represents a kind of portable molded device of common semiconductor capsule;
Fig. 2 is a stereogram, and its represents inserting of device for molding shown in Figure 1;
Fig. 3 is the cross-sectional view of inserting among Fig. 2;
Fig. 4 is the figure of the portable molded device of common multiport formula;
The top view that Fig. 5 inserts for common multiport formula;
Fig. 6 A and 6B are the portable molded schematic representation of apparatus according to semiconductor capsule of the present invention, wherein:
Fig. 6 A represents the state before this device work;
Fig. 6 B represents the state in this device busy process;
Fig. 7 is a stereogram, and expression is according to the top of the small pieces loader of device for molding of the present invention;
Fig. 8 is a stereogram.Its expression is according to the part of inserting of device for molding of the present invention;
Fig. 9 is the cross-sectional view of a side of inserting, and is provided with one according to backing-out punch of the present invention in this is inserted;
Figure 10 is the stereogram according to backing-out punch of the present invention; With
Figure 11 A and 11B are the working state figure according to device for molding of the present invention, wherein:
Figure 11 A represents open mode;
Figure 11 B represents impaction state.
As shown in Figure 6A, the molded device of movable type according to the present invention comprises down dull and stereotyped 51 and upper flat plate 52, a plurality of be placed on pillar 54 between this play flat board 51 and the upper flat plate 52 and polylith layering insert 53.Insert two sides of 53 and the side of pillar 54 of polylith layering weld together.Following dull and stereotyped 51 can move up and down.Each root pillar 54 comprises many joints, and these joints are spaced from each other distance.Inserting each joint accordingly, another just can couple together these joints in saving.
CD-ROM drive motor of label 58 expressions, it is arranged on the predetermined portions of upper flat plate 52.A gear 58a is arranged on the CD-ROM drive motor 58.Small pieces loader 55 is driven by CD-ROM drive motor 58, can move up and down.Label 55a represents toothed groove.Label 56 expressions push-rod assembly more than, and 57 expressions drive the hydraulic means of this push-rod assembly 56.Small pieces loader 55 comprises a solid molded mixture that is promoted by hydraulic cylinder 59.This small pieces loader 55 plays feedway, and it is with many push-rod assemblies, and molded mixture is sent into during this inserts.
Fig. 6 B represents the impaction state inserted.Pillar 54 is made of many joints, and in these many joints, joint can insert in another root joint, and therefore, polylith is inserted and 53 can be contacted with each other.Small pieces loader 55 is located at 53 the both sides of inserting, and 60 of small pieces are contained in this small pieces loader 55.In addition, the end of many push-rod assemblies 56 enters the inside of small pieces by small pieces loader 55 to insert in 53.
The put procedure of small pieces 60 is described referring now to Fig. 7.Small pieces loader 55 by toothed groove 55a, is meshing with each other with the gear 58a that is arranged on the CD-ROM drive motor 58 on 53 of inserting.This toothed groove 55a forms on the side of small pieces loader 55.The small pieces loader can move up and down.Small pieces loader 55 comprises many hole 55b, and these many holes are with clocklike spaced-apart at interval.For small pieces 60 being sent among the 55b of this hole, the piston 59a of hydraulic cylinder 59 to promote to be placed on guide rail 60 ' on small pieces 60.
Insert referring now to Fig. 8 explanation.Insert and 53 be welded on the pillar 54.The pit 53b that many flute profiles are arranged on insert 53 upper surface and lower surface.Runner 53a is connected with all pit 53b, and has an input port 53c at the end of runner 53a.Uppermost inserting has the input port on its lower surface, and nethermost inserting has the input port on the surface thereon.Heater 61 is located at inserts 53 and pillar 54 the insides.
Fig. 9 represents liftout attachment 70, and it is arranged on inserts in 53.Inserting has a slotted hole 53d that cam is set in 53.Hole 53d extends to 53 the inboard of inserting in 53 the side direction of inserting.In addition, insert in 53, also have many vertical hole 53e that pin is set at this.These many pinhole 53e are communicated with above-mentioned a plurality of pits and runner.The groove 53f that spring is set is arranged in the upper end of pinhole 53e.
Camshaft 75 has the length that is predetermined, and inserts above-mentioned cam and be provided with among the 53d of hole.One end of camshaft 75 is fixed on the part that is predetermined of connector 72.The two ends of connecting rod 73 are connected on the two relative ends of connector 72.In the drawings, label 74 expression knock pins, and label 76 expressions are arranged on the tension spring of this knock pin one end.Knock pin 74 contacts with camshaft 75 by means of the elastic force of spring 76.This spring 76 is used to make knock pin 74 flexibly supporting camshaft 75.Insert the position of the liftout attachment 70 in 53 on the rightabout that above-mentioned lead frame is installed.
As shown in figure 10, from the side section of camshaft 75, the shape of the camshaft 75 of liftout attachment 70 is oval-shaped.The lower end of knock pin 74 contacts with the garden perimeter surface of camshaft 75.Do opposite moving up and down with the connecting rod 73 that the relative two ends of connector 72 connect, this camshaft 75 is rotated.Knock pin 74 moves upward along the garden perimeter surface of camshaft 75, and molded good semiconductor capsule is ejected.
As shown in figure 11, on 53 the face inserted, be provided with many liftout attachments 70.Best, the number of this liftout attachment 70 is corresponding with 53 the pit number respectively inserted.A plurality of liftout attachments 70 are connected to each other by many connecting rods 73.When compressing (Figure 11 B) or opening (Figure 11 A) and insert 53 the time, liftout attachment just can move.
At first, as shown in Figure 6A, switch on to the heater 61 that is located at pillar 54 and insert in 53, will insert then 53 is heated to mouldable temperature.After this, dull and stereotyped instantly 51 when moving upward, and each joint of pillar 54 inserts mutually, forms a pillar, and a plurality of inserting 53 compressed.
After on small pieces 60 being placed on small pieces placed hole 55b respectively, just can switch on.Small pieces loader 55 is along with the revolution of CD-ROM drive motor 58 moves downward.At this moment, small pieces hole 55b aims at 53 the small pieces input port 53c of inserting.Hydraulic means 57 action moves to push-rod assembly 56 to insert 53 both sides.The end of push-rod assembly 56 passes small pieces hole 55b, arrives 53 the input port 53c that inserts, and small pieces 60 is pushed insert in 53.
In the incipient stage, the small pieces of being made by the epoxy molding mixture 60 are solid.Yet As time goes on, this solid tablets becomes liquid condition.These liquid state small pieces are sent among each pit 53b by runner 53a.When small pieces 60 injections finished, small pieces 60 just solidified, and open then and insert 53.
At this moment, each joint of pillar 54 moves upward, and is disconnected from each other.Simultaneously, connecting rod 73 moves up and down, and camshaft 75 is rotated.After this, knock pin 74 moves upward, and molded good semiconductor capsule is deviate from 53 from inserting.
In addition, owing to heater can be directly installed on during this inserts, therefore can carry out desirable rapid moulding.Owing to do not use main mould in the present invention, device size can be done compactlyer, and the weight of device also can alleviate.In addition, in the present invention, knock pin is not by costing an arm and a leg usually, and baroque hydraulic system drives, but is driven by mechanical system, therefore safeguard easily, and the program control process is simple.
Though, the preferred embodiments of the present invention are disclosed for illustrative purposes, those skilled in the art are appreciated that and can carry out various change to it, increase and replace, and can not depart from scope of the present invention and the aim described in claims.
The foregoing description is exemplary, is not limitation of the present invention.This programme can easily be applied in the other forms of device.Explanation among the present invention is exemplary, and it does not limit the scope of claim.Many alternative methods, it is conspicuous improving and changing those skilled in the art.

Claims (7)

1. molded device of movable type, it comprises:
One first dull and stereotyped and second movable flat board;
Be arranged on many pillars between above-mentioned first dull and stereotyped and movable second flat board, each the root pillar in the described many pillars comprises many joints, and these many joints can insert mutually, to form this pillar;
The polylith that is fixed on the above-mentioned pillar is inserted, and which floor described inserting be divided into by the described second movable flat board;
A plurality of liftout attachments that are arranged on described a plurality of sides of inserting;
Be used for simultaneously molded mixture being infeeded a plurality of feedwaies of inserting.
2. device as claimed in claim 1 is characterized in that, described inserting comprises:
The many pits that on above-mentioned first and second surfaces of inserting, form;
Many runners that are communicated with described many pits;
An input port that forms at an above-mentioned end of inserting, molded mixture enters in this input port;
On the predetermined degree of depth, and extend to a long camshaft installing hole of the other end from the end that this is inserted;
Many in above-mentioned inserting pin installing hole spaced apart from each other, described pin installing hole is vertical with above-mentioned cam installing hole, and at least with above-mentioned a plurality of pits and runner in one be connected; And
, the groove of the mounting spring that forms at an end of above-mentioned pin installing hole.
3. device as claimed in claim 1 is characterized in that, described feedway comprises:
Be positioned at the above-mentioned side of inserting, and have the small pieces loader of solid molded mixture; And
When above-mentioned small pieces loader moves to above-mentioned both sides of inserting, molded mixture is infeeded many push-rod assemblies in above-mentioned the inserting.
4. device as claimed in claim 1 is characterized in that, described liftout attachment comprises:
Oval cam axle with predetermined length;
A connector that is fixed on an end of above-mentioned camshaft;
A connecting rod that is connected with the two sides of above-mentioned connector; And
A movable knock pin that contacts with the external peripheral surface of above-mentioned camshaft.
5. device as claimed in claim 4 is characterized in that, when clamping and opening above-mentioned inserting, described a plurality of liftout attachments move simultaneously.
6. device as claimed in claim 1 is characterized in that, described insert and described pillar have heater, this heater be arranged on above-mentioned insert and pillar in.
7. device as claimed in claim 1 is characterized in that, described small pieces loader comprises many holes and a toothed groove, and therefore above-mentioned small pieces loader and said gear are meshing with each other, and can upper and lowerly move.
CN96114097A 1995-12-30 1996-12-30 Transfer molding apparatus having laminated chase block Expired - Fee Related CN1065475C (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1019950068654A KR0157929B1 (en) 1995-12-30 1995-12-30 Semiconductor package molding apparatus of multi-layer mold type
KR68654/1995 1995-12-30

Publications (2)

Publication Number Publication Date
CN1158499A CN1158499A (en) 1997-09-03
CN1065475C true CN1065475C (en) 2001-05-09

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN96114097A Expired - Fee Related CN1065475C (en) 1995-12-30 1996-12-30 Transfer molding apparatus having laminated chase block

Country Status (4)

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US (1) US5871782A (en)
JP (1) JP2741671B2 (en)
KR (1) KR0157929B1 (en)
CN (1) CN1065475C (en)

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CN101777437A (en) * 2010-03-04 2010-07-14 成都尚明工业有限公司 Tantalum capacitor encapsulating mould

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CN1158499A (en) 1997-09-03
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JPH09187836A (en) 1997-07-22
US5871782A (en) 1999-02-16

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