CN106541310A - 显示面板的切割方法 - Google Patents
显示面板的切割方法 Download PDFInfo
- Publication number
- CN106541310A CN106541310A CN201510609160.0A CN201510609160A CN106541310A CN 106541310 A CN106541310 A CN 106541310A CN 201510609160 A CN201510609160 A CN 201510609160A CN 106541310 A CN106541310 A CN 106541310A
- Authority
- CN
- China
- Prior art keywords
- display
- grinding
- display module
- substrate
- cutting method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005520 cutting process Methods 0.000 title claims abstract description 45
- 238000000034 method Methods 0.000 title claims abstract description 42
- 239000000758 substrate Substances 0.000 claims abstract description 42
- 238000007688 edging Methods 0.000 claims abstract description 39
- 238000004806 packaging method and process Methods 0.000 claims abstract description 38
- 239000004033 plastic Substances 0.000 claims abstract description 35
- 229920003023 plastic Polymers 0.000 claims abstract description 35
- 238000000227 grinding Methods 0.000 claims description 83
- 239000011521 glass Substances 0.000 claims description 12
- 239000002826 coolant Substances 0.000 claims description 9
- 239000006071 cream Substances 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 5
- 239000002131 composite material Substances 0.000 claims description 3
- 229910001651 emery Inorganic materials 0.000 claims description 3
- 238000013461 design Methods 0.000 abstract description 10
- 208000034699 Vitreous floaters Diseases 0.000 description 45
- 239000003292 glue Substances 0.000 description 23
- 238000005538 encapsulation Methods 0.000 description 9
- 238000010586 diagram Methods 0.000 description 6
- 238000002955 isolation Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 208000037656 Respiratory Sounds Diseases 0.000 description 2
- 235000003642 hunger Nutrition 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 230000037351 starvation Effects 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 239000000110 cooling liquid Substances 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000013519 translation Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
- B24B9/08—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass
- B24B9/10—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass of plate glass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
- B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
- B28D7/02—Accessories specially adapted for use with machines or devices of the preceding groups for removing or laying dust, e.g. by spraying liquids; for cooling work
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/851—Division of substrate
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
Description
Claims (13)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510609160.0A CN106541310B (zh) | 2015-09-23 | 2015-09-23 | 显示面板的切割方法 |
US15/159,153 US10038170B2 (en) | 2015-09-23 | 2016-05-19 | Method for cutting display panel |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510609160.0A CN106541310B (zh) | 2015-09-23 | 2015-09-23 | 显示面板的切割方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN106541310A true CN106541310A (zh) | 2017-03-29 |
CN106541310B CN106541310B (zh) | 2019-09-17 |
Family
ID=58283122
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201510609160.0A Active CN106541310B (zh) | 2015-09-23 | 2015-09-23 | 显示面板的切割方法 |
Country Status (2)
Country | Link |
---|---|
US (1) | US10038170B2 (zh) |
CN (1) | CN106541310B (zh) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107393416A (zh) * | 2017-08-14 | 2017-11-24 | 维沃移动通信有限公司 | 一种显示屏制造方法及显示屏基板 |
CN108447391A (zh) * | 2018-03-01 | 2018-08-24 | 昆山国显光电有限公司 | 显示面板以及显示面板的封装方法和装置 |
CN108538862A (zh) * | 2018-05-11 | 2018-09-14 | 昆山国显光电有限公司 | 显示母板、显示屏及显示终端 |
CN108878677A (zh) * | 2018-06-13 | 2018-11-23 | 上海天马有机发光显示技术有限公司 | 显示面板和显示装置 |
CN110722462A (zh) * | 2019-10-24 | 2020-01-24 | 深圳市华星光电技术有限公司 | 用以制备显示面板的磨轮及显示面板的制备方法 |
CN113001595A (zh) * | 2021-02-04 | 2021-06-22 | 阳江市美珑美利刀具有限公司 | 一种柳叶型刀刃的刀具及其制备方法 |
CN113103071A (zh) * | 2021-03-22 | 2021-07-13 | 深圳市华星光电半导体显示技术有限公司 | 显示面板及其磨边方法 |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111201482A (zh) * | 2017-11-30 | 2020-05-26 | 深圳市柔宇科技有限公司 | 显示屏保护结构、显示组件及切割方法、贴膜方法 |
KR102552270B1 (ko) | 2018-11-22 | 2023-07-07 | 삼성디스플레이 주식회사 | 원장보호필름의 박리방법 및 유기발광 표시장치의 제조방법 |
KR102677473B1 (ko) | 2018-11-22 | 2024-06-24 | 삼성디스플레이 주식회사 | 원장보호필름의 박리방법, 유기발광 표시장치의 제조방법, 및 유기발광 표시장치 |
KR20200100914A (ko) * | 2019-02-18 | 2020-08-27 | 삼성디스플레이 주식회사 | 디스플레이 패널 및 그 제조방법 |
KR20200109422A (ko) * | 2019-03-12 | 2020-09-23 | 삼성디스플레이 주식회사 | 표시 패널 및 이의 제조방법 |
TWI726417B (zh) | 2019-09-12 | 2021-05-01 | 元太科技工業股份有限公司 | 電子裝置 |
CN112863371B (zh) * | 2021-02-26 | 2023-08-29 | 京东方科技集团股份有限公司 | 拼接显示屏的制造方法及拼接显示屏 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040135268A1 (en) * | 2003-01-14 | 2004-07-15 | Osram Opto Semiconductors, Gmbh | Interface for UV-curable adhesives |
CN200964772Y (zh) * | 2006-09-30 | 2007-10-24 | 王及伟 | 玻璃百页片 |
CN103311183A (zh) * | 2013-06-05 | 2013-09-18 | 上海和辉光电有限公司 | 平板显示器的面板及其切割方法 |
CN103619537A (zh) * | 2011-06-28 | 2014-03-05 | 康宁股份有限公司 | 玻璃边缘精加工方法 |
CN103730604A (zh) * | 2013-11-22 | 2014-04-16 | 上海和辉光电有限公司 | 一种提升有机发光二极管结构强度的方法 |
CN103985826A (zh) * | 2014-05-30 | 2014-08-13 | 深圳市华星光电技术有限公司 | Oled基板的封装方法及oled结构 |
CN104409652A (zh) * | 2014-10-23 | 2015-03-11 | 京东方科技集团股份有限公司 | 玻璃薄膜的制备方法、光电器件及其封装方法、显示装置 |
CN204463733U (zh) * | 2015-02-16 | 2015-07-08 | 上海和辉光电有限公司 | Oled面板的边框结构 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2004746B1 (en) * | 2006-03-29 | 2018-08-01 | Henkel AG & Co. KGaA | Radiation-curable rubber adhesive/sealant |
TWI465545B (zh) * | 2011-11-18 | 2014-12-21 | Lg Chemical Ltd | 用於封裝有機電子裝置之光固化型壓敏性黏著膜,有機電子裝置及用於封裝彼之方法 |
KR20130055541A (ko) * | 2011-11-18 | 2013-05-28 | 주식회사 엘지화학 | 유기전자장치 봉지용 광경화형 점접착 필름, 유기전자장치 및 그의 봉지 방법 |
KR102271696B1 (ko) * | 2014-10-29 | 2021-07-01 | 엘지디스플레이 주식회사 | 유기 발광 표시 장치용 봉지 필름, 이의 제조 방법 및 이를 이용한 유기 발광 표시 장치 |
CN107001879A (zh) * | 2014-10-29 | 2017-08-01 | 德莎欧洲公司 | 包含硅烷水清除剂的oled相容性胶粘剂 |
CN104576707B (zh) * | 2015-01-28 | 2018-04-06 | 京东方科技集团股份有限公司 | Oled面板及其制备方法和显示装置 |
CN105097885B (zh) * | 2015-09-01 | 2018-07-27 | 京东方科技集团股份有限公司 | Oled面板及其封装方法、显示装置 |
CN105739154B (zh) * | 2016-04-29 | 2019-09-27 | 上海天马有机发光显示技术有限公司 | 一种显示面板以及电子设备 |
-
2015
- 2015-09-23 CN CN201510609160.0A patent/CN106541310B/zh active Active
-
2016
- 2016-05-19 US US15/159,153 patent/US10038170B2/en not_active Expired - Fee Related
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040135268A1 (en) * | 2003-01-14 | 2004-07-15 | Osram Opto Semiconductors, Gmbh | Interface for UV-curable adhesives |
CN200964772Y (zh) * | 2006-09-30 | 2007-10-24 | 王及伟 | 玻璃百页片 |
CN103619537A (zh) * | 2011-06-28 | 2014-03-05 | 康宁股份有限公司 | 玻璃边缘精加工方法 |
CN103311183A (zh) * | 2013-06-05 | 2013-09-18 | 上海和辉光电有限公司 | 平板显示器的面板及其切割方法 |
CN103730604A (zh) * | 2013-11-22 | 2014-04-16 | 上海和辉光电有限公司 | 一种提升有机发光二极管结构强度的方法 |
CN103985826A (zh) * | 2014-05-30 | 2014-08-13 | 深圳市华星光电技术有限公司 | Oled基板的封装方法及oled结构 |
CN104409652A (zh) * | 2014-10-23 | 2015-03-11 | 京东方科技集团股份有限公司 | 玻璃薄膜的制备方法、光电器件及其封装方法、显示装置 |
CN204463733U (zh) * | 2015-02-16 | 2015-07-08 | 上海和辉光电有限公司 | Oled面板的边框结构 |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107393416A (zh) * | 2017-08-14 | 2017-11-24 | 维沃移动通信有限公司 | 一种显示屏制造方法及显示屏基板 |
CN107393416B (zh) * | 2017-08-14 | 2019-08-20 | 维沃移动通信有限公司 | 一种显示屏制造方法及显示屏基板 |
CN108447391A (zh) * | 2018-03-01 | 2018-08-24 | 昆山国显光电有限公司 | 显示面板以及显示面板的封装方法和装置 |
CN108538862A (zh) * | 2018-05-11 | 2018-09-14 | 昆山国显光电有限公司 | 显示母板、显示屏及显示终端 |
CN108538862B (zh) * | 2018-05-11 | 2021-08-13 | 广州国显科技有限公司 | 显示母板、显示屏及显示终端 |
CN108878677A (zh) * | 2018-06-13 | 2018-11-23 | 上海天马有机发光显示技术有限公司 | 显示面板和显示装置 |
CN110722462A (zh) * | 2019-10-24 | 2020-01-24 | 深圳市华星光电技术有限公司 | 用以制备显示面板的磨轮及显示面板的制备方法 |
CN113001595A (zh) * | 2021-02-04 | 2021-06-22 | 阳江市美珑美利刀具有限公司 | 一种柳叶型刀刃的刀具及其制备方法 |
CN113103071A (zh) * | 2021-03-22 | 2021-07-13 | 深圳市华星光电半导体显示技术有限公司 | 显示面板及其磨边方法 |
CN113103071B (zh) * | 2021-03-22 | 2022-05-27 | 深圳市华星光电半导体显示技术有限公司 | 显示面板及其磨边方法 |
Also Published As
Publication number | Publication date |
---|---|
CN106541310B (zh) | 2019-09-17 |
US10038170B2 (en) | 2018-07-31 |
US20170084879A1 (en) | 2017-03-23 |
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Address after: 201500, building two, building 100, 1, Jinshan Industrial Road, 208, Shanghai, Jinshan District Patentee after: Shanghai Hehui optoelectronic Co., Ltd Address before: 201500, building two, building 100, 1, Jinshan Industrial Road, 208, Shanghai, Jinshan District Patentee before: EverDisplay Optronics (Shanghai) Ltd. |
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Address after: 201506, No. nine, No. 1568, Jinshan Industrial Zone, Shanghai, Jinshan District Patentee after: Shanghai Hehui optoelectronic Co., Ltd Address before: 201500, building two, building 100, 1, Jinshan Industrial Road, 208, Shanghai, Jinshan District Patentee before: Shanghai Hehui optoelectronic Co., Ltd |
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CP02 | Change in the address of a patent holder |