CN106537581B - 散热片材以及使用该散热片材的散热结构体 - Google Patents
散热片材以及使用该散热片材的散热结构体 Download PDFInfo
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- 239000000463 material Substances 0.000 title claims abstract description 203
- 239000011347 resin Substances 0.000 claims abstract description 125
- 229920005989 resin Polymers 0.000 claims abstract description 125
- 239000012790 adhesive layer Substances 0.000 claims abstract description 24
- 238000007639 printing Methods 0.000 claims description 35
- 239000000758 substrate Substances 0.000 claims description 35
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 20
- 230000002093 peripheral effect Effects 0.000 claims description 13
- 229920000642 polymer Polymers 0.000 claims description 9
- -1 siloxanes Chemical class 0.000 claims description 5
- 230000001681 protective effect Effects 0.000 description 13
- 238000000034 method Methods 0.000 description 9
- 238000011084 recovery Methods 0.000 description 8
- 238000012546 transfer Methods 0.000 description 8
- 239000002390 adhesive tape Substances 0.000 description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 5
- 229910002804 graphite Inorganic materials 0.000 description 5
- 239000010439 graphite Substances 0.000 description 5
- 206010037660 Pyrexia Diseases 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 229920001971 elastomer Polymers 0.000 description 2
- 239000000806 elastomer Substances 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000006837 decompression Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000007373 indentation Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
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- H—ELECTRICITY
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- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
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- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
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- B32B7/02—Physical, chemical or physicochemical properties
- B32B7/027—Thermal properties
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- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
- B32B27/302—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising aromatic vinyl (co)polymers, e.g. styrenic (co)polymers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/02—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions
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- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
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- B32B3/263—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by a layer having non-uniform thickness
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
- B32B3/266—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by an apertured layer, the apertures going through the whole thickness of the layer, e.g. expanded metal, perforated layer, slit layer regular cells B32B3/12
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/005—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
- B32B9/007—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile comprising carbon, e.g. graphite, composite carbon
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B9/045—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/18—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying coatings, e.g. radiation-absorbing, radiation-reflecting; by surface treatment, e.g. polishing
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
- F28F21/06—Constructions of heat-exchange apparatus characterised by the selection of particular materials of plastics material
- F28F21/067—Details
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
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- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
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- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2250/00—Layers arrangement
- B32B2250/03—3 layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/302—Conductive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/732—Dimensional properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2275/00—Fastening; Joining
- F28F2275/02—Fastening; Joining by using bonding materials; by embedding elements in particular materials
- F28F2275/025—Fastening; Joining by using bonding materials; by embedding elements in particular materials by using adhesives
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- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
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Abstract
本发明提供散热片材以及使用该散热片材的散热结构体。散热片材具备:导热树脂片材;设于导热树脂片材的上表面的粘结层;以及设于粘结层的上表面且导热率比导热树脂片材高的导热膜,导热树脂片材具有在导热树脂片材的下表面形成凹部的局部薄的薄壁部。另外,上述的凹部也可以是贯穿导热树脂片材的贯通孔,粘结层从导热树脂片材的贯通孔露出。
Description
技术领域
本发明涉及在各种电子设备中使用的散热片材以及使用该散热片材的散热结构体。
背景技术
近年来,电子设备的各种功能、处理能力等迅速提高,与此相伴地,来自以半导体元件为代表的电子部件的发热量呈增加的趋势。因此,为了保证半导体元件等的动作特性、可靠性等,使向树脂混合导热性填充物而固化后的导热片材与发热部件抵接,从而进行散热或者传热。在此,发热部件是具有发热性的电子部件。
需要说明的是,与上述的导热片材类似的技术例如在专利文献1中公开。
在先技术文献
专利文献
专利文献1:日本特开2010-24371号公报
发明内容
散热片材具备:导热树脂片材;设于导热树脂片材的上表面的粘结层;以及设于粘结层的上表面且导热率比导热树脂片材高的导热膜,导热树脂片材具有在导热树脂片材的下表面形成凹部的局部薄的薄壁部。
另外,上述的凹部也可以是贯穿导热树脂片材的贯通孔,粘结层从导热树脂片材的贯通孔露出。
附图说明
图1是实施方式1中的散热片材的仰视立体图。
图2是图1中的散热片材的II-II线的剖视图。
图3是将图2中的散热片材的一部分扩大的剖视图。
图4是在图2的散热片材上设有打印基板的散热结构体的剖视图。
图5是实施方式2中的散热片材的立体图。
图6是图5中的散热片材的VI-VI线的剖视图。
图7是将图6中的散热片材的一部分扩大的剖视图。
图8是在图6的散热片材上设有打印基板的散热结构体的剖视图。
具体实施方式
前述的现有的导热片材中,发热部件与导热片材之间的热阻大。另外,导热片材本身的导热率不够。因此难以充分地进行散热、传热。另外,为了降低接触状态下的热阻,代替使用导热片材,还具有如下方法:向液状的树脂混合导热填充物,并将该混合物涂敷于发热部件而使其固化,但在该情况下难以从打印基板卸下。此外,作为用于这种目的的液状树脂,大多使用包含硅氧烷的硅酮。然而,硅氧烷容易污染电子设备等的内部。
参照附图对解决以上那样的问题点的散热片材进行说明。
(实施方式1)
图1是实施方式1中的散热片材16的仰视立体图。图2是将图1的散热片材16以II-II线剖开的剖视图。图3是将图2的散热片材16的一部分A扩大的剖视图。
如图3所示,散热片材16在由厚度为约1.2mm的苯乙烯聚合物构成的导热树脂片材11的上表面设有厚度为约10μm的双面胶带来作为粘结层13。此外,在粘结层13的上表面设有厚度为约25μm的石墨膜作为导热膜14。此外,在导热膜14的上表面设有厚度为约10μm的保护膜15。导热树脂片材11由25℃时发生塑性变形的材料构成,且由能够在25℃时发生塑性变形且不含有硅氧烷的苯乙烯聚合物构成。
如图2所示,导热树脂片材11具有在导热树脂片材的下表面111形成凹部12的局部薄的薄壁部11b。薄壁部11b设于比导热树脂片材的周边部11a靠内侧的位置。薄壁部11b的厚度为约0.5mm且周边部11a的厚度为约1.1mm。发出热量的发热部件与薄壁部11b的上表面抵接而紧贴于散热片材16。
根据以上的结构,实施方式1的散热片材16在通过加压而贴合于安装有包括发热部件在内的电子部件的打印基板的上表面时,能够使导热树脂片材11紧贴于发热部件的上表面以及侧面,因此能够降低发热部件和导热树脂片材11的热阻。
另外,通过使发热部件与薄壁部11b的下表面即凹部12的底面11ba抵接并进行加压,由此导热树脂片材11以较小的变形量紧贴于发热部件。此外能够减小对发热部件和散热片材16进行加压的加压力。
在导热树脂片材11贴合有导热率比导热树脂片材11高的导热膜14。因此,从发热部件产生的热量从导热树脂片材11迅速地向导热膜14传递而被散热或者传热。其结果是,能够抑制发热部件的温度的上升。此外,能够不使导热树脂片材11加热固化而紧贴于打印基板。因此,能够在重贴散热片材16时容易从打印基板拆卸。
薄壁部11b的厚度优选为导热树脂片材11的周边部11a的厚度的5%以上且70%以下。薄壁部11b的厚度超过70%时,对发热部件和散热片材16进行加压的加压力变大,因此向发热部件施加的加压力也变大,从而向发热部件施加负荷。在薄壁部11b的厚度小于导热树脂片材11的周边部11a的5%时,在工艺方面难以形成。
凹部12具有向导热树脂片材11的下表面111开口的开口部12a。在导热树脂片材11的下表面111设置的凹部12优选随着从凹部12的开口部12a接近薄壁部11b的下表面即凹部12的底面11ba而成为凹部12的宽度缩窄的锥状。
根据以上的结构,发热部件和导热树脂片材11容易紧贴。
导热树脂片材11具有绝缘性,能够在25℃时发生塑性变形。在此,塑性变形是指,弹性复原率为50%以下的变形。弹性复原率通过如下方式求出:使用恒定形状的按压件对试验片的表面施加负载,以恒定的增压速度压入按压件直到相当于试验片的20%的膜厚(x)的距离为止且保持1秒,然后以恒定的减压速度卸除负载并保持30秒之后,根据此时的试验片的膜厚(y)由下式求出弹性复原率RE。
RE(%)=((x)-(y))/(x)×100
在本实施方式中使用的苯乙烯聚合物的弹性复原率RE为约30%。通常的苯乙烯聚合物等树脂片材相对于这样的压力而发生弹性变形,但通过加入较多的可塑剂,能够实现50%以下的弹性复原率RE。
导热膜14优选使用对高分子膜进行热分解而生成的热分解石墨膜。热分解石墨膜在面方向上具有约1600W/m·K的导热率,因此能够确保良好的散热性。
导热树脂片材11具有约2W/m·K的导热率。导热树脂片材11的导热率越高,越能够有效地输送热量。导热树脂片材11的导热率优选为1W/m·K以上。然而,树脂的导热率通常较低,因此作为导热树脂片材11也无法获得高导热率。对此,如本实施方式那样,通过在导热树脂片材11之上贴合具有远比该导热树脂片材11大的导热率的导热膜14,由此能够使热量迅速地沿导热膜14的面方向扩散。
根据以上的结构,本实施方式的散热片材16即便使用导热率为2W/m·K左右的导热树脂片材11,也能够充分地进行散热或者传热。导热膜14的导热率优选为导热树脂片材11的导热率的100倍以上。
本实施方式的散热片材16通过使形成凹部12的局部薄的薄壁部11b与发热部件抵接并进行加压,由此使导热树脂片材11塑性变形,从而紧贴于发热部件。
根据以上的结构,本实施方式的散热片材16能够使发热部件的上表面整体以及发热部件的侧面紧贴于导热树脂片材11。
相对于本实施方式的散热片材16,在使用不具有薄壁部11b的主面为平面的导热树脂片材的情况下,为了使导热树脂片材发生塑性变形而需要较大的压力。然而,像本实施方式的散热片材16那样,通过使形成凹部12的局部薄的薄壁部11b与发热部件抵接并进行加压,由此能够以较小的加压力充分地使发热部件紧贴于导热树脂片材11。
在本实施方式的导热树脂片材11的下表面111设置的凹部12优选为随着从开口部12a接近凹部12的底面11ba而凹部12的宽度缩窄的锥状。
根据以上的结构,发热部件容易紧贴于导热树脂片材11。
此外,在将发热部件***到凹部12之前,凹部12的底面11ba的大小优选小于发热部件的大小。通过使凹部12的底面11ba的大小小于发热部件的大小,能够更可靠地使发热部件的上表面整体以及发热部件的侧面紧贴于导热树脂片材11。具体地说,优选使凹部12的底面11ba的大小比发热部件的大小在0.5~2.0mm的范围内减小,使凹部12的开口部12a的大小比发热部件的大小在0.5~2.0mm的范围内增大。
需要说明的是,在使凹部12的底面11ba小于发热部件的大小的情况下,在向凹部12***发热部件并进行加压时,空气进入发热部件的上表面与凹部12的底面11ba之间而可能导致发热部件的上表面与凹部12的底面11ba无法充分紧贴。在该情况下,通过一边使导热树脂片材11弯曲一边从发热部件的一方的侧面朝向另一方的侧面依次抵接,能够避免空气进入到发热部件的上表面与凹部12的底面11ba之间,能够获得发热部件的上表面与凹部12的底面11ba充分紧贴的散热片材。
另外,也可以设置从导热树脂片材11的下表面111贯穿散热片材16的空气的通孔,能够避免空气进入到发热部件的上表面与凹部12的底面11ba之间,能够获得发热部件的上表面与凹部12的底面11ba充分紧贴的散热片材。
根据以上的结构,发热部件更容易紧贴于导热树脂片材11。
另外,导热树脂片材11的周边部11a的厚度优选为0.5~2.0mm。
根据以上的结构,导热树脂片材11与发热部件充分紧贴,从而能够得到散热性高的散热片材16。
凹部12的深度优选为发热部件的高度的80%以上且95%以下。在此,凹部12的深度是指,从凹部12的底面11ba到导热树脂片材11的下表面111为止的距离。
根据以上的结构,当使导热树脂片材11与发热部件抵接并进行加压时,作用于发热部件的加压力变小,并且能够稳定地使导热树脂片材11紧贴于发热部件。
此外,如图3所示,更优选在导热膜14的上表面预先贴合具有绝缘性的保护膜15。
根据以上的结构,能够确保散热片材16的表面的绝缘性,并且能够防止来自外部的应力对散热片材16造成的损伤。需要说明的是,该保护膜15也可以是在两面具有粘结性的双面胶带。通过使保护膜15为双面胶带,例如,能够将散热片材16与壳体或者散热器连接,能够更高效地进行散热或者传热。
接下来,对使用实施方式1的散热片材16的散热结构体进行说明。散热结构体是指将散热片材16贴合于打印基板的结构体。
图4是使用实施方式1的散热片材16的散热结构体20的剖视图。
在打印基板19的上表面19a安装有IC等发热部件17以及其他电子部件18。发热部件17的高度为约1mm。散热片材16中,使导热膜14贴合于厚度为约1.3mm的导热树脂片材11。
散热结构体20中,通过使打印基板19的上表面19a与导热树脂片材11的下表面111抵接并进行加压,由此使导热树脂片材11发生塑性变形。导热树脂片材11与发热部件17的上表面整体、连结于发热部件17的上表面和下表面的侧面以及打印基板的上表面19a抵接。
在此,导热树脂片材11的凹部12优选与发热部件17的侧面中的、从发热部件17的上表面到底面为止的一半以上抵接。
相对于本实施方式的导热树脂片材11,在使具有弹性的导热树脂片材与发热部件17抵接并进行加压的情况下,导热树脂片材11与发热部件的上表面抵接,但导热树脂片材11与发热部件17的侧面因回弹而无法充分地抵接。另一方面,本实施方式的导热树脂片材11在发热部件17的上表面与形成凹部的局部薄的薄壁部11b抵接的状态下被加压,因此能够以较小的压力使发热部件17的侧面紧贴于导热树脂片材11。此外,贴合于打印基板19之前的导热树脂片材11的周边部11a的厚度比发热部件17的高度大,因此导热树脂片材11也能够与打印基板19抵接。
根据以上的结构,由发热部件17产生的热量大多从发热部件17的上表面通过导热树脂片材11而传热至导热膜14。另外,能够使一部分的热量从发热部件17的侧面经由导热树脂片材11而传热至打印基板19。
如图4所示,塑性变形后的导热树脂片材11的薄壁部11b的厚度T1为约0.4mm。薄壁部11b的厚度T1越薄、从发热部件17产生的热量能够越迅速地传热至导热膜14,故是优选的。薄壁部11b的厚度T1优选为大于0mm且0.5mm以下。根据以上的结构,能够在实用方面确保良好的散热性。
作为向打印基板19贴合散热片材16的方法,举出通过辊的加压或者利用弹性体从散热片材16的上表面进行冲压的方法。这些方法均优选在导热膜14之上进一步设置保护膜15。此外,保护膜15的拉伸强度优选大于导热膜14的拉伸强度。由此,能够减少对打印基板19进行加压时的散热片材16的破损。
以上,本实施方式的散热结构体20能够远比现有的导热片材更高效地散热或者传热。
(实施方式2)
图5是实施方式2中的散热片材36的立体图。图6是将图5的散热片材36以VI-VI线剖开的剖视图。图7是将图6的散热片材36的一部分B扩大的剖视图。图5所示的实施方式2的散热片材36具备供实施方式1中的散热片材16的凹部12的底面11ba(薄壁部11b)贯穿的贯通孔32。
如图7所示,散热片材36在由厚度为约1.2mm的苯乙烯聚合物构成的导热树脂片材31的上表面设有厚度为10μm的双面胶带作为粘结层33。此外,在粘结层33的上表面设有厚度为约25μm的石墨膜作为导热膜34。此外,在导热膜34的上表面设有厚度为约10μm的保护膜35。导热树脂片材31由在25℃时发生塑性变形的材料构成,且由能够在25℃时发生塑性变形且不含有硅氧烷的苯乙烯聚合物构成。
粘结层33从导热树脂片材31的贯通孔32露出。
以上的散热片材36中,以安装于打印基板的发热部件进入贯通孔32的方式使散热片材36抵接而施加加压力,由此使导热树脂片材31塑性变形。发热部件的上表面粘结于从贯通孔32露出的粘结层33的露出面33a。塑性变形后的导热树脂片材31抵接并紧贴于发热部件的侧面以及打印基板。
根据以上的结构,实施方式2的散热片材36能够使由发热部件产生的热量经由粘结层33而沿由石墨膜构成的导热膜34的面方向散热或者传热,并且也从发热部件的侧面通过导热树脂片材31而向打印基板散热或者传热。
导热树脂片材31具有绝缘性,能够在25℃时发生塑性变形。在此,塑性变形是指,弹性复原率为50%以下的变形。需要说明的是,关于弹性复原率的定义以及测定方法与实施方式1相同,故省略说明。
在实施方式2的导热树脂片材31中使用的苯乙烯聚合物与在实施方式1的导热树脂片材11中使用的苯乙烯聚合物相同地,弹性复原率为约30%。
关于导热膜34以及导热树脂片材31的导热率,也与实施方式1相同,故省略说明。
在将发热部件***到贯通孔32之前,粘结层33的露出面33a的大小优选大于发热部件的大小。通过使粘结层33的露出面33a的大小大于发热部件的大小,能够使发热部件的上表面更可靠地紧贴于粘结层33的露出面33。需要说明的是,在使粘结层33的露出面33a的大小大于发热部件的大小的情况下,无需使发热部件的侧面整体与导热树脂片材31紧贴,发热部件的侧面中的至少一部分为紧贴的状态即可。
具体地说,优选粘结层33的露出面33a的大小比发热部件的大小在0.5~2.0mm的范围内减小。
根据以上的结构,发热部件更容易紧贴于导热树脂片材31。另外,导热树脂片材31的周边部31a的厚度优选为0.5~2.0mm。
根据以上的结构,导热树脂片材31能够与发热部件抵接并充分紧贴,从而获得散热性高的散热片材36。
此外,如图7所示,更优选在导热膜34的上表面预先贴合具有绝缘性的保护膜35。
根据以上的结构,能够确保散热片材36的表面的绝缘性,并且能够防止来自外部的应力对散热片材36造成的损伤。需要说明的是,该保护膜35也可以是在两面具有粘结性的双面胶带。
通过使保护膜15为双面胶带,例如能够将散热片材36与壳体或者散热器连接,从而能够更高效地进行散热或者传热。
接下来,对使用实施方式2的散热片材36的散热结构体进行说明。散热结构体是将散热片材36贴合于打印基板的结构体。
图8是使用实施方式2的散热片材36的散热结构体40的剖视图。
在打印基板39安装有IC等发热部件37以及其他电子部件38。发热部件37的高度为约1mm。散热片材36中,在厚度为约1.2mm的导热树脂片材31上贴合有导热膜34。
散热结构体40中,使打印基板39的上表面39a与导热树脂片材31的下表面333抵接并进行加压,由此使导热树脂片材11塑性变形。导热树脂片材31紧贴于发热部件37的上表面整体、侧面以及打印基板39的上表面39a。
在向贯通孔32中***发热部件37之前,导热树脂片材31的粘结层33的露出面33a的大小也可以大于发热部件37的上表面的大小。
而且,以发热部件37进入导热树脂片材31的贯通孔32之中的方式进行对位,使导热树脂片材31的下表面333与打印基板39的上表面39a抵接并进行加压,由此使导热树脂片材31发生塑性变形并贴合于打印基板39。
根据以上的结构,导热树脂片材31发生塑性变形,发热部件37的上表面粘结于导热膜34的粘结层33的露出面33a,能够使发热部件37的侧面以及打印基板39的上表面39a紧贴于导热树脂片材31。
导热树脂片材31的贯通孔优选为与发热部件37的侧面中的、从发热部件的上表面到底面为止的一半以上抵接的结构。
根据以上的结构,也能够从发热部件37的侧面释放出更多的热量。
如以上那样,实施方式2的散热片材36使由发热部件37产生的热量的大部分从发热部件37的上表面通过导热树脂片材31而传热至导热膜34。另外,一部分的热量也能够从发热部件37的侧面传递至导热树脂片材31,进而也向打印基板39传热,从而能够远比现有的导热片材更高效地进行散热或者传热。
另外,作为使散热片材36贴合于打印基板39的方法,举出通过辊的加压或者利用弹性体从散热片材36的上表面进行冲压的方法。在该情况下,优选在导热膜34之上预先设置保护膜35。保护膜35的拉伸强度优选比导热膜34的拉伸强度大。
根据以上的结构,能够减少加压于打印基板39时产生的散热片材36的破损。
需要说明的是,实施方式中的表示上表面、下表面等方向的用语是表示打印基板、散热片材的构成部件的相对位置关系的用语,并非表示绝对的方向。
工业实用性
本发明所涉及的散热片材以及使用该散热片材的散热结构能够高效地对由发热部件产生的热量进行散热或者传热,且容易相对于打印基板拆卸,故在产业方面是有用的。
附图标记说明:
11 导热树脂片材;
11a 周边部;
11b 薄壁部;
11ba 底面;
12 凹部;
12a 开口部;
13 粘结层;
14 导热膜;
15 保护膜;
16 散热片材;
17 发热部件;
18 电子部件;
19 打印基板;
20 散热结构体;
31 导热树脂片材;
31a 周边部;
32 贯通孔;
33 粘结层;
33a 露出面;
34 导热膜;
35 保护膜;
36 散热片材;
37 发热部件;
38 电子部件;
39 打印基板;
40 散热结构体。
Claims (10)
1.一种散热片材,其中,
所述散热片材具备:
导热树脂片材;
粘结层,其设于所述导热树脂片材的上表面;以及
导热膜,其设于所述粘结层的上表面,且导热率比所述导热树脂片材高,
所述导热树脂片材具有在所述导热树脂片材的下表面形成凹部的局部薄的薄壁部,
所述凹部构成为供发热部件***,
所述凹部的底面的大小小于所述发热部件的上表面的大小,
一边使所述导热树脂片材弯曲一边从所述发热部件的一方的侧面朝向另一方的侧面依次抵接。
2.根据权利要求1所述的散热片材,其中,
所述薄壁部的厚度为所述导热树脂片材的周边部的厚度的5%以上且70%以下。
3.根据权利要求1所述的散热片材,其中,
所述凹部以随着从所述导热树脂片材的所述下表面接近所述凹部的底面而所述凹部的宽度缩窄的方式成为锥状。
4.根据权利要求1所述的散热片材,其中,
所述凹部设于比所述导热树脂片材的周边部靠内侧的位置。
5.根据权利要求1所述的散热片材,其中,
所述导热树脂片材由不含有硅氧烷且在25℃时发生塑性变形的材料构成。
6.根据权利要求1所述的散热片材,其中,
所述导热树脂片材由苯乙烯聚合物构成。
7.一种散热结构体,其中,
所述散热结构体具有:
打印基板;
发热部件,其安装于所述打印基板的上表面;以及
散热片材,
所述散热片材具有:
导热树脂片材;
粘结层,其设于所述导热树脂片材的上表面;以及
导热膜,其设于所述粘结层的上表面,且导热率比所述导热树脂片材高,
所述导热树脂片材具有:
凹部,其设于所述导热树脂片材的下表面,且具有与所述发热部件的上表面抵接的底面;以及
形成所述凹部的局部薄的薄壁部,
所述导热树脂片材与所述打印基板的所述上表面的至少一部分、所述发热部件的所述上表面的全部、以及所述发热部件的侧面中的从所述发热部件的所述上表面至下表面为止的一半以上抵接,
在所述发热部件没有进入到所述凹部的状态下,所述凹部的所述底面的大小小于所述发热部件的所述上表面的大小,
一边使所述导热树脂片材弯曲一边从所述发热部件的一方的侧面朝向另一方的侧面依次抵接。
8.根据权利要求7所述的散热结构体,其中,
所述薄壁部的厚度为所述导热树脂片材的周边部的厚度的5%以上且70%以下。
9.根据权利要求7所述的散热结构体,其中,
所述凹部设于比所述导热树脂片材的周边部靠内侧的位置。
10.根据权利要求7所述的散热结构体,其中,
所述导热树脂片材由苯乙烯聚合物构成。
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JP2018019001A (ja) * | 2016-07-29 | 2018-02-01 | 株式会社カネカ | フィルム状熱伝導部材及び電子機器筐体 |
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