CN106466887B - 切断装置 - Google Patents

切断装置 Download PDF

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CN106466887B
CN106466887B CN201610270643.7A CN201610270643A CN106466887B CN 106466887 B CN106466887 B CN 106466887B CN 201610270643 A CN201610270643 A CN 201610270643A CN 106466887 B CN106466887 B CN 106466887B
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CN106466887A (zh
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冈岛康智
曽山正信
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Mitsuboshi Diamond Industrial Co Ltd
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
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    • B28D1/22Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26DCUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/20Cutting beds
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26DCUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/26Means for mounting or adjusting the cutting member; Means for adjusting the stroke of the cutting member
    • B26D7/2628Means for adjusting the position of the cutting member
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
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    • B28D1/225Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising for scoring or breaking, e.g. tiles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00Accessories specially adapted for use with machines or devices of the preceding groups
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
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    • B28D7/00Accessories specially adapted for use with machines or devices of the preceding groups
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    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
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    • C03B33/023Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033Apparatus for opening score lines in glass sheets
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/02Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/037Controlling or regulating
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26FPERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F2210/00Perforating, punching, cutting-out, stamping-out, severing by means other than cutting of specific products
    • B26F2210/08Perforating, punching, cutting-out, stamping-out, severing by means other than cutting of specific products of ceramic green sheets, printed circuit boards and the like

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Abstract

本发明提供一种切断装置,所述切断装置具有不使用垫板等就能简单地调整按压刃的顶端棱线与基板表面的平行度的切断条。所述切断装置(A)包括:工作台(1),载置基板(W);以及切断条(10),配置在工作台(1)的上方,切断条(10)具有排列为直线状的多个按压板(14),并且在各按压板(14)之间设置有间隙。

Description

切断装置
技术领域
本发明涉及对由玻璃、陶瓷、半导体晶片等脆性材料构成的基板进行分割的切断装置。本发明特别涉及切断装置的切断条,所述切断装置通过对在先前工序中形成了刻划线(切槽)的基板从该刻划线的相反侧的面按压来使基板弯曲,从而沿着刻划线分割基板。
背景技术
现有技术中已知如下例如在专利文献1、专利文献2中公开的方法:使用刀轮(也称为刻划轮)、激光束等在脆性材料基板(以下,简称为“基板”)的表面形成相互正交的X方向及Y方向的刻划线,之后沿该刻划线施加外力来进行切断,由此将基板分割为单元基板。
图5是概略地示出使用了切断条的现有技术的一般的切断装置的立体图。
切断装置21具有载置并保持成为加工对象的基板W的水平的工作台22。工作台22能够在水平面内转动,并且能够在Y方向上移动。在工作台22的上方设置有在X方向上水平地延伸的横梁(横向框架)23,在该横梁23安装有与该横梁23平行(X方向)地延伸的板状的切断条24,该切断条24能够经由汽缸25所驱动的升降轴27而进行升降。
当用该切断装置21切断基板W时,首先使刻划线S1、S2的任一者例如刻划线S1沿着X方向,夹着由弹性材料构成的缓冲板26将基板W载置于工作台22上。此时,以刻划线S1位于下表面侧的方式载置基板W。然后,使切断条24从基板W的上方的待机位置朝向刻划线S1下降,用其下端的按压刃24a按压基板W,使其在缓冲板26上稍微弯曲为V字形,由此使刻划线S1的裂纹伸展而切断基板W。此外,全部的刻划线S1的切断结束后,使工作台22进行90度旋转,与上述同样地用切断条24依次切断刻划线S2。
现有技术文献
专利文献
专利文献1:日本特开2014-080336号公报;
专利文献2:日本特开2002-187098号公报。
发明要解决的课题
通常,在利用切断条进行的分割中,当切断条对基板的压入量大时基板的弯曲变大,有时会由于分割侧端面彼此的接触等而在分割端面产生破损或者龟裂向未预期的方向延伸。此外,相反地当压入量小时,会出现由于弯曲不足而产生未被分割的部分等故障,因此需要确保切断条的适当的压入量。进而,还需要使切断条的按压刃的顶端棱线相对于基板平行地对峙,并且遍及刻划线全长均匀地施加按压力。
但是,由于现有技术的切断条是由一根长尺寸材料形成的,所以有时因为切断条主体、包含其安装部、工作台、其驱动机构的各构件的微小的误差,导致按压刃的顶端棱线与基板表面的平行度微妙地偏差。特别是在对大型的基板进行切断时,由于切断条的尺寸进一步变长,所以伴随于此平行度的偏差也会变大。
当平行度产生偏差时,无法遍及刻划线全长用适当的按压力均匀地按压,无法完美地切断。于是,现有技术中如图6所示将薄的垫板(垫片)28***到基板W的低的部分的下侧而调整平行度,但是该作业非常麻烦并且耗时。
发明内容
因此,鉴于上述的现有技术课题,本发明目的在于提供一种切断装置,所述切断装置具有不使用垫板等就能够简单地调整按压刃的顶端棱线与基板表面的平行度的切断条。
用于解决课题的方案
为了达到上述目的,本发明采用了如下技术手段。即,在本发明的切断装置中采用如下结构:一种切断装置,将形成有刻划线的脆性材料基板 沿着所述刻划线切断,所述切断装置包括:工作台,具有载置所述脆性材料基板的载置面;以及切断条,配置在所述工作台的上方,所述切断条由排列为直线状的多个按压板构成,在相邻的各按压板之间设置有间隙。
在上述发明中可以采用如下结构:各所述按压板具有用于调整所述按压板相对于所述脆性材料基板的表面的平行度的平行度调整机构。
发明效果
根据本发明,不使用现有技术的垫板,通过对各按压单元的按压板的上下位置、转动姿态进行调整,就能够准确且容易地修正按压刃相对于基板表面的平行度,能够高精度地切断基板。此外,由于使用由多个按压单元构成的集合体来构成切断条,所以具有通过配合基板的尺寸来增减按压单元的数量,从而总能够形成有效的最适合的长度的切断条的效果。
在本发明中可以采用如下结构:所述平行度调整机构由枢轴和固定螺钉形成,所述枢轴以相对于所述支承板转动自由的方式对所述按压板进行枢轴支承,所述固定螺钉对转动进行锁定。
由此,能够简洁地形成并且能够容易地进行调整操作。
附图说明
图1是示出本发明的切断装置的概略的整体结构的立体图。
图2是图1中的切断条的放大立体图。
图3是示出图1中的切断条的按压单元部分的放大正视图。
图4是图3中的B-B线剖视图。
图5是示出使用了现有技术的切断条的切断装置的概略结构的立体图。
图6是示出现有技术的切断条与基板表面的平行度的调整机构的说明图。
具体实施方式
以下,基于实施附图对本发明的切断装置的细节进行说明。图1是示 出本发明的切断装置的概略的整体结构的立体图,图2~4是示出图1所示的切断条的细节的图。
如图1所示,本发明的切断装置A形成为具有工作台1,所述工作台1具有用于载置基板W的载置面1a,在工作台1的表面设置有许多吸气孔(未图示),利用该吸气孔进行吸气由此对基板W进行吸附保持。
此外,工作台1能够利用通过电机3而旋转的螺丝轴4沿着水平的轨道2在Y方向上移动。进而,工作台1能够通过内置有电机的旋转驱动部5而在水平面内转动。
由夹着工作台1设置的两侧的支承柱6、6和架桥于该支承柱6、6且在X方向上延伸的横梁(beam)7形成门型的支承体。而且,在横梁7保持有在横梁7的延伸方向(X方向)上延伸的切断条10。在本实施例中,切断条10形成为能够从基板W上方的待机位置经由升降轴8和汽缸9相对于基板W进行升降。
如图2~4所示,切断条10由支承构件11和被该支承构件11支承的多个(在本实施例中为5个)按压单元12构成,所述支承构件11以经由升降轴8能够升降的方式被保持在切断装置A的横梁7。此外,按压单元12由支承板13和安装在该支承板13的下端的按压板14构成,所述支撑板13安装成能够相对于支承构件11调整上下位置。
支承板13安装成能够沿着形成在支承构件11并上下延伸的燕尾槽11a向上下方向移动,通过转动用于调整上下的螺栓15从而能够调整上下位置。
按压板14在其下端具有沿着横梁7的延伸方向直线状地延伸的按压刃14a,并且以各按压板14的侧端面彼此相邻的方式配置在一条直线上。
进而,按压板14以能够相对于基板W的表面调整按压刃14a的平行度的方式经由平行度调整机构16安装在支承板13。在本实施例中,平行度调整机构16由枢轴16a和固定螺钉16b形成,所述枢轴16a以相对于支承板13转动自由的方式对按压板14进行枢轴支承,所述固定螺钉16b对转动进行锁定。此外,固定螺钉16b经由设置在按压板14的将枢轴16a作为中心的圆弧状的长孔16c而螺合于支承板13。
另外,在相邻的按压板14、14的侧端面彼此之间,预先设置有允许调整平行度的0.3~1mm左右的间隙L。
如上述那样构成的切断条10通过以下的方法从而能够简单地进行各按压刃14a相对于基板W表面的平行度的修正。
首先,在基板W的切断操作之前,松开固定螺钉16b而使按压板14处于转动自由的状态,之后转动用于调整上下的螺栓15,使全部的按压板14从上方的待机位置下降至与基板W的表面抵接的位置。在按压板14的按压刃14a变成沿着基板W表面的平行姿态的状态下拧紧固定螺钉16b而固定按压板14的姿态。然后,转动用于调整上下的螺栓15而使按压板14返回到原来的待机位置。由此,能够简单地修正全部的按压刃14a的相对于基板W表面的平行度。
根据上述那样的本发明,不使用现有技术那样的垫板28,通过对各按压单元12的按压板14的上下位置、转动姿态进行调整,就能够准确且容易地修正按压刃14a相对于基板W表面的平行度,能够高精度地切断基板W。此外,由于切断条10采用由多个按压单元12构成的集合体的结构,所以通过配合基板W的尺寸来增减按压单元12的数量,从而总能够形成有效的最适合的长度的切断条10。
以上对本发明的代表性的实施例进行了说明,但是本发明并不限定于上述的实施方式。例如虽然在上述的实施例中示出了通过将切断条10从上方的待机位置朝向基板W压下来使基板W弯曲从而沿着刻划线进行切断的例子,但是,代替于此,也能够使切断条10在与基板W的表面接触的位置静止,在该状态下使锤落下到切断条10,通过其冲击而使基板W沿着刻划线切断。除此之外,本发明能够在达成本发明的目的、不脱离权利要求书的范围内进行适当修正、变更。
工业上的可利用性
本发明可利用于沿着在基板上形成的刻划线来分割基板的切断装置。
附图标记说明
A:切断装置;
W:基板;
1:工作台;
1a:载置面;
7:横梁;
8:升降轴;
10:切断条;
11:支承构件;
12:按压单元;
13:支承板;
14:按压板;
14a:按压刃;
15:用于调整上下的螺栓;
16:平行度调整机构;
16a:枢轴;
16b:固定螺钉。

Claims (1)

1.一种切断装置,将形成有刻划线的脆性材料基板沿着所述刻划线切断,所述切断装置包括:
工作台,具有载置所述脆性材料基板的载置面;以及
切断条,配置在所述工作台的上方,
所述切断条由多个按压板构成,各所述按压板以其侧端面彼此相邻的方式配置在一条直线上,
在相邻的各按压板之间设置有间隙,
各所述按压板具有用于调整所述按压板相对于所述脆性材料基板的表面的平行度的平行度调整机构,
所述平行度调整机构由枢轴和固定螺钉形成,
所述枢轴以相对于支承板转动自由的方式对所述按压板进行枢轴支承,所述固定螺钉对转动进行锁定。
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