CN106463500A - 具有压力件的紧固设备 - Google Patents
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Abstract
本发明涉及一种紧固设备(1),具有机械夹紧的依次堆叠地设置的组件(3‑7)的布置(2)、用于在组件的布置上产生机械压力的紧固装置以及用于将机械压力从紧固装置传送到所述布置(2)的压力件(10)。为了平面均匀地传送压力,按照本发明,压力件(10)包含金属泡沫材料。
Description
技术领域
本发明涉及一种紧固设备,具有机械夹紧的依次堆叠地设置的组件的布置、用于在组件的布置上产生机械压力的紧固装置以及用于将机械压力从紧固装置传送到所述布置的压力件。
背景技术
这种紧固设备由现有技术所公知。
文献DE 10 2011 006 990 A1描述了一种柱状紧固设备,其中借助构造为压力板的压力件和紧固螺钉将堆叠地上下布置的功率二极管和散热器彼此机械地夹紧。借助紧固螺钉产生的压力在此在特定的点被传送到压力板。这在该公知的紧固设备中导致不均匀的压力分布。在柱状紧固设备的中心轴区域中产生的压力远高于在其边缘区域中产生的压力。
发明内容
本发明要解决的技术问题是,建立一种上述类型的紧固设备,其中压力的传送是尽可能均匀的。
按照本发明,上述技术问题在紧固设备中通过压力件来解决,该压力件包含金属泡沫材料。
通过使用金属泡沫材料,其弹性特性可以有针对性地控制并且可以通过相应的制造来影响,可以在将压力传送到组件的布置上时实现相对均匀的压力分布。如果组件是并联连接的、具有相对大的平面并且还是细和脆的半导体芯片,这是特别重要的。在这样的情况下,不均匀性会导致组件损坏。此外,压力件可以关于待夹紧的组件的大小任意伸缩。相应地,按照本发明的紧固设备的优点可以应用于任意大小的组件。
通过使用包含金属泡沫材料的压力件,可以实现衰减设备振荡的附加效果。与实心材料相比,金属泡沫材料的衰减特性可以高出2-3倍。这尤其可以在高压技术(例如高压直流传输)的应用中是具有优势的,在那里通过高频激励使所述布置的组件一般处于振荡并且由此受到机械应力。
作为金属泡沫材料例如可以考虑以钢、铝或氧化钛为基础的泡沫材料。金属泡沫材料可以借助由专业人员已知的粉末冶金法来制造。在这种的方法中将金属粉末(例如铝)与释放气体的发泡剂(例如氢化钛)相混合。然后,将粉末混合物浓缩并且在热处理过程中使其发泡。可以考虑借助专业人员同样已知的熔炼冶金法来制造金属泡沫材料。用于制造金属泡沫材料的方法例如在文献DE 10 2006 031 213 B3中描述。在已知的方法中可以几乎任意地选择在金属泡沫中形成的气孔的数量和/或大小以及金属泡沫材料的大小和由此弹性特性。
弹性特性例如可以通过弹性模量来表征或量化。随着气孔的体积分量的增加,金属泡沫材料的弹性模量和由此其硬度相应地减小。
按照本发明的优选的实施方式,压力件包含多个具有不同弹性特性的金属泡沫材料。通过金属泡沫材料在压力件中的合适的空间设置,可以特别有针对性地控制平面的压力分布并且将其与各个应用相匹配。较小的弹性模量在此意味着金属泡沫材料的较高的柔韧性。
按照本发明的特别优选的实施方式,压力件中的金属泡沫材料形成部分区域,所述部分区域设置为,使得部分区域的硬度关于所述布置的中心轴从内向外增加。通过部分区域的该空间设置可以实现特别均匀的压力传送。
按照本发明的另外的优选的实施方式,所述布置包括至少一个半导体元件,其中半导体元件包括平行设置的紧压包装半导体(Press-Pack-Halbleiter)(为此例如参见文献EP 1 403 923 A1)。由此,半导体元件由并排设置的半导体模块组成。半导体模块形成电组件的并联电路。在此,例如可以是IGBT半导体、二极管或晶闸管元件或者相应组合的、具有单独壳体的模块。这样的半导体模块的表面例如可以具有6至9mm的直径。组件的待夹紧的表面可以在400和1000cm2之间。
为了冷却半导体元件,所述布置优选地还包括至少一个由导电材料构成的冷却板,其中至少一个冷却板与半导体元件邻接地设置,从而在半导体元件和冷却板之间存在电接触。冷却板用于导出半导体元件中形成的热量。该热量尤其通过半导体元件的导通电阻形成。合适地,冷却板由还导热的材料组成,优选具有高于200W/(mK)的导热系数的材料,例如金属或金属合金。
所述布置还可以包括多个依次叠置的半导体元件,其中给每个半导体元件分配至少一个冷却板并且半导体元件构成串联电路。
特别优选地是,给每个半导体元件分配两个冷却板,其设置在各自的半导体元件的两侧。通过这种方式可以在半导体元件的两侧实现热排出。因为冷却板由导电材料制成,所以借助冷却板建立在半导体元件之间的电接触。
为了进一步改善压力传送的均匀性,视为特别具有优势的是,设置配合压力件,其关于组件的布置与压力件相对设置。配合压力件可以,但不是必须,与压力件相同地构造。特别地,两者可以圆锥形地、锥台形地、梯形地或以任意其它合适的形状构造。
此外,本发明涉及一种变流器的子模块,具有至少一个由功率半导体开关单元构成的串联电路和与之并联连接的能量存储器,该功率半导体开关单元分别具有带有相同的导通方向的可通断的功率半导体并且分别在上述导通方向的相反方向是导通的。这样的子模块的示例由DE 101 030 31 A1所公知。
基于已知的子模块,本发明要解决的另外的技术问题是,建议一种上面提到的类型的子模块,其尽可能少地发生故障。
按照本发明,上述技术问题通过这类子模块来解决,其中在前面描述的紧固装置中实现功率半导体开关单元的串联电路。
通过使用按照本发明的压力件可以避免半导体由于不均匀的压力分布而损坏和故障的危险。
附图说明
下面对照图1和图2所示的实施例对本发明作进一步的说明。
图1以示意图示出了按照本发明的紧固设备的实施例的横截面。
图2以示意图示出了按照本发明的子模块的实施例。
具体实施方式
图1示出了按照本发明的紧固设备1的示意性侧视图。紧固设备1包括依次堆叠地设置的组件3、4、5、6、7的布置2,这些组件彼此机械地夹紧。在本发明的图1中示出的实施例中,组件4和6是半导体元件。组件3、5和7是冷却板,其由导电且导热的材料制成。由此,在布置2的组件3-7之间存在导电连接,从而组件、并且特别是半导体模块4、6形成电的串联电路。布置2的组件3-7彼此夹紧,方法是,将由图1中未示出的紧固装置产生的机械力从两个端面侧施加到布置2。紧固装置例如可以以螺旋机构形式实现。由紧固装置产生的机械力的方向在图1中以附图标记8和9标出。借助压力件10和配合压力件11将机械力传送到紧固设备1。在图1中示出的紧固设备1的实施例中,紧固设备1具有圆形的基本平面。因此,压力件10和配合压力件11具有锥台形状。
压力件10包含金属泡沫材料,其中金属泡沫材料形成五个部分区域12-16。部分区域12、13、14、15和16设置为,使得其彼此部分地包围。在此,部分区域12被部分区域13部分地包围,部分区域13和部分区域14和相应地部分区域15被部分区域16部分地包围。给每个部分区域12-16分配金属泡沫材料,其中金属泡沫材料尤其通过其弹性模量来区分。部分区域12中的金属泡沫材料在此具有最低的弹性模量。这相应于所有部分区域的最大的气体含量或最小的硬度。相应地,在部分区域13-16中金属泡沫材料的弹性模量关于紧固设备的中心轴或对称轴17从内向外增加。
与压力件10相对地设置配合压力件11。配合压力件11与压力件10镜像地类似地构造。由此,配合压力件11具有部分区域18、19、20、21、22,其分别分配金属泡沫材料。部分区域18-22通过在其中包含的金属泡沫材料来区分。每个金属泡沫材料具有弹性模量,相应于压力件10,其关于轴17从内向外具有增加的值。
图2示出了按照本发明的子模块23的实施例。子模块23双极地构造,其中子模块23的极(端子)在图2中以附图标记24和25标出。子模块23构成图2中未图形地示出的变流器的部分,其中在构造变换器相位支路的条件下串联连接与子模块23类似构造的多个另外的子模块23。子模块23具有功率半导体开关单元26的串联电路,其中两个功率半导体开关单元26的每一个都由功率半导体开关27和与之反并联连接的二极管28组成。子模块23还包括存储电容29,其与功率半导体开关单元26的串联电路并联地设置。功率半导体开关单元26的串联电路以图1中示出的紧固设备1的形式实施。
附图标记列表
1 紧固设备
2 组件的布置
3-7 组件
8,9 箭头
10 压力件
11 配合压力件
12-16 部分区域
17 中心轴
18-22 部分区域
23 子模块
24,25 端子
26 功率半导体开关单元
27 功率半导体开关
28 二极管
29 能量存储器
Claims (8)
1.一种紧固设备(1),具有机械夹紧的依次堆叠设置的组件(3-7)的布置(2)、用于在组件(3-7)的布置上产生机械压力的紧固装置以及用于将机械压力从紧固装置传送到所述布置(2)的压力件(10),其特征在于,所述压力件(10)包含金属泡沫材料。
2.根据权利要求1所述的紧固设备(1),其中,所述压力件(10)包含多个具有不同弹性特性的金属泡沫材料。
3.根据权利要求2所述的紧固设备(1),其中,所述压力件(10)中的金属泡沫材料形成部分区域(12-16),所述部分区域设置为,使得部分区域(12-16)的硬度关于所述布置(2)的中心轴(17)从内向外增加。
4.根据上述权利要求中任一项所述的紧固设备(1),其中,所述布置(2)包括半导体元件(4,6)。
5.根据权利要求4所述的紧固设备(1),其中,所述布置(2)包括至少一个由导电材料构成的冷却板(5),其中至少一个冷却板与半导体元件(4,6)邻接地设置,从而在半导体元件(4,6)和冷却板(5)之间存在电接触。
6.根据权利要求5所述的紧固设备(1),其中,所述布置包括多个半导体元件(4,6),其中给每个半导体元件(4,6)分配至少一个冷却板(3,5,7)并且半导体元件(4,6)构成串联电路。
7.根据权利要求6所述的紧固设备(1),其中,给每个半导体元件(4,6)分配两个冷却板(3,5,7),其设置在半导体元件(4,6)的两侧。
8.一种变流器的子模块(23),具有至少一个由功率半导体开关单元(26)构成的串联电路和与之并联连接的能量存储器(29),该功率半导体开关单元分别具有带有相同的导通方向的可通断的功率半导体(27)并且分别在上述导通方向的相反方向是导通的,其特征在于,功率半导体开关单元(26)的串联电路按照根据权利要求1至7中任一项所述的紧固设备(1)实现。
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US6686658B2 (en) * | 1998-01-15 | 2004-02-03 | Hitachi, Ltd. | Semiconductor device, including an arrangement to provide a uniform press contact and converter using same |
US6642576B1 (en) * | 2002-07-15 | 2003-11-04 | Mitsubishi Denki Kabushiki Kaisha | Power semiconductor device having layered structure of power semiconductor elements and terminal members |
CN101593748A (zh) * | 2009-06-30 | 2009-12-02 | 许继集团有限公司 | 顶压连接的串联晶闸管阀段 |
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KR20170013938A (ko) | 2017-02-07 |
US20170162470A1 (en) | 2017-06-08 |
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CA2954019A1 (en) | 2016-01-07 |
CA2954019C (en) | 2019-10-15 |
KR101921585B1 (ko) | 2018-11-26 |
RU2660397C1 (ru) | 2018-07-06 |
US10103085B2 (en) | 2018-10-16 |
WO2016000762A1 (de) | 2016-01-07 |
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