CN106449625A - 基于荧光基板的倒装led灯丝及其封装工艺 - Google Patents
基于荧光基板的倒装led灯丝及其封装工艺 Download PDFInfo
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Abstract
本发明涉及一种基于荧光基板的倒装LED灯丝及其封装工艺,该倒装LED灯丝包括呈长条状的荧光基板,在荧光基板的两端分别设有焊盘,其特征在于,在荧光基板的一面设有至少一根两端分别与所述的焊盘相连的且为串联或者并联的金属线路、在每根金属线路上分别设有若干倒装LED芯片,且设置在金属线路上的若干倒装LED芯片位于同一直线上,在荧光基板设有焊盘和金属线路的一面涂有荧光胶,荧光胶以单面涂覆方式将倒装LED芯片封装于荧光基板上。基于荧光基板的倒装LED灯丝封装工艺,其步骤包括 A、固晶,B、焊接,C、点胶。本发明的优点在于:发光亮度均匀且提高了生产效率、使用寿命长。
Description
技术领域
本发明涉及一种基于荧光基板的倒装LED灯丝及其封装工艺,特别涉及基于荧光基板的倒装LED灯丝结构及其封装方法。
背景技术
发光二极管(Light Emitting Diode)是21世纪最具有发展前景的一种冷光源,因其节能、环保、可靠性高和设计灵活等优点在照明领域得到广泛开发和应用。随着禁止使用白炽灯计划的推行,钨白炽灯行将消失,LED灯丝灯逐步取代钨丝白炽灯在人们心中的地位,倒装LED灯丝是无频闪、无蓝光泄出、低热、长寿命、缓衰减等特性的新一代LED照明新光源,因其倒装和平面涂覆工艺以及360°立体发光的特点赢得怀旧的人们喜爱和追捧。
目前倒装LED产品主要为灯丝与灯片,且商业化倒装LED灯丝以白陶瓷作为基板为主流,白光LED 的制作方法通常是利用蓝光LED 作为基础光源来激发荧光胶。倒装LED灯丝的制作方法主要是在陶瓷基板上印刷银线,通过固晶工艺将倒装蓝光LED芯片固定在陶瓷基板上,再通过双面涂覆工艺将混合充分的荧光粉和硅胶分别涂覆在陶瓷基板的两面,充分烘烤后形成倒装LED灯丝。采用陶瓷作为基板得到的倒装LED灯丝,由于陶瓷基板为单面透光材质,使蓝光LED发出的基础光源不能被完全利用,导致倒装LED灯丝的光通量偏低。采用这种方法得到的倒装LED灯丝,由于涂覆方式为双面涂覆,即陶瓷基板的两面都有荧光胶,芯片背面产生的热量需要通过陶瓷基板和荧光胶后才能散发出去,散热不良导致芯片温度升高进一步导致荧光粉性能劣化使荧光胶加速老化导致透过率下降,倒装LED灯丝使用寿命缩短。同时,由于荧光粉在胶体中分布的不均匀性,出现不同白光倒装LED 灯丝之间白光质量不一致的问题。现阶段虽然在提高封装的均匀性、稳定性、老化性及灯丝散热性能方面有一定的进展,但仍然不能满足高光效、高显色指数、长寿命的大功率白光LED灯丝照明的发展需求。
荧光基板相比陶瓷基板拥有荧光粉优异的发光性能和良好的热学、物理、化学稳定性、且透光率好、激发效率高、封装工艺简单,非常适合作为传统LED灯丝陶瓷基板的替代材料并适合大批量生产。
发明内容
本发明要解决的技术问题是提供一种基于荧光基板的倒装LED灯丝及其封装工艺,用于提高传统倒装LED灯丝的稳定性,延长灯丝的使用寿命。
本发明的技术方案是:一种基于荧光基板的倒装LED灯丝,包括呈长条状的荧光基板,在荧光基板的两端分别设有焊盘,其特征在于,在荧光基板的一面设有至少一根两端分别与所述的焊盘相连的且为串联或者并联的金属线路、在每根金属线路上分别设有若干倒装LED芯片,且设置在金属线路上的若干倒装LED芯片位于同一直线上,在荧光基板设有焊盘和金属线路的一面涂有荧光胶,荧光胶以单面涂覆方式将倒装LED芯片封装于荧光基板上。
所述荧光基板为荧光晶体、荧光陶瓷、荧光玻璃陶瓷、荧光薄膜中的任一种。
所述的荧光胶将荧光基板的两侧覆盖,当倒装LED芯片通电后从荧光胶和荧光基板射出的的光均为白光,且两者白光的色温相同。
所述荧光胶为红色与绿色荧光粉按照设定比例与硅胶充分混合而成。
所述倒装LED芯片为蓝光芯片,尺寸为06milx20mil或08milx20mil,且该芯片的波长为440-460nm。
一种基于荧光基板的倒装LED灯丝的封装工艺,包括以下步骤:
A、在所述金属线路相应的位置用锡膏粘接倒装LED芯片,使所述倒装LED芯片固定在所述荧光基板上;
B、对固晶后的所述荧光基板进行焊接,焊接方式为回流焊;
C、将所述荧光胶充分搅拌均匀后用真空脱泡机进行脱泡处理;
D、在所述荧光基板相应的位置单面涂覆所述荧光胶进行点胶操作;
E、对点胶后的所述倒装LED灯丝在160℃下烘烤两小时后转移到180℃下再烘烤两小时。
步骤B之后将固晶好的荧光基板降至25℃,对所述的荧光基板及其连接的所述倒装LED芯片进行检测,对固晶不良的灯丝进行补晶以及补焊操作。
步骤D之后对点胶完成后未烘烤的半成品灯丝进行检测,对不符合产品色温要求的所述荧光胶的比例进行调整。
本发明采用上述结构以及封装工艺后具有如下有益效果:
(1) 以荧光基板替代陶瓷基板的技术方案,具有激发发射效率高、物理化学性能稳定、高度均匀性、热导率高、后处理工艺简单等一系列优点,克服陶瓷基板的稳定性差、易老化等问题。
(2)采用倒装LED芯片,固晶工艺简单,避免了灯丝在封装或运输过程中由于焊线断裂造成的损坏。
(3)本发明可通过改变荧光粉与硅胶的比例从而达到不同的光通量、色温、显指以及光色要求。满足实际生活环境对发光的要求。
(4)该倒装LED 灯丝封装结构简单,其制作工艺简易,适合大规模的工业化生产。
(5)在发明中,所述荧光基板比传统的陶瓷基板的散热效果好,且具有良好的散热性,。封装面粘接荧光胶后能3D全方位发光,拥有立体发光效果,且发光均匀,光衰较小,可靠性较高。
附图说明
图1为本发明提供的串联灯丝封装后结构示意图;
图2为本发明提供的并联灯丝封装后结构示意图;
图3为本发明提供的串联灯丝未封装的结构示意图;
图4为本发明提供的并联灯丝未封装的结构示意图;
图5为本发明提供的串联灯丝未贴芯片的结构示意图;
图6为本发明提供的并联灯丝未贴芯片的结构示意图;
图7为本发明提供的灯丝横向截面结构示意图。
具体实施方式
以下是发明的具体实施案例并结合附图,对本发明的技术方案做进一步的描述,但本发明并不限于这些实施例。
如图1,2所示,本发明的基于荧光基板的倒装LED灯丝,包括呈长条状的荧光基板1,在荧光基板1的两端分别设有焊盘11,在基板1的一面设有至少一根两端分别与所述的焊盘11相连接且相互串联或者并联设置的金属线路12,在每根金属线路12上分别设有若干倒装LED芯片2,且设置在金属线路12上的若干倒装LED芯片2位于同一直线上,倒装LED芯片为蓝光芯片,尺寸为06milx20mil或08milx20mil,且该芯片的波长为440-460nm。并联设置的金属线路12结合设置在不同弯曲金属线路12上的LED倒装芯片2位于同一直线上的结构可以大幅降低生产制造的成本,同时,便于制造和使用控制。在荧光基板1设有焊盘11和金属线路12的一面涂有荧光胶3,荧光胶3以单面涂覆方式将倒装LED芯片2封装于荧光基板1上。荧光胶3将荧光基板1的两侧覆盖,当倒装LED芯片通电后从荧光胶3和荧光基板1射出的的光均为白光,且两者白光的色温相同。荧光胶3为红色与绿色荧光粉按照设定比例与硅胶充分混合而成。
如图7所示,荧光胶3周向将荧光基板1封装后和所述的荧光基板1相连形成呈半圆柱状的结构。半圆柱状的结构体积小且制造成本低,封装方式简单。该结构能够保证发光亮度的均匀性,从而提高实用性。
如图3至图6所示,本实施例的焊盘11设置在荧光基板1的一面,且金属线路的两端分别与两端的焊盘相连接。
本发明的基于荧光基板的倒装LED灯丝的封装工艺,包括如下步骤:
A、在所述金属线路12相应的位置用锡膏粘接倒装LED芯片,使所述倒装LED芯片2固定在所述荧光基板1上;
B、对固晶后的所述荧光基板1进行焊接,焊接方式为回流焊;
C、将所述荧光胶3充分搅拌均匀后用真空脱泡机进行脱泡处理;
D、在所述荧光基板1相应的位置单面涂覆所述荧光胶3进行点胶操作;
E、对点胶后的所述倒装LED灯丝在160℃下烘烤两小时后转移到180℃下再烘烤两小时。
步骤B之后将固晶好的荧光基板1降至25℃,对所述的荧光基板1及其连接的所述倒装LED芯片2进行检测,对固晶不良的灯丝进行补晶以及补焊操作。
步骤D之后对点胶完成后未烘烤的半成品灯丝进行检测,对不符合产品色温要求的所述荧光胶3的比例进行调整。
Claims (8)
1.一种基于荧光基板的倒装LED灯丝,包括呈长条状的荧光基板(1),在荧光基板(1)的两端分别设有焊盘(11),其特征在于,在荧光基板(1)的一面设有至少一根两端分别与所述的焊盘(11)相连的且为串联或者并联的金属线路(12)、在每根金属线路(12)上分别设有若干倒装LED芯片(2),且设置在金属线路(12)上的若干倒装LED芯片(2)位于同一直线上,在荧光基板(1)设有焊盘(11)和金属线路(12)的一面涂有荧光胶(3),荧光胶(3)以单面涂覆方式将倒装LED芯片(2)封装于荧光基板(1)上。
2.根据权利要求1所述的基于荧光基板的倒装LED灯丝,其特征在于:所述荧光基板(1)为荧光晶体、荧光陶瓷、荧光玻璃陶瓷、荧光薄膜中的任一种。
3.根据权利要求1所述的基于荧光基板的倒装LED灯丝,其特征在于:所述的荧光胶(3)将荧光基板(1)的两侧覆盖,当倒装LED芯片通电后从荧光胶(3)和荧光基板(1)射出的的光均为白光,且两者白光的色温相同。
4.根据权利要求1所述的基于荧光基板的倒装LED灯丝,其特征在于:所述荧光胶(3)为红色与绿色荧光粉按照设定比例与硅胶充分混合而成。
5.根据权利要求1所述的基于荧光基板的倒装LED灯丝,其特征在于:所述倒装LED芯片(2)为蓝光芯片,尺寸为06milx20mil或08milx20mil,且该芯片的波长为440-460nm。
6.一种权利要求1-5任一项所述的基于荧光基板的倒装LED灯丝的封装工艺,其特征在于,包括以下步骤:
A、在所述金属线路(12)相应的位置用锡膏粘接倒装LED芯片,使所述倒装LED芯片(2)固定在所述荧光基板(1)上;
B、对固晶后的所述荧光基板(1)进行焊接,焊接方式为回流焊;
C、将所述荧光胶(3)充分搅拌均匀后用真空脱泡机进行脱泡处理;
D、在所述荧光基板(1)相应的位置单面涂覆所述荧光胶(3)进行点胶操作;
E、对点胶后的所述倒装LED灯丝在160℃下烘烤两小时后转移到180℃下再烘烤两小时。
7.根据权利要求6所述的基于荧光基板的倒装LED灯丝的封装工艺,其特征在于:步骤B之后将固晶好的荧光基板(1)降至25℃,对所述的荧光基板(1)及其连接的所述倒装LED芯片(2)进行检测,对固晶不良的灯丝进行补晶以及补焊操作。
8.根据权利要求6所述的基于荧光基板的倒装LED灯丝的封装工艺,其特征在于:步骤D之后对点胶完成后未烘烤的半成品灯丝进行检测,对不符合产品色温要求的所述荧光胶(3)的比例进行调整。
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Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
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Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103956421A (zh) * | 2014-04-22 | 2014-07-30 | 中国科学院上海光学精密机械研究所 | 基于透明荧光陶瓷的led灯 |
CN104051597A (zh) * | 2014-06-13 | 2014-09-17 | 骆伟经 | 全方位led器件的封装方法 |
CN204271077U (zh) * | 2014-08-29 | 2015-04-15 | 王维昀 | 全周光led光源 |
-
2016
- 2016-11-30 CN CN201611082152.6A patent/CN106449625A/zh active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103956421A (zh) * | 2014-04-22 | 2014-07-30 | 中国科学院上海光学精密机械研究所 | 基于透明荧光陶瓷的led灯 |
CN104051597A (zh) * | 2014-06-13 | 2014-09-17 | 骆伟经 | 全方位led器件的封装方法 |
CN204271077U (zh) * | 2014-08-29 | 2015-04-15 | 王维昀 | 全周光led光源 |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106895282A (zh) * | 2017-03-13 | 2017-06-27 | 上海应用技术大学 | 将荧光薄膜用于led灯丝制作球泡灯的方法 |
CN108155106A (zh) * | 2017-12-22 | 2018-06-12 | 珠海市大鹏电子科技有限公司 | 一种长爬电光电耦合器的制备工艺 |
CN108630797A (zh) * | 2018-04-27 | 2018-10-09 | 上海应用技术大学 | 一种倒装柔性led灯丝的固晶工艺 |
CN109119516A (zh) * | 2018-09-11 | 2019-01-01 | 台山鸿隆光电科技有限公司 | 一种led灯丝制作工艺 |
CN109538972A (zh) * | 2018-12-06 | 2019-03-29 | 上海应用技术大学 | 一种led创意球泡灯 |
CN111146324A (zh) * | 2019-11-25 | 2020-05-12 | 华中科技大学鄂州工业技术研究院 | 一种超高显色指数白光led器件 |
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