CN111375898A - Machining method for machining cutter with complex cutting edge by combined laser - Google Patents
Machining method for machining cutter with complex cutting edge by combined laser Download PDFInfo
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- CN111375898A CN111375898A CN202010218325.2A CN202010218325A CN111375898A CN 111375898 A CN111375898 A CN 111375898A CN 202010218325 A CN202010218325 A CN 202010218325A CN 111375898 A CN111375898 A CN 111375898A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/60—Preliminary treatment
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Abstract
The invention provides a processing method for processing a complex cutting edge cutter by combined laser, which comprises the following specific steps: cleaning a cutter blank to be processed, and clamping the cutter blank on a machine tool; the laser integrated system is used for processing, and the system is provided with three sets of nanosecond-picosecond-femtosecond laser systems at the same time and can be converted on the same operation platform. The invention provides a processing method for processing a complex cutting edge cutter by using combined laser, which uses a nanosecond-picosecond-femtosecond combined laser processing system to realize one-step forming from contour forming to cutting edge finish machining of the cutter, and three lasers realize the balance of processing efficiency and processing precision. The invention can improve the processing efficiency and the processing precision, shorten the processing period and realize high-efficiency and high-precision processing.
Description
Technical Field
The invention belongs to the technical field of cutter processing, and particularly relates to a processing method for processing a cutter with a complex cutting edge by combined laser.
Background
Cutting tools are known as industrial "teeth". With the development of manufacturing industry, more typical difficult-to-process materials are widely used, and the requirements on processing quality and processing efficiency are continuously improved. Therefore, the material of the cutting tool develops towards the superhard direction, the profile of the cutting tool tends to be complex, and the requirements on precision and quality are higher. Due to the difficult processing characteristic of the cutter material, the traditional processing methods such as grinding, electric spark processing and the like are particularly difficult to manufacture superhard cutters and cutters with complex shapes, the manufacturing cost is high, the processing efficiency is low, and the processing technology is extremely complex. Therefore, new machining methods are needed to achieve machining of superhard cutters.
The laser processing is a new processing method for removing materials based on the photo-thermal effect, has the characteristics of no contact, high energy, flexible processing, small heat affected zone, no material selectivity and the like, and becomes an important means for replacing the traditional processing mode of difficult-to-process materials at home and abroad. Laser processing is divided into long pulse laser and short pulse laser according to the difference of pulse width, the long pulse laser is most used by nanosecond laser, and the short pulse laser is composed of picosecond laser and femtosecond laser.
The long pulse laser belongs to thermal processing, the processing efficiency is high, the removal amount is large, but the processing quality is relatively poor, and the heat affected zone is large, so the post-processing is still needed after the long pulse laser processing, the short pulse laser is ultrafast laser, the duration of each pulse is extremely short, the short pulse laser has very high instantaneous power, the heat effect is small, the processing precision is high, and the short pulse laser belongs to cold processing, but the energy of the short pulse laser is not enough for a large amount of materials, so the efficiency is low, wherein the femtosecond laser is smaller than the picosecond laser pulse width, and the processing precision is higher.
In the prior art, chinese patent CN201510569099 discloses an ultra-precision machining method for a complex-profile cutter, which utilizes a combined machining cutter of linear cutting, electro-erosion and laser machining to achieve an ultra-precision cutting edge, but this method needs to clamp the cutter three times, and every clamping needs to be repositioned, and patent CN 201410648592.8 discloses a PCD cutting edge machining method, which uses a combined machining cutter of linear cutting and laser, but needs to clamp and reposition for many times, and efficiency and positioning accuracy are not enough. Patent CN 201810038990.6 proposes a method for machining PCD cutter by using two lasers in one-time combination, but the machining is mainly used for two-dimensional machining, and the flexibility is not enough. In addition, chinese patent CN 201610876970.7 discloses a ceramic drilling method using a composite long pulse laser-picosecond-short pulse laser technology, wherein the composite laser processing is used for drilling ceramic holes, but the drilling mode is different from the laser processing mode and path used in linear/curved cutting in cutter processing.
Therefore, a new laser combination processing mode is needed to meet the requirements of efficient, precise and flexible processing of the complex and large-curvature profile of the superhard cutter.
Disclosure of Invention
The invention aims to provide a combined laser processing mode, which uses nanosecond-picosecond-femtosecond combined laser to process and position a superhard cutter with a complex profile at one time so as to realize one-time processing from contour forming to cutting edge finish machining. The invention can improve the processing efficiency and the processing precision, shorten the processing period and realize high-efficiency and high-precision processing.
The technical scheme of the invention is as follows:
a machining method for machining a cutter with a complex cutting edge by combined laser is characterized by comprising the following specific steps:
s1, cleaning the blank of the cutter to be processed, and clamping the blank on a machine tool;
s2, processing by using a laser integrated system, wherein the system is provided with three sets of laser systems of nanosecond, picosecond and femtosecond and can be converted on the same operation platform;
s3, roughly processing the blank into a required shape by using nanosecond laser, and simultaneously spraying auxiliary gas to blow away molten slag;
s4, semi-finishing the rough machined blank by picosecond laser to enable the cutting edge of the cutter to reach basic machining precision and reserve enough finishing allowance for finishing;
and S5, performing finish machining on the cutter by using the femtosecond laser, and removing a heat affected zone, a recast layer and the like remained after rough machining and semi-finish machining to meet the final machining requirement.
Further, in step S3, the nanosecond laser parameters are: the laser power is 10-100w, the spot diameter is 0.1-0.5mm, the scanning speed is 200-.
Further, in step S4, the picosecond laser parameters are: laser power is 10-50w, repetition frequency is 100-.
Further, in step S5, the femtosecond laser parameters: the laser power is 1-20w, the repetition frequency is 100-.
Further, in step S1, the tool to be machined is any one of a cemented carbide tool, a ceramic tool, a super hard coated tool, and a diamond tool, but not limited to these.
Further, in step S2, the integrated system is simultaneously equipped with three sets of processing systems, namely nanosecond-picosecond-femtosecond, and the processing mode is a pin turning processing or a milling processing, or a combination of the two.
Further, in steps S2 and S3, the nanosecond laser is any one of a pulsed fiber laser, a carbon dioxide gas laser, and a YAG laser; the machining mode is any one of milling or turning.
Further, in steps S2 and S4, the picosecond laser is any one of a pulsed fiber laser, a carbon dioxide gas laser and a YAG laser; the processing mode is two-dimensional processing or three-dimensional processing.
Further, in steps S2 and S5, the femtosecond laser is any one of a pulsed fiber laser and a carbon dioxide gas laser YAG laser; the processing mode is two-dimensional processing or three-dimensional processing.
Furthermore, in step S2, the tool blank is clamped by one-step mounting without disassembly, and the three sets of laser systems share the same positioning system without secondary positioning and operation, thereby ensuring the positioning accuracy.
The main innovation points of the invention are as follows:
1. the invention uses the laser integrated system to process, the system is provided with three sets of nanosecond-picosecond-femtosecond laser systems at the same time, the three sets of laser systems can be converted through the operating system and share one set of positioning system, repeated clamping and positioning are not needed in the processing process, and the one-step forming from contour forming to cutting edge finish machining of a cutter is realized;
2. the integrated system of the invention integrates turning and milling processing at the same time, can process independently or process in a combined manner, and realizes a complete set of process from the cutter outline to the cutter cutting edge;
3. the invention fully utilizes the characteristics of high efficiency of nanosecond laser and high-precision processing of picosecond/femtosecond laser, and simultaneously improves the processing efficiency and the processing quality.
The working principle of the invention is that a nanosecond-picosecond-femtosecond composite laser combined processing system is used, a set of positioning system is shared, repeated positioning is not needed, and one-step forming from contour forming to cutting edge finish machining of a cutter is realized. The nanosecond laser is used for carrying out contour machining rough machining, high-efficiency machining can be achieved, and the picosecond laser is used for carrying out semi-finish machining to remove the heat influence of rough machining and a recasting layer; the femtosecond laser carries out finish machining, reduces machining efficiency, promotes machining precision.
The invention has the beneficial technical effects that: the machining method for machining the complex cutting edge tool by the combined laser is provided, a nanosecond-picosecond-femtosecond combined laser machining system is used, one-step forming from contour forming to cutting edge finish machining of the tool is achieved, and balance between machining efficiency and machining precision is achieved by the three lasers.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail with reference to the following embodiments. It should be understood that the detailed description and specific examples, while indicating the scope of the invention, are intended for purposes of illustration only and are not intended to limit the scope of the invention.
Example 1
A machining method for machining a cutter with a complex cutting edge by combined laser is characterized by comprising the following specific steps:
s1, cleaning the blank of the cutter to be processed, and clamping the blank on a machine tool;
s2, processing by using a laser integrated system, wherein the system is provided with three sets of laser systems of nanosecond, picosecond and femtosecond and can be converted on the same operation platform;
s3, roughly processing the blank into a required shape by using nanosecond laser, and simultaneously spraying auxiliary gas to blow away molten slag;
s4, semi-finishing the rough machined blank by picosecond laser to enable the cutting edge of the cutter to reach basic machining precision and reserve enough finishing allowance for finishing;
and S5, performing finish machining on the cutter by using the femtosecond laser, and removing a heat affected zone, a recast layer and the like remained after rough machining and semi-finish machining to meet the final machining requirement.
Further, in step S3, the nanosecond laser parameters are: the laser power is 20w, the diameter of a light spot is 0.5mm, the scanning speed is 500mm/min, and the scanning times are 100 times.
Further, in step S4, the picosecond laser parameters are: the laser power is 10w, the repetition frequency is 200khz, the spot diameter is 0.1mm, the scanning speed is 1000mm/s, the scanning times are 5 times, and the laser taper is 5 degrees.
Further, in step S5, the femtosecond laser parameters: the laser power is 5w, the repetition frequency is 500khz, the spot diameter is 0.03mm, the scanning speed is 400mm/s, the scanning times are 10 times, and the laser taper is 5 degrees.
Further, in step S1, the tool to be machined is a cemented carbide tool.
Further, in step S2, the integrated system is simultaneously equipped with three sets of processing systems, namely nanosecond-picosecond-femtosecond, and the processing mode is turning and milling combined processing.
Further, in steps S2 and S3, the nanosecond laser is a carbon dioxide laser, and the machining mode is turning.
Further, in steps S2 and S4, the picosecond laser is a pulsed fiber laser, and the processing method is three-dimensional processing.
Further, in steps S2 and S5, the femtosecond laser is a pulsed fiber laser; the processing mode is three-dimensional processing.
Furthermore, in step S2, the tool blank is clamped by one-step mounting without disassembly, and the three sets of laser systems share the same positioning system without secondary positioning and operation, thereby ensuring the positioning accuracy.
Example 2
A machining method for machining a cutter with a complex cutting edge by combined laser is characterized by comprising the following specific steps:
s1, cleaning the blank of the cutter to be processed, and clamping the blank on a machine tool;
s2, processing by using a laser integrated system, wherein the system is provided with three sets of laser systems of nanosecond, picosecond and femtosecond and can be converted on the same operation platform;
s3, roughly processing the blank into a required shape by using nanosecond laser, and simultaneously spraying auxiliary gas to blow away molten slag;
s4, semi-finishing the rough machined blank by picosecond laser to enable the cutting edge of the cutter to reach basic machining precision and reserve enough finishing allowance for finishing;
and S5, performing finish machining on the cutter by using the femtosecond laser, and removing a heat affected zone, a recast layer and the like remained after rough machining and semi-finish machining to meet the final machining requirement.
Further, in step S3, the nanosecond laser parameters are: the laser power is 30w, the diameter of a light spot is 0.2mm, the scanning speed is 500mm/min, and the scanning times are 30 times.
Further, in step S4, the picosecond laser parameters are: the laser power is 30w, the repetition frequency is 300khz, the spot diameter is 0.2mm, the scanning speed is 500mm/s, the scanning times are 10 times, and the laser taper is 7 degrees.
Further, in step S5, the femtosecond laser parameters include a laser power of 10w, a repetition frequency of 700khz, a spot diameter of 0.05mm, a scanning speed of 500mm/S, a scanning frequency of 20 times, and a laser taper of 7 °.
Further, in step S1, the tool to be machined is a ceramic tool.
Further, in step S2, the integrated system is simultaneously equipped with three sets of processing systems, namely nanosecond-picosecond-femtosecond, and the processing mode is turning and milling combined processing.
Further, in steps S2 and S3, the nanosecond laser is YAG; the processing mode is turning.
Further, in steps S2 and S4, the picosecond laser is a carbon dioxide gas laser; the processing mode is three-dimensional processing.
Further, in steps S2 and S5, the femtosecond laser is a carbon dioxide gas laser; the processing mode is three-dimensional processing.
Furthermore, in step S2, the tool blank is clamped by one-step mounting without disassembly, and the three sets of laser systems share the same positioning system without secondary positioning and operation, thereby ensuring the positioning accuracy.
Example 3
A machining method for machining a cutter with a complex cutting edge by combined laser is characterized by comprising the following specific steps:
s1, cleaning the blank of the cutter to be processed, and clamping the blank on a machine tool;
s2, processing by using a laser integrated system, wherein the system is provided with three sets of laser systems of nanosecond, picosecond and femtosecond and can be converted on the same operation platform;
s3, roughly processing the blank into a required shape by using nanosecond laser, and simultaneously spraying auxiliary gas to blow away molten slag;
s4, semi-finishing the rough machined blank by picosecond laser to enable the cutting edge of the cutter to reach basic machining precision and reserve enough finishing allowance for finishing;
and S5, performing finish machining on the cutter by using the femtosecond laser, and removing a heat affected zone, a recast layer and the like remained after rough machining and semi-finish machining to meet the final machining requirement.
Further, in step S3, the nanosecond laser parameters are: the laser power is 80w, the diameter of a light spot is 0.3mm, the scanning speed is 500mm/min, and the scanning times are 80 times.
Further, in step S4, the picosecond laser parameters are: the laser power is 40w, the repetition frequency is 400khz, the spot diameter is 0.3mm, the scanning speed is 800mm/s, the scanning times are 40 times, and the laser taper is 10 degrees.
Further, in step S5, the femtosecond laser parameters: the laser power is 15w, the repetition frequency is 800khz, the spot diameter is 0.08mm, the scanning speed is 1000mm/s, the scanning times are 80 times, and the laser taper is 10 degrees.
Further, in step S1, the tool to be processed is a superhard coating tool.
Further, in step S2, the integrated system is equipped with three sets of nanosecond-picosecond-femtosecond processing systems, and the processing mode is milling.
Further, in steps S2 and S3, the nanosecond laser is a pulse fiber laser; the processing mode is milling.
Further, in steps S2 and S4, the picosecond laser is a pulsed fiber laser; the processing mode is three-dimensional processing.
Further, in steps S2 and S5, the picosecond laser is a pulsed fiber laser; the processing mode is three-dimensional processing.
Furthermore, in step S2, the tool blank is clamped by one-step mounting without disassembly, and the three sets of laser systems share the same positioning system without secondary positioning and operation, thereby ensuring the positioning accuracy.
Example 4
A machining method for machining a cutter with a complex cutting edge by combined laser is characterized by comprising the following specific steps:
s1, cleaning the blank of the cutter to be processed, and clamping the blank on a machine tool;
s2, processing by using a laser integrated system, wherein the system is provided with three sets of laser systems of nanosecond, picosecond and femtosecond and can be converted on the same operation platform;
s3, roughly processing the blank into a required shape by using nanosecond laser, and simultaneously spraying auxiliary gas to blow away molten slag;
s4, semi-finishing the rough machined blank by picosecond laser to enable the cutting edge of the cutter to reach basic machining precision and reserve enough finishing allowance for finishing;
and S5, performing finish machining on the cutter by using the femtosecond laser, and removing a heat affected zone, a recast layer and the like remained after rough machining and semi-finish machining to meet the final machining requirement.
Further, in step S3, the nanosecond laser parameters are: the laser power is 100w, the diameter of a light spot is 0.5mm, the scanning speed is 500mm/min, and the scanning times are 100 times.
Further, in step S4, the picosecond laser parameter: the laser power is 50w, the repetition frequency is 500khz, the spot diameter is 0.3mm, the scanning speed is 1000mm/s, the scanning times are 50 times, and the laser taper is 10 degrees.
Further, in step S5, the femtosecond laser parameters: the laser power is 20w, the repetition frequency is 1000khz, the spot diameter is 0.1mm, the scanning speed is 2000mm/s, the scanning times are 100 times, and the laser taper is 10 degrees.
Further, in step S1, the tool to be machined is a diamond tool.
Further, in step S2, the integrated system is equipped with three sets of processing systems, namely nanosecond-picosecond-femtosecond, and the processing mode is turning and milling combined processing.
Further, in steps S2 and S3, the nanosecond laser is a pulse fiber laser; the processing mode is turning.
Further, in steps S2 and S4, the picosecond laser is a pulsed fiber laser; the processing mode is two-dimensional processing.
Further, in steps S2 and S5, the femtosecond laser is a pulsed fiber laser; the processing mode is three-dimensional processing.
Furthermore, in step S2, the tool blank is clamped by one-step mounting without disassembly, and the three sets of laser systems share the same positioning system without secondary positioning and operation, thereby ensuring the positioning accuracy.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art. It should be noted that the technical features not described in detail in the present invention can be implemented by any prior art in the field.
Claims (10)
1. A machining method for machining a cutter with a complex cutting edge by combined laser is characterized by comprising the following specific steps:
s1, cleaning the blank of the cutter to be processed, and clamping the blank on a machine tool;
s2, processing by using a laser integrated system, wherein the system is provided with three sets of laser systems of nanosecond, picosecond and femtosecond and can be converted on the same operation platform;
s3, roughly processing the blank into a required shape by using nanosecond laser, and simultaneously spraying auxiliary gas to blow away molten slag;
s4, semi-finishing the rough machined blank by picosecond laser;
and S5, performing finish machining on the cutter by using a femtosecond laser, and removing a heat affected zone and a recast layer which are remained after rough machining and semi-finish machining to meet the final machining requirement.
2. The machining method for machining the complex-edge cutter by using the combined laser as claimed in claim 1, wherein in the step S3, nanosecond laser parameters are as follows: the laser power is 10-100w, the spot diameter is 0.1-0.5mm, the scanning speed is 200-.
3. The machining method for machining the complex-edge tool by using the combined laser as claimed in claim 1, wherein in the step S4, the picosecond laser parameters are as follows: laser power is 10-50w, repetition frequency is 100-.
4. The machining method for machining the complex-edge tool by the combined laser according to claim 1, wherein in the step S5, the femtosecond laser parameters are as follows: the laser power is 1-20w, the repetition frequency is 100-.
5. The machining method of a composite laser machining complex-edge tool according to claim 1, wherein in step S1, the machined tool is any one of a cemented carbide tool, a ceramic tool, a super-hard coated tool and a diamond tool.
6. The machining method for machining the complex-cutting-edge cutter by the combined laser according to claim 1, wherein in the step S2, the integrated system is simultaneously provided with three sets of machining systems of nanosecond-picosecond-femtosecond, and the machining mode is a pin turning machining mode or a milling machining mode or a combined machining mode of the two.
7. The machining method of the complex-cutting-edge tool by the combined laser according to claim 1, wherein in the steps S2 and S3, the nanosecond laser is any one of a pulse fiber laser and a carbon dioxide gas laser YAG laser; the machining mode is any one of milling or turning.
8. The machining method of the complex-cutting-edge tool by the combined laser according to claim 1, wherein in the steps S2 and S4, the picosecond laser is any one of a pulse fiber laser and a carbon dioxide gas laser YAG laser; the processing mode is two-dimensional processing or three-dimensional processing.
9. The machining method of the complex cutting edge tool by the combined laser according to claim 1, wherein in the steps S2 and S5, the femtosecond laser is any one of a pulse fiber laser and a carbon dioxide gas laser YAG laser; the processing mode is two-dimensional processing or three-dimensional processing.
10. The method for machining the tool with the complex cutting edge by the combined laser as claimed in claim 1, wherein in step S2, the tool blank is clamped in a one-step mode without disassembly, and three sets of laser systems share the same positioning system without secondary positioning and operation.
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| CN202010218325.2A CN111375898A (en) | 2020-03-25 | 2020-03-25 | Machining method for machining cutter with complex cutting edge by combined laser |
| PCT/CN2021/082563 WO2021190530A1 (en) | 2020-03-25 | 2021-03-24 | Processing method for tool having complex cutting edge using combined laser |
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| CN202010218325.2A CN111375898A (en) | 2020-03-25 | 2020-03-25 | Machining method for machining cutter with complex cutting edge by combined laser |
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| CN112589273A (en) * | 2020-11-20 | 2021-04-02 | 广东工业大学 | Nano cutter and machining method thereof |
| WO2021190530A1 (en) * | 2020-03-25 | 2021-09-30 | 广东工业大学 | Processing method for tool having complex cutting edge using combined laser |
| CN113913605A (en) * | 2021-10-13 | 2022-01-11 | 中国航空制造技术研究院 | Composite strengthening method for femtosecond laser superposed nanosecond laser impact |
| CN114714528A (en) * | 2022-05-19 | 2022-07-08 | 深圳技术大学 | Composite processing method for difficult-to-process material |
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| WO2021190530A1 (en) | 2021-09-30 |
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