CN106416447A - 一种小尺寸器件的散热装置和电路板散热*** - Google Patents

一种小尺寸器件的散热装置和电路板散热*** Download PDF

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Publication number
CN106416447A
CN106416447A CN201580005208.5A CN201580005208A CN106416447A CN 106416447 A CN106416447 A CN 106416447A CN 201580005208 A CN201580005208 A CN 201580005208A CN 106416447 A CN106416447 A CN 106416447A
Authority
CN
China
Prior art keywords
fin
circuit board
size device
small size
heat abstractor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201580005208.5A
Other languages
English (en)
Inventor
陈登旭
刘光明
邓以实
王厚新
周列春
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huawei Technologies Co Ltd
Original Assignee
Huawei Technologies Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huawei Technologies Co Ltd filed Critical Huawei Technologies Co Ltd
Publication of CN106416447A publication Critical patent/CN106416447A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

一种小尺寸器件的散热装置和电路板散热***，包括：小尺寸器件(102)焊接在电路板(101)的铜皮(103)上，散热片(104)焊接在电路板的另一铜皮(105)上，且位于小尺寸器件的周围。降低了小尺寸器件的生产成本。

Description

PCT国内申请，说明书已公开。

Claims (12)

  1. PCT国内申请，权利要求书已公开。
CN201580005208.5A 2015-01-22 2015-01-22 一种小尺寸器件的散热装置和电路板散热*** Pending CN106416447A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2015/071292 WO2016115702A1 (zh) 2015-01-22 2015-01-22 一种小尺寸器件的散热装置和电路板散热***

Publications (1)

Publication Number Publication Date
CN106416447A true CN106416447A (zh) 2017-02-15

Family

ID=56416287

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201580005208.5A Pending CN106416447A (zh) 2015-01-22 2015-01-22 一种小尺寸器件的散热装置和电路板散热***

Country Status (3)

Country Link
EP (1) EP3247185A4 (zh)
CN (1) CN106416447A (zh)
WO (1) WO2016115702A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3096864B1 (fr) * 2019-05-28 2022-08-05 Valeo Vision Montage avec transistors bipolaires et procede d’assemblage
CN113871802A (zh) * 2021-09-10 2021-12-31 东莞市万连实业有限公司 一种带新型电压采样点的铜排连接件及其制备方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201063965Y (zh) * 2007-05-29 2008-05-21 康舒科技股份有限公司 电子元件散热结构
CN202178916U (zh) * 2011-07-22 2012-03-28 重庆科鹰电气有限公司 一种车用前照灯led电路板
CN102802347A (zh) * 2011-06-17 2012-11-28 深圳光启高等理工研究院 定向导热pcb板及电子设备
CN103176563A (zh) * 2011-12-20 2013-06-26 鸿富锦精密工业（深圳）有限公司 电子装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH051396A (ja) * 1991-06-19 1993-01-08 Matsushita Electric Works Ltd プリント回路板の製法
JP3097644B2 (ja) * 1998-01-06 2000-10-10 日本電気株式会社 半導体装置接続構造及び接続方法
US6856007B2 (en) * 2001-08-28 2005-02-15 Tessera, Inc. High-frequency chip packages
JP2003289191A (ja) * 2002-03-28 2003-10-10 Denso Corp 電子制御装置
DE102004030443A1 (de) * 2004-06-24 2006-01-19 Robert Bosch Gmbh Steuergerät
AT8722U1 (de) * 2005-06-06 2006-11-15 Siemens Ag Oesterreich Anordnung zur kühlung einer gruppe von leistungselektronischen bauelementen
US9013035B2 (en) * 2006-06-20 2015-04-21 Broadcom Corporation Thermal improvement for hotspots on dies in integrated circuit packages
DE102008040727A1 (de) * 2008-07-25 2010-01-28 Robert Bosch Gmbh Verfahren und Vorrichtung zur Ermittlung der Rotortemperatur einer permanenterregten Synchronmaschine
KR200448519Y1 (ko) * 2009-04-28 2010-04-21 남동진 돌출형 ⅰｃ 패키지용 방열판
TWI504852B (zh) * 2012-09-07 2015-10-21 Compal Electronics Inc 散熱模組

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201063965Y (zh) * 2007-05-29 2008-05-21 康舒科技股份有限公司 电子元件散热结构
CN102802347A (zh) * 2011-06-17 2012-11-28 深圳光启高等理工研究院 定向导热pcb板及电子设备
CN202178916U (zh) * 2011-07-22 2012-03-28 重庆科鹰电气有限公司 一种车用前照灯led电路板
CN103176563A (zh) * 2011-12-20 2013-06-26 鸿富锦精密工业（深圳）有限公司 电子装置

Also Published As

Publication number Publication date
WO2016115702A1 (zh) 2016-07-28
EP3247185A1 (en) 2017-11-22
EP3247185A4 (en) 2018-01-24

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Application publication date: 20170215

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