CN106412780B - 超声波探头及其制造方法 - Google Patents
超声波探头及其制造方法 Download PDFInfo
- Publication number
- CN106412780B CN106412780B CN201610802396.0A CN201610802396A CN106412780B CN 106412780 B CN106412780 B CN 106412780B CN 201610802396 A CN201610802396 A CN 201610802396A CN 106412780 B CN106412780 B CN 106412780B
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- Prior art keywords
- piezoelectric
- electrode
- titanium
- target
- piezoelectric layer
- Prior art date
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- Expired - Fee Related
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- 239000000523 sample Substances 0.000 title claims abstract description 35
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 29
- 238000000034 method Methods 0.000 title claims description 16
- 239000000463 material Substances 0.000 claims abstract description 36
- 238000004544 sputter deposition Methods 0.000 claims abstract description 14
- 229910052719 titanium Inorganic materials 0.000 claims abstract description 13
- 239000010936 titanium Substances 0.000 claims abstract description 13
- 229910052726 zirconium Inorganic materials 0.000 claims abstract description 13
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims abstract description 12
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims abstract description 12
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 claims abstract description 10
- 239000000919 ceramic Substances 0.000 claims abstract description 9
- 229910052451 lead zirconate titanate Inorganic materials 0.000 claims abstract description 9
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 8
- 239000000956 alloy Substances 0.000 claims abstract description 8
- 239000010410 layer Substances 0.000 claims description 49
- 150000002500 ions Chemical class 0.000 claims description 20
- 239000011241 protective layer Substances 0.000 claims description 20
- 239000013077 target material Substances 0.000 claims description 9
- 238000000151 deposition Methods 0.000 claims description 8
- UGACIEPFGXRWCH-UHFFFAOYSA-N [Si].[Ti] Chemical compound [Si].[Ti] UGACIEPFGXRWCH-UHFFFAOYSA-N 0.000 claims description 6
- HZEWFHLRYVTOIW-UHFFFAOYSA-N [Ti].[Ni] Chemical compound [Ti].[Ni] HZEWFHLRYVTOIW-UHFFFAOYSA-N 0.000 claims description 6
- YJVLWFXZVBOFRZ-UHFFFAOYSA-N titanium zinc Chemical compound [Ti].[Zn] YJVLWFXZVBOFRZ-UHFFFAOYSA-N 0.000 claims description 6
- PMTRSEDNJGMXLN-UHFFFAOYSA-N titanium zirconium Chemical compound [Ti].[Zr] PMTRSEDNJGMXLN-UHFFFAOYSA-N 0.000 claims description 4
- 229910000990 Ni alloy Inorganic materials 0.000 claims description 3
- 229910000676 Si alloy Inorganic materials 0.000 claims description 3
- 229910001297 Zn alloy Inorganic materials 0.000 claims description 3
- 230000003116 impacting effect Effects 0.000 claims description 3
- 239000011159 matrix material Substances 0.000 claims description 3
- 229910001093 Zr alloy Inorganic materials 0.000 claims description 2
- 238000001514 detection method Methods 0.000 abstract description 5
- 230000008569 process Effects 0.000 description 9
- 238000010586 diagram Methods 0.000 description 7
- 230000008021 deposition Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 238000002604 ultrasonography Methods 0.000 description 4
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000005070 sampling Methods 0.000 description 2
- -1 zirconium ions Chemical class 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N ZrO2 Inorganic materials O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- NKZSPGSOXYXWQA-UHFFFAOYSA-N dioxido(oxo)titanium;lead(2+) Chemical compound [Pb+2].[O-][Ti]([O-])=O NKZSPGSOXYXWQA-UHFFFAOYSA-N 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R17/00—Piezoelectric transducers; Electrostrictive transducers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
- B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
- B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
- B06B1/0629—Square array
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
- A61B8/44—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
- A61B8/4444—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device related to the probe
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
- A61B8/44—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
- A61B8/4483—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1329—Protecting the fingerprint sensor against damage caused by the finger
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/06—Forming electrodes or interconnections, e.g. leads or terminals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/101—Piezoelectric or electrostrictive devices with electrical and mechanical input and output, e.g. having combined actuator and sensor parts
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/85—Piezoelectric or electrostrictive active materials
- H10N30/853—Ceramic compositions
- H10N30/8548—Lead-based oxides
- H10N30/8554—Lead-zirconium titanate [PZT] based
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/877—Conductive materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Human Computer Interaction (AREA)
- General Physics & Mathematics (AREA)
- Multimedia (AREA)
- Theoretical Computer Science (AREA)
- Mechanical Engineering (AREA)
- Biophysics (AREA)
- Biomedical Technology (AREA)
- Veterinary Medicine (AREA)
- Ceramic Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
- Pathology (AREA)
- Radiology & Medical Imaging (AREA)
- Public Health (AREA)
- Heart & Thoracic Surgery (AREA)
- Medical Informatics (AREA)
- Molecular Biology (AREA)
- Surgery (AREA)
- Animal Behavior & Ethology (AREA)
- General Health & Medical Sciences (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Gynecology & Obstetrics (AREA)
- Transducers For Ultrasonic Waves (AREA)
Abstract
Description
Claims (9)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610802396.0A CN106412780B (zh) | 2016-09-05 | 2016-09-05 | 超声波探头及其制造方法 |
US15/490,978 US10185863B2 (en) | 2016-09-05 | 2017-04-19 | Ultrasonic transducer, method for manufacturing ultrasonic transducer, ultrasonic finger recognition sensor and electronic device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610802396.0A CN106412780B (zh) | 2016-09-05 | 2016-09-05 | 超声波探头及其制造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN106412780A CN106412780A (zh) | 2017-02-15 |
CN106412780B true CN106412780B (zh) | 2020-06-05 |
Family
ID=57999713
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201610802396.0A Expired - Fee Related CN106412780B (zh) | 2016-09-05 | 2016-09-05 | 超声波探头及其制造方法 |
Country Status (2)
Country | Link |
---|---|
US (1) | US10185863B2 (zh) |
CN (1) | CN106412780B (zh) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101830209B1 (ko) * | 2017-02-16 | 2018-02-21 | 주식회사 베프스 | 압전 센서 제조 방법 및 이를 이용한 압전 센서 |
KR101850127B1 (ko) * | 2017-03-16 | 2018-04-19 | 주식회사 베프스 | 초음파 지문 센서 제조 방법 |
EP3449419B1 (en) * | 2017-05-01 | 2021-12-22 | Shenzhen Goodix Technology Co., Ltd. | Ultrasound fingerprint sensing and sensor fabrication |
CN110633601A (zh) * | 2018-06-22 | 2019-12-31 | 华为技术有限公司 | 一种超声导波换能器、终端设备和指纹识别方法 |
CN111241867B (zh) * | 2018-11-28 | 2023-11-07 | 茂丞(郑州)超声科技有限公司 | 具悬浮结构的晶圆级超声波芯片模块及其制造方法 |
WO2021097749A1 (zh) * | 2019-11-21 | 2021-05-27 | 深圳市汇顶科技股份有限公司 | 超声换能器、信息采集元件及电子设备 |
CN111289022B (zh) * | 2020-02-26 | 2022-08-09 | 京东方科技集团股份有限公司 | 一种传感器及其驱动方法和制备方法 |
CN115315320B (zh) * | 2020-03-18 | 2024-04-02 | 株式会社村田制作所 | 致动器、流体控制装置和致动器的制造方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103767729A (zh) * | 2012-10-17 | 2014-05-07 | 精工爱普生株式会社 | 超声波测量装置、探头、探测器、电子设备及诊断装置 |
CN103776526A (zh) * | 2012-10-25 | 2014-05-07 | 精工爱普生株式会社 | 超声波测量装置、探头单元、探测器及诊断装置 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5818149A (en) * | 1996-03-25 | 1998-10-06 | Rutgers, The State University Of New Jersey | Ceramic composites and methods for producing same |
JP3985866B2 (ja) * | 2001-12-05 | 2007-10-03 | 富士フイルム株式会社 | 超音波トランスジューサ及びその製造方法 |
US7109642B2 (en) * | 2003-11-29 | 2006-09-19 | Walter Guy Scott | Composite piezoelectric apparatus and method |
EP1694479A2 (en) * | 2003-11-29 | 2006-08-30 | Cross Match Technologies, Inc. | Polymer ceramic slip and method of manufacturing ceramic green bodies therefrom |
KR20130128427A (ko) * | 2010-12-03 | 2013-11-26 | 리써치 트라이앵글 인스티튜트 | 초음파 트랜스듀서의 형성 방법 및 관련 장치 |
US10497747B2 (en) * | 2012-11-28 | 2019-12-03 | Invensense, Inc. | Integrated piezoelectric microelectromechanical ultrasound transducer (PMUT) on integrated circuit (IC) for fingerprint sensing |
KR101983010B1 (ko) * | 2012-12-28 | 2019-09-10 | 다우 코닝 도레이 캄파니 리미티드 | 변환기용 경화성 유기폴리실록산 조성물 및 그러한 변환기용 경화성 실리콘 조성물의 응용 |
JP6164405B2 (ja) * | 2013-03-28 | 2017-07-19 | セイコーエプソン株式会社 | 圧電素子モジュール、超音波トランスデューサー、超音波デバイス、液体噴射ヘッド、液体噴射装置及び圧電素子モジュールの製造方法 |
US9323393B2 (en) * | 2013-06-03 | 2016-04-26 | Qualcomm Incorporated | Display with peripherally configured ultrasonic biometric sensor |
US9211980B1 (en) * | 2014-06-20 | 2015-12-15 | The Procter & Gamble Company | Microfluidic delivery system for releasing fluid compositions |
US9613246B1 (en) * | 2014-09-16 | 2017-04-04 | Apple Inc. | Multiple scan element array ultrasonic biometric scanner |
KR101661642B1 (ko) * | 2016-03-11 | 2016-09-30 | 주식회사 베프스 | 생체정보 인식장치 및 상기 생체정보 인식장치의 스캐닝 방법 |
KR101661634B1 (ko) * | 2016-03-11 | 2016-09-30 | 주식회사 베프스 | 복수의 압전 소자를 선택적으로 활성화 시키는 방법 및 이를 위한 생체정보 인식장치 |
US9953205B1 (en) * | 2017-04-28 | 2018-04-24 | The Board Of Trustees Of The Leland Stanford Junior University | Acoustic biometric touch scanner |
-
2016
- 2016-09-05 CN CN201610802396.0A patent/CN106412780B/zh not_active Expired - Fee Related
-
2017
- 2017-04-19 US US15/490,978 patent/US10185863B2/en active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103767729A (zh) * | 2012-10-17 | 2014-05-07 | 精工爱普生株式会社 | 超声波测量装置、探头、探测器、电子设备及诊断装置 |
CN103776526A (zh) * | 2012-10-25 | 2014-05-07 | 精工爱普生株式会社 | 超声波测量装置、探头单元、探测器及诊断装置 |
Also Published As
Publication number | Publication date |
---|---|
US10185863B2 (en) | 2019-01-22 |
CN106412780A (zh) | 2017-02-15 |
US20180068154A1 (en) | 2018-03-08 |
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Address after: 330013 No.699 Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Patentee after: Jiangxi OMS Microelectronics Co.,Ltd. Address before: 330013 east of Xueyuan 6th Road, south of Tianxiang Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Patentee before: OFilm Microelectronics Technology Co.,Ltd. Address after: 330013 east of Xueyuan 6th Road, south of Tianxiang Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Patentee after: OFilm Microelectronics Technology Co.,Ltd. Address before: 330013 no.1189 Jingdong Avenue, high tech Zone, Nanchang City, Jiangxi Province Patentee before: NANCHANG OFILM BIO-IDENTIFICATION TECHNOLOGY Co.,Ltd. |
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Granted publication date: 20200605 |