CN106410520B - Structure and method for reducing electromagnetic interference - Google Patents
Structure and method for reducing electromagnetic interference Download PDFInfo
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- CN106410520B CN106410520B CN201510456961.8A CN201510456961A CN106410520B CN 106410520 B CN106410520 B CN 106410520B CN 201510456961 A CN201510456961 A CN 201510456961A CN 106410520 B CN106410520 B CN 106410520B
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- circuit board
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Abstract
The invention discloses a structure and a method for reducing electromagnetic interference. The circuit board has an upper surface and a grounding circuit. The expansion slot is arranged on the upper surface of the circuit board and is provided with at least one metal pin which is electrically connected with the circuit board. The electric conductor is positioned on the upper surface of the circuit board, and a spacing distance is kept between the electric conductor and the metal pin of the expansion slot to generate a capacitor. The present invention further includes a method for reducing electromagnetic interference, which is used to complete the above structure.
Description
Technical Field
The present invention relates to emi reduction, and more particularly, to an emi reduction structure and an emi reduction method without a metal shield.
Background
When the connector and the electronic components connected thereto are in operation, the transmission of high frequency electronic signals thereof will radiate the generated common mode noise (noise) into the space, forming electromagnetic interference. Electromagnetic interference causes interference to other devices and components, and if so, the function of the interfered components is reduced. Therefore, various countries have regulations on the electromagnetic compatibility that regulate the intensity of electromagnetic interference.
Conventionally, for reducing the intensity of the electronic interference, a grounded metal shield is mainly used to shield and reduce the intensity of the common mode noise radiated into the space. The metal shield can effectively reduce the intensity of the electronic interference, but needs to occupy a certain installation space in the electronic device.
For a thin electronic device, the internal space is small, which is not favorable for additional arrangement of too many components. In addition, the metal shield is not conducive to air cooling and heat dissipation for the object to be covered. Therefore, reducing electromagnetic interference tends to find new solutions to solve the above problems.
Disclosure of Invention
In view of the above problems, an objective of the present invention is to provide a structure for reducing electromagnetic interference, which can prevent the electromagnetic wave converged in a closed electromagnetic loop with a short path from being emitted into the space, and can be applied to a thin electronic device without adding a metal shield.
To achieve the above objective, the present invention provides a structure for reducing electromagnetic interference, which includes a circuit board, an expansion slot and an electrical conductor. The circuit board has an upper surface and a grounding circuit. The expansion slot is arranged on the upper surface of the circuit board and is provided with at least one metal pin which is electrically connected with the circuit board. The electric conductor is positioned on the upper surface of the circuit board, and a spacing distance is kept between the electric conductor and the metal pin of the expansion slot to generate a capacitor.
In one embodiment, the expansion slot has a connection side and a substrate side which are opposite to each other, the opening of the expansion slot is located at the connection side, the direction of the opening of the expansion slot is directed to be parallel to the circuit board, and the metal pins are arranged corresponding to the substrate side.
In one embodiment, a separation distance is maintained between the electrical conductor and the top surface of the circuit board, and another capacitance is created between the electrical conductor and the ground circuit.
In one embodiment, the structure for reducing electromagnetic interference further comprises an insulator covering the electrical conductor.
In one embodiment, the structure for reducing electromagnetic interference further includes an insulator disposed between the electrical conductor and the expansion slot and between the electrical conductor and the upper surface of the circuit board.
In one embodiment, the circuit board further includes a ground contact disposed on the upper surface of the circuit board and electrically connected to the ground circuit, and the electrical conductor contacts the ground contact.
In one embodiment, the structure for reducing electromagnetic interference further comprises a metal shell, wherein the metal shell keeps a spacing distance with the upper surface, and the metal shell is in contact with the electrical conductor to generate electrical conduction.
In one embodiment, the structure for reducing electromagnetic interference further comprises an insulator disposed between the electrical conductor and the expansion slot.
The invention further provides a method for reducing electromagnetic interference, which comprises the following steps:
arranging a circuit board, wherein the circuit board is provided with an upper surface and is electrically connected to a grounding circuit;
providing an expansion slot with at least one metal pin, wherein the expansion slot is arranged on the upper surface of the circuit board, and the metal pin is electrically connected with the circuit board;
an electrical conductor is provided and arranged on the upper surface of the circuit board, and a spacing distance is kept between the electrical conductor and the metal pin of the expansion slot to generate a capacitor.
In one embodiment, the method for reducing electromagnetic interference further comprises a step of maintaining a separation distance between the electrical conductor and the upper surface of the circuit board to generate a capacitor.
In one embodiment, the method for reducing electromagnetic interference further comprises a step of providing an insulator to cover the electrical conductor.
In one embodiment, the method for reducing electromagnetic interference further includes a step of providing an insulator disposed between the electrical conductor and the expansion slot and between the electrical conductor and the upper surface of the circuit board.
In one embodiment, the method for reducing electromagnetic interference further includes a step of providing a ground contact disposed on the upper surface of the circuit board and electrically connected to the ground circuit, such that the electrical conductor contacts the ground contact.
In one embodiment, the method for reducing electromagnetic interference further comprises a step of providing a metal shell, keeping a spacing distance with the upper surface, and making the metal shell contact the electrical conductor to generate electrical conduction.
In one embodiment, the method for reducing electromagnetic interference further includes a step of providing an insulator disposed between the electrical conductor and the base side of the expansion slot.
The invention forms a closed electromagnetic loop with a short path by arranging the expansion card, the expansion slot and the circuit board in opposite positions, so that the electromagnetic wave generated on the metal pin when the memory card and the expansion slot operate converges on the closed electromagnetic loop with the short path and cannot be emitted to the space. The configuration mode of the relative position can be suitable for notebook computers, thin computer hosts or other thin electronic devices with extremely limited height, and does not need to additionally increase metal shields, thereby effectively simplifying the structure of the EMI shielding screen.
The invention is described in detail below with reference to the drawings and specific examples, but the invention is not limited thereto.
Drawings
FIG. 1 is a side view of a first embodiment of the present invention;
FIG. 2 is another side view of the first embodiment of the present invention;
FIG. 3 is a schematic side view of a closed electromagnetic circuit according to a first embodiment of the present invention;
FIG. 4 is a schematic side view of the first embodiment of the present invention;
FIG. 5 is a schematic side view of the first embodiment of the present invention;
FIG. 6 is a schematic side view of the first embodiment of the present invention;
FIG. 7 is a side view of a second embodiment of the present invention;
FIG. 8 is a schematic side view of a closed electromagnetic circuit according to a second embodiment of the present invention;
FIG. 9 is a flow chart of a method of reducing EMI in accordance with the present invention;
FIGS. 10 to 12 are schematic diagrams illustrating a method for reducing EMI according to the present invention;
FIG. 13 is another flow chart of the method of reducing EMI of the present invention;
FIG. 14 is a flowchart of a method for reducing EMI according to another embodiment of the present invention.
Wherein the reference numerals
100 structure for reducing electromagnetic interference
110 circuit board
112 upper surface
113 lower surface
114 ground circuit
116 ground contact
120 expansion slot
122 opening
124 connecting side
126 base side
128 metal pin
130 electrical conductor
140 insulating body
200 memory card
300 Metal case
C capacitor
P center line
Detailed Description
The invention will be described in detail with reference to the following drawings, which are provided for illustration purposes and the like:
referring to fig. 1, a structure 100 for reducing electromagnetic interference according to a first embodiment of the present invention includes a circuit board 110, an expansion slot 120, and an electrical conductor 130.
As shown in fig. 1, the circuit board 110 may be, but is not limited to, a motherboard of a desktop computer, a motherboard of a notebook computer, or any circuit board 110 having an expansion slot 120. The circuit board 110 has an upper surface 112 and a ground circuit 114. The ground circuit 114 is located on one of the copper foil circuit layers of the circuit board 110. In addition, the circuit board 110 may be further configured with other connecting lines, connecting ports, sockets, electronic chips, etc. according to the functional requirements, and the aforementioned components are conventional technologies of those skilled in the art and are not novel features of the present disclosure, which are not described herein again.
The expansion slot 120 is disposed on the upper surface 112 of the circuit board 110. In the embodiment of the present invention, the expansion slot 120 is exemplified by a memory card slot, but other expansion card slots are not excluded. The expansion slot 120 has at least one metal pin 128 electrically connected to the circuit board 110.
In the first embodiment, the expansion slot 120 is disposed in a lateral direction, i.e., the opening 122 of the expansion slot 120 is directed parallel to the upper surface 112 of the circuit board 110. The expansion slot 120 has a connection side 124 and a base side 126 opposite to each other, and the opening 122 of the expansion slot 120 is located on the connection side 124. The memory card 200 is transversely disposed and inserted into the opening 122, and is electrically connected to the expansion slot 120. And metal pins 128 of the expansion slot 120 correspond to the base side 126.
However, the expansion slot 120 is not limited to be disposed horizontally, but may be disposed vertically, that is, the base side 126 is disposed on the upper surface 112 of the circuit board 110, such that the opening 122 faces upward, and the metal pins 128 are disposed corresponding to a side of the expansion slot 120.
The electrical conductor 130 is disposed on the upper surface 112 of the circuit board 110, and a distance is kept between the electrical conductor 130 and the metal pin 128 of the expansion slot 120 without direct electrical connection, so as to generate a capacitance C between the electrical conductor 130 and the metal pin 128. The electrical conductor 130 may be a metal or a conductive foam. In addition, a spacing distance is also maintained between the electrical conductor 130 and the upper surface 112 of the circuit board 110, and another capacitance C is generated between the electrical conductor 130 and the grounding circuit 114.
The electrical conductor 130 may have an L-shaped cross-sectional structure, one portion corresponding to the base side 126 of the expansion slot 120 and the other portion corresponding to the ground circuit 114 of the circuit board 110.
As shown in fig. 2, the electrical conductor 130 may also be a metal tube or a conductive foam with a rectangular cross section, one side of which corresponds to the substrate side 126 of the expansion slot 120 and the other side of which corresponds to the ground circuit 114 of the circuit board 110.
As shown in fig. 3, when an expansion card, such as a memory card 200, is inserted into the expansion slot 120, a closed electromagnetic loop with a short path is formed between two sides of the memory card 200, the metal pins 128 on the substrate side 126, the two sets of capacitors C, and the ground circuit 114 of the circuit board 110, so that the electromagnetic waves generated at the metal pins 128 when the memory card 200 and the expansion slot 120 operate converge on the closed electromagnetic loop with a short path and do not radiate to the outside into the space, thereby reducing the interference of the electromagnetic waves to the outside without shielding the electromagnetic waves with a metal shield.
As shown in fig. 4, in the first embodiment, two expansion slots 120 may also be adopted, which are symmetrically disposed along a center line P and share the same electrical conductor 130 and the ground circuit 114, so as to form two closed electromagnetic circuits with short path.
As shown in fig. 5, in the first embodiment, two expansion slots 120 may also be adopted, which are symmetrically disposed on the upper surface 112 and the lower surface 113 of the circuit board 110 along the circuit board 110. At the same time, another electrical conductor 130 is disposed corresponding to the lower surface 113, and another closed electromagnetic loop with a short path is formed on the lower surface of the circuit board 110.
As shown in fig. 1, 2, 3, 4 and 5, the structure 100 for reducing electromagnetic interference further includes an insulator 140 for isolating between the electrical conductor 130 and the expansion slot 120 and between the electrical conductor 130 and the upper surface 112 of the circuit board 110, so as to ensure the formation of the capacitor C and improve the capacitance by dielectric characteristics.
As shown in fig. 1, 3 and 5, the insulator 140 may be a simple sheet, or an adhesive, and is adhered between the electrical conductor 130 and the expansion slot 120 and between the electrical conductor 130 and the upper surface 112 of the circuit board 110, so as to fix the electrical conductor 130 and achieve the purpose of insulation and capacitance improvement. The insulator 140 may also be partially coated, so that the insulator 140 is disposed between the electrical conductor 130 and the expansion slot 120 and between the electrical conductor 130 and the upper surface 112 of the circuit board 110, and the required separation distance for forming the capacitor C is maintained.
As shown in fig. 2 and 4, in the case that the electrical conductor 130 is a tube, the insulator 140 may also completely or partially cover the electrical conductor 130, such that the insulator 140 contacts the expansion slot 120 and the circuit board 110 to maintain a distance required for forming the capacitor C.
In the present invention, the insulator 140 is preferably made of a material having a high dielectric constant to increase the capacitance C generated, such as polyethylene, polystyrene, silicone resin, silicone, aramid paper, polyester film, polyimide film, or heat-resistant insulating rubber.
As shown in fig. 6, in the electronic device using the metal case 300, the metal case 300 maintains a spaced distance from the upper surface 112. The metal housing 300 is grounded (e.g., electrically connected to the ground line 114). At this time, the metal shell 300 may be arranged to contact the electrical conductor 130, as shown in the figure, at least a portion of the upper end of the electrical conductor 130 is not covered by the insulator 140, so that the metal shell 300 contacts the electrical conductor 130 to generate electrical conduction. The electrical conductor 130 is still spaced apart from the expansion slot 120 and disposed therebetween by the insulator 140, such that a capacitance C is generated between the electrical conductor 130 and the metal pin 128.
In addition, when the relative position between the circuit board 110 and the electrical conductor 130 allows, the capacitor C between the electrical conductor 130 and the ground circuit 114 can be omitted, and the electrical conductor 130 is directly grounded, for example, the lower end of the electrical conductor 130 is at least partially not shielded by the insulator 140 and can contact the ground contact 116 to electrically connect to the ground circuit 114, so that the electrical conductor 130 is directly electrically grounded. .
As shown in fig. 7, a structure 100 for reducing electromagnetic interference according to a second embodiment of the present invention includes a circuit board 110, an expansion slot 120, an electrical conductor 130, and an insulator 140.
In the second embodiment, a ground contact 116 is disposed on the circuit board 110, and is located on the upper surface 112 of the circuit board 110 and electrically connected to the ground circuit 114, and the electrical conductor 130 contacts the ground contact 116. For example, the insulator 140 is disposed between the electrical conductor 130 and the base side 126 of the expansion slot 120, such that a distance is maintained between the electrical conductor 130 and the base side 126 of the expansion slot 120 to generate a capacitor C.
As shown in fig. 8, when the memory card 200 is inserted into the expansion slot 120, a closed electromagnetic loop with a short path is formed between the two sides of the memory card 200, the metal pins 128, the capacitor C, and the ground circuit 114 of the circuit board 110, so that the electromagnetic wave generated by the metal pins 128 during the operation of the memory card 200 and the expansion slot 120 converges on the closed electromagnetic loop with a short path without being emitted into the space.
As shown in fig. 9, the present invention further provides a method for reducing emi, so as to achieve the structure 100 for reducing emi.
As shown in fig. 9 and 10, the method first arranges a circuit board 110, the circuit board 110 has an upper surface 112, and the circuit board 110 is electrically connected to a grounding circuit 114, as shown in Step 110.
As shown in fig. 9 and 11, an expansion slot 120 having at least one metal pin 128 is provided on the upper surface 112 of the circuit board 110, as shown in Step 120. Meanwhile, the metal pins 128 are connected to the circuit board 110.
As shown in fig. 9 and 12, an electrical conductor 130 is provided and disposed on the upper surface 112 of the circuit board 110, and a distance is kept between the electrical conductor 130 and the metal pins 128 of the expansion slot 120 to generate a capacitor C, as shown in Step 130.
As shown in fig. 9 and 12, after Step 130, a Step 140 may be further included to maintain a spacing distance between the electrical conductor 130 and the upper surface 112 of the circuit board 110, so as to generate a capacitor C.
As shown in fig. 9 and 12, before or after Step 130, a Step 132 of providing an insulator 140 disposed between the electrical conductor 130 and the expansion slot 120 is further included, and a Step 134 of disposing the insulator 140 between the electrical conductor 130 and the upper surface 112 of the circuit board 110 is further included.
As shown in fig. 13, if the electrical conductor 130 is a metal tube with a rectangular cross section, Step 132 and Step 134 may be replaced by coating the electrical conductor 130 with an insulator 140 (Step 136).
As shown in fig. 14, if the circuit board 110 has the exposed ground contact 116 and the relative position corresponds to the electrical conductor 130, the Step 134 may be modified to provide a ground contact 116 disposed on the upper surface 112 of the circuit board 110 and electrically connected to the ground circuit 114, so that the ground contact 116 contacts the ground contact 116, as shown in Step 138, and delete the Step 140. In addition, a metal housing 300 (as a housing of the electronic device, especially as a top housing portion) may be further provided, and the metal housing 300 is kept at a distance from the top surface 112, and is electrically connected to the electrical conductor 130.
By the above method, the structure 100 for reducing electromagnetic interference according to the first embodiment or the second embodiment can be assembled.
The present invention forms a closed electromagnetic loop with a short path by arranging the expansion card (memory card 200), the expansion slot 120 and the circuit board 110 at opposite positions, so that the electromagnetic wave generated by the metal pins 128 when the memory card 200 and the expansion slot 120 are operated converges to the closed electromagnetic loop with a short path, and does not radiate to the outside into the space. The configuration mode of the relative position can be suitable for notebook computers, thin computer hosts or other thin electronic devices with extremely limited height, and does not need to additionally increase metal shields, thereby effectively simplifying the structure of the EMI shielding screen.
The present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof, and it should be understood that various changes and modifications can be effected therein by one skilled in the art without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (12)
1. A structure for reducing electromagnetic interference, comprising:
a circuit board having an upper surface and a ground circuit;
an expansion slot, which is arranged on the upper surface of the circuit board and is provided with at least one metal pin and is electrically connected with the circuit board; and
an electric conductor, which is positioned on the upper surface of the circuit board and keeps a spacing distance with the metal pin of the expansion slot to generate a capacitor;
and the insulator is arranged between the electric conductor and the expansion slot and between the electric conductor and the upper surface of the circuit board.
2. The structure of claim 1, wherein the expansion slot has a connection side and a substrate side opposite to each other, the opening of the expansion slot is located on the connection side, the direction of the opening of the expansion slot is parallel to the circuit board, and the metal pins are disposed corresponding to the substrate side.
3. The structure of claim 1, wherein the electrical conductor is spaced apart from the top surface of the circuit board to create another capacitance between the electrical conductor and the ground circuit.
4. The structure of claim 1, wherein the circuit board further comprises a ground contact disposed on the upper surface of the circuit board and electrically connected to the ground circuit, the electrical conductor contacting the ground contact.
5. The structure of claim 4, further comprising a metal shell spaced apart from the top surface, the metal shell contacting the electrical conductor to create electrical continuity.
6. The structure of claim 4, wherein the insulator is disposed between the electrical conductor and the expansion slot.
7. A method for reducing electromagnetic interference, comprising the steps of:
arranging a circuit board, wherein the circuit board is provided with an upper surface and is electrically connected to a grounding circuit;
providing an expansion slot with at least one metal pin, wherein the expansion slot is arranged on the upper surface of the circuit board, and the metal pin is electrically connected with the circuit board; and
providing an electrical conductor arranged on the upper surface of the circuit board, and enabling a spacing distance to be kept between the electrical conductor and the metal pin of the expansion slot to generate a capacitor;
and providing an insulator for coating the electric conductor, wherein the insulator is arranged between the electric conductor and the expansion slot and between the electric conductor and the upper surface of the circuit board.
8. The method as claimed in claim 7, wherein the expansion slot has a connection side and a substrate side opposite to each other, the opening of the expansion slot is located on the connection side, the direction of the opening of the expansion slot is parallel to the circuit board, and the metal pins are disposed corresponding to the substrate side.
9. The method of claim 7, further comprising a step of maintaining a separation distance between the electrical conductor and the top surface of the circuit board to generate a capacitance.
10. The method of claim 7, further comprising the step of providing a ground contact disposed on the upper surface of the circuit board and electrically connected to the ground circuit, such that the electrical conductor contacts the ground contact.
11. The method of claim 10, further comprising the step of providing a metal shell spaced apart from the top surface and contacting the metal shell with the electrical conductor to create electrical continuity.
12. The method of claim 10, wherein the insulator is disposed between the electrical conductor and the expansion slot.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510456961.8A CN106410520B (en) | 2015-07-30 | 2015-07-30 | Structure and method for reducing electromagnetic interference |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510456961.8A CN106410520B (en) | 2015-07-30 | 2015-07-30 | Structure and method for reducing electromagnetic interference |
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| Publication Number | Publication Date |
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| CN106410520A CN106410520A (en) | 2017-02-15 |
| CN106410520B true CN106410520B (en) | 2020-05-12 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510456961.8A Active CN106410520B (en) | 2015-07-30 | 2015-07-30 | Structure and method for reducing electromagnetic interference |
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| Country | Link |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1201280A (en) * | 1997-05-30 | 1998-12-09 | 莫列斯公司 | Electric connector with shielding device |
| CN1264197A (en) * | 1999-02-04 | 2000-08-23 | 莫列斯公司 | Screening electric connector |
| CN200941451Y (en) * | 2006-05-30 | 2007-08-29 | 达昌电子科技(苏州)有限公司 | Socket connector and plug connector thereof |
| WO2012136956A1 (en) * | 2011-04-07 | 2012-10-11 | Gyrus Medical Limited | Electrosurgical generator |
| CN104638465A (en) * | 2013-11-13 | 2015-05-20 | 纬创资通股份有限公司 | Noise suppression component and electronic device with same |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6580028B1 (en) * | 2000-01-31 | 2003-06-17 | Hewlett-Packard Development Company, L.P. | EMI reduction device |
| DE202010009369U1 (en) * | 2010-06-22 | 2010-08-26 | Brymen Technology Corporation, Chung-Ho City | Multimeter with a flexible current sensor |
-
2015
- 2015-07-30 CN CN201510456961.8A patent/CN106410520B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1201280A (en) * | 1997-05-30 | 1998-12-09 | 莫列斯公司 | Electric connector with shielding device |
| CN1264197A (en) * | 1999-02-04 | 2000-08-23 | 莫列斯公司 | Screening electric connector |
| CN200941451Y (en) * | 2006-05-30 | 2007-08-29 | 达昌电子科技(苏州)有限公司 | Socket connector and plug connector thereof |
| WO2012136956A1 (en) * | 2011-04-07 | 2012-10-11 | Gyrus Medical Limited | Electrosurgical generator |
| CN104638465A (en) * | 2013-11-13 | 2015-05-20 | 纬创资通股份有限公司 | Noise suppression component and electronic device with same |
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| CN106410520A (en) | 2017-02-15 |
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Address after: Taiwan Xindian District, New Taipei City Chinese Po Road No. 6 Applicant after: GIGA-BYTE TECHNOLOGY Co.,Ltd. Address before: Chinese Taiwan Taipei City store Bao Jiang Road No. 6 Applicant before: GIGA-BYTE TECHNOLOGY Co.,Ltd. |
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Effective date of registration: 20230328 Address after: 7th Floor, No. 6, Baoqiang Road, Xindian District, Xinbei City, Taiwan, China, China Patentee after: Technical Steel Technology Co.,Ltd. Address before: Taiwan Xindian District, New Taipei City Chinese Po Road No. 6 Patentee before: GIGA-BYTE TECHNOLOGY Co.,Ltd. |
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