CN106409713A - 多点测量晶圆表面铜层厚度的在线计算方法 - Google Patents
多点测量晶圆表面铜层厚度的在线计算方法 Download PDFInfo
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- CN106409713A CN106409713A CN201610860560.3A CN201610860560A CN106409713A CN 106409713 A CN106409713 A CN 106409713A CN 201610860560 A CN201610860560 A CN 201610860560A CN 106409713 A CN106409713 A CN 106409713A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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- Testing Or Measuring Of Semiconductors Or The Like (AREA)
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CN201610860560.3A CN106409713B (zh) | 2016-09-28 | 2016-09-28 | 多点测量晶圆表面铜层厚度的在线计算方法 |
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CN201610860560.3A CN106409713B (zh) | 2016-09-28 | 2016-09-28 | 多点测量晶圆表面铜层厚度的在线计算方法 |
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CN106409713A true CN106409713A (zh) | 2017-02-15 |
CN106409713B CN106409713B (zh) | 2019-11-22 |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107195571A (zh) * | 2017-07-03 | 2017-09-22 | 上海华力微电子有限公司 | 一种侦测*** |
CN110044249A (zh) * | 2019-04-30 | 2019-07-23 | 清华大学 | 一种膜厚测量方法、***及化学机械抛光装置 |
CN116255917A (zh) * | 2023-02-23 | 2023-06-13 | 泰微科技(珠海)有限公司 | 晶圆厚度测量方法及装置 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7751609B1 (en) * | 2000-04-20 | 2010-07-06 | Lsi Logic Corporation | Determination of film thickness during chemical mechanical polishing |
CN103677832A (zh) * | 2013-12-13 | 2014-03-26 | 清华大学 | 晶圆铜膜厚度的绘图方法及*** |
CN103700601A (zh) * | 2013-12-13 | 2014-04-02 | 清华大学 | 用于测量晶圆表面铜膜厚度的标定方法和测量方法及装置 |
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2016
- 2016-09-28 CN CN201610860560.3A patent/CN106409713B/zh not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7751609B1 (en) * | 2000-04-20 | 2010-07-06 | Lsi Logic Corporation | Determination of film thickness during chemical mechanical polishing |
CN103677832A (zh) * | 2013-12-13 | 2014-03-26 | 清华大学 | 晶圆铜膜厚度的绘图方法及*** |
CN103700601A (zh) * | 2013-12-13 | 2014-04-02 | 清华大学 | 用于测量晶圆表面铜膜厚度的标定方法和测量方法及装置 |
Non-Patent Citations (1)
Title |
---|
赵乾,曲子濂,余强,路新春,孟永钢: "晶圆表面金属薄膜的纳米精度在线测量方法与实现", 《中国基础科学》 * |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107195571A (zh) * | 2017-07-03 | 2017-09-22 | 上海华力微电子有限公司 | 一种侦测*** |
CN110044249A (zh) * | 2019-04-30 | 2019-07-23 | 清华大学 | 一种膜厚测量方法、***及化学机械抛光装置 |
CN110044249B (zh) * | 2019-04-30 | 2020-09-15 | 清华大学 | 一种膜厚测量方法、***及化学机械抛光装置 |
CN116255917A (zh) * | 2023-02-23 | 2023-06-13 | 泰微科技(珠海)有限公司 | 晶圆厚度测量方法及装置 |
CN116255917B (zh) * | 2023-02-23 | 2023-08-29 | 泰微科技(珠海)有限公司 | 晶圆厚度测量方法及装置 |
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Effective date of registration: 20171023 Address after: 100084 Beijing City, Haidian District Tsinghua Yuan Applicant after: TSINGHUA University Applicant after: HWATSING TECHNOLOGY Co.,Ltd. Address before: 300350, Tianjin City, Jinnan District Science and Technology Park, Hai Hing Road, No. 9, building No. 8 Applicant before: HWATSING TECHNOLOGY Co.,Ltd. Applicant before: Tsinghua University |
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Address after: 100084 Beijing City, Haidian District Tsinghua Yuan Co-patentee after: Huahaiqingke Co.,Ltd. Patentee after: TSINGHUA University Address before: 100084 Beijing City, Haidian District Tsinghua Yuan Co-patentee before: HWATSING TECHNOLOGY Co.,Ltd. Patentee before: TSINGHUA University |
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