CN106289040B - 用于晶圆铜层厚度多点测量的标定*** - Google Patents
用于晶圆铜层厚度多点测量的标定*** Download PDFInfo
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- CN106289040B CN106289040B CN201610872138.XA CN201610872138A CN106289040B CN 106289040 B CN106289040 B CN 106289040B CN 201610872138 A CN201610872138 A CN 201610872138A CN 106289040 B CN106289040 B CN 106289040B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
- G01B7/02—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness
- G01B7/06—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness for measuring thickness
- G01B7/10—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness for measuring thickness using magnetic means, e.g. by measuring change of reluctance
- G01B7/105—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness for measuring thickness using magnetic means, e.g. by measuring change of reluctance for measuring thickness of coating
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
- G01B21/02—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness
- G01B21/04—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness by measuring coordinates of points
- G01B21/045—Correction of measurements
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Length Measuring Devices With Unspecified Measuring Means (AREA)
Abstract
Description
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Priority Applications (1)
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CN201610872138.XA CN106289040B (zh) | 2016-09-30 | 2016-09-30 | 用于晶圆铜层厚度多点测量的标定*** |
Applications Claiming Priority (1)
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CN201610872138.XA CN106289040B (zh) | 2016-09-30 | 2016-09-30 | 用于晶圆铜层厚度多点测量的标定*** |
Publications (2)
Publication Number | Publication Date |
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CN106289040A CN106289040A (zh) | 2017-01-04 |
CN106289040B true CN106289040B (zh) | 2019-11-22 |
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CN201610872138.XA Expired - Fee Related CN106289040B (zh) | 2016-09-30 | 2016-09-30 | 用于晶圆铜层厚度多点测量的标定*** |
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CN (1) | CN106289040B (zh) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107214610B (zh) * | 2017-05-05 | 2019-04-23 | 清华大学 | 铜cmp的在线平坦度控制*** |
CN107607595B (zh) * | 2017-09-21 | 2020-05-12 | 京东方科技集团股份有限公司 | 滤光片检测装置及方法 |
CN110044249B (zh) * | 2019-04-30 | 2020-09-15 | 清华大学 | 一种膜厚测量方法、***及化学机械抛光装置 |
CN113607214B (zh) * | 2021-08-03 | 2022-08-05 | 北京理工大学 | 一种金属管道参数确定方法及*** |
CN116242239B (zh) * | 2022-12-09 | 2023-07-28 | 江汉大学 | 一种检测球墨铸铁管厚度的方法及装置 |
CN117681117B (zh) * | 2024-01-31 | 2024-05-17 | 华海清科(北京)科技有限公司 | 用于晶圆的金属薄膜厚度测量方法、装置、抛光设备和介质 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102425144A (zh) * | 2011-09-22 | 2012-04-25 | 浙江大学 | 压力前池式雨水发电***及方法 |
CN103268382A (zh) * | 2013-05-28 | 2013-08-28 | 清华大学 | 晶圆铜膜厚度离线测量模块控制*** |
CN103324131A (zh) * | 2013-05-28 | 2013-09-25 | 清华大学 | 晶圆铜膜厚度在线测量模块控制*** |
CN103700601A (zh) * | 2013-12-13 | 2014-04-02 | 清华大学 | 用于测量晶圆表面铜膜厚度的标定方法和测量方法及装置 |
CN206223084U (zh) * | 2016-09-30 | 2017-06-06 | 天津华海清科机电科技有限公司 | 用于晶圆铜层厚度多点测量的标定*** |
-
2016
- 2016-09-30 CN CN201610872138.XA patent/CN106289040B/zh not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102425144A (zh) * | 2011-09-22 | 2012-04-25 | 浙江大学 | 压力前池式雨水发电***及方法 |
CN103268382A (zh) * | 2013-05-28 | 2013-08-28 | 清华大学 | 晶圆铜膜厚度离线测量模块控制*** |
CN103324131A (zh) * | 2013-05-28 | 2013-09-25 | 清华大学 | 晶圆铜膜厚度在线测量模块控制*** |
CN103700601A (zh) * | 2013-12-13 | 2014-04-02 | 清华大学 | 用于测量晶圆表面铜膜厚度的标定方法和测量方法及装置 |
CN206223084U (zh) * | 2016-09-30 | 2017-06-06 | 天津华海清科机电科技有限公司 | 用于晶圆铜层厚度多点测量的标定*** |
Non-Patent Citations (1)
Title |
---|
In-situ measurement of Cu film thickness during the CMP process by using eddy current method alone;Zilian Qu, et al;《Microelectronic Engineering》;20130322;全文 * |
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CN106289040A (zh) | 2017-01-04 |
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Effective date of registration: 20171013 Address after: 100084 Beijing City, Haidian District Tsinghua Yuan Applicant after: TSINGHUA University Applicant after: HWATSING TECHNOLOGY Co.,Ltd. Address before: 300350, Tianjin City, Jinnan District Science and Technology Park, Hai Hing Road, No. 9, building No. 8 Applicant before: HWATSING TECHNOLOGY Co.,Ltd. Applicant before: Tsinghua University |
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Address after: 100084 Beijing City, Haidian District Tsinghua Yuan Co-patentee after: Huahaiqingke Co.,Ltd. Patentee after: TSINGHUA University Address before: 100084 Beijing City, Haidian District Tsinghua Yuan Co-patentee before: HWATSING TECHNOLOGY Co.,Ltd. Patentee before: TSINGHUA University |
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