CN106398507A - Heat dissipation coating for electronic element and preparation method thereof - Google Patents
Heat dissipation coating for electronic element and preparation method thereof Download PDFInfo
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- CN106398507A CN106398507A CN201610794473.2A CN201610794473A CN106398507A CN 106398507 A CN106398507 A CN 106398507A CN 201610794473 A CN201610794473 A CN 201610794473A CN 106398507 A CN106398507 A CN 106398507A
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- 239000011248 coating agent Substances 0.000 title claims abstract description 30
- 238000000576 coating method Methods 0.000 title claims abstract description 30
- 238000002360 preparation method Methods 0.000 title claims description 12
- 230000017525 heat dissipation Effects 0.000 title abstract description 5
- 239000004814 polyurethane Substances 0.000 claims abstract description 27
- 229920002635 polyurethane Polymers 0.000 claims abstract description 27
- 239000000839 emulsion Substances 0.000 claims abstract description 26
- 239000012752 auxiliary agent Substances 0.000 claims abstract description 19
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 19
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 19
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical class [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 18
- APUPEJJSWDHEBO-UHFFFAOYSA-P ammonium molybdate Chemical compound [NH4+].[NH4+].[O-][Mo]([O-])(=O)=O APUPEJJSWDHEBO-UHFFFAOYSA-P 0.000 claims abstract description 13
- 239000011609 ammonium molybdate Substances 0.000 claims abstract description 13
- 229940010552 ammonium molybdate Drugs 0.000 claims abstract description 13
- 235000018660 ammonium molybdate Nutrition 0.000 claims abstract description 13
- 229910021389 graphene Inorganic materials 0.000 claims abstract description 12
- 239000003822 epoxy resin Substances 0.000 claims abstract description 8
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 8
- 238000000034 method Methods 0.000 claims abstract description 7
- 230000005855 radiation Effects 0.000 claims description 27
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 24
- 230000033444 hydroxylation Effects 0.000 claims description 18
- 238000005805 hydroxylation reaction Methods 0.000 claims description 18
- 229920000570 polyether Polymers 0.000 claims description 15
- -1 Ether modified amino silicon Chemical class 0.000 claims description 14
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims description 13
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 12
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical group [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 12
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 12
- 229920001296 polysiloxane Polymers 0.000 claims description 12
- 229910000077 silane Inorganic materials 0.000 claims description 12
- 238000002156 mixing Methods 0.000 claims description 11
- ZFOZVQLOBQUTQQ-UHFFFAOYSA-N Tributyl citrate Chemical compound CCCCOC(=O)CC(O)(C(=O)OCCCC)CC(=O)OCCCC ZFOZVQLOBQUTQQ-UHFFFAOYSA-N 0.000 claims description 10
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 10
- 239000000203 mixture Substances 0.000 claims description 10
- 239000003921 oil Substances 0.000 claims description 10
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 claims description 9
- 239000003054 catalyst Substances 0.000 claims description 9
- 238000006243 chemical reaction Methods 0.000 claims description 9
- 238000001816 cooling Methods 0.000 claims description 9
- 239000012467 final product Substances 0.000 claims description 9
- 229910052710 silicon Inorganic materials 0.000 claims description 9
- 239000010703 silicon Substances 0.000 claims description 9
- 239000000376 reactant Substances 0.000 claims description 8
- 238000010792 warming Methods 0.000 claims description 8
- 239000004970 Chain extender Substances 0.000 claims description 7
- 238000004945 emulsification Methods 0.000 claims description 7
- 229910052760 oxygen Inorganic materials 0.000 claims description 7
- 239000001301 oxygen Substances 0.000 claims description 7
- 238000000498 ball milling Methods 0.000 claims description 6
- 238000007865 diluting Methods 0.000 claims description 6
- 239000003973 paint Substances 0.000 claims description 6
- 150000003839 salts Chemical class 0.000 claims description 6
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 claims description 6
- 238000001291 vacuum drying Methods 0.000 claims description 5
- 239000002318 adhesion promoter Substances 0.000 claims description 4
- 230000008859 change Effects 0.000 claims description 4
- 239000002270 dispersing agent Substances 0.000 claims description 4
- 239000004014 plasticizer Substances 0.000 claims description 4
- 238000003756 stirring Methods 0.000 claims description 4
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 3
- 239000007822 coupling agent Substances 0.000 claims description 3
- 230000006837 decompression Effects 0.000 claims description 3
- 238000009413 insulation Methods 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 claims description 2
- 125000000118 dimethyl group Polymers [H]C([H])([H])* 0.000 claims description 2
- 239000002048 multi walled nanotube Substances 0.000 claims description 2
- 230000007935 neutral effect Effects 0.000 claims description 2
- 229920005573 silicon-containing polymer Polymers 0.000 claims description 2
- 238000003786 synthesis reaction Methods 0.000 claims description 2
- 229910052593 corundum Inorganic materials 0.000 claims 2
- 229910001845 yogo sapphire Inorganic materials 0.000 claims 2
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 claims 1
- 229910052799 carbon Inorganic materials 0.000 claims 1
- 150000002148 esters Chemical class 0.000 claims 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims 1
- 239000002071 nanotube Substances 0.000 claims 1
- 229920000137 polyphosphoric acid Polymers 0.000 claims 1
- 229910052700 potassium Inorganic materials 0.000 claims 1
- 239000011591 potassium Substances 0.000 claims 1
- 238000007711 solidification Methods 0.000 claims 1
- 230000008023 solidification Effects 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 5
- 239000000463 material Substances 0.000 abstract description 3
- 230000007547 defect Effects 0.000 abstract 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 abstract 1
- 229920000515 polycarbonate Polymers 0.000 abstract 1
- 239000004417 polycarbonate Substances 0.000 abstract 1
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 17
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 15
- 229920000388 Polyphosphate Polymers 0.000 description 5
- 150000004651 carbonic acid esters Chemical class 0.000 description 5
- 239000001205 polyphosphate Substances 0.000 description 5
- 235000011176 polyphosphates Nutrition 0.000 description 5
- 239000002041 carbon nanotube Substances 0.000 description 4
- 229910021393 carbon nanotube Inorganic materials 0.000 description 4
- JZZIHCLFHIXETF-UHFFFAOYSA-N dimethylsilicon Chemical class C[Si]C JZZIHCLFHIXETF-UHFFFAOYSA-N 0.000 description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- 150000001412 amines Chemical class 0.000 description 3
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- PSGAAPLEWMOORI-PEINSRQWSA-N medroxyprogesterone acetate Chemical compound C([C@@]12C)CC(=O)C=C1[C@@H](C)C[C@@H]1[C@@H]2CC[C@]2(C)[C@@](OC(C)=O)(C(C)=O)CC[C@H]21 PSGAAPLEWMOORI-PEINSRQWSA-N 0.000 description 2
- 229960001124 trientine Drugs 0.000 description 2
- 239000005711 Benzoic acid Substances 0.000 description 1
- 244000248349 Citrus limon Species 0.000 description 1
- 235000005979 Citrus limon Nutrition 0.000 description 1
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 230000003190 augmentative effect Effects 0.000 description 1
- 239000012975 dibutyltin dilaurate Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 230000000640 hydroxylating effect Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- 238000009738 saturating Methods 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D175/00—Coating compositions based on polyureas or polyurethanes; Coating compositions based on derivatives of such polymers
- C09D175/04—Polyurethanes
- C09D175/08—Polyurethanes from polyethers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
Landscapes
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Paints Or Removers (AREA)
Abstract
The invention discloses a heat dissipation coating for electronic elements, which is characterized by comprising the following components in parts by weight: 30-50 parts of aqueous polyurethane emulsion, 5-8 parts of surface hydroxylated carbon nanotubes and 5-10 parts of epoxy resin; 2-4 parts of graphene, 5-8 parts of aluminum oxide, 3-5 parts of ammonium molybdate, 0.1-0.3 part of polycarbonate, 1.1-2.2 parts of an auxiliary agent, 20-40 parts of water and 6-10 parts of a curing agent. The invention aims to overcome the defects in the prior art and provide the heat-dissipation coating for the electronic element, which has reasonable components and proportion and good heat-dissipation effect; another object of the present invention is to provide a method for preparing the above heat-dissipating coating material for electronic components.
Description
Technical field
The present invention relates to a kind of electronic component heat radiation coating, another object of the present invention is to provide one kind to prepare above-mentioned electricity
The method of subcomponent heat radiation coating.
Background technology
Electronic component heat radiation coating is a kind of radiating efficiency improving body surface, reduces the extraordinary painting of system temperature
Material.Electronic component heat radiation coating, is by improving body surface radiation efficiency, augmented heat dispersion.Existing electronics
Element is complicated with its formula of heat radiation coating, and component proportion is unreasonable, and radiating effect is relatively poor.
Content of the invention
The invention aims to overcoming weak point of the prior art, providing a kind of component and reasonable mixture ratio, dissipating
The good electronic component heat radiation coating of thermal effect；
Another object of the present invention is to provide a kind of method preparing above-mentioned electronic component heat radiation coating.
In order to achieve the above object, the present invention adopts below scheme：
A kind of electronic component heat radiation coating is it is characterised in that include following components by weight：
30～50 parts of aqueous polyurethane emulsion, 5～8 parts of the CNT of surface hydroxylation, 5～10 parts of epoxy resin；Stone
2～4 parts of black alkene, 5～8 parts of alundum (Al2O3), 3～5 parts of ammonium molybdate, 0.1～0.3 part of Merlon, auxiliary agent 1.1-2.2 part, water
20～40 parts, 6～10 parts of curing agent.
A kind of electronic component heat radiation coating is it is characterised in that described auxiliary agent includes 0.1- by weight as above
0.5 part of dispersant, 0.2-0.4 part adhesion promoter, 0.3～0.5 part of levelling agent, 0.5～0.8 part of plasticizer.
A kind of electronic component heat radiation coating is it is characterised in that described dispersant is polyphosphate as above；Described
Adhesion promoter is silane base silane；Described levelling agent is polyether-modified dimethyl silicone polymer, and described plasticizer is lemon
Sour tri-n-butyl.
A kind of electronic component heat radiation coating is it is characterised in that described aqueous polyurethane emulsion is alkane hydroxyl as above
Silicon oil modified aqueous polyurethane, preparation method is：By weight, by 10～30 parts of TDI, 8～20 parts of polyethers, DMPA8～16
Part, 10～18 parts of hydroxyl-containing silicone mix, and are warming up to 70～90 DEG C, add 0.5～3 part of organotin catalysts to be reacted
3～6h, adds 5～10 parts of chain extender and carries out reacting 1～3h, add acetone diluting reaction thing, adds triethylamine after cooling
Neutralize into salt, add water 10～20 parts of emulsifications, remove acetone under reduced pressure, emulsion may finally be obtained.
A kind of electronic component heat radiation coating is it is characterised in that the CNT of described surface hydroxylation is pressed as above
Prepared by following methods：By weight, in ball grinder, 0.1-0.5 part multi-walled carbon nano-tubes is mixed with 8-12 part potassium hydroxide
Conjunction, plus ethanol in proper amount, ball milling, after 15 hours, is washed with deionized reactant to neutral, CNT is put into 100 DEG C of vacuum
Obtain final product after being dried 12 hours in drying box.
A kind of electronic component heat radiation coating is it is characterised in that also to include 2-5 weight portion polyether-modified as above
Amido silicon oil.
A kind of electronic component heat radiation coating is it is characterised in that described polyether-containing aminopolysiloxane is by following as above
Prepared by method：S1：Equipped with agitator, condenser pipe, the there-necked flask of thermometer, adding 400 weight portion D4, stirring, heat up
To 115 DEG C, add catalyst TMAH 0.24 weight portion, about insulation half an hour, add after viscosity significantly increases
Enter coupling agent N- β (aminoethyl)-γ-aminopropyltriethoxy dimethoxy silane 20.8 weight portion, temperature control 115 DEG C about 6 hours, obtain
To amido silicon oil；S2：Equipped with agitator, condenser pipe, the 1000ml there-necked flask of thermometer, add the above-mentioned conjunction of 200 weight portions
The amido silicon oil becoming, 150 parts by weight of activated polyethers, 105g isopropanol, at 80～92 DEG C, carry out back flow reaction, saturating to reactant
After bright, it is further continued for being incubated four hours, finally under the conditions of 0.01MPa, cooling decompression sloughs isopropanol, obtains final product.
Organotin catalysts of the present invention refer to dibutyl tin dilaurate.
Polyethers of the present invention refers to polyethers E-210.
Chain extender of the present invention is l, 4- butanediol, neopentyl glycol, ethylene glycol, diglycol, glycerine, suitable fourth
One of enedioic acid acid anhydride, trimethylolpropane, ethylenediamine, diethylenetriamine, triethylene tetramine or dihydromethyl propionic acid or several
The mixture planted.
Emulsification refers to stirring under speed 2000～4000rpm.
A kind of method preparing electronic component heat radiation coating as claimed in claim 1 of the present invention is it is characterised in that include
Following steps：
By aqueous polyurethane emulsion, the CNT of surface hydroxylation, Graphene, alundum (Al2O3), ammonium molybdate, poly- carbonic acid
Ester, auxiliary agent, water add in paint grinder mill after mixing and are ground to 30-50 μm, and ultrasonic disperse uniformly, adds curing agent mixing
Uniformly.
In sum, the present invention with respect to prior art its advantage is：
Instant component and reasonable mixture ratio, good heat dissipation effect.
Specific embodiment
With reference to specific embodiment, the invention will be further described：
Embodiment 1
30 parts of aqueous polyurethane emulsion, 5 parts of the CNT of surface hydroxylation, 5 parts of epoxy resin, 2 parts of Graphene, three oxygen
Change 5 parts of two aluminium, 3 parts of ammonium molybdate, 0.1 part of Merlon, 1.1 parts of auxiliary agent, 20 parts of water, 6 parts of curing agent.
Curing agent of the present invention is triethylene tetramine.
Described auxiliary agent includes 0.1 part of polyphosphate, 0.2 part of silane base silane, polyether-modified poly dimethyl silicon by weight
0.3 part of oxygen alkane, 0.5 part of tri-n-butyl citrate.
Described aqueous polyurethane emulsion is hydroxyl-containing silicone modified aqueous polyurethane, and preparation method is：By weight, will
10 parts of TDI, 8 parts of polyethers, 8 parts of DMPA, 10 parts of hydroxyl-containing silicone mix, and are warming up to 70 DEG C, add organotin catalysts
0.5 part carries out reacting 3h, adds 5 parts of chain extender and carries out reacting 1h, adds acetone diluting reaction thing, add three second after cooling
In amine with become salt, add water 10 parts of emulsifications, remove acetone under reduced pressure, emulsion may finally be obtained.
The CNT of described surface hydroxylation is prepared as follows：By weight, by more than 0.1 part in ball grinder
Wall carbon nano tube is mixed with 8 parts of potassium hydroxide, plus ethanol in proper amount, and ball milling is after 15 hours, be washed with deionized reactant in
Property, CNT is put into and obtains final product after being dried 12 hours in 100 DEG C of vacuum drying chambers.
Preparation method comprises the following steps：
By aqueous polyurethane emulsion, the CNT of surface hydroxylation, Graphene, alundum (Al2O3), ammonium molybdate, poly- carbonic acid
Ester, auxiliary agent, water add in paint grinder mill after mixing and are ground to 30-50 μm, and ultrasonic disperse uniformly, adds curing agent mixing
Uniformly.
Embodiment 2
50 parts of aqueous polyurethane emulsion, 8 parts of the CNT of surface hydroxylation, 10 parts of epoxy resin, 4 parts of Graphene, three
8 parts of Al 2 O, 5 parts of ammonium molybdate, 0.3 part of Merlon, 2.2 parts of auxiliary agent, 40 parts of water, 10 parts of curing agent.
Described auxiliary agent includes 0.5 part of polyphosphate, 0.4 part of silane base silane, polyether-modified poly dimethyl silicon by weight
0.5 part of oxygen alkane, 0.8 part of tri-n-butyl citrate.
Described aqueous polyurethane emulsion is hydroxyl-containing silicone modified aqueous polyurethane, and preparation method is：By weight, will
30 parts of TDI, 20 parts of polyethers, DMPA16 part, 18 parts of hydroxyl-containing silicone mix, and are warming up to 90 DEG C, add organotin catalysts
0.5～3 part carries out reacting 6h, adds 10 parts of chain extender and carries out reacting 3h, adds acetone diluting reaction thing, add after cooling
In triethylamine with become salt, add water 20 parts of emulsifications, remove acetone under reduced pressure, emulsion may finally be obtained.
The CNT of described surface hydroxylation is prepared as follows：By weight, by more than 0.5 part in ball grinder
Wall carbon nano tube is mixed with 12 parts of potassium hydroxide, plus ethanol in proper amount, and ball milling is after 15 hours, be washed with deionized reactant in
Property, CNT is put into and obtains final product after being dried 12 hours in 100 DEG C of vacuum drying chambers.
Preparation method comprises the following steps：
By aqueous polyurethane emulsion, the CNT of surface hydroxylation, Graphene, alundum (Al2O3), ammonium molybdate, poly- carbonic acid
Ester, auxiliary agent, water add in paint grinder mill after mixing and are ground to 30-50 μm, and ultrasonic disperse uniformly, adds curing agent mixing
Uniformly.
Embodiment 3
40 parts of aqueous polyurethane emulsion, 6 parts of the CNT of surface hydroxylation, 7 parts of epoxy resin, 3 parts of Graphene, three oxygen
Change 6 parts of two aluminium, 4 parts of ammonium molybdate, 0.2 part of Merlon, 1.5 parts of auxiliary agent, 30 parts of water, 8 parts of curing agent.
Described auxiliary agent includes 0.2 part of polyphosphate, 0.3 part of silane base silane, polyether-modified poly dimethyl silicon by weight
0.4 part of oxygen alkane, 0.6 part of tri-n-butyl citrate.
Described aqueous polyurethane emulsion is hydroxyl-containing silicone modified aqueous polyurethane, and preparation method is：By weight, will
20 parts of TDI, 12 parts of polyethers, 12 parts of DMPA, 14 parts of hydroxyl-containing silicone mix, and are warming up to 80 DEG C, add organotin catalyzed
1 part of agent carries out reacting 4h, adds 6 parts of chain extender and carries out reacting 2h, adds acetone diluting reaction thing, add three second after cooling
In amine with become salt, add water 15 parts of emulsifications, remove acetone under reduced pressure, emulsion may finally be obtained.
The CNT of described surface hydroxylation is prepared as follows：By weight, by more than 0.2 part in ball grinder
Wall carbon nano tube is mixed with 10 parts of potassium hydroxide, plus ethanol in proper amount, and ball milling is after 15 hours, be washed with deionized reactant in
Property, CNT is put into and obtains final product after being dried 12 hours in 100 DEG C of vacuum drying chambers.
Preparation method comprises the following steps：
By aqueous polyurethane emulsion, the CNT of surface hydroxylation, Graphene, alundum (Al2O3), ammonium molybdate, poly- carbonic acid
Ester, auxiliary agent, water add in paint grinder mill after mixing and are ground to 30-50 μm, and ultrasonic disperse uniformly, adds curing agent mixing
Uniformly.
Embodiment 4
50 parts of aqueous polyurethane emulsion, 5 parts of the CNT of surface hydroxylation, 10 parts of epoxy resin, 4 parts of Graphene, three
8 parts of Al 2 O, 5 parts of ammonium molybdate, 0.1 part of Merlon, 1.1 parts of auxiliary agent, 40 parts of water, 10 parts of curing agent, 5 weight portion polyethers change
Property amido silicon oil.
Described auxiliary agent includes 0.1 part of polyphosphate, 0.2 part of silane base silane, polyether-modified poly dimethyl silicon by weight
0.3 part of oxygen alkane, 0.5 part of tri-n-butyl citrate.
Described aqueous polyurethane emulsion is hydroxyl-containing silicone modified aqueous polyurethane, and preparation method is：By weight, will
15 parts of TDI, 18 parts of polyethers, DMPA14 part, 16 parts of hydroxyl-containing silicone mix, and are warming up to 85 DEG C, add organotin catalysts
2.5 parts carry out reacting 5h, add 8 parts of chain extender and carry out reacting 2h, add acetone diluting reaction thing, add three second after cooling
In amine with become salt, add water 15 parts of emulsifications, remove acetone under reduced pressure, emulsion may finally be obtained.
The CNT of described surface hydroxylation is prepared as follows：By weight, by more than 0.1 part in ball grinder
Wall carbon nano tube is mixed with 12 parts of potassium hydroxide, plus ethanol in proper amount, and ball milling is after 15 hours, be washed with deionized reactant in
Property, CNT is put into and obtains final product after being dried 12 hours in 100 DEG C of vacuum drying chambers.
Described polyether-containing aminopolysiloxane is prepared as follows：S1：Equipped with agitator, condenser pipe, thermometer three
In mouth flask, add 400 weight portion D4, stirring, be warming up to 115 DEG C, add catalyst TMAH 0.24 weight portion,
About insulation half an hour, add coupling agent N- β (aminoethyl)-γ-aminopropyltriethoxy dimethoxy silane after viscosity significantly increases
20.8 weight portions, temperature control 115 DEG C about 6 hours, obtain amido silicon oil；S2：Equipped with agitator, condenser pipe, thermometer
In 1000ml there-necked flask, add the amido silicon oil of the above-mentioned synthesis of 200 weight portions, 150 parts by weight of activated polyethers, 105g isopropyl
Alcohol, at 80～92 DEG C, carries out back flow reaction, to reactant transparent after, be further continued for being incubated four hours, finally in 0.01MPa bar
Under part, cooling decompression sloughs isopropanol, obtains final product.
Preparation method comprises the following steps：
By aqueous polyurethane emulsion, the CNT of surface hydroxylation, Graphene, alundum (Al2O3), ammonium molybdate, poly- carbonic acid
Ester, auxiliary agent, water and other component add in paint grinder mill after mixing and are ground to 30-50 μm, and ultrasonic disperse uniformly, adds
Curing agent mixes.
Above electronic component is carried out with heat radiation coating with electromagnetic shielding and infrared heat dispersion characterizes, result is as follows：
As can be seen from the above table, electronic component heat radiation coating of the present invention has preferably anti-effectiveness, tool
There are less sheet resistance and larger shield effectiveness, by changing to aqueous polyurethane emulsion hydroxyl-containing silicone in the present invention
Property, improve the compatibility of surface polyurethane material and granular materials so as to get face coat anti-effectiveness more
Good；Modified by CNT is carried out with hydroxylating, also improve its heat-conducting effect.
General principle and principal character and the advantages of the present invention of the present invention have been shown and described above.The skill of the industry
The simply explanation it should be appreciated that the present invention is not restricted to the described embodiments, described in above-described embodiment and specification for the art personnel
The principle of the present invention, without departing from the spirit and scope of the present invention, the present invention also has various changes and modifications, these
Changes and improvements both fall within scope of the claimed invention.Claimed scope by appending claims and
Its equivalent thereof.
Claims (8)
1. a kind of electronic component heat radiation coating is it is characterised in that include following components by weight：
30～50 parts of aqueous polyurethane emulsion, 5～8 parts of the CNT of surface hydroxylation, epoxy resin 5-10 part, Graphene 2
～4 parts, 5～8 parts of alundum (Al2O3), 3～5 parts of ammonium molybdate, 0.1～0.3 part of Merlon, auxiliary agent 0.1-2.2 part, water 20～40
Part, 6～10 parts of curing agent.
2. a kind of electronic component heat radiation coating according to claim 1 is it is characterised in that described auxiliary agent wraps by weight
Include 0.1-0.5 part dispersant, 0.2-0.4 part adhesion promoter, 0.3～0.5 part of levelling agent, plasticizer 0.5～0.8.
3. a kind of electronic component heat radiation coating according to claim 2 is it is characterised in that described dispersant is polyphosphoric acid
Ester；Described adhesion promoter is silane base silane；Described levelling agent is polyether-modified dimethyl silicone polymer, described plasticizer
For tri-n-butyl citrate.
4. a kind of electronic component heat radiation coating according to claim 1 is it is characterised in that described aqueous polyurethane emulsion
For hydroxyl-containing silicone modified aqueous polyurethane, preparation method is：By weight, by 10～30 parts of TDI, 8～20 parts of polyethers,
DMPA8～16 part, 10～18 parts of hydroxyl-containing silicone mix, and are warming up to 70～90 DEG C, add organotin catalysts 0.5～3
Part carries out reacting 3～6h, adds 5～10 parts of chain extender and carries out reacting 1～3h, adds acetone diluting reaction thing, after cooling
Add triethylamine in become salt, add water 10～20 parts of emulsifications, remove acetone under reduced pressure, emulsion may finally be obtained.
5. a kind of electronic component heat radiation coating according to claim 1 is it is characterised in that the carbon of described surface hydroxylation
Nanotube is prepared as follows：By weight, by 0.1-0.5 part multi-walled carbon nano-tubes and 8-12 part hydrogen-oxygen in ball grinder
Change potassium mixing, plus ethanol in proper amount, ball milling, after 15 hours, is washed with deionized reactant to neutral, CNT is put into 100
Obtain final product after being dried 12 hours in DEG C vacuum drying chamber.
6. a kind of electronic component heat radiation coating according to claim 1 gathers it is characterised in that also including 2-5 weight portion
Ether modified amino silicon oil.
7. a kind of electronic component heat radiation coating described in 6 is required it is characterised in that described polyether-containing aminopolysiloxane according to profit
It is prepared as follows：S1：Equipped with agitator, condenser pipe, the there-necked flask of thermometer, add 400 weight portion D4, stir
Mix, be warming up to 115 DEG C, add catalyst TMAH 0.24 weight portion, about insulation half an hour, treat that viscosity substantially increases
Add coupling agent N- β (aminoethyl)-γ-aminopropyltriethoxy dimethoxy silane 20.8 weight portion afterwards greatly, temperature control is at 115 DEG C about 6
Hour, obtain amido silicon oil；S2：Equipped with agitator, condenser pipe, the 1000ml there-necked flask of thermometer, add 200 weight portions
The amido silicon oil of above-mentioned synthesis, 150 parts by weight of activated polyethers, 105g isopropanol, at 80～92 DEG C, carry out back flow reaction, to anti-
After answering thing transparent, it is further continued for being incubated four hours, finally under the conditions of 0.01MPa, cooling decompression sloughs isopropanol, obtains final product.
8. a kind of method preparing electronic component heat radiation coating as claimed in claim 1 is it is characterised in that comprise the following steps：
By aqueous polyurethane emulsion, the CNT of surface hydroxylation, epoxy resin, Graphene, alundum (Al2O3), ammonium molybdate,
Merlon, auxiliary agent, water add in paint grinder mill after mixing and are ground to 30-50 μm, and ultrasonic disperse uniformly, adds solidification
Agent mixes.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108192461A (en) * | 2017-12-26 | 2018-06-22 | 天长市金陵电子有限责任公司 | A kind of LED light is with being not easy to peel off heat radiation coating |
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