CN106392341B - A kind of fragile material drilling method - Google Patents
A kind of fragile material drilling method Download PDFInfo
- Publication number
- CN106392341B CN106392341B CN201610975424.9A CN201610975424A CN106392341B CN 106392341 B CN106392341 B CN 106392341B CN 201610975424 A CN201610975424 A CN 201610975424A CN 106392341 B CN106392341 B CN 106392341B
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- China
- Prior art keywords
- fragile material
- laser
- sliver
- processing
- drilling method
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
- B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/54—Glass
Abstract
The present invention relates to laser drilling fields, and in particular to a kind of fragile material drilling method.Fragile material to be processed cut at silk using ultrashort laser pulse beam, forms the annulus for penetrating the fragile material；One ablation areas is set in the annulus, and the shape of the ablation areas is designated shape, is removed in the way of laser ablation to the fragile material of the designated shape, is formed multiple to sliver processing and mutually disjunct to sliver monomer；To it is multiple it is described to sliver monomer simultaneously carry out sliver processing, realize the perforation processing of the fragile material.It will cut at silk and be combined with laser ablation, and its edge chipping and heat-affected zone can be reduced, so that the efficiency and success rate of lifting, punching, reduce cost.Solves the efficiency and effect problem in process.
Description
Technical field
The present invention relates to laser drilling fields, and in particular to a kind of fragile material drilling method.
Background technique
Sapphire crystal is a kind of multifunctional oxygen compound for integrating excellent optics, physics, chemistry and mechanical performance,
It is widely used in the fields such as industry, national defence and scientific research, is usually used in making optical element, window material and micromechanical devices etc.,
Especially on mobile phone products application and be concerned again.Most of application requirement sapphires must have very high processing matter
Amount, but since sapphire brittleness is very big, the problems such as traditional machining is also easy to produce chipping, crackle and tool wear, and by
In its superior chemical stability, traditional chemical etching is extremely difficult to processing request, however laser processing technology has non-connect
Touching, the characteristics such as easy to operate, flexibility is high, may be implemented arbitrary shape, processing rapidly and efficiently.
The interaction of laser and storeroom can be divided into photothermy and photochemical effect, i.e., " hot-working " and " cold to add
Work ".Laser heat processing refers to makes material fusing evaporation achieve the purpose that removal using the heat effect of laser, the CO2 generally used
The mainstream laser pulsewidth towards industrial application such as laser, optical-fiber laser, semiconductor laser and excimer laser is mostly in microsecond
(μm), nanosecond (ns) are horizontal.Long pulsewidth laser action absorbs laser energy when material, through Joule heating, through lattice/electronics
Heat transfer makes material irradiation region heat up, and is melted to the removal that material is completed in gasification." hot-working " effect easily cause consolidation residue,
The heat affectings such as strain crack, which limit the processing quality of workpiece and efficiency.
Eliminating laser must just inhibit laser energy to input generated heat-conduction effect material " hot-working " effect.Such as
The action time of fruit laser photon can be less than material conduction band electron/lattice thermal vibration passing time, it is possible to because coming
Not as good as carrying out hot transmitting, and the mechanism such as ionization by collision, photoionization or tunnel ionization under being acted on by photon excitation electronics from
Valence band transits to conduction band, and electron concentration can constantly enhance with the progress of ionization, be exploded before end-of-pulsing by coulomb
Reach threshold limit value, cause the expendable destruction of material lattice structure, macroscopical presentation is to be applied material without " fuel factor "
Removal, here it is ultra-short pulse laser realize " cold working " basic physical basis.Laser cold working refers to that material molecule is same
When or the multiple photons of continuous absorption make that the chemical bond in material is interrupted or lattice structure is destroyed, to reach the mesh of removal
, the method is more suitable for the low-loss processing of sapphire high quality.Laser cold working generally uses short pulse and short wavelength
Laser.Picosecond laser allows directly to pump using laser diode, and single pulse energy has had commonly up to J grades of tens μ
MHz grades of high repetition frequencies ensure that the high removal rate of picosecond laser processing, basic fundamental parameter attribute make the reality of picosecond laser
Processing efficiency can be far longer than other types ultrafast laser, be expected to bring breakthrough in terms of material machining accuracy takes into account processing efficiency
Property it is winged remote.In addition, picosecond laser also has the beam quality (beam quality factor M2 < 1.3), good of accessible diffraction limit
Stability and lower equipment purchasing and maintenance cost, make it have boundless application prospect to shape in industrial circle
There is the advantage less than other types laser at the efficiently high-precision new removal manufacturing science taken into account.
At this stage the fragile materials such as sapphire punch using laser general using at silk cutting and laser ablation two
Kind method.
1, as shown in Figure 1, being cut at silk: referring to and be formed by filament phenomenon when superpower short laser pulse transmits in the medium.
Ultrashort laser pulse beam acts on sapphire/glass surface, is formed in the interior thereof perforative Filamentous pattern.Filamentous pattern destroys
Material internal stress structure, cooperating suitable sliver mode, (physics punching press sliver, CO2 laser thermal effect sliver, chemical agent are rotten
Erosion sliver etc.) material separation can be realized.The practical mark area of the method is small, the mark time is short, high-efficient, and punched hole without
Obvious taper can reduce the energy of material absorption, reduce stress accumulation, the intensity of preferable reserved materials.But for indigo plant
The materials such as jewel can not be such that material in hole is efficiently separated with matrix after carrying out such method and being punched.And due to
The reasons such as the setting of parameter, which will lead to, is also easy to produce non-uniform sawtooth on cutting track.
2, as shown in Fig. 2, laser ablation: laser beam acts on sapphire/glass surface and brings it about one kind of gasification
Except processing method.Removal range is laser facula irradiation area, cooperates X-Y two-dimensional scanning mirrors system and image editing system,
The material removal of designated shape can be achieved.This drilling method keeps removal part integrally formed, more simple without carrying out sliver operation
It is single.But its punching time is longer, when handling thicker material or larger aperture, is also easy to produce taper.As laser sweeps material
The increase for retouching the time easily leads to material internal stress accumulation, influences the intensity of material, and stress easily occurs in process and releases
The rupture for leading to sample is put, production efficiency is influenced, increases security risk.
Summary of the invention
In order to solve the above technical problems, stress release can be alleviated to a certain extent the present invention provides a kind of, and split
The low fragile material drilling method of piece difficulty.
The technical scheme is that, comprising:
Fragile material to be processed cut at silk using ultrashort laser pulse beam, formation penetrates the fragile material
Annulus；
One ablation areas is set in the annulus, and the shape of the ablation areas is designated shape, is disappeared using laser
The mode melted is removed the fragile material of the designated shape, is formed multiple to sliver processing and mutually disjunct to sliver
Monomer；
To it is multiple it is described to sliver monomer simultaneously carry out sliver processing, realize the perforation processing of the fragile material.
Further, the designated shape is the cross or M shape that end is intersected with the annulus, the laser light
After spot carries out laser ablation processing to cross or M shape region, formed to sliver processing and mutual disjunct multiple fan sections
Domain.
Further, the designated shape is the hollow polygon that vertex is intersected with the annulus, the laser facula pair
After hollow polygonal region carries out laser ablation processing, formed to sliver processing and mutual disjunct arcuate region.
Further, sliver processing is carried out to sliver monomer to described using CO2 laser.
Further, when being cut using ultrashort laser pulse beam is described to fragile material to be processed progress at silk, formation
Hot spot point spacing is 3-10um.
Further, when cutting using ultrashort laser pulse beam is described to fragile material to be processed progress at silk, laser is defeated
Power is 15-50W, output frequency 20-100KHz out.
Further, when cutting using ultrashort laser pulse beam is described to fragile material to be processed progress at silk, laser is cut
Cutting a movement speed is 50-200mm/s.
Further, when being handled in the way of the laser ablation the fragile material, laser facula overlapping
Rate is 70%~95%.
Further, when being handled in the way of the laser ablation the fragile material, scanning galvanometer is mobile
Speed is 1000-4000mm/s.
Further, when being handled in the way of the laser ablation the fragile material, laser output frequency
For 200-500KHz.
Beneficial effects of the present invention: will cut at silk and combine with laser ablation, cut shape at silk using laser ablation
At circle ring area in carry out cross, rice word or polygon ablation processing, make entire circle to sliver Region Decomposition at multiple fans
Shape or arch wait for sliver monomer, carry out sliver processing respectively to sliver monomer to each, effectively reduce sliver difficulty, so that
The perforation processing can be suitably used for the processing of the fragile materials such as glass, sapphire.And when due to carrying out laser ablation, hot spot active region
Domain is only cross, rice block domain or polygon outer outline area, and compared to traditional entire border circular areas, sphere of action is significantly
It reduces, to alleviate problem caused by stress release, keeps stress accumulation effect unobvious, the strength of materials can be kept, made
Material after excision is not easily broken.The processing method reduces edge chipping and heat-affected zone, thus the efficiency of lifting, punching
And success rate, reduce cost.Solves the efficiency and effect problem in process.
Detailed description of the invention
Fig. 1 is into silk cutting schematic diagram；
Fig. 2 is laser ablation schematic diagram；
Fig. 3 is a kind of embodiment schematic diagram of this patent fragile material drilling method；
Fig. 4 is another embodiment schematic diagram of this patent fragile material drilling method；
Specific embodiment
Below by way of specific embodiment, the present invention is described in further detail:
The principle of combined machining method is in the present invention: sapphire cut at silk by ultrashort pulse laser,
The advantages of melting in conjunction with partial region of the laser ablation to cutting center, combine two kinds of boring techniques, one
Determine to alleviate problem caused by stress release in degree, and is significantly reduced the difficulty of sliver.
Specifically, the scheme that the present invention uses is:
As shown in figure 3, adjusting suitable parameter in the hollow ring of one diameter 1mm of motion control software inside-paint first
After open laser, it is that 1mm penetrates the annulus of sapphire layer (as schemed that laser, which cuts out a diameter in sapphire surface by cutting head,
Shown in 1, which is approximate annulus, practical to be formed by multiple through-holes for penetrating sapphire layer by circular arrangement).Followed by
The annulus that CCD cuts cutting head positions, and is moved to below scanning galvanometer using software control platform, is shaken using scanning
Mirror processes annulus inside, and a solid cross is drawn on mark software, opens laser, resets parameter, mobile
The laser facula of scanning galvanometer gets solid cross or rice word inside annulus, and makes the endpoint and circle of solid cross or rice word
Ring intersection, formed it is multiple when sliver processing and mutual disjunct fan-shaped region (being four quadrants when cross), it is each
A fan-shaped region is one to sliver monomer.As shown in Figure 4, or using the polygons such as hollow triangle as assignment graph into
Row laser ablation, thus formed it is multiple to sliver processing and mutually disjunct arcuate region, each arcuate region be one to
Sliver monomer.Sliver processing finally is carried out simultaneously to sliver monomer to each using CO2 laser, makes internal annulus and sapphire
Substrate is effectively separated.
Wherein, the present embodiment is when cut at silk, laser parameter are as follows: laser cutting head movement speed 50-200mm/,
Frequency is 20-100KHz, and output power 15-50W, the hot spot point spacing of formation is 3-10um.When carrying out laser ablation, swash
Optical parameter are as follows: scanning galvanometer movement speed is 1000-4000mm/s, frequency 200-500KHz, laser output power 15-
50W, light laser beam overlap ratio are 70%~95%.When carrying out sliver processing, vibration mirror scanning movement speed is 300-800mm/s, is swashed
Light output frequency is 10-50KHz, laser output power 50-100W.
The above description is merely a specific embodiment, it is noted that anyone skilled in the art exists
Disclosed herein technical scope in, any changes or substitutions that can be easily thought of, should all cover protection scope of the present invention it
It is interior.
Claims (8)
1. a kind of fragile material drilling method, it is characterised in that:
Fragile material to be processed cut at silk using ultrashort laser pulse beam, forms the circle for penetrating the fragile material
Ring；
One ablation areas is set in the annulus, and the shape of the ablation areas is designated shape, utilizes laser ablation
Mode is removed the fragile material of the designated shape, is formed multiple to sliver processing and mutually disjunct to sliver list
Body；
To it is multiple it is described to sliver monomer simultaneously carry out sliver processing, realize the perforation processing of the fragile material；
The designated shape is the hollow polygon that vertex is intersected with the annulus, and laser facula carries out hollow polygonal region
After laser ablation processing, formed to sliver processing and mutual disjunct arcuate region；Or
The designated shape is the cross or M shape that end is intersected with the annulus, and laser facula is to cross or M shape
After region carries out laser ablation processing, formed to sliver processing and mutual disjunct multiple fan-shaped regions.
2. fragile material drilling method as described in claim 1, it is characterised in that: using CO2 laser to described to sliver
Monomer carries out sliver processing.
3. fragile material drilling method as described in claim 1, it is characterised in that: using ultrashort laser pulse beam to be processed
Fragile material carries out described when cutting at silk, and the hot spot point spacing of formation is 3-10um.
4. fragile material drilling method as described in claim 1, it is characterised in that: using ultrashort laser pulse beam to be processed
Fragile material carries out described when cutting at silk, laser output power 15-50W, output frequency 20-100KHz.
5. fragile material drilling method as described in claim 1, it is characterised in that: using ultrashort laser pulse beam to be processed
Fragile material carries out described when cutting at silk, and laser cutting head movement speed is 50-200mm/s.
6. fragile material drilling method as described in claim 1, it is characterised in that: to institute in the way of the laser ablation
When stating fragile material and being handled, laser facula Duplication is 70%~95%.
7. fragile material drilling method as described in claim 1, it is characterised in that: to institute in the way of the laser ablation
When stating fragile material and being handled, scanning galvanometer movement speed is 1000-4000mm/s.
8. fragile material drilling method as described in claim 1, it is characterised in that: to institute in the way of the laser ablation
When stating fragile material and being handled, laser output frequency 200-500KHz.
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| CN201610975424.9A CN106392341B (en) | 2016-11-07 | 2016-11-07 | A kind of fragile material drilling method |
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| CN201610975424.9A CN106392341B (en) | 2016-11-07 | 2016-11-07 | A kind of fragile material drilling method |
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| CN106392341A CN106392341A (en) | 2017-02-15 |
| CN106392341B true CN106392341B (en) | 2019-06-11 |
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Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106891098B (en) * | 2017-03-17 | 2018-06-29 | 北京工业大学 | A kind of laser high method for fine finishing of sapphire submicron order section |
| CN108971775B (en) * | 2017-06-02 | 2021-05-18 | 大族激光科技产业集团股份有限公司 | Laser drilling method and device for metal |
| CN108723615A (en) * | 2018-07-17 | 2018-11-02 | 西安中科微精光子制造科技有限公司 | Micropore laser processing and system based on the control of laser pulse Duplication |
| CN109226977A (en) * | 2018-09-12 | 2019-01-18 | 广东正业科技股份有限公司 | A kind of low temperature process method and system of hard brittle material |
| CN109175714B (en) * | 2018-09-27 | 2021-02-12 | 江苏大学 | Laser rotary cutting marking method for surface of hard and brittle material |
| CN109304547A (en) * | 2018-10-12 | 2019-02-05 | 广东正业科技股份有限公司 | A kind of laser processing and system of hard brittle material |
| KR20220035332A (en) * | 2019-07-16 | 2022-03-22 | 닛토덴코 가부시키가이샤 | How to divide composites |
| CN111151895A (en) * | 2020-01-13 | 2020-05-15 | 大族激光科技产业集团股份有限公司 | Process and system for cutting transparent material by utilizing filamentation effect |
| CN112234017B (en) * | 2020-10-19 | 2023-07-14 | 绍兴同芯成集成电路有限公司 | Double-sided processing technology for glass carrier plate and wafer |
| CN113172354A (en) * | 2021-05-13 | 2021-07-27 | 深圳力星激光智能装备有限公司 | Laser processing method for hole-shaped structure of brittle sheet |
| CN115536257A (en) * | 2022-10-25 | 2022-12-30 | 深圳市益铂晶科技有限公司 | Corrosion splitting method for glass micropores |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102785031A (en) * | 2012-08-15 | 2012-11-21 | 武汉隽龙科技有限公司 | Method and device for cutting transparent material by using ultra-short pulse laser |
| CN104216047A (en) * | 2014-09-26 | 2014-12-17 | 南京先进激光技术研究院 | Method for manufacturing optical waveguide based on self-focusing filamentation ultra-short pulse laser |
| US9102011B2 (en) * | 2013-08-02 | 2015-08-11 | Rofin-Sinar Technologies Inc. | Method and apparatus for non-ablative, photoacoustic compression machining in transparent materials using filamentation by burst ultrafast laser pulses |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009142886A (en) * | 2007-12-18 | 2009-07-02 | Agt:Kk | Laser drilling method |
| EP2781296B1 (en) * | 2013-03-21 | 2020-10-21 | Corning Laser Technologies GmbH | Device and method for cutting out contours from flat substrates using a laser |
| KR20160058902A (en) * | 2013-11-28 | 2016-05-25 | 도레이 카부시키가이샤 | Anti-thrombotic material |
| US9938187B2 (en) * | 2014-02-28 | 2018-04-10 | Rofin-Sinar Technologies Llc | Method and apparatus for material processing using multiple filamentation of burst ultrafast laser pulses |
-
2016
- 2016-11-07 CN CN201610975424.9A patent/CN106392341B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102785031A (en) * | 2012-08-15 | 2012-11-21 | 武汉隽龙科技有限公司 | Method and device for cutting transparent material by using ultra-short pulse laser |
| US9102011B2 (en) * | 2013-08-02 | 2015-08-11 | Rofin-Sinar Technologies Inc. | Method and apparatus for non-ablative, photoacoustic compression machining in transparent materials using filamentation by burst ultrafast laser pulses |
| CN104216047A (en) * | 2014-09-26 | 2014-12-17 | 南京先进激光技术研究院 | Method for manufacturing optical waveguide based on self-focusing filamentation ultra-short pulse laser |
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