CN106376225A - Plug-type spray cooling device applied to super-computing center - Google Patents
Plug-type spray cooling device applied to super-computing center Download PDFInfo
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- CN106376225A CN106376225A CN201611052969.9A CN201611052969A CN106376225A CN 106376225 A CN106376225 A CN 106376225A CN 201611052969 A CN201611052969 A CN 201611052969A CN 106376225 A CN106376225 A CN 106376225A
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- Prior art keywords
- cooling device
- spraying chamber
- spray cooling
- instant
- nozzle
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
Abstract
The invention relates to a plug-type spray cooling device applied to a super-computing center. The cooling device comprises more than one enclosed spray cavity; one sidewall of each spray cavity includes a copper cold plate, and the corresponding other sidewall is provided with more than five nozzles mounted in an array; the cooling device also comprises a liquid storage tank and a micro pump; and the more than one enclosed spray cavity and the liquid storage tank form an enclosed circulation loop. During use, each copper cold plate is tightly fixed on a cooled heating component via a corresponding insertion sheet, and heat of the heating component is taken away via cooling by the copper cold plate. Each spray is connected with a header liquid input pipe via a valve, adjustment can be made according to conditions, and it is ensured that the cooling system operates safely and reliably. The cooling system is high in integrated level, convenient to install and replace, safe to use, and suitable for super computer equipment of high heat flux and high integrated degree and different high-heat-flux distributed heat sources.
Description
Technical field
The invention belongs to refrigeration technology field is and in particular to a kind of instant-plugging spray cooling for supercomputer radiating
Device.
Background technology
Supercomputer suffers from being widely applied in every field, with the arrival in big data epoch, to supercomputing
The performance of machine is put forward higher requirement.Supercomputer improves constantly in integrated level, data-handling capacity and calculating speed
Meanwhile, its energy consumption is also continuously increased, and the heating of chip and integrating cabinet is also increasingly severe, and the radiating of supercomputer becomes system
About one of key issue of its development.
Chao Suan center cooling at present mainly uses air-cooled and water-cooled two ways.Air-cooled cooling is main empty using precision
Adjust and whole machine room cooled down, although this type of cooling simple system, easy to maintenance, air-cooled unit packing density is big,
Lead to air-flow to be difficult to be evenly distributed, so that each cabinet temperature skewness of machine room, local temperature easily occurs too high.
Additionally, air-cooled unit cooling noise is big, and cooling effectiveness is low, high energy consumption.Cooling by water mainly includes water-cooling tower and water cooling unit
Cabinet, its advantage is that cooling effectiveness is high, the air conditioning unit energy-conservation 15% about of ratio, but water-cooled principle is by machine room interior-heat using coolant
Amount is taken away, then coolant is carried out cooling to enter back in machine room be circulated by cooling column or water-cooled cabinet, be not to send out
The direct cooling of thermal, reduces the cooling effectiveness of water-cooled.And water-cooling tower and water-cooled cabinet cost are high, need special system
Cold group, and maintenance cost is high.In sum, there is certain limitation to the type of cooling at Chao Suan center at present.Therefore,
Need a kind of novel cooling manner to improve cooling effectiveness, and reduce power consumption of cooling.
Content of the invention
In order to overcome the shortcomings of traditional type of cooling, a kind of instant-plugging being applied to Chao Suan center of present invention proposition is sprayed cold
But device.
The instant-plugging spray cooling device being applied to Chao Suan center includes more than one airtight spraying chamber 7;Each spraying
The side cavity wall in chamber 7 is copper sheet cold drawing 8, and corresponding opposite side cavity wall 5 is laid with the nozzle 6 of more than five;Spraying chamber 7
Top is provided with inlet 12, and the nozzle 6 of more than five connects inlet 12, and described inlet 12 connects the one of feed tube
End, the other end of feed tube connects fluid reservoir 1;Described feed tube is provided with valve 4, on the feed tube of the entrance of valve 4
Connect Micropump 2;The bottom in spraying chamber 7 is provided with liquid outlet 13, and liquid outlet 13 connects fluid reservoir 1, described storage by drain pipe
Connect in liquid pipe condenser 11;One above airtight spraying chamber 7 and fluid reservoir 1 form looping back of a closing
Road.
During use, copper sheet cold drawing 8 is tightly fixed on cooled heater element by inserted sheet 9, and cooling working medium is from feed liquor
Mouth 12 enters spraying chambeies 7, in spraying chamber 7, spray cooling occurs, and generation cooling effect on copper sheet cold drawing 8, by copper sheet
The cooling of cold drawing 8 is taking away the heat of heater element.
The technical scheme limiting further is as follows:
Described nozzle 6 is pressure swirl atomizer, and nozzle od is 6mm, and spray orifice aperture is 0.2mm.
Spacing 1cm between adjacent nozzle 6.
Described cavity wall 5 is double wall, and the inner side wall thickness of double wall is 1.2mm;Nozzle 6 array of described more than five is located at interior
On the wall of side, and it is respectively communicated with medial wall, described inlet 12 is located at the top of double wall.
On described medial wall, array is provided with eight nozzles 6, and eight nozzles connect medial wall.
Described Micropump 2 is magnetically-actuated gear electric pump.
Described condenser 11 is the parallel flow condenser with high-speed fan.
The import of more than one airtight valve 4 of feed tube in spraying chamber 7 is respectively communicated with feed liquor house steward 3, and feed liquor is total
Pipe 3 connects fluid reservoir 1 by Micropump 2;The drain pipe in more than one airtight spraying chamber 7 is respectively communicated with collector tube 10, collection
Liquid pipe 10 connects fluid reservoir 1, condenser 11 that collector tube 10 is connected.
The Advantageous Effects of the present invention embody in the following areas:
1. spray cooling is a kind of liquid phase-change cooling technology, by nozzle, cooling working medium is atomized into the small liquid of high speed
Drip, droplet impacts surface to be cooled, by droplet impact, thin film drainage, liquid film surface evaporation, liquid film nucleate boiling and two
The mechanism augmentation of heat transfer such as secondary nucleation.Spray cooling with its heat-sinking capability high, working medium and the hot surface temperature difference are little, working medium demand is little,
There is no the advantages of be not in contact with thermal resistance between the hysteresis quality seethed with excitement and the surface of solids, in high heat flux dissipation from electronic devices side
Mask has broad application prospects.Research shows to compare with air cooling, and application spray cooling can make the piece of electronic devices and components tie
Temperature reduces by 33 DEG C, lower power consumption 35%.Spray cooling is applied to the cooling of Chao Suan center by the present invention, and adopts instant-plugging
Spraying chamber, the copper sheet cold drawing 8 in spraying chamber is arranged on the heater element of supercomputer, and so that the two is in close contact, and passes through
The heat of heater element is taken away in cooling to copper sheet cold drawing 8.
2. integrated level of the present invention is high, install convenient, and using safety, it is convenient to change, and is not only suitable for high heat flux, highly integrated
The supercomputing machine equipment of degree, is also applied for the distributed thermal source of various high heat fluxs.
3. each spraying chamber 7 of the present invention can be arranged on each place according to heater members position, and each spraying chamber is joined
Have flow control valve can independent regulation it is adaptable to the distributed thermal source of various high heat flux, of many uses.
4. the present invention adopts closed spraying chamber, and liquid refrigerant is not directly contacted with heater members, avoids well
The problem of liquid leakage.
Brief description
Fig. 1 is the instant-plugging spray cooling device schematic diagram being applied to Chao Suan center;
Fig. 2 is single spraying chamber schematic diagram;
The arrangement mode of the multiinjector plate nozzle that Fig. 3 adopts for the present invention.
Upper in figure sequence number: 1 fluid reservoir, 2, Micropump, 3 feed liquor house stewards, 4 valves, 5 multiinjector plates, 6 nozzles, 7 spraying chambeies, 8 bronze medals
Piece cold drawing, 9 inserted sheets, 10 manifolds, 11 condensers, 12 inlets, 13 liquid outlets.
Specific embodiment
Below in conjunction with the accompanying drawings, by embodiment, the present invention is further described.
Embodiment 1
Heat dispersal situations when single heater members being cooled down only with a spraying chamber.
Referring to Fig. 2 and Fig. 3, the instant-plugging spray cooling device being applied to Chao Suan center includes an airtight spraying chamber 7;
The side cavity wall in spraying chamber 7 is copper sheet cold drawing 8, and corresponding opposite side cavity wall 5 is double wall, and the inner side wall thickness of double wall is 1.2mm,
On medial wall, array is provided with eight nozzles 6, and connects medial wall;Nozzle 6 is pressure swirl atomizer, and nozzle od is
6mm, spray orifice aperture is 0.2mm;The top of double wall is provided with inlet 12.Inlet 12 connects one end of feed tube, feed liquor
The other end of pipe connects fluid reservoir 1.Valve 4 is provided with feed tube, Micropump that the feed tube of the entrance of valve 4 is connected
2, Micropump 2 is magnetically-actuated gear electric pump.The bottom in spraying chamber 7 offers liquid outlet 13, and liquid outlet 13 is connected by drain pipe
Fluid reservoir 1, condenser 11 that liquid storage pipe is connected, condenser 11 is the parallel flow condenser with high-speed fan.Airtight spray
Mist chamber 7 and fluid reservoir 1 form a closed circuit closed.
The thermal control environment of the present embodiment is: the rectangle heating surface of the 30mm × 30mm of heating power 800w is carried out cold
But, and keep heating surface temperature be less than 75 DEG C.
The copper sheet cold drawing 8 of the present embodiment adopts the high metallic copper of thermal conductivity, and Main Function is so that hot-fluid can be with large area
Uniform conductive, copper sheet cold drawing 8 is the rectangle of 30mm × 30mm, thickness 4mm.Spraying chamber 7 height is 26mm, section be 30mm ×
The rectangle of 30mm.Spacing 1cm between adjacent nozzle, the diameter 8mm of each nozzle 6, aperture in eight nozzles 6 lining up array
0.2mm, is arranged on the medial wall of thick 1.2mm, concrete arrangement mode is as shown in Figure 3.
During use, the copper sheet cold drawing 8 in spraying chamber 7 is tightly fixed on cooled heater element by inserted sheet 9.Bosher
Matter water is driven by Micropump 2, and in Micropump 2 rated power 60w, total flow is 40l/h.Water under high pressure enters spraying chamber by inlet 12
7.7 in spraying chamber, on nozzle 6 atomized spray to copper sheet cold drawing 8, it is small that water is atomized into high speed by nozzle 6 to water under high pressure
Drop, droplet impacts copper sheet cold drawing 8, by droplet impact, thin film drainage, etc. heat exchange mode, take away substantial amounts of heat, thus cold
But heater element.Hot water after cooling flows out from liquid outlet 13, flows into condenser 11 and is condensed into cryogenic liquid, enters back into fluid reservoir
1, thus completing the circulation of whole spray cooling.
Embodiment 2
Situation about being cooled down respectively using ten spraying chamber heater members different to ten.
Referring to Fig. 1, the copper sheet cold drawing 8 in each spraying chamber 7 is tightly fixed to cooled corresponding respectively by inserted sheet 9
On thermal device.
The import of the valve 4 of feed tube in each spraying chamber 7 is respectively communicated with feed liquor house steward 3, and feed liquor house steward 3 passes through Micropump
2 connect fluid reservoir 1;The drain pipe in ten spraying chambeies 7 is respectively communicated with collector tube 10, and collector tube 10 connects fluid reservoir 1, collection
Connect in liquid pipe 10 condenser 11.
Other structures and operation principle are with embodiment 1.
Claims (8)
1. be applied to the instant-plugging spray cooling device at Chao Suan center it is characterised in that: include more than one airtight spraying chamber
(7);Each spraying chamber (7) side cavity wall be copper sheet cold drawing (8), corresponding opposite side cavity wall (5) is laid with five with
On nozzle (6);The top of spraying chamber (7) is provided with inlet (12), and the nozzle (6) of more than five connects inlet (12),
Described inlet (12) connects one end of feed tube, and the other end of feed tube connects fluid reservoir (1);Set on described feed tube
There is valve (4), Micropump (2) that the feed tube of entrance of valve (4) is connected;The bottom of spraying chamber (7) is provided with liquid outlet
(13), liquid outlet (13) connects fluid reservoir (1) by drain pipe, condenser (11) that described liquid storage pipe is connected;Described one
Individual above airtight spraying chamber (7) and fluid reservoir (1) form a closed circuit closed;
During use, copper sheet cold drawing (8) is tightly fixed on cooled heater element by inserted sheet (9), and cooling working medium is from feed liquor
Mouth (12) enters spraying chamber (7), spray cooling occurs in spraying chamber (7), above produces cooling effect in copper sheet cold drawing (8), lead to
Cross the heat that heater element is taken away in the cooling to copper sheet cold drawing (8).
2. be applied to the instant-plugging spray cooling device at Chao Suan center according to claim 1 it is characterised in that: described nozzle
(6) it is pressure swirl atomizer, nozzle od is 6mm, spray orifice aperture is 0.2mm.
3. be applied to the instant-plugging spray cooling device at Chao Suan center according to claim 1 it is characterised in that: adjacent nozzle
(6) spacing 1cm between.
4. be applied to the instant-plugging spray cooling device at Chao Suan center according to claim 1 it is characterised in that: described cavity wall
(5) it is double wall, the inner side wall thickness of double wall is 1.2mm;Nozzle (6) array of described more than five is on medial wall, and connects
Lead to medial wall, described inlet (12) is located at the top of double wall.
5. be applied to the instant-plugging spray cooling device at Chao Suan center according to claim 4 it is characterised in that: described inner side
On wall, array is provided with eight nozzles (6), and eight nozzles (6) are respectively communicated with medial wall.
6. be applied to the instant-plugging spray cooling device at Chao Suan center according to claim 1 it is characterised in that: described Micropump
(2) it is magnetically-actuated gear electric pump.
7. be applied to the instant-plugging spray cooling device at Chao Suan center according to claim 1 it is characterised in that: described condensation
Device (11) is the parallel flow condenser with high-speed fan.
8. be applied to the instant-plugging spray cooling device at Chao Suan center according to claim 1 it is characterised in that: more than one
The import of the valve (4) of the airtight feed tube in spraying chamber (7) is respectively communicated with feed liquor house steward (3), and feed liquor house steward (3) is passed through micro-
Pump (2) connects fluid reservoir (1);The drain pipe in more than one airtight spraying chamber (7) is respectively communicated with collector tube (10), liquid collecting
Pipe (10) connects fluid reservoir (1), condenser (11) that collector tube (10) is connected.
Priority Applications (1)
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CN201611052969.9A CN106376225A (en) | 2016-11-25 | 2016-11-25 | Plug-type spray cooling device applied to super-computing center |
Applications Claiming Priority (1)
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CN201611052969.9A CN106376225A (en) | 2016-11-25 | 2016-11-25 | Plug-type spray cooling device applied to super-computing center |
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Publication Number | Publication Date |
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CN201611052969.9A Pending CN106376225A (en) | 2016-11-25 | 2016-11-25 | Plug-type spray cooling device applied to super-computing center |
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Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109817594A (en) * | 2019-01-16 | 2019-05-28 | 西安交通大学 | A kind of modularization spray cooler |
CN109830468A (en) * | 2019-03-26 | 2019-05-31 | 合肥能源研究院 | A kind of high heat flux density heat dissipation cold plate |
CN109862764A (en) * | 2019-04-09 | 2019-06-07 | 郑州轻工业学院 | A kind of portable piezoelectricity atomisation cold plate |
CN109974504A (en) * | 2019-03-27 | 2019-07-05 | 中国电子科技集团公司第三十八研究所 | The spraying cold plate of integrated atomization mechanism |
CN110112112A (en) * | 2019-04-12 | 2019-08-09 | 中国电子科技集团公司第三十八研究所 | Misting cooling formula cold plate |
CN110381700A (en) * | 2019-06-25 | 2019-10-25 | 南京理工大学 | A kind of chamber and vapor chamber integral type phase-change cooling device and system by spraying |
CN110381701A (en) * | 2019-06-25 | 2019-10-25 | 南京理工大学 | A kind of spray cooling device that vapor chamber is combined with composite microstructure |
CN111629570A (en) * | 2020-06-28 | 2020-09-04 | 中国电子科技集团公司第三十八研究所 | Spraying jet type double-loop data center liquid cooling system |
CN112880299A (en) * | 2021-02-04 | 2021-06-01 | 佛山宇仁智能科技有限公司 | Dot-matrix spray cooling system |
CN113465409A (en) * | 2021-05-21 | 2021-10-01 | 常州大学 | Pipe shell type spray cooling heat exchanger |
CN113543590A (en) * | 2021-06-29 | 2021-10-22 | 福建海峡基石科技集团有限公司 | Data terminal processing equipment based on cloud computing |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003033920A (en) * | 2001-07-24 | 2003-02-04 | Ahresty Corp | Spray device for mold |
CN202799551U (en) * | 2012-09-26 | 2013-03-13 | 上海理工大学 | Sealed spray cooling and testing device |
CN105960145A (en) * | 2016-06-08 | 2016-09-21 | 上海理工大学 | Enclosed spray cooling device with adjustable dip angle |
CN206212549U (en) * | 2016-11-25 | 2017-05-31 | 中国科学技术大学 | It is applied to the instant-plugging spray cooling device at Chao Suan centers |
-
2016
- 2016-11-25 CN CN201611052969.9A patent/CN106376225A/en active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003033920A (en) * | 2001-07-24 | 2003-02-04 | Ahresty Corp | Spray device for mold |
CN202799551U (en) * | 2012-09-26 | 2013-03-13 | 上海理工大学 | Sealed spray cooling and testing device |
CN105960145A (en) * | 2016-06-08 | 2016-09-21 | 上海理工大学 | Enclosed spray cooling device with adjustable dip angle |
CN206212549U (en) * | 2016-11-25 | 2017-05-31 | 中国科学技术大学 | It is applied to the instant-plugging spray cooling device at Chao Suan centers |
Non-Patent Citations (3)
Title |
---|
LIN L,PONNAPPAN R, YERKES K, ET AL: "《Large area spray cooling》", 《42ND AIAA AEROSPACE SCIENCES MEETING AND EXHIBIT》 * |
TAN Y B,XIE J L,DUAN F,ET AL: "《Multi-nozzle spray cooling for high heat flux applications in a closed loop system》", 《APPLIED THERMAL ENGINEERING》 * |
胡士松,刘伟,章玮玮,程文龙: "《单相阶段板式多喷嘴阵列喷雾冷却的试验研究》", 《流体机械》 * |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109817594A (en) * | 2019-01-16 | 2019-05-28 | 西安交通大学 | A kind of modularization spray cooler |
CN109817594B (en) * | 2019-01-16 | 2020-07-28 | 西安交通大学 | Modular spray cooler |
CN109830468A (en) * | 2019-03-26 | 2019-05-31 | 合肥能源研究院 | A kind of high heat flux density heat dissipation cold plate |
CN109974504A (en) * | 2019-03-27 | 2019-07-05 | 中国电子科技集团公司第三十八研究所 | The spraying cold plate of integrated atomization mechanism |
CN109862764A (en) * | 2019-04-09 | 2019-06-07 | 郑州轻工业学院 | A kind of portable piezoelectricity atomisation cold plate |
CN110112112A (en) * | 2019-04-12 | 2019-08-09 | 中国电子科技集团公司第三十八研究所 | Misting cooling formula cold plate |
CN110381700A (en) * | 2019-06-25 | 2019-10-25 | 南京理工大学 | A kind of chamber and vapor chamber integral type phase-change cooling device and system by spraying |
CN110381701A (en) * | 2019-06-25 | 2019-10-25 | 南京理工大学 | A kind of spray cooling device that vapor chamber is combined with composite microstructure |
CN111629570A (en) * | 2020-06-28 | 2020-09-04 | 中国电子科技集团公司第三十八研究所 | Spraying jet type double-loop data center liquid cooling system |
CN112880299A (en) * | 2021-02-04 | 2021-06-01 | 佛山宇仁智能科技有限公司 | Dot-matrix spray cooling system |
CN113465409A (en) * | 2021-05-21 | 2021-10-01 | 常州大学 | Pipe shell type spray cooling heat exchanger |
CN113543590A (en) * | 2021-06-29 | 2021-10-22 | 福建海峡基石科技集团有限公司 | Data terminal processing equipment based on cloud computing |
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