CN106373903B - IC chip appearance detects belt-braiding device - Google Patents
IC chip appearance detects belt-braiding device Download PDFInfo
- Publication number
- CN106373903B CN106373903B CN201610746640.6A CN201610746640A CN106373903B CN 106373903 B CN106373903 B CN 106373903B CN 201610746640 A CN201610746640 A CN 201610746640A CN 106373903 B CN106373903 B CN 106373903B
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- Prior art keywords
- chip
- reinspection
- image
- initial survey
- guide rail
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/34—Sorting according to other particular properties
- B07C5/342—Sorting according to other particular properties according to optical properties, e.g. colour
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/36—Sorting apparatus characterised by the means used for distribution
- B07C5/361—Processing or control devices therefor, e.g. escort memory
- B07C5/362—Separating or distributor mechanisms
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The invention discloses IC chip appearances to detect belt-braiding device, including initial survey portion, reinspection portion, chip transfer mechanism and industrial personal computer, and the initial survey portion is adjacent with reinspection portion, and reinspection portion is adjacent with sealing station and encapsulation carrier band is delivered to sealing station；When the image of chip to be measured is detected as rejected product by preliminary survey light inspection module, defective products is quickly skidded off from guide rail, and when the image of chip to be measured is qualified by the inspection module detection of preliminary survey light, which is identified as repetition measurement chip；The repetition measurement chip that track baffle stops on guide rail is allowed to be stopped at track baffle, and chip transfer mechanism moves into repetition measurement chip in the encapsulation lattice of the encapsulation carrier band at reinspection portion；When the image for rechecking chip is qualified by the inspection module detection of repetition measurement light, which is identified as product to be packaged, and the carrier tape package lattice for being equipped with product to be packaged are sent to sealing station and complete braid sealing；The present invention can detect chip appearance, bad part is rejected and integrated with braid packaging operation.
Description
Technical field
The present invention relates to chip manufacture equipment, especially IC chip appearances to detect belt-braiding device.
Background technique
Appearance detection is an important link of semiconductor chip production, is detected by appearance, can be to avoid outside by chip
See chip functions defect caused by defect.Using realizing of Robot Vision chip appearance defects automatic detection can to avoid due to
Human subjective's property bring error reduces the cost of labor of production, improves production efficiency；When chip carries out braid encapsulation, have
When can because encapsulation plant movement to chip appearance caused by damage, if detected not in time, when carry sealing after just need spend compared with
More times and cost could handle defective chip after dismantling sealing, it is therefore necessary to carry out to the chip in braid encapsulation process outer
Detection is seen, how appearance is detected and is integrated with braid packaging operation, be a research direction.
Summary of the invention
The present invention propose IC chip appearance detect belt-braiding device, can chip appearance detect, bad part reject with
Braid packaging operation is integrated.
The present invention uses following technical scheme.
IC chip appearance detects belt-braiding device, appearance detection is carried out before braid encapsulates for chip, encapsulation carries
It takes and is equipped with encapsulation lattice, the detection belt-braiding device includes initial survey portion, reinspection portion, chip transfer mechanism and industrial personal computer, at the beginning of described
Inspection portion is adjacent with reinspection portion, and reinspection portion is adjacent with sealing station and encapsulation carrier band is delivered to sealing station.
Initial survey portion includes guide assembly, initial survey optical path component, initial survey image-forming assembly and preliminary survey light inspection module, the guide rail group
Part includes guide rail and track baffle, and when the work of initial survey portion, chip to be measured slides on guide rail, and track baffle is to chip on guide rail
Sliding transmission controlled；The initial survey optical path component, chip transfer mechanism and initial survey image-forming assembly are adjacent with guide assembly,
Top image and side image of the initial survey image-forming assembly through chip to be measured on initial survey optical path component acquisition guide rail；When core to be measured
When the image of piece is detected as unqualified by preliminary survey light inspection module, which is identified as initial survey defective products, initial survey defective products
Defective products rewinding container is slid onto through guide rail；When the image of chip to be measured is qualified by the inspection module detection of preliminary survey light, the core to be measured
Piece is identified as repetition measurement chip；The repetition measurement chip that track baffle stops on guide rail is allowed to be stopped at track baffle, chip drag-over unit
Structure moves into repetition measurement chip in the encapsulation lattice of the encapsulation carrier band at reinspection portion.
The reinspection portion includes braid transport mechanism, reinspection optical path component, reinspection image-forming assembly and repetition measurement light inspection module, is carried
There is the carrier band of repetition measurement chip to be transmitted by braid transport mechanism to forward direction at sealing station, the reinspection optical path component, reinspection imaging
Component is in close proximity to carrier band transmission path, and the reinspection image-forming assembly obtains repetition measurement chip in carrier tape package lattice through reinspection optical path component
Top image；When the image of repetition measurement chip is detected as unqualified by repetition measurement light inspection module, which is identified as multiple
Defective products is examined, braid transport mechanism, which carries out reverse transfer to carrier band, makes the carrier tape package lattice where rechecking defective products be recycled to core
It is stopped at piece transfer mechanism, when chip transfer mechanism takes out reinspection defective products out of carrier tape package lattice and is built into encapsulation lattice
After new repetition measurement chip, braid transport mechanism restores positive transmission, when the image of reinspection chip is closed by the inspection module detection of repetition measurement light
When lattice, which is identified as product to be packaged, and the carrier tape package lattice for being equipped with product to be packaged are sent to sealing station and complete to compile
Band sealing.
When repetition measurement light inspection module detects that braid transport mechanism carries out carrier band anti-there are when vacant encapsulation lattice on carrier band
The encapsulation lattice for keeping this vacant to transmission are recycled at chip transfer mechanism and stop, when chip transfer mechanism is to the vacant encapsulation lattice
After being built into repetition measurement chip, braid transport mechanism restores positive transmission.
The initial survey optical path component includes light source, chip front side light path mechanism and chip sides light path mechanism, the light source
Above guide rail；The light entrance of the chip front side light path mechanism is directed toward the chip upper surface to be measured in guide rail；The core
The light entrance of piece side light path mechanism is directed toward the pin face of the chip to be measured in guide rail；Chip front side light path mechanism and chip side
The optical path outlet of face light path mechanism is directed to initial survey image-forming assembly.
Chip baffle is equipped at the initial survey image-forming assembly, when chip to be measured slides onto the guide rail at initial survey image-forming assembly
When, chip to be measured is stopped at initial survey image-forming assembly by chip baffle, until preliminary survey light inspection module is completed to the chip to be measured
After detection, chip baffle release chip slides chip continuation on guide rail.
It is equipped with blowning installation by the guide rail, high-speed flow is blown out in the blowning installation direction guiding rail transmission surface to promote core
Sliding velocity of the piece on guide rail.
The braid transport mechanism carries out positive transmission to carrier band in a manner of intermittent movement, carries every time one mobile
The distance for encapsulating lattice carries the inspection of mobile intermittent time and reinspection image-forming assembly, repetition measurement light inspection module to every repetition measurement chip
Total duration is surveyed to match.
The chip transfer mechanism carries out pick-and-place operation to chip with sucker.
In the present invention, the detection belt-braiding device includes initial survey portion, reinspection portion, chip transfer mechanism and industrial personal computer, described
Initial survey portion is adjacent with reinspection portion, and reinspection portion is adjacent with sealing station and encapsulation carrier band is delivered to sealing station；Initial survey portion includes
Guide assembly, initial survey optical path component, initial survey image-forming assembly and preliminary survey light examine module；The reinspection portion include braid transport mechanism,
It rechecks optical path component, reinspection image-forming assembly and repetition measurement light and examines module；The design uses the side of two re-detections in chip detection
Formula, since guide rail can fast move progress initial survey at chip to initial survey image-forming assembly, the underproof chip of initial survey i.e. can be by guide rail
Quickly discharge, to reduce the bad product rate of chip at carrier band so that carrier band will not the frequent rewinding because of excessive defective products,
Detection efficiency is effectively promoted.
In the present invention, it is responsible for repetition measurement chip to move into the chip drag-over unit in the encapsulation lattice of the encapsulation carrier band at reinspection portion
Structure, while being also responsible for replacing the defective products in carrier band, due to using same mechanism, reduce in equipment mobile range compared with
Big movement mechanism quantity can effectively reduce equipment and shake the interference detected to chip, be conducive to improving stability, so that equipment
Controlling mechanism is more succinct, also can effectively prevent the interference between multiple movement mechanisms.
In the present invention, the initial survey optical path component includes light source, chip front side light path mechanism and chip sides light path mechanism,
The light source is set to above guide rail；The light entrance of the chip front side light path mechanism is directed toward table on the chip to be measured in guide rail
Face；The light entrance of the chip sides light path mechanism is directed toward the pin face of the chip to be measured in guide rail；Chip front side optical path machine
The outlet of the optical path of structure and chip sides light path mechanism is directed to initial survey image-forming assembly；The design so that this equipment at the beginning of carrying out chip
When inspection, two parts image in chip front side and pin face can be obtained in primary shooting, improves detection efficiency.
Detailed description of the invention
The present invention is described in more detail with reference to the accompanying drawings and detailed description:
Attached drawing 1 is schematic diagram of the invention；
Attached drawing 2 is the partial enlargement diagram in initial survey portion of the invention；
Attached drawing 3 is the partial enlargement diagram in reinspection portion of the invention；
Attached drawing 4 is the schematic diagram of encapsulation carrier band when being not loaded into chip；
In figure: 1- initial survey image-forming assembly；2- guide rail；3- initial survey portion；4- chip transfer mechanism；5- carrier band；6- reinspection imaging
Component；7- reinspection portion；8- track baffle；9- sucker；Encapsulation lattice on 10- carrier band；11- seals station；12- braid conveyer
Structure.
Specific embodiment
As shown in Figure 1, 2, 3, IC chip appearance detects belt-braiding device, carries out before braid encapsulates for chip outer
Detection is seen, encapsulation carrier band 5 is equipped with encapsulation lattice 10, and the detection belt-braiding device includes initial survey portion 3, reinspection portion 7, chip drag-over unit
Structure 4 and industrial personal computer, the initial survey portion 3 is adjacent with reinspection portion 7, and reinspection portion 7 is adjacent with sealing station and encapsulation carrier band is delivered to
Seal station 11.
Initial survey portion includes guide assembly, initial survey optical path component, initial survey image-forming assembly 1 and preliminary survey light inspection module, the guide rail
Component 2 includes guide rail 2 and track baffle 8, and when the work of initial survey portion, chip to be measured slides on guide rail 2, and track baffle is led to 8
The sliding transmission of chip is controlled on rail 2；The initial survey optical path component, chip transfer mechanism and initial survey image-forming assembly 1 with lead
Rail assembly is adjacent, top image and side view of the initial survey image-forming assembly through chip to be measured on initial survey optical path component acquisition guide rail
Picture；When the image of chip to be measured is detected as unqualified by preliminary survey light inspection module, which is identified as initial survey defective products,
Initial survey defective products slides onto defective products rewinding container through guide rail；When the image of chip to be measured is qualified by the inspection module detection of preliminary survey light
When, which is identified as repetition measurement chip；The repetition measurement chip that track baffle stops on guide rail is allowed to be stopped at track baffle,
Chip transfer mechanism moves into repetition measurement chip in the encapsulation lattice of the encapsulation carrier band at reinspection portion.
The reinspection portion 7 includes that braid transport mechanism 12, reinspection optical path component, reinspection image-forming assembly 6 and repetition measurement light examine mould
Block, the carrier band 5 for being loaded with repetition measurement chip are transmitted by braid transport mechanism to forward direction at sealing station 11, the reinspection optical path component,
Reinspection image-forming assembly is in close proximity to carrier band transmission path, and the reinspection image-forming assembly obtains in carrier tape package lattice through reinspection optical path component
The top image of repetition measurement chip；When the image of repetition measurement chip is detected as unqualified by repetition measurement light inspection module, which is
It is identified as reinspection defective products, braid transport mechanism makes the carrier tape package lattice quilt where reinspection defective products to carrier band progress reverse transfer
It is recycled at chip transfer mechanism and stops, when chip transfer mechanism 4 out of carrier tape package lattice takes out reinspection defective products and to envelope
After dress lattice are built into new repetition measurement chip, braid transport mechanism restores positive transmission, when the image of reinspection chip is examined by repetition measurement light
When module detection is qualified, which is identified as product to be packaged, and the carrier tape package lattice for being equipped with product to be packaged are sent to sealing
Station completes braid sealing.
When repetition measurement light inspection module detects that braid transport mechanism carries out carrier band there are when vacant encapsulation lattice 10 on carrier band
The encapsulation lattice that reverse transfer keeps this vacant are recycled at chip transfer mechanism and stop, when chip transfer mechanism is to the vacant encapsulation
After lattice are built into repetition measurement chip, braid transport mechanism restores positive transmission.
The initial survey optical path component includes light source, chip front side light path mechanism and chip sides light path mechanism, the light source
Above guide rail；The light entrance of the chip front side light path mechanism is directed toward the chip upper surface to be measured in guide rail；The core
The light entrance of piece side light path mechanism is directed toward the pin face of the chip to be measured in guide rail；Chip front side light path mechanism and chip side
The optical path outlet of face light path mechanism is directed to initial survey image-forming assembly.
Chip baffle is equipped at the initial survey image-forming assembly, when chip to be measured slides onto the guide rail at initial survey image-forming assembly
When, chip to be measured is stopped at initial survey image-forming assembly by chip baffle, until preliminary survey light inspection module is completed to the chip to be measured
After detection, chip baffle release chip slides chip continuation on guide rail.
It is equipped with blowning installation by the guide rail, high-speed flow is blown out in the blowning installation direction guiding rail transmission surface to promote core
Sliding velocity of the piece on guide rail.
The braid transport mechanism carries out positive transmission to carrier band in a manner of intermittent movement, carries every time one mobile
The distance for encapsulating lattice carries the inspection of mobile intermittent time and reinspection image-forming assembly, repetition measurement light inspection module to every repetition measurement chip
Total duration is surveyed to match.
The chip transfer mechanism 4 carries out pick-and-place operation to chip with sucker 9.
Claims (7)
1. IC chip appearance detects belt-braiding device, appearance detection, encapsulation carrier band are carried out before braid encapsulates for chip
It is equipped with encapsulation lattice, it is characterised in that: the detection belt-braiding device includes initial survey portion, reinspection portion, chip transfer mechanism and industry control
Machine, the initial survey portion is adjacent with reinspection portion, and reinspection portion is adjacent with sealing station and encapsulation carrier band is delivered to sealing station；
Initial survey portion includes guide assembly, initial survey optical path component, initial survey image-forming assembly and preliminary survey light inspection module, the guide assembly packet
Guide rail and track baffle are included, when the work of initial survey portion, chip to be measured slides on guide rail, cunning of the track baffle to chip on guide rail
Transmission is moved to be controlled；The initial survey optical path component, chip transfer mechanism and initial survey image-forming assembly are adjacent with guide assembly, described
Top image and side image of the initial survey image-forming assembly through chip to be measured on initial survey optical path component acquisition guide rail；When chip to be measured
When image is detected as unqualified by preliminary survey light inspection module, which is identified as initial survey defective products, and initial survey defective products is through leading
Rail slides onto defective products rewinding container；When the image of chip to be measured is qualified by the inspection module detection of preliminary survey light, which is
It is identified as repetition measurement chip；The repetition measurement chip that track baffle stops on guide rail is allowed to be stopped at track baffle, chip transfer mechanism handle
Repetition measurement chip moves into the encapsulation lattice of the encapsulation carrier band at reinspection portion；
The reinspection portion includes braid transport mechanism, reinspection optical path component, reinspection image-forming assembly and repetition measurement light inspection module, is loaded with multiple
The carrier band for surveying chip is transmitted by braid transport mechanism to forward direction at sealing station, the reinspection optical path component, reinspection image-forming assembly
It is in close proximity to carrier band transmission path, the reinspection image-forming assembly obtains the top plane view of repetition measurement chip in encapsulation lattice through reinspection optical path component
Picture；When the image of repetition measurement chip is detected as unqualified by repetition measurement light inspection module, which is identified as reinspection defective products,
Braid transport mechanism, which carries out reverse transfer to carrier band, is recycled to the encapsulation lattice where rechecking defective products at chip transfer mechanism
It stops, after chip transfer mechanism takes out reinspection defective products out of encapsulation lattice and is built into new repetition measurement chip to encapsulation lattice,
Braid transport mechanism restores positive transmission, when the image for rechecking chip is qualified by the inspection module detection of repetition measurement light, the reinspection chip
Product to be packaged are identified as, the encapsulation lattice for being equipped with product to be packaged are sent to sealing station and complete braid sealing.
2. IC chip appearance according to claim 1 detects belt-braiding device, it is characterised in that: when repetition measurement light examines mould
Block detects that braid transport mechanism carries out the encapsulation that reverse transfer keeps this vacant to carrier band there are when vacant encapsulation lattice on carrier band
Lattice are recycled at chip transfer mechanism and stop, and after chip transfer mechanism is built into repetition measurement chip to the vacant encapsulation lattice, compile
Tape transport restores positive transmission.
3. IC chip appearance according to claim 1 detects belt-braiding device, it is characterised in that: the initial survey optical path
Component includes light source, chip front side light path mechanism and chip sides light path mechanism, and the light source is set to above guide rail；The chip
The light entrance of front light path mechanism is directed toward the chip upper surface to be measured in guide rail；The light of the chip sides light path mechanism enters
The pin face of chip to be measured in mouth direction guide rail；The outlet of the optical path of chip front side light path mechanism and chip sides light path mechanism is equal
It is directed toward initial survey image-forming assembly.
4. IC chip appearance according to claim 1 detects belt-braiding device, it is characterised in that: the initial survey imaging
Chip baffle is equipped at component, when the guide rail at chip to be measured slides onto initial survey image-forming assembly, chip to be measured is by chip baffle
It stops at initial survey image-forming assembly, until chip baffle discharges core after preliminary survey light inspection module is completed to the detection of the chip to be measured
Piece slides chip continuation on guide rail.
5. IC chip appearance according to claim 1 detects belt-braiding device, it is characterised in that: set by the guide rail
There is blowning installation, blowout high-speed flow is in the blowning installation direction guiding rail transmission surface to promote sliding speed of the chip on guide rail
Degree.
6. IC chip appearance according to claim 1 detects belt-braiding device, it is characterised in that: the braid transmission
Mechanism carries out positive transmission to carrier band in a manner of intermittent movement, carries every time the distance of mobile encapsulation lattice, and carrier band moves
The dynamic intermittent time matches to the detection total duration of every repetition measurement chip with reinspection image-forming assembly, repetition measurement light inspection module.
7. IC chip appearance according to claim 1 detects belt-braiding device, it is characterised in that: the chip transfer
Mechanism carries out pick-and-place operation to chip with sucker.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610746640.6A CN106373903B (en) | 2016-08-29 | 2016-08-29 | IC chip appearance detects belt-braiding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610746640.6A CN106373903B (en) | 2016-08-29 | 2016-08-29 | IC chip appearance detects belt-braiding device |
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| Publication Number | Publication Date |
|---|---|
| CN106373903A CN106373903A (en) | 2017-02-01 |
| CN106373903B true CN106373903B (en) | 2019-01-01 |
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| CN113976473B (en) * | 2021-10-25 | 2022-09-13 | 广东西尼科技有限公司 | Intelligent marking device and method for electronic component |
| CN114653606B (en) * | 2022-03-25 | 2023-09-15 | 博众精工科技股份有限公司 | High-efficient chip detects encapsulation equipment |
| CN116344378B (en) * | 2023-03-31 | 2024-01-23 | 江苏神州新能源电力有限公司 | Intelligent detection system for photovoltaic panel production and detection method thereof |
| CN116754579B (en) * | 2023-08-21 | 2023-11-07 | 佛山市蓝箭电子股份有限公司 | Multi-track braid appearance detection equipment |
| CN117531731B (en) * | 2024-01-09 | 2024-04-05 | 深圳市华拓半导体技术有限公司 | IGBT chip detection method and device, equipment and storage medium |
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| CN106373903A (en) | 2017-02-01 |
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