CN106363826B - Cut the device and method of silicon ingot - Google Patents
Cut the device and method of silicon ingot Download PDFInfo
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- CN106363826B CN106363826B CN201610808088.9A CN201610808088A CN106363826B CN 106363826 B CN106363826 B CN 106363826B CN 201610808088 A CN201610808088 A CN 201610808088A CN 106363826 B CN106363826 B CN 106363826B
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- mortar
- height
- silicon ingot
- pin groove
- cutting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
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- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Silicon Compounds (AREA)
Abstract
The invention provides a kind of device for cutting silicon ingot, device includes self-powered platform, is disposed with the mortar pin groove set between two guide wheels of cutting steel wire, silicon ingot to be cut is connected with below self-powered platform, the both sides of self-powered platform are provided with the mortar nozzle towards cutting steel wire spray furnace；Mortar pin groove includes the open cell body in upper end, and the bottom of cell body is provided with leakage sand hole；Mortar pin groove is used to make the ingot section cut or the mortar being all dipped into mortar pin groove when the cutting-height of silicon ingot reaches the first height；The side wall of mortar pin groove is additionally provided with quick hollow part；Quick hollow part is used to empty the mortar in mortar pin groove when the cutting-height of silicon ingot reaches the second height, wherein, the first height is less than or equal to 0.6 0.7 times of the height of silicon ingot to be cut, and the second height is close to the junction of silicon ingot and self-powered platform.It is avoided that in cutting process that silicon chip sticks together using the device, improves the yields of silicon chip.Present invention also offers the method for cutting silicon ingot.
Description
Technical field
The present invention relates to photovoltaic silicon wafer production technical field, and in particular to a kind of device and method for cutting silicon ingot.
Background technology
Photovoltaic industry is an emerging green energy resource industry, and high quality, low cost are that photovoltaic industry develops
It is crucial.For using silicon chip, for the photovoltaic cell of substrate, silicon chip is the part of most expensive in crystal silicon photovoltaic cell technology, institute
It is most important for the competitiveness for improving solar energy to reduce the manufacturing cost of silicon chip.Silicon chip section is used as technique for processing silicon chip stream
The critical process of journey, its processing efficiency and crudy are directly connected to the overall situation of whole silicon chip production.
The processing method of silicon chip generally uses multi-wire saw at present, and it is the cutting steel wire by high-speed mobile on slicer
Carrying cutting mortar (including the cutting blade materials such as carborundum, diamond) carries out polishing to the silicon ingot for doing feed motion from top to bottom and cut
Cut, so as to by silicon ingot processing into silicon chip.With the progress of cutting process, when silicon ingot is cut into certain depth, cut
Adhesion phenomenon as shown in Figure 1 occurs between silicon chip, and then the impurity discharge such as silica flour caused by being unfavorable for cutting, and silicon chip
The inter-adhesive ability that can also reduce cutting steel wire and carry mortar, easily cause stria, chipping and the unfilled corner the defects of ratio of silicon chip
The rise of example, this can all have a strong impact on the cutting yield of silicon chip, and this, which turns into, restricts one of bottleneck that silicon chip cost reduces.
The content of the invention
In view of this, the invention provides a kind of device and method for cutting silicon ingot, for solving silicon chip in the prior art
The inter-adhesive problem occurred in cutting process, the method and device of the cutting silicon ingot provided in of the invention can make silicon chip exist
It is separated from each other in cutting process.
First aspect present invention provides a kind of device for cutting silicon ingot, and described device includes two guide wheels, is arranged in institute
The cutting steel wire on two guide wheels and the mortar pin groove between described two guide wheels, in addition to self-powered platform are stated, lifts work
Make to be connected with silicon ingot to be cut below platform, the both sides of the self-powered platform are provided with the mortar towards cutting steel wire spray furnace
Nozzle；Wherein, the mortar pin groove includes the open cell body in upper end, and the bottom of the cell body is provided with leakage sand hole；The mortar pin groove is used
The mortar being dipped into the silicon ingot for when the cutting-height of silicon ingot reaches the first height, making cut portion in the mortar pin groove；
The side wall of the mortar pin groove is additionally provided with quick hollow part；The quick hollow part is used to reach the in the cutting-height of silicon ingot
During two height, the mortar in the mortar pin groove is emptied, wherein, first height or the height less than the silicon ingot to be cut
0.6-0.7 times；Second height is close to the junction of the silicon ingot and the self-powered platform.
In the application, the silicon ingot produces pressure during moving from top to bottom to the cutting steel wire, makes described
Cutting blade material is pressed into the surface of the silicon ingot, and the silicon ingot is cut.Wherein, when the cutting-height of the silicon ingot reaches
During the first height, it is necessary to allow the ingot section of cut portion or whole to be dipped into mortar, in case the silicon chip cut into occurs to glue
Even, while the mortar dynamically flowed in mortar pin groove can also soak, the chip rinsed between silicon chip and mortar remain, and do not interfere with and cut
Cut the ability that steel wire carries the mortar sprayed from mortar nozzle, the defects of reducing stria, chipping and the unfilled corner of silicon chip ratio.This
Outside, mortar pin groove can also store the broken silicon wafers to be dropped in cutting process, and preventing portion morcels silicon chip and enters the mortar circulatory system.But work as
When the cutting-height of the silicon ingot reaches the second height, now it is closer to the part that silicon ingot is connected with self-powered platform and (closes on
Cut through), the connection of uncut silicon ingot and self-powered platform is weaker, it is necessary to and the mortar allowed in mortar pin groove empties, in order to avoid mortar pin groove
The mortar of middle dynamic flowing drives silicon chip drift or waved, and causes more silicon chip to crush.It is understood that described quick
During mortar in hollow part rapid deflation mortar pin groove, also there is part mortar to be discharged by the leakage sand hole.
In the application, the height that first height is less than or equal to the silicon ingot to be cut (does not cut preceding initial silicon
The full height of ingot) 0.6-0.7 times.
Preferably, first height is 0.4-0.65 times of height of the silicon ingot to be cut.
It is further preferred that first height is 60-100mm.For example, it may be 60,70,80,85,90 or 100mm.
It is further preferred that first height is 80-100mm.
It is highly preferred that first height is 80-90mm.
In the application, when the cutting-height of the silicon ingot reaches the first height, the silicon ingot for making to have cut (is connected to silicon ingot
On silicon chip) be partly or entirely dipped into the mortar in the mortar pin groove.
Preferably, when the cutting-height of the silicon ingot reaches first height, the silicon ingot cut has 1-100mm immersions
Mortar into mortar pin groove.For example, the silicon ingot cut has 1mm, 2,5,10,10,30,40,50,60,70 or 80mm to be dipped into
Mortar in mortar pin groove.
It is further preferred that the silicon ingot cut has 10-90mm to be dipped into the mortar in mortar pin groove.
It is highly preferred that the silicon ingot cut has 40-80mm to be dipped into the mortar in mortar pin groove.
In the application, junction (that is, when initial silicon of second height close to the silicon ingot and the self-powered platform
The fixing end of ingot).Preferably, distance of second height away from the silicon ingot and the junction of the self-powered platform is 1-
8mm.For example, can be at a distance of 1,2,3,3.5,4,5,5.5,6,7 or 8mm.
It is further preferred that distance of second height away from the silicon ingot and the junction of the self-powered platform is 2-
6mm。
It is further preferred that second height is 150-155mm.For example, can be 150,151,152,153,154 or
155mm。
Preferably, the bottom of the mortar pin groove is additionally provided with drainage tube, and the drainage tube is connected to one via the leakage sand hole
Delivery pump, the mortar spilt can be sprayed again by mortar nozzle, realized the recycling of mortar.
Preferably, also embedded with the horizontal work rest slided, the lower end of the work rest is connected with holds the self-powered platform
Support plate, the loading plate are fixed with the silicon ingot by glue.Wherein, the loading plate be it is Nian Jie with adhesive sheet by supporting plate and
Into.The viscose board is usually ground glass, and the supporting plate can be described as metal tray, work plate etc. again.
In one embodiment of the invention, the upper end of the cell body is opening end, and the cell body is in rectangular-shape.
In the application, the mortar pin groove is located at the lower section of the cutting steel wire, is the free end of silicon ingot directly over it.It is preferred that
The distance between ground, the upper edge of the mortar pin groove and described cutting steel wire are 20-60mm.Such as can be 25,30,35,40,
45th, 50 or 60mm.Further preferably into 25-50mm.
The size of the mortar pin groove, which must assure that, can not touch silicon ingot, in order to avoid influence the yield rate of the silicon chip of cutting.Can
With understanding, the depth of the mortar pin groove is more than the height of silicon ingot to be cut.The width of the mortar pin groove is more than to be cut
1 piece or polylith silicon ingot width.
In the application, in slicing processes, enter institute from the top of the cutting steel wire from the mortar of mortar nozzle injection
State in mortar pin groove, and part realizes that the mortar amount in mortar pin groove keeps dynamic equilibrium from the leakage sand hole discharge in the mortar pin groove.
Mortar can be collected into mortar pin groove.Generally speaking, before the cutting-height of silicon ingot reaches the second height, the leakage sand hole and institute
The mortar amount that stating mortar nozzle makes to flow into the mortar pin groove is more than the mortar amount of outflow.Wherein, the cutting-height of the silicon ingot
When reaching the first height, the silicon ingot (silicon chip being connected on silicon ingot) for making to have cut partly or entirely is dipped into the mortar pin groove
In mortar.
In one embodiment of the present invention, the quick hollow part is a baffle plate.The baffle plate has the first plane
With the first inclined-plane for extending the mortar pin groove, the baffle plate is fitting to connection in the side of the mortar pin groove by first plane
On wall.First plane of the baffle plate matches with the side wall of the mortar pin groove to be connected, and reaches second in the cutting-height of silicon ingot
Before height, hardly have mortar and reserved at the baffle plate.Wherein, it is smooth mistake between first plane and the first inclined-plane
Cross or broken line transition.
First inclined-plane and the angle of horizontal direction are acute angle.Preferably, first inclined-plane and the folder of horizontal direction
Angle is 30-60 °.For example, it may be 30 °, 35 °, 40 °, 50 ° or 60 °.
Wherein, the mortar groove sidewall is provided with groove, and the first plane of the baffle plate is fitted to the groove.
Preferably, the height of the first plane of the baffle plate is equal to or more than the height of the groove.
Preferably, the height of the groove is equal to or less than the depth of the mortar pin groove.In an embodiment of the present invention, institute
The height for stating groove is equal to the depth of the mortar pin groove.
In one embodiment of the invention, a top is installed on the self-powered platform and opens rod, is reached in the cutting-height of silicon ingot
During to the second height, rod is opened on the top can push up open the baffle plate to empty the mortar in the mortar pin groove.In the lifting work
Make under the rolling action of platform, the top opens rod and moves to the first inclined-plane for contacting the baffle plate from top to bottom, passes through mechanical force
Open the baffle plate for the connection that coincide with the mortar pin groove in mode top.Now, the first plane of the baffle plate and the mortar pin groove it
Between no longer coincide connection, produce larger space.Mortar in mortar pin groove rapid deflation since then.
Described push up opens the length of rod, opens the installation site of rod with described push up (such as the fixation of rod and self-powered platform is opened on top
Situation, the difference in height that top is opened the hanging bottom of rod and is cut at first between the bottom of silicon ingot, rod is opened the of the baffle plate in top
Projection on one inclined-plane etc.), the first inclined-plane deviate vertical direction angle have relation, as long as the cutting-height in silicon ingot reaches
During the second height, the baffle plate can be pushed up open by controlling the top to open rod.
It is further preferred that first inclined-plane is provided with jack, the size of the jack opens the end face of rod with the top
Match.The jack is used to accommodate the end face pushed up and open rod, so that the power that rod and the baffle plate are opened in the top is better achieved
Learn contact.
It is further preferred that the roughness on first inclined-plane is more than the roughness of first plane.It is easy to the top
The mechanics that rod is opened with the baffle plate contacts.
It is further preferred that the baffle plate can be connected to the side wall of the mortar pin groove by first two-dimensional activity
On.In such cases, in the presence of opening rod on the top, between the baffle plate and the mortar pin groove space is produced (to cover originally
Cover the size of the first planar section of mortar pin groove upper groove), but the one side of the baffle plate is still connected with the mortar pin groove.
It is further preferred that the first plane of the baffle plate is connected with the mortar pin groove by way of magnetic-adsorption.
In such cases, in the presence of opening rod on the top, the baffle plate drops from the mortar pin groove.
In an embodiment of the present invention, the baffle plate is metal baffle, and the first of the mortar pin groove and the baffle plate is flat
The place that face is in contact is provided with magnetic plate.
In another embodiment of the present invention, the first plane of the baffle plate in the mortar groove sidewall with being respectively equipped with magnetic
The opposite magnetic plate of property.The first plane of the baffle plate and the identical connection of the mortar groove sidewall can also so be realized.
In another embodiment of the present invention, the quick hollow part is the block piece being arranged in mortar groove sidewall
The middle part of side wall (be preferably provided be).The mortar groove sidewall is provided with an opening, and the block piece part is fitted to the mortar
In groove sidewall, to realize that the side wall of the mortar pin groove flows out without mortar.
Before the cutting-height of silicon ingot reaches the second height, the opening is blocked by the block piece always, no sand
Slurry flows out from there.Shape, the size of the opening are unlimited, as long as ensureing that the cutting-height in silicon ingot reaches first height
When, the block piece is removed to expose the opening, the mortar in the mortar pin groove can be via the opening rapid deflation.
Preferably, the length that the block piece extends the mortar groove sidewall is 4-50mm.Further preferably into 10-
40mm。
Preferably, the opening is square or circular, and the size (or diameter) of the opening is 80-120mm.
Second aspect of the present invention provides a kind of method for cutting silicon ingot, comprises the following steps：
Mortar pin groove is set between two guide wheels for being disposed with cutting steel wire, silicon ingot to be cut is connected to lifting work
Below platform, the mortar nozzle that the self-powered platform both sides are set is towards the cutting steel wire spray furnace, in the lifting work
Make platform to drive during the silicon ingot moves from top to bottom, the silicon ingot is cut into slices using the cutting steel wire, wherein,
The mortar pin groove includes the open cell body in upper end, and the bottom of the cell body is provided with leakage sand hole, and the side wall of the mortar pin groove is additionally provided with
Quick hollow part；
When the cutting-height of the silicon ingot reaches the first height, make the ingot section that has cut or be all dipped into described
Mortar in mortar pin groove；
When the cutting-height of silicon ingot reaches the second height, using mortar pin groove described in the quick hollow part rapid deflation
In mortar, wherein, first height is less than or equal to 0.6-0.7 times of height of the silicon ingot to be cut；Described second
Highly close to the junction of the silicon ingot and the self-powered platform；
Completion to be cut, obtains silicon chip.
Preferably, a top is installed on the self-powered platform and opens rod, rod is opened for the cutting-height in silicon ingot in the top
The baffle plate is opened to empty the mortar in the mortar pin groove in top when reaching the second height.
Beneficial effects of the present invention include：
The method and device of the cutting silicon ingot of present invention offer, during the first half of cutting silicon ingot, by silicon ingot
Partly or entirely be immersed in the mortar of the mortar pin groove, it is possible to reduce cut the adhesion of silicon chip, the chip rinsed between silicon chip and
Mortar remains, and does not influence the band sand ability of cutting steel wire, is effectively increased steel wire and carries mortar amount and solid capacity, improves silicon chip
Yields；And before silicon ingot closes on and cut through, away from the mortar of immersion, reduce the broken of silicon chip.Method provided by the invention
And device, the inter-adhesive problem that the silicon chip that can solve to be formed in cutting process in the prior art easily occurs, it is possible to reduce
Silicon chip surface stria defective products and collapse scarce defective products ratio so that silicon chip yields improves more than 2%, can also reduce cutting of steel
The abrasion of line.
Advantages of the present invention will be illustrated partly in the following description, and a part is apparent according to specification
, or can be known by the implementation of the embodiment of the present invention.
Brief description of the drawings
Fig. 1 is the schematic diagram of the silicon chip adhesion situation that silicon ingot occurs in cutting process in the prior art；
Fig. 2 is the structural representation for the device that silicon ingot is cut in the present invention；
Fig. 3 opens the structural representation of rod for mortar pin groove in the device of cutting silicon ingot of the embodiment of the present invention and top；
Fig. 4 is the structural representation of quick hollow part 32 in Fig. 3.
The label of each part is as follows：Guide wheel 1, cutting steel wire 2, mortar pin groove 3, silicon ingot 4, mortar nozzle 5, leakage sand hole 31, soon
Rod 7 is opened on the hollow part 32 of speed, loading plate 6, top.
Embodiment
In order that technical problems, technical solutions and advantageous effects to be solved by the present invention are more clearly understood, with reference to
Accompanying drawing and preferred embodiment, are described in further detail to the present invention.It should be appreciated that specific embodiment described herein is only used
To explain the present invention, the restriction present invention is not used in.
Please also refer to accompanying drawing 2-4, wherein Fig. 2 is the structural representation for the device that silicon ingot is cut in the present invention.The device
Including two guide wheels 1, the cutting steel wire 2 being arranged on described two guide wheels 1 and the mortar pin groove between described two guide wheels
3, the device also includes self-powered platform (not shown), and silicon ingot 4 to be cut, the lifting work are connected with below self-powered platform
Make the both sides of platform provided with the mortar nozzle 5 towards the spray furnace of cutting steel wire 2.
The guiding of the admittance wheel of cutting steel wire 2, a cutting of steel gauze is formed on guide wheel.(the cutting steel wire of cutting steel wire 2
Net) high-speed motion, mortar nozzle 5 sprays the mortar containing cutting blade material, and the cutting blade material (mortar) of ejection, which is attached to, to be transported at a high speed
On the cutting steel wire 2 (cutting of steel gauze) turned, and silicon ingot 4 realizes feeding by the motion of self-powered platform from top to bottom, to cutting
Cut steel wire 2 (cutting of steel gauze) and produce pressure, the cutting blade material for making to be attached on cutting steel wire 2 (cutting of steel gauze) is pressed into silicon
The surface of ingot 4, silicon ingot 4 is cut.
Also embedded with the horizontal work rest slided on the self-powered platform, the lower end of the work rest is connected with loading plate 6
(not shown), the loading plate 6 are fixed with the silicon ingot 4 by glue.Wherein, the loading plate 6 is by supporting plate and adhesive sheet
Bonding forms.The viscose board is usually ground glass, and the supporting plate can be described as metal tray, work plate etc. again.
The mortar pin groove 3 includes the open cell body in upper end, and the bottom of the cell body is provided with leakage sand hole 31.The present invention one is implemented
In example, the mortar pin groove 3 includes the rectangular-shape cell body that upper end is opening end.Mortar nozzle 4 sprays sand towards cutting steel wire 2
Starch, mortar is fallen into mortar pin groove 3, and the mortar that leakage sand hole 31 makes to fall into mortar pin groove constantly leaks, but in regulation mortar nozzle 4
Injection flow and leakage sand hole 31 size (flowing out flow) in the case of, the mortar amount that is flowed into mortar pin groove 3 is more than stream
The mortar amount gone out, in general, the mortar amount in mortar pin groove 3 keep dynamic equilibrium.And ensure that the cutting-height in silicon ingot reaches
During the first height, the silicon ingot of cut portion can partly or entirely be dipped into the mortar in the mortar pin groove 3.
Wherein, when the cutting-height of the silicon ingot reaches the first height, the silicon ingot cut has 1-100mm to be dipped into mortar
Mortar in groove.
It is further preferred that the silicon ingot cut has 10-90mm to be dipped into the mortar in mortar pin groove.More preferably into having cut
Silicon ingot there is 40-80mm to be dipped into the mortar in mortar pin groove.
Wherein, first height (does not cut preceding initial silicon ingot less than or equal to the height of the silicon ingot to be cut
Full height) 0.6-0.7 times.
Preferably, first height is 0.4-0.65 times of height of the silicon ingot to be cut.
It is further preferred that first height is 60-100mm.
It is further preferred that first height is 80-100mm.
In an embodiment of the present invention, it is 250- to adjust the mortar flow flowed into from mortar nozzle 5 in mortar pin groove 3
300L/min (be, for example, 300L/min), the outflow flow for making mortar in mortar pin groove 3 are 200-250L/min, or 220,
240L/min.Control makes the flow that flows into of mortar in mortar pin groove 3 be more than outflow flow.
In the application, the mortar pin groove 3 is located at the lower section of the cutting steel wire 2, and the surface of mortar pin groove 3 is silicon ingot 4
Free end (that is to say part cut at first).In embodiment of the present invention, upper edge and the cutting of steel of the mortar pin groove
The distance between line is 20-60mm.
The size of the mortar pin groove 3, which must assure that, can not touch silicon ingot 4, in order to avoid influence the yield rate of the silicon chip of cutting.
It is understood that the depth of the mortar pin groove 3 is more than the height of silicon ingot to be cut.The width of the mortar pin groove 3, which is more than, to be treated
1 piece of cutting or the width of polylith silicon ingot.
The side wall of the mortar pin groove 3 is additionally provided with quick hollow part 32, and the quick hollow part 32 is used in silicon ingot
When cutting-height reaches the second height, the mortar in the mortar pin groove is emptied.
Wherein, junction (that is, when initial silicon ingot of second height close to the silicon ingot and the self-powered platform
Fixing end).Preferably, distance of second height away from the silicon ingot and the junction of the self-powered platform is 1-8mm.
It is further preferred that second height is 150-155mm.
It is highly preferred that distance of second height away from the silicon ingot and the junction of the self-powered platform is 2-6mm.
Preferably, the quick hollow part 3 is the baffle plate being arranged in mortar groove sidewall, or is arranged in the middle part of side wall
Block piece.
In one embodiment of the present invention, Fig. 3-Fig. 4 is referred to, the quick hollow part 32 is a baffle plate 32.Institute
Stating baffle plate 32 has the first plane 321 and extends the first inclined-plane 322 of the mortar pin groove 3.The side wall of the mortar pin groove is provided with
Groove, the first plane 321 of the baffle plate are fitted to the groove.The baffle plate connects by the way that first plane 321 is chimeric
It is connected in the side wall of the mortar pin groove 33.
The bearing of trend on the first inclined-plane 322 is the opening end away from mortar pin groove 3.First plane 321 of the baffle plate 32 with
The mortar pin groove 3 is flexibly connected or is connected by way of magnetic-adsorption.
Before the cutting-height of silicon ingot 3 reaches the second height, the side wall of first plane 321 and the mortar pin groove 3
Match connection, hardly has mortar and is reserved at the baffle plate 32.Wherein, the inclined-plane 322 of the first plane 321 and first it
Between to smoothly transit or broken line transition.
In this embodiment of the present invention, the angle α of first inclined-plane 322 and horizontal direction is 30-60 °.
One top is installed on the self-powered platform and opens rod 7, when the cutting-height of silicon ingot reaches the second height, the top
The baffle plate 32 can be pushed up open by opening rod.
Under the rolling action of the self-powered platform, the top opens rod 7 and moves to the contact baffle plate 32 from top to bottom
The first inclined-plane 322, by way of mechanical force top open and the mortar pin groove 3 coincide connection the baffle plate 32.That is, described gear
No longer coincide connection between the first plane 321 and the mortar pin groove 3 of plate 32, produces larger space.Mortar in mortar pin groove 3
Rapid deflation since then.
In the application, the baffle plate 32 can pass through the side for being movably connected in the mortar pin groove 3 of first plane 321
On wall, in such cases, in the presence of opening rod 7 on the top, space is produced (i.e. between the baffle plate 32 and the mortar pin groove 3
Originally cover the size of the part of the first plane 321 of mortar pin groove upper groove), but the one side of the baffle plate 32 still with it is described
It is connected in mortar pin groove 3.
First plane 321 of the baffle plate 32 can also be connected by way of magnetic-adsorption with the mortar pin groove 3.
In such cases, in the presence of opening rod 7 on the top, the baffle plate 32 drops from the mortar pin groove 3.For example, the baffle plate
32 be metal baffle 32, and the place that the mortar pin groove 3 is in contact with the first plane 321 of the baffle plate 32 is provided with magnetic plate.Again
For example, the magnetic plate that the baffle plate 32 is opposite with being respectively equipped with magnetic in the mortar pin groove 3, can also realize that magnetic connects.
Preferably, the first plane 321 of the baffle plate 32 is flexibly connected with the mortar pin groove 3.
First inclined-plane 322 is provided with jack 323, and the size of the jack 323 opens the end face phase of rod 7 with the top
Match somebody with somebody.The jack 323 be used for accommodate it is described push up open rod 7 free end end face, be better achieved it is described top open rod 7 with it is described
The mechanics contact of baffle plate 32.
The roughness on first inclined-plane 322 is more than the roughness of first plane 321.Be easy to it is described top open rod 7 with
The mechanics contact of the baffle plate 32.
Embodiment 1：
A kind of method for cutting silicon ingot, comprises the following steps：
(1) using the device of the cutting silicon ingot shown in Fig. 2-Fig. 4, using multi-line cutting machine (Dong Gang companies, model
VWS), mortar pin groove 3 is set between two guide wheels 1 for being disposed with cutting steel wire 2, made between the upper edge of mortar pin groove and cutting steel wire
Distance be 30mm；Silicon ingot 4 (156 × 156mm) to be cut is connected to below self-powered platform, and in the liter for loading silicon ingot
The top that a length is 200-250mm is fixed on drop workbench and opens rod 7 (being specially a round steel bar), in the self-powered platform two
Side sets mortar nozzle 5 so that it drives the silicon ingot certainly towards the spray furnace of cutting steel wire 2 in the self-powered platform
During upper and lower motion, the silicon ingot 4 is cut into slices using the cutting steel wire 2；Wherein, the dress of cutting silicon ingot is started
Putting operates guide wheel 2, and the maximum speed that self-powered platform is moved from top to bottom is arranged to 500 μm/min；
Wherein, the size of mortar pin groove 3 is 744mm × 375mm × 70mm, and its cell body upper end is open, the cell body bottom of mortar pin groove 3
Portion offers 3 × 5 leakage sand holes 31, and each leakage sand hole 31 is circular, its a diameter of 68mm；The quick leakage set in mortar pin groove 3
Empty part 32 is a baffle plate 32, and baffle plate 32 has the first plane 321 and extends the first inclined-plane 322 of the mortar pin groove 3, its
In, a length of 70mm in bottom of the first plane 321 of the baffle plate 32, the groove depth of the height of the first plane 321 and the mortar pin groove 3
Degree is the same, is 70mm；First inclined-plane 322 of baffle plate 32 and the angle α of horizontal direction are 60 °；Open the installation position of rod 7 in adjustment top
Put so that when the cutting-height of silicon ingot reaches 150-155mm, rod 7 is opened on top can push up open the quick hollow part 32.
(2) in section, mortar nozzle 4 is fallen into mortar pin groove 3 to cutting steel wire spray furnace, and leakage sand hole 31 makes to fall
The mortar entered in mortar pin groove constantly leaks, and the quick hollow part 32 in mortar pin groove 3 still coincide with mortar pin groove 3 and connected, no sand
Slurry is revealed at quick hollow part 32, adjusts the flow velocity of mortar nozzle 5, the mortar amount in mortar pin groove 3 is kept dynamic equilibrium,
Its mortar amount flowed into is more than the mortar amount of outflow, wherein, when the cutting-height of the silicon ingot reaches 80-100mm, cut
Partial silicon ingot is dipped into the mortar in the mortar pin groove；
(3) when the cutting-height of silicon ingot reaches 150-155mm (i.e. silicon ingot is close to when being cut through), top opens the top of rod 7 and opens institute
State quick hollow part 32, the mortar in mortar pin groove described in rapid deflation, silicon ingot is left the mortar of immersion before being cut through；
During completion to be cut, silicon chip is obtained.
Silicon chip caused by cutting in the present embodiment is subjected to final measurement and sorting by Hennecke silicon tests instrument.
Hennecke silicon tests instrument is mainly made up of 3 feeding platform, measuring system and separation system parts, and wherein measuring system is
The core of whole Hennecke silicon test instrument, and stria module is then the important component in measuring system, works as silicon
Piece from feeding platform pass into measuring system when, stria module is by infrared vision technique and is aided with laser accunputure scanning technique to silicon chip
Non-Contact Scanning Measurement is carried out, the surface of silicon chip is detected, and contrast whether silicon chip surface reaches sets requirement, Ran Hougen
Silicon chip of the surface with stria is sorted into inside the box of corresponding storehouse according to the numerical value that measurement obtains, finally sub-elects non-defective unit detection silicon
Piece, and its measurement result can export on the display screen in real time.As a result show, surface caused by the present embodiment cutting has
The quantity of the silicon chip of stria has under the quantity of silicon chip of stria than surface caused by the cutting of existing Multi-wire wafer cutting method
3% is dropped, i.e. silicon chip yields improves 3%.
Embodiment 2：
A kind of device for cutting silicon ingot, the device includes multi-line cutting machine (HCT companies of Switzerland, model MB5), wherein more
Wire cutting machine includes two guide wheels 1, the cutting steel wire 2 being arranged on described two guide wheels 1 and between described two guide wheels
Mortar pin groove 3, wherein, the distance between the upper edge of mortar pin groove 3 and cutting steel wire are 40-45mm；
Silicon ingot 4 (156 × 156mm) to be cut is connected with below the self-powered platform of multi-line cutting machine, and is loading silicon
The top that a length is 150-200mm is fixed on the self-powered platform of ingot and opens rod 7, the self-powered platform both sides are provided with mortar
Nozzle 5 is so that it drives the silicon ingot to move from top to bottom towards the spray furnace of cutting steel wire 2 in the self-powered platform
During, the cutting steel wire 2 is used to cut into slices to the silicon ingot 4；
Wherein, the size of mortar pin groove 3 is 583mm × 376mm × 103mm, and its cell body upper end is open, and cell body bottom offers
Square leakage sand hole 31, the size of each leakage sand hole 31 is 60mm；Quick hollow part 32 is additionally provided with mortar pin groove 3, wherein
Quick hollow part is a baffle plate 32, and baffle plate 32 has the first plane 321 and extends the first inclined-plane 322 of the mortar pin groove 3,
Wherein, a length of 84mm in bottom of the first plane 321 of the baffle plate 32, the height of the first plane 321 is 103mm；Baffle plate 32
First inclined-plane 322 and the angle α of horizontal direction are 45 °.
The flow of mortar nozzle 4 is set with reference to the size of leakage sand hole in mortar pin groove 31, the sand collected in mortar pin groove can be made
Slurry amount keeps dynamic equilibrium, wherein controlling the silicon ingot for when the cutting-height of silicon ingot reaches 90mm, making cut portion all to soak
Steep the mortar in the mortar pin groove 3；
The installation site that rod 7 is opened on top is adjusted with reference to the shape of baffle plate so that when the cutting-height of silicon ingot reaches 150-
During 153mm, top opens rod 7 and can push up open the quick hollow part 32 and empty the mortar in mortar pin groove 3.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all essences in the present invention
All any modification, equivalent and improvement made within refreshing and principle etc., should be included in the scope of the protection.
Claims (10)
1. a kind of device for cutting silicon ingot, it is characterised in that described device includes two guide wheels, is arranged on described two guide wheels
Cutting steel wire and the mortar pin groove between described two guide wheels, in addition to self-powered platform, connect below self-powered platform
There is silicon ingot to be cut, the both sides of the self-powered platform are provided with the mortar nozzle towards cutting steel wire spray furnace；Wherein, institute
Stating mortar pin groove includes the open cell body in upper end, and the bottom of the cell body is provided with leakage sand hole；
The mortar pin groove is for the ingot section for when the cutting-height of silicon ingot reaches the first height, making to have cut or all immersions
To the mortar in the mortar pin groove；
The side wall of the mortar pin groove is additionally provided with quick hollow part；The quick hollow part is used to reach in the cutting-height of silicon ingot
During to the second height, the mortar in the mortar pin groove is emptied, wherein, first height is less than or equal to the silicon ingot to be cut
0.7 times of height, second height is close to the junction of the silicon ingot and the self-powered platform.
2. device according to claim 1, it is characterised in that first height is the height of the silicon ingot to be cut
0.4-0.65 times；Distance of second height away from the silicon ingot and the junction of the self-powered platform is 1-8mm.
3. device according to claim 2, it is characterised in that first height is 80-100mm；Second height
For 150-155mm.
4. device according to claim 3, it is characterised in that the quick hollow part is a baffle plate, the baffle plate tool
There is the first plane and extend the first inclined-plane of the mortar pin groove, the baffle plate is fitting to connection described by first plane
In the side wall of mortar pin groove.
5. device according to claim 4, it is characterised in that fluted, the gear is opened up in the side wall of the mortar pin groove
First plane of plate is fitted to the groove.
6. device according to claim 4, it is characterised in that a top is installed on the self-powered platform and opens rod, it is described
Open rod and open the baffle plate for being pushed up when the cutting-height of silicon ingot reaches the second height to empty the mortar in the mortar pin groove in top.
7. device according to claim 4, it is characterised in that the first plane of the baffle plate connects with the mortar pin groove activity
Connect, or be connected by way of magnetic-adsorption.
8. device according to claim 6, first inclined-plane is provided with jack, and the size of the jack is opened with the top
The end face of rod matches.
9. device according to claim 1, it is characterised in that the self-powered platform is also embedded with the horizontal workpiece slided
Frame, the lower end of the work rest are connected with loading plate, and the loading plate is fixed with the silicon ingot by glue.
A kind of 10. method for cutting silicon ingot, it is characterised in that comprise the following steps：
Mortar pin groove is set between two guide wheels for being disposed with cutting steel wire, silicon ingot to be cut is connected under self-powered platform
Side, the mortar nozzle that the self-powered platform both sides are set is towards the cutting steel wire spray furnace, in the self-powered platform
Drive during the silicon ingot moves from top to bottom, the silicon ingot is cut into slices using the cutting steel wire, wherein, it is described
Mortar pin groove includes the open cell body in upper end, and the bottom of the cell body is provided with leakage sand hole, and the side wall of the mortar pin groove is additionally provided with quickly
Hollow part；
When the cutting-height of the silicon ingot reaches the first height, make the ingot section that has cut or be all dipped into the mortar
Mortar in groove；
When the cutting-height of silicon ingot reaches the second height, using in mortar pin groove described in the quick hollow part rapid deflation
Mortar, wherein, first height is less than or equal to 0.7 times of the height of the silicon ingot to be cut, and second height approaches
The junction of the silicon ingot and the self-powered platform；
Completion to be cut, obtains silicon chip.
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| CN108673770B (en) * | 2018-05-29 | 2021-01-15 | 浙江鹏展新能源科技有限公司 | Crystalline silicon cutting device |
| CN108389783B (en) * | 2018-05-29 | 2020-05-22 | 宁夏海盛实业有限公司 | Preparation process of polycrystalline silicon wafer |
| CN109808092B (en) * | 2019-02-14 | 2022-01-04 | 厦门芯光润泽科技有限公司 | Multi-wire cutting method for silicon carbide crystal bar |
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