CN106332436B - Circuit board and preparation method thereof - Google Patents
Circuit board and preparation method thereof Download PDFInfo
- Publication number
- CN106332436B CN106332436B CN201510359973.9A CN201510359973A CN106332436B CN 106332436 B CN106332436 B CN 106332436B CN 201510359973 A CN201510359973 A CN 201510359973A CN 106332436 B CN106332436 B CN 106332436B
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- China
- Prior art keywords
- perforated portion
- circuit board
- groove
- circuit layer
- substrate
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09863—Concave hole or via
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The present invention discloses a kind of circuit board and preparation method thereof, which includes substrate, circuit layer and conductive material.Substrate has opposite first surface and second surface, also has the perforation through first surface and second surface.Perforating, there is the first perforated portion being connected and the second perforated portion to abut first surface and second surface respectively.First perforated portion is inside contracted with respect to the second perforated portion, and then forms cut different unit between the first perforated portion and the second perforated portion.Circuit layer is set to first surface, and covers the opening of the first perforated portion.Conductive material fills up perforation.
Description
Technical field
The present invention relates to a kind of circuit boards and preparation method thereof.
Background technique
Existing circuit board is the main carriers of electric equipment products.Complicated conducting wire and each is needed on cloth on circuit boards
Kind electronic component makes the function of reaching expected running by the circulation of electric current, various signals.Part electronic equipment is come
It says, it is necessary to which by biggish current loading (for example, being greater than 100A) and temperature lifting range must be controlled in 20 degree of C need below
It asks, therefore thick in the copper that circuit board domestic demand is embedded to 200 microns or more.
However, being the structural schematic diagram for being painted existing circuit board 3 referring to figure 5..As shown in figure 5, when 30 benefit of substrate
When forming groove 300 with laser processing manufacture craft, the inner wall out-of-flatness of groove 300 may be such that.This situation is incited somebody to action subsequent
When conductive material 34 is plated in groove 300 by circuit layer 32, conductive material 34 will be caused to have a common boundary in the opening of groove 300
Place forms bulge-structure 340, and the shape for not only resulting in circuit board 3 unsightly, damages texture, is also easy to cause asking for line short
Topic.
Summary of the invention
In view of this, a purpose of the present invention is that proposing the circuit board and its manufacturer that one kind can solve the above problems
Method.
In order to achieve the above object, an embodiment according to the present invention, a kind of circuit board include substrate, first circuit layer
And conductive material.Substrate has opposite first surface and second surface, also has and runs through first surface and second surface
Perforation.Perforating has the first perforated portion and the second perforated portion being connected.First perforated portion and the second perforated portion are adjacent respectively
Connect first surface and second surface.For especially, the first perforated portion is inside contracted with respect to second perforated portion, so in the first perforated portion and
Cut different unit is formed between second perforated portion.First circuit layer is set to first surface, and covers the opening of the first perforated portion.It is conductive
Material fills up perforation.
In one or more embodiments of the invention, above-mentioned cut different unit has width, and this width is essentially 1
To 7 mils.
In one or more embodiments of the invention, the first above-mentioned perforated portion has height relative to first circuit layer
Degree, and this is highly essentially 0.1 to 8 mil.
In one or more embodiments of the invention, above-mentioned cut different unit is perpendicular to the inner wall of the first perforated portion and second
The inner wall of perforated portion.
In one or more embodiments of the invention, above-mentioned circuit board also includes the second circuit layer.The second circuit layer
It is set to second surface, and exposes the opening of the second perforated portion.
In one or more embodiments of the invention, above-mentioned first circuit layer and the second circuit layer are copper foil.
In order to achieve the above object, another embodiment according to the present invention, a kind of circuit board manufacturing method include: providing
Substrate, wherein substrate includes substrate, first circuit layer and the second circuit layer, and substrate has opposite first surface and second
Surface, and first circuit layer and the second circuit layer are respectively arranged at first surface and second surface；Remove part second circuit
Layer, to expose a part of second surface；First groove is formed in substrate by the part that second surface is exposed；By the first groove
Bottom formed the second groove be connected to first surface, wherein cut different unit is formed between the first groove and the second groove；And
Electroplating of conductive material is to fill up the first groove and the second groove.
In one or more embodiments of the invention, the step of above-mentioned the first groove of formation, includes: being made by blind fishing
Technique forms the first groove.
In one or more embodiments of the invention, the step of above-mentioned the second groove of formation, includes: by laser plus
Work manufacture craft forms the second groove.
In one or more embodiments of the invention, above-mentioned laser processing manufacture craft is sequentially existed with laser beam
Multiple processing stands process substrate.There is the first center spacing, and the first center between wantonly 2 adjacent laser processing point
Spacing is substantially equal to the radius of each laser processing point.
2 adjacent laser processing points in one or more embodiments of the invention, positioned at the corner of the second groove
Between have the second center spacing, and the second center spacing be greater than above-mentioned radius.
In conclusion circuit board and its manufacturing method of the invention is when processing the perforation of substrate, in the inner wall of perforation
Form the inner shrinking structure with cut different unit.By this inner shrinking structure, when conductive material is electroplated to perforation by the bottom perforated
Opening when, conductive material would not the opening intersection of perforation formed bulge-structure.That is, inner shrinking structure can compensate for
It is influenced caused by the inner wall out-of-flatness of perforation.Therefore, circuit board manufactured by method of manufacturing circuit board through the invention is not
Only there is the beautiful and shape rich in texture, also can avoid conductive material because caused by bulge-structure the problem of line short.
The above is only to illustrate the problem of present invention is to be solved, technical means to solve problem and its generation
Effect etc., detail of the invention will be discussed in detail in embodiment and relevant drawings below.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the circuit board of an embodiment of the present invention；
Fig. 2 is the step flow chart of the method for manufacturing circuit board of an embodiment of the present invention；
Fig. 3 A to Fig. 3 F is the structural schematic diagram of circuit board each fabrication stage of an embodiment of the present invention；
Fig. 4 is the local top view of the substrate in Fig. 3 E；
Fig. 5 is the structural schematic diagram of existing circuit board.
Symbol description
1,3: circuit board
10,30: substrate
100: first surface
102: second surface
104: perforation
104a: the first perforated portion
104b: the second perforated portion
104c: cut different unit
12: first circuit layer
14,34: conductive material
16: the second circuit layer
2: resist
300: groove
32: circuit layer
340: bulge-structure
G1: the first center spacing
G2: the second center spacing
H: height
L: blind fishing line
P: laser processing point
R: radius
W: width
S100~S104: step
Specific embodiment
Multiple embodiments of the invention will be disclosed with attached drawing below, as clearly stated, the details in many practices
It will be explained in the following description.It should be appreciated, however, that the details in these practices is not applied to limit the present invention.Also
It is to say, in some embodiments of the present invention, the details in these practices is non-essential.In addition, for the sake of simplifying attached drawing, one
A little existing usual structures and element will be painted it in a manner of simply illustrating in the accompanying drawings.
Fig. 1 is please referred to, is the structural schematic diagram for being painted the circuit board 1 of an embodiment of the present invention.
As shown in Figure 1, in the present embodiment, circuit board 1 includes substrate 10, first circuit layer 12 and conductive material
14.Substrate 10 has opposite first surface 100 and second surface 102, also has and runs through first surface 100 and second surface
102 perforation 104.Perforation 104 has the first perforated portion 104a and the second perforated portion 104b being connected.First perforated portion
104a and the second perforated portion 104b abuts first surface 100 and second surface 102 respectively.First perforated portion 104a is worn with respect to second
Hole portion 104b is inside contracted, and then cut different unit 104c is formed between the first perforated portion 104a and the second perforated portion 104b.First circuit
Layer 12 is set to first surface 100, and covers opening of the first perforated portion 104a far from the second perforated portion 104b and (i.e. wear in Fig. 1
The under shed in hole 104).Conductive material 14 fills up perforation 104.
Furthermore, it is understood that as shown in Figure 1, cut different unit 104c perpendicular to the first perforated portion 104a inner wall and the second perforated portion
The inner wall of 104b.In addition, circuit board 1 also includes the second circuit layer 16.The second circuit layer 16 is set to the second surface of substrate 10
102, and expose opening (i.e. the upper opening of Fig. 1 middle punch 104) of the second perforated portion 104b far from the first perforated portion 104a.
On the other hand, orthographic projection of the first perforated portion 104a in first circuit layer 12 is to be located at the second perforation
Portion 104b is within the scope of the orthographic projection in first circuit layer 12.That is, the aperture ratio second of the first perforated portion 104a
The aperture of perforated portion 104b is small, and if by the surface of substrate 10 from the point of view of, the first perforated portion 104a and the second perforated portion 104b it
Between to be formed by cut different unit 104c substantially annular in shape.
It is configured according to the structure of above-mentioned substrate 10, it can be in bottom (i.e. the first circuit by conductive material 14 by perforation 104
The intersection of layer 12 and the first perforated portion 104a) start the opening (i.e. the opening of the second perforated portion 104b) for being electroplated to perforation 104
When, avoid conductive material 14 from forming bulge-structure in the opening intersection of perforation 104.Therefore, above-mentioned substrate 10 is by plating system
Make circuit board 1 manufactured by technique, not only there is the beautiful and shape rich in texture, also can avoid conductive material 14 because protrusion is tied
Caused by structure the problem of line short.
In order to reach the above-mentioned technical effect for avoiding conductive material 14 from forming bulge-structure in the opening intersection of perforation 104
To better effect, in the present embodiment, can design keeps width W (as best shown in figs. 1 and 4) possessed by cut different unit 104c real
It is in matter 1 to 7 mil (mil), it is therefore preferable to 3.5 mils.In addition, in the present embodiment, can also design makes the first perforated portion
104a is essentially 0.1 to 8 mil relative to height H possessed by first circuit layer 12, it is therefore preferable to 2 mils.However, this hair
It is bright to be not limited thereto.
In the present embodiment, first circuit layer 12 and the second circuit layer 16 are all copper foil, but the present invention not as
Limit.
Referring to figure 2. to Fig. 3 F.Fig. 2 is the step process for being painted the method for manufacturing circuit board of an embodiment of the present invention
Figure.Fig. 3 A to Fig. 3 F is the structural schematic diagram of each fabrication stage of circuit board 1 of an embodiment of the present invention.
As shown in Fig. 2, and cooperate referring to Fig. 3 A to Fig. 3 F, in present embodiment, method of manufacturing circuit board is included at least
Step S100~step S104, as follows.
Step S100: providing substrate, and wherein substrate includes substrate 10, the first metal layer and second metal layer, substrate 10
With opposite first surface 100 and second surface 102, and the first metal layer and second metal layer are respectively arranged at first
Surface 100 and second surface 102 (see Fig. 3 A).
Step S101: part second metal layer is removed, to expose a part of second surface 102 (see Fig. 3 B).
Step S102: the first groove is formed in substrate 10 (see Fig. 3 C) by the part that second surface 102 is exposed.
In the present embodiment, the first groove formed in step S102 can correspond to the second perforated portion into Fig. 1
The structure of 104b.Also, step S102 can further include step S102a: pass through blind fishing (blind routing) manufacture craft
Form the first groove.It, can be rapidly using blind fishing manufacture craft since the material removing speed of blind fishing manufacture craft is very fast
The first deeper groove of depth is milled out in the blind fishing line L (see Fig. 4) of substrate 10.However, the present invention is not limited thereto, it is above-mentioned
The first groove other processing technology thereofs can also be used formed.
Step S103: the second groove is formed by the bottom of the first groove and is connected to first surface 100, wherein cut different unit 104c
It is formed between the first groove and the second groove (see Fig. 3 D).
In the present embodiment, the second groove formed in step S103 can correspond to the first perforated portion into Fig. 1
The structure of 104a.Also, step S103 can further include step S103a: it is recessed to form second by laser processing manufacture craft
Slot.Since the material removal precision of laser processing manufacture craft is higher, can critically be existed using laser processing manufacture craft
The bottom of first groove processes the second shallower groove of depth, and can avoid destroying first circuit layer 12.However, the present invention is simultaneously
It is not limited, the second above-mentioned groove can also be used other processing technology thereofs and be formed.
In the present embodiment, laser machining laser used by manufacture craft is carbon dioxide laser, but the present invention is simultaneously
It is not limited.
In addition, forming the second groove, then method of manufacturing circuit board of the invention according to above-mentioned laser processing manufacture craft
It also may include step S103b: removing glue residue caused by laser processing manufacture craft.
Step S104: electroplating of conductive material 14 is to fill up the first groove and the second groove (see Fig. 3 E, Fig. 3 F and Fig. 1).
It, can be first in position (i.e. in the first circuit layer 12 and the second circuit layer 16) coating for being not intended to plating in step S104
Resist 2, and the position to be electroplated (i.e. the perforation 104 of substrate 10) is exposed, as shown in FIGURE 3 E.Then, it is electroplated.Due to resistance
The reason that agent 2 stops, therefore controllable conductive material 14 is electroplated to by the intersection of the second groove and first circuit layer 12
The opening of first groove, as illustrated in Figure 3 F.Finally, stripping (stripping) manufacture craft can be carried out, resist 2 is removed, and
1 finished product of circuit board can be obtained, as shown in Figure 1.
It referring to figure 4., is the local top view for the substrate 10 being painted in Fig. 3 E.As shown in figure 4, in present embodiment
In, laser processing manufacture craft employed in step S103a be with laser beam sequentially multiple processing stands to substrate 10 into
Row processing.There is the first center spacing G1, and the first center spacing G1 is substantially equal between wantonly two adjacent laser processing point P
Laser machine the radius R of point P.
Furthermore, it is understood that laser processing manufacture craft is excessively intensively moved in the processing of the corner of the second groove in order to prevent
Except excessive material, in the present embodiment, can set makes between two adjacent laser processing point P of the corner of the second groove
With the second center spacing G2, and the second center spacing G2 is greater than above-mentioned radius R.
By above for the detailed description of a specific embodiment of the invention, it is apparent that circuit board of the invention and
Its manufacturing method is to form the inner shrinking structure with cut different unit in the inner wall of perforation when processing the perforation of substrate.By in this
Shrinking structure, when conductive material is electroplated to the opening of perforation by the bottom perforated, conductive material would not opening in perforation
Mouth intersection forms bulge-structure.That is, inner shrinking structure can compensate for influencing caused by the inner wall out-of-flatness of perforation.Cause
This, circuit board manufactured by method of manufacturing circuit board through the invention not only has beauty and the shape rich in texture, may be used also
Avoid the problem that conductive material because of line short caused by bulge-structure.
It is any to be familiar with this not to limit the present invention although disclosing the present invention in conjunction with embodiment of above
Operator can be used for a variety of modifications and variations, therefore protection scope of the present invention without departing from the spirit and scope of the present invention
It should be subject to what the appended claims were defined.
Claims (12)
1. a kind of circuit board, includes:
Substrate has opposite first surface and second surface, also has wearing through the first surface and the second surface
There is the first perforated portion being connected and the second perforated portion to abut the first surface and the second surface respectively for hole, the perforation,
Wherein first perforated portion is inside contracted with respect to second perforated portion, and then is formed between first perforated portion and second perforated portion
One cut different unit, wherein the cut different unit is perpendicular to the inner wall of first perforated portion and the inner wall of second perforated portion；
Wherein, which is formed by a blind fishing manufacture craft, which makes work by a laser processing
Skill is formed；
First circuit layer is set to the first surface, and covers the opening of first perforated portion；And
Conductive material fills up the perforation.
2. circuit board as described in claim 1, wherein the cut different unit has a width, and the width is essentially 1 to 7 close
Ear.
3. circuit board as described in claim 1, wherein first perforated portion has a height relative to the first circuit layer, and
And this is highly essentially 0.1 to 8 mil.
4. circuit board as described in claim 1 also includes the second circuit layer, which is set to the second surface,
And expose the opening of second perforated portion.
5. circuit board as claimed in claim 4, wherein the first circuit layer and the second circuit layer are copper foil.
6. a kind of circuit board manufacturing method, includes:
A substrate is provided, wherein the substrate includes substrate, first circuit layer and the second circuit layer, which has opposite the
One surface and second surface, and the first circuit layer and the second circuit layer be respectively arranged at the first surface and this second
Surface；
The part the second circuit layer is removed, with a part of the exposure second surface；
The part being exposed by the second surface forms one first groove in the substrate by a blind fishing manufacture craft；
One second groove is formed by a laser processing manufacture craft by the bottom of first groove and is connected to the first surface,
In a cut different unit be formed between first groove and second groove；And
A conductive material is electroplated to fill up first groove and second groove.
7. circuit board manufacturing method as claimed in claim 6, wherein the cut different unit has a width, and the width is substantial
For 1 to 7 mil.
8. circuit board manufacturing method as claimed in claim 6, wherein second groove has one relative to the first circuit layer
Highly, and this is highly essentially 0.1 to 8 mil.
9. circuit board manufacturing method as claimed in claim 6, wherein the cut different unit is perpendicular to the inner wall of first groove and this
The inner wall of second groove.
10. circuit board manufacturing method as claimed in claim 6, wherein the laser processing manufacture craft be with a laser beam according to
Sequence processes the substrate in multiple processing stands, has one first center spacing between wantonly two those adjacent laser processing points,
And the first center spacing is substantially equal to the Radius of each of laser processing point.
11. circuit board manufacturing method as claimed in claim 10, wherein be located at a corner of second groove two are adjacent
There is one second center spacing between those laser processing points, and the second center spacing is greater than the radius.
12. circuit board manufacturing method as claimed in claim 6, wherein the first circuit layer and the second circuit layer are copper foil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510359973.9A CN106332436B (en) | 2015-06-26 | 2015-06-26 | Circuit board and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510359973.9A CN106332436B (en) | 2015-06-26 | 2015-06-26 | Circuit board and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106332436A CN106332436A (en) | 2017-01-11 |
| CN106332436B true CN106332436B (en) | 2019-05-14 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510359973.9A Active CN106332436B (en) | 2015-06-26 | 2015-06-26 | Circuit board and preparation method thereof |
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| Country | Link |
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| CN (1) | CN106332436B (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103857197A (en) * | 2012-12-04 | 2014-06-11 | 宏启胜精密电子(秦皇岛)有限公司 | Circuit board and manufacturing method of circuit board |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100632556B1 (en) * | 2005-01-28 | 2006-10-11 | 삼성전기주식회사 | Method for fabricating printed circuit board |
| TWI565378B (en) * | 2012-12-31 | 2017-01-01 | 三星電機股份有限公司 | Circuit board and method of manufacturing the same |
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2015
- 2015-06-26 CN CN201510359973.9A patent/CN106332436B/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103857197A (en) * | 2012-12-04 | 2014-06-11 | 宏启胜精密电子(秦皇岛)有限公司 | Circuit board and manufacturing method of circuit board |
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| Publication number | Publication date |
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| CN106332436A (en) | 2017-01-11 |
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| TA01 | Transfer of patent application right |
Effective date of registration: 20190404 Address after: 433000 Wuzhou Avenue, Xiantao City, Hubei Province, 5, 7, 9 Applicant after: Jian Ding (Hubei) Electronics Co., Ltd. Address before: 214101 No. 6 Tuanjiezhong Road, Xishan Economic Development Zone, Wuxi City, Jiangsu Province Applicant before: Tripod (Wuxi) Electronic Co., Ltd. |
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