CN106329288A - Terminal local shielding method - Google Patents
Terminal local shielding method Download PDFInfo
- Publication number
- CN106329288A CN106329288A CN201610780809.XA CN201610780809A CN106329288A CN 106329288 A CN106329288 A CN 106329288A CN 201610780809 A CN201610780809 A CN 201610780809A CN 106329288 A CN106329288 A CN 106329288A
- Authority
- CN
- China
- Prior art keywords
- terminal
- film
- tail band
- plating
- punch
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/16—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending
Abstract
The invention relates to a terminal local shielding method, and the method comprises the following steps: S1, preprocessing: enabling a base film for forming a terminal to be placed in a base film groove, dragging the base film forwards through a material dragging mechanism, and carrying out the dust removal of the surface of the base film through a dust removing device; S2, punch forming: leading the base film into a punch forming die, enabling the punch forming fie to carry out the punch forming of the base film, and obtaining the terminal; S3, film pasting: enabling a part, which does not need to be electroplated, of the terminal to be pasted with an insulating film; S4, inspection: detecting the film pasting quality of the terminal; S5, electroplating: enabling the terminal to be placed into an electroplating groove, and carrying out the plating of a conductive film on the surface of the terminal; S6, insulating film removing: peeling off the insulating film on the terminal plated with the conductive film, and obtaining a terminal product. The method is advantageous in that the method is high in production efficiency, and is low in reject percentage.
Description
Technical field
The present invention relates to the production technical field of electronic devices and components, particularly terminal shadow shield method.
Background technology
Electronic devices and components are the bases of information industry, belong to new high-tech industry, and development prospect is wide.In the coming years,
Miniaturization will be one of topmost development trend of electronic devices and components.And the processing technique of electronic devices and components is the most more and more
Paid close attention to by people.
Terminal belongs to the one in electronic devices and components, mostly needs at terminal surfaces plating last layer conducting film, but have
Terminal surfaces is not to need to plate completely conducting film, owing to terminal belongs to mini component, in traditional terminal part plating conduction
Film is all first to plate whole conducting films, then need not plate the position of conducting film further according to terminal surfaces, is removed by conducting film, this
Plant production technology extremely inefficient, and be easily destroyed the position needing to plate conducting film when removing conducting film, thus occur a large amount of
Waster.
Summary of the invention
It is an object of the invention to overcome the shortcoming of prior art, it is provided that a kind of production efficiency is high, waster rate is low
Terminal shadow shield method.
The purpose of the present invention is achieved through the following technical solutions: terminal shadow shield method, comprises the following steps:
S1, pre-treatment: be placed in tail band groove by the tail band being used for forming terminal, dragging mechanism drag forward, simultaneously by removing
Dirt device carries out dust removal process to tail band surface；
S2, punch forming: introduced by tail band in punch-forming mold, punch-forming mold carries out punch forming to tail band, obtains
Terminal；
S3, pad pasting: terminal need not the position of plating, carry out pasting dielectric film and process；
S4, inspection: check the pad pasting quality of terminal；
S5, plating: terminal is put into coating bath, carry out plating conducting film in terminal surfaces and process；
S6, except dielectric film: will plating conducting film after terminal on dielectric film tear off, obtain terminal product.
In step S2, described dielectric film is PI film, PE film or PET film.
The both sides of described tail band have hole, location by target-shooting machine the most respectively, and dragging mechanism is by hole, location
Tail band is dragged forward.
The invention have the advantages that
The present invention by when not plating conducting film directly to need not plate conducting film position, stick dielectric film, prevent terminal not
Need the position plating conducting film when plating conducting film, be coated to upper conductive film, after plating conducting film, have only to tear dielectric film off just may be used
Obtaining product, production efficiency is high, and waster rate is low, is suitable for producing in enormous quantities.
Detailed description of the invention
The present invention will be further described for knot below, but protection scope of the present invention is not limited to the following stated.
Terminal shadow shield method, comprises the following steps:
S1, pre-treatment: be placed in tail band groove by the tail band being used for forming terminal, dragging mechanism drag forward, simultaneously by removing
Dirt device carries out dust removal process to tail band surface；
S2, punch forming: introduced by tail band in punch-forming mold, punch-forming mold carries out punch forming to tail band, obtains
Terminal；
S3, pad pasting: terminal need not the position of plating, carry out pasting dielectric film and process；
S4, inspection: check the pad pasting quality of terminal, see whether the position of pad pasting is the position that need not plate conducting film, if not
Then to tear dielectric film off, again paste dielectric film, even if thus the dielectric film pad pasting site error of terminal is relatively big, be also not result in
Terminal is scrapped；
S5, plating: terminal is put into coating bath, carry out plating conducting film in terminal surfaces and process, and plating conducting film uses existing plating to lead
The technique of electrolemma is electroplated；
S6, except dielectric film: will plating conducting film after terminal on dielectric film tear off, obtain terminal product.
In step S2, described dielectric film is PI film, PE film or PET film.
The both sides of described tail band have hole, location by target-shooting machine the most respectively, and dragging mechanism is by hole, location
Tail band is dragged forward.
Claims (3)
1. terminal shadow shield method, it is characterised in that: comprise the following steps:
S1, pre-treatment: be placed in tail band groove by the tail band being used for forming terminal, dragging mechanism drag forward, simultaneously by removing
Dirt device carries out dust removal process to tail band surface；
S2, punch forming: introduced by tail band in punch-forming mold, punch-forming mold carries out punch forming to tail band, obtains
Terminal；
S3, pad pasting: terminal need not the position of plating, carry out pasting dielectric film and process；
S4, inspection: check the pad pasting quality of terminal；
S5, plating: terminal is put into coating bath, carry out plating conducting film in terminal surfaces and process；
S6, except dielectric film: will plating conducting film after terminal on dielectric film tear off, obtain terminal product.
Terminal shadow shield method the most according to claim 1, it is characterised in that: in step S2, described dielectric film is PI
Film, PE film or PET film.
Terminal shadow shield method the most according to claim 1, it is characterised in that: the both sides of described tail band are along its length
Having hole, location by target-shooting machine respectively, tail band is dragged forward by dragging mechanism by hole, location.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610780809.XA CN106329288A (en) | 2016-08-31 | 2016-08-31 | Terminal local shielding method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610780809.XA CN106329288A (en) | 2016-08-31 | 2016-08-31 | Terminal local shielding method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106329288A true CN106329288A (en) | 2017-01-11 |
Family
ID=57789715
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610780809.XA Pending CN106329288A (en) | 2016-08-31 | 2016-08-31 | Terminal local shielding method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106329288A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108779567A (en) * | 2017-03-13 | 2018-11-09 | 华为技术有限公司 | The electro-plating method of terminal material belt |
| CN109295483A (en) * | 2018-11-28 | 2019-02-01 | 中国航发沈阳黎明航空发动机有限责任公司 | A kind of insulation protection method of copper facing part |
| CN112323111A (en) * | 2020-11-02 | 2021-02-05 | 昆山一鼎工业科技有限公司 | Method for electrolyzing continuous terminal |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN200956429Y (en) * | 2006-09-22 | 2007-10-03 | 番禺得意精密电子工业有限公司 | Terminal material band structure |
| CN103921525A (en) * | 2014-04-16 | 2014-07-16 | 曾芳勤 | Continuous moulding method of insulating film covering interior of shielding case |
| CN203728950U (en) * | 2014-01-21 | 2014-07-23 | 安费诺-泰姆斯（常州）通迅设备有限公司 | Continuous electroplating device for spare parts |
| CN105142351A (en) * | 2015-08-04 | 2015-12-09 | 深圳市景旺电子股份有限公司 | Leadless local gold electroplating method |
| CN105696037A (en) * | 2014-11-26 | 2016-06-22 | 泰科电子(上海)有限公司 | Electroplating method for workpiece and electroplating protective glue |
-
2016
- 2016-08-31 CN CN201610780809.XA patent/CN106329288A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN200956429Y (en) * | 2006-09-22 | 2007-10-03 | 番禺得意精密电子工业有限公司 | Terminal material band structure |
| CN203728950U (en) * | 2014-01-21 | 2014-07-23 | 安费诺-泰姆斯（常州）通迅设备有限公司 | Continuous electroplating device for spare parts |
| CN103921525A (en) * | 2014-04-16 | 2014-07-16 | 曾芳勤 | Continuous moulding method of insulating film covering interior of shielding case |
| CN105696037A (en) * | 2014-11-26 | 2016-06-22 | 泰科电子(上海)有限公司 | Electroplating method for workpiece and electroplating protective glue |
| CN105142351A (en) * | 2015-08-04 | 2015-12-09 | 深圳市景旺电子股份有限公司 | Leadless local gold electroplating method |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108779567A (en) * | 2017-03-13 | 2018-11-09 | 华为技术有限公司 | The electro-plating method of terminal material belt |
| CN109295483A (en) * | 2018-11-28 | 2019-02-01 | 中国航发沈阳黎明航空发动机有限责任公司 | A kind of insulation protection method of copper facing part |
| CN112323111A (en) * | 2020-11-02 | 2021-02-05 | 昆山一鼎工业科技有限公司 | Method for electrolyzing continuous terminal |
| CN112323111B (en) * | 2020-11-02 | 2021-07-23 | 昆山一鼎工业科技有限公司 | Method for electrolyzing continuous terminal |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
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| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170111 |