CN106328556A - Automatic tester for wafer - Google Patents
Automatic tester for wafer Download PDFInfo
- Publication number
- CN106328556A CN106328556A CN201610932289.XA CN201610932289A CN106328556A CN 106328556 A CN106328556 A CN 106328556A CN 201610932289 A CN201610932289 A CN 201610932289A CN 106328556 A CN106328556 A CN 106328556A
- Authority
- CN
- China
- Prior art keywords
- test
- plate
- platform
- sucker
- external member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims description 5
- 238000005520 cutting process Methods 0.000 claims description 4
- 238000003825 pressing Methods 0.000 claims description 3
- 230000001105 regulatory effect Effects 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 238000001514 detection method Methods 0.000 description 3
- 239000013078 crystal Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000007670 refining Methods 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67271—Sorting devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses an automatic tester for a wafer, comprising a rack, a blanking table, a feeding table, a suction external member, a transverse shift motor assembly body and a testing platform, wherein the rack is assembled by multiple bars, the transverse shift motor assembly body is fixedly arranged on the table of the rack, the two sides of the transverse shift assembly body are provided with the blanking table and the feeding table,the suction external member is arranged on the transverse shift assembly body,and the testing platform is set at one side of the rack. The beneficial effects of the invention are as follows: the automatic tester can realize grabbing, detecting and classifying the wafer automatically, the personnel misjudgment rate is reduced, the precision can be 100%, the production efficiency is greatly improved, and the product quality is ensured.
Description
Technical field
The present invention relates to quasiconductor detection technique field, specifically a kind of wafer automatic test machine.
Background technology
Wafer is to produce the carrier of used in integrated circuits, refers to monocrystal silicon disk more.Monocrystal silicon disk is drawn by common silica sand
Refining, make silicon single crystal rod through dissolving, purify, distill series of measures, silicon single crystal rod, after polishing, section, just becomes
For wafer.Wafer is the most frequently used semi-conducting material, is divided into 4 inches, 5 inches, 6 inches, 8 inches of equal-specifications by its diameter,
Recently develop 12 inches even research and develop bigger specification (14 English, 15 English, 16 English ... 20 English with first-class).Wafer
The biggest, on same disk, producible IC is the most, it is possible to decrease cost；But require that material technology and production technology are higher.Existing
Wafer during detection, need personnel manually take and detect, cause production efficiency low, examined personnel are subjective
Property and the impact of operation technique, the quality of product can not be guaranteed.
Summary of the invention
It is an object of the invention to provide a kind of wafer automatic test machine, with asking of solving to propose in above-mentioned background technology
Topic.
For achieving the above object, the present invention provides following technical scheme:
A kind of wafer automatic test machine, including frame, blanking bench, feeding platform, sucker external member, traversing motor assembly and survey
Examination platform, described frame uses the splicing of many root type material to make, the table top of frame is installed with traversing motor assembly, traversing motor
Assembly be respectively provided on two sides with blanking bench and feeding platform, traversing motor assembly is provided with sucker external member, and the side of frame sets
There is test platform；Described test platform include test platen, base plate, test right plate, test left plate, test installing plate and
Vacuum platform assembly, described upper test platen, test right plate and test left plate are spliced into two frames being placed on base plate
Body, is all installed with vacuum platform assembling in each described framework, vacuum platform fit on is provided with pcb board, the two of upper test platen
Side is all slidably connected with test right plate and test left plate by riser in lifting riser and lifting, and upper test platen passes through
Screw is installed with test installing plate, and the outside of test right plate and test left plate is equipped with regulating block and block；Described sucker
External member includes sucker backboard, bracket, support post and slide rail, is provided with many support posts in described bracket, and the side of bracket sets
Having backboard, fixed multiple sucker disk seats fixing by cutting ferrule on backboard, sucker disk seat is provided with suction nozzle, and the surface of bracket is provided with instrument
Support and cable tray, bracket is provided with the lower platen being close to arrange and synchronizes pressing plate；Described sucker external member is slidably connected at cunning
On rail, bottom slide rail, it is provided with locating piece.
As the further scheme of the present invention: described vacuum platform assembly is provided with position block.
As the present invention further scheme: described blanking bench is provided with multiple blanking pallet, as preferably, blanking torr
The quantity of dish is set to 12.
Compared with prior art, the invention has the beneficial effects as follows: can realize to automatically the capturing of wafer to be measured, detection and
Classification, reduces personnel's False Rate, accurately up to absolutely, greatly improves production efficiency, it is ensured that product quality.
Accompanying drawing explanation
Fig. 1 is the structural representation of a kind of wafer automatic test machine.
Fig. 2 is the structural representation of sucker external member in a kind of wafer automatic test machine.
Fig. 3 is the structural representation of middle test platform in a kind of wafer automatic test machine.
In figure: 1-frame, 2-blanking bench, 3-feeding platform, 4-sucker external member, 5-traversing motor assembly, 6-test platform,
Test riser, 12-in platen, 8-base plate, 9-test right plate, 10-lifting riser, 11-lifting on 7-and test left plate, 13-
Test installing plate, 14-regulating block, 15-block, 16-position block, 17-vacuum platform assembly, 18-PCB plate, 19-mirror image are surveyed
Examination right plate, 20-interior plate, 21-cutting ferrule, 22-sucker disk seat, 23-sucker backboard, 24-lower platen, 25-synchronize pressing plate, 26-torr
Frame, 27-cable tray, 28-instrument support, 29-support post, 30-locating piece, 31-slide rail.
Detailed description of the invention
Below in conjunction with detailed description of the invention, the technical scheme of this patent is described in more detail.
Referring to Fig. 1-3, a kind of wafer automatic test machine, including frame 1, blanking bench 2, feeding platform 3, sucker external member 4, horizontal stroke
Moving motor assembly 5 and test platform 6, described frame 1 uses the splicing of many root type material to make, and the table top of frame 1 is installed with horizontal stroke
Move motor assembly 5, traversing motor assembly 5 be respectively provided on two sides with blanking bench 2 and feeding platform 3, on traversing motor assembly 5
Being provided with sucker external member 4, the side of frame 1 is provided with test platform 6；Described test platform 6 includes test platen 7, base plate 8, surveys
Examination right plate 9, test left plate 12, test installing plate 13 and vacuum platform assembly 17, described upper test platen 7, the test right side
Side plate 9 and test left plate 12 are spliced into two frameworks being placed on base plate 8, are all installed with vacuum platform in each described framework
Assembling 17, vacuum platform assembling 17 is provided with pcb board 18, and the both sides of upper test platen 7 are all by lifting riser 10 and lifting
Riser 11 is slidably connected with test right plate 9 and test left plate 12, upper test platen 7 is installed with test by screw and installs
Plate 13, the outside of test right plate 9 and test left plate 12 is equipped with regulating block 14 and block 15, the position to upper test platen 7
Put and be adjusted；Described sucker external member 4 includes sucker backboard 23, bracket 26, support post 29 and slide rail 31, in described bracket 26
Being provided with many support posts 29, the side of bracket 26 is provided with backboard 23, fixed multiple by the fixing suction of cutting ferrule 21 on backboard 23
Dish seat 22, sucker disk seat 22 is provided with suction nozzle, and suction nozzle can hold wafer, facilitates subsequent operation, the surface of bracket 26 to be provided with instrument
Support 28 and cable tray 27, convenient erection instrument and cabling, bracket 26 is provided with the lower platen 24 and synchronous pressure being close to arrange
Plate 25；Described sucker external member 4 is slidably connected on slide rail 31, is provided with locating piece 30 bottom slide rail 31, and sucker external member 4 connects traversing
Motor assembly 5, after sucker external member 4 adsorbs wafer, slides under the driving of traversing motor assembly 5 on slide rail 31,
Wafer is transported on blanking bench 2 from feeding platform 3.
Described vacuum platform assembly 17 is provided with position block 16, and the motion to vacuum platform assembly 17 limits
Position.
Described blanking bench 2 is provided with multiple blanking pallet, for different types of wafer automatically being classified, can be divided into 12
Grade, classifies automatically, saves a large amount of cost of labor, it is ensured that product quality.
Above the better embodiment of this patent is explained in detail, but this patent is not limited to above-mentioned embodiment party
Formula, in the ken that one skilled in the relevant art is possessed, it is also possible on the premise of without departing from this patent objective
Make a variety of changes.
Claims (3)
1. a wafer automatic test machine, including frame, blanking bench, feeding platform, sucker external member, traversing motor assembly and test
Platform, it is characterised in that described frame uses the splicing of many root type material to make, and the table top of frame is installed with the assembling of traversing motor
Body, traversing motor assembly be respectively provided on two sides with blanking bench and feeding platform, traversing motor assembly is provided with sucker external member, machine
The side of frame is provided with test platform；Described test platform includes test platen, base plate, test right plate, test left plate, survey
Examination installing plate and vacuum platform assembly, described upper test platen, test right plate and test left plate are spliced into two and are placed in
Framework on base plate, is all installed with vacuum platform assembling in each described framework, vacuum platform fit on is provided with pcb board, upper survey
The both sides of test stand plate are all slidably connected with test right plate and test left plate by riser in lifting riser and lifting, upper test
Being installed with test installing plate by screw on platen, the outside of test right plate and test left plate is equipped with regulating block and gear
Block；Described sucker external member includes sucker backboard, bracket, support post and slide rail, is provided with many support posts in described bracket, torr
The side of frame is provided with backboard, and fixed multiple sucker disk seats fixing by cutting ferrule on backboard, sucker disk seat is provided with suction nozzle, the table of bracket
Face is provided with instrument support and cable tray, and bracket is provided with the lower platen being close to arrange and synchronizes pressing plate；Described sucker external member is sliding
It is automatically connected on slide rail, bottom slide rail, is provided with locating piece.
A kind of wafer automatic test machine the most according to claim 1, it is characterised in that set on described vacuum platform assembly
There is position block.
A kind of wafer automatic test machine the most according to claim 1, it is characterised in that described blanking bench be provided with multiple under
Material pallet, as preferably, the quantity of blanking pallet is set to 12.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610932289.XA CN106328556A (en) | 2016-10-25 | 2016-10-25 | Automatic tester for wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610932289.XA CN106328556A (en) | 2016-10-25 | 2016-10-25 | Automatic tester for wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106328556A true CN106328556A (en) | 2017-01-11 |
Family
ID=57818416
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610932289.XA Pending CN106328556A (en) | 2016-10-25 | 2016-10-25 | Automatic tester for wafer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106328556A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109590705A (en) * | 2018-12-26 | 2019-04-09 | 上海福赛特机器人有限公司 | A kind of wafer automatic assembling apparatus and automatic assembly method |
| CN110921317A (en) * | 2019-12-25 | 2020-03-27 | 佛山信卓派思机械科技有限公司 | Device for testing chip in product |
| CN111505476A (en) * | 2020-04-29 | 2020-08-07 | 江苏七维测试技术有限公司 | Test equipment of sensor wafer level test method |
| CN111735397A (en) * | 2020-01-15 | 2020-10-02 | 长治高测新材料科技有限公司 | Single polycrystalline silicon rod automatic checkout device |
| CN113687111A (en) * | 2021-08-26 | 2021-11-23 | 深圳市佳润芯电子科技有限公司 | Integrated circuit board testing device capable of adjusting azimuth coordinate |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201117644Y (en) * | 2007-09-20 | 2008-09-17 | 中国电子科技集团公司第二研究所 | Full-automatic silicon chip charging-discharging machine |
| CN201435403Y (en) * | 2009-06-22 | 2010-03-31 | 武汉帝尔激光科技有限公司 | Automatic solar silicon wafer loading device |
| CN201999522U (en) * | 2010-12-21 | 2011-10-05 | 苏州阿特斯阳光电力科技有限公司 | Full-automatic silicon chip feeding machine |
| CN202093108U (en) * | 2011-05-24 | 2011-12-28 | 阳新宏洋电子有限公司 | Automatic tester |
| CN202120967U (en) * | 2011-05-25 | 2012-01-18 | 湖南红太阳光电科技有限公司 | Automatic junction device |
| CN204857697U (en) * | 2015-07-28 | 2015-12-09 | 张家港国龙光伏科技有限公司 | Brilliant first cleaning machine for feed quick -witted |
-
2016
- 2016-10-25 CN CN201610932289.XA patent/CN106328556A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201117644Y (en) * | 2007-09-20 | 2008-09-17 | 中国电子科技集团公司第二研究所 | Full-automatic silicon chip charging-discharging machine |
| CN201435403Y (en) * | 2009-06-22 | 2010-03-31 | 武汉帝尔激光科技有限公司 | Automatic solar silicon wafer loading device |
| CN201999522U (en) * | 2010-12-21 | 2011-10-05 | 苏州阿特斯阳光电力科技有限公司 | Full-automatic silicon chip feeding machine |
| CN202093108U (en) * | 2011-05-24 | 2011-12-28 | 阳新宏洋电子有限公司 | Automatic tester |
| CN202120967U (en) * | 2011-05-25 | 2012-01-18 | 湖南红太阳光电科技有限公司 | Automatic junction device |
| CN204857697U (en) * | 2015-07-28 | 2015-12-09 | 张家港国龙光伏科技有限公司 | Brilliant first cleaning machine for feed quick -witted |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109590705A (en) * | 2018-12-26 | 2019-04-09 | 上海福赛特机器人有限公司 | A kind of wafer automatic assembling apparatus and automatic assembly method |
| CN109590705B (en) * | 2018-12-26 | 2020-09-04 | 上海福赛特机器人有限公司 | Automatic wafer assembling device and automatic assembling method |
| CN110921317A (en) * | 2019-12-25 | 2020-03-27 | 佛山信卓派思机械科技有限公司 | Device for testing chip in product |
| CN111735397A (en) * | 2020-01-15 | 2020-10-02 | 长治高测新材料科技有限公司 | Single polycrystalline silicon rod automatic checkout device |
| CN111505476A (en) * | 2020-04-29 | 2020-08-07 | 江苏七维测试技术有限公司 | Test equipment of sensor wafer level test method |
| CN113687111A (en) * | 2021-08-26 | 2021-11-23 | 深圳市佳润芯电子科技有限公司 | Integrated circuit board testing device capable of adjusting azimuth coordinate |
| CN113687111B (en) * | 2021-08-26 | 2024-02-06 | 深圳市佳润芯电子科技有限公司 | Integrated circuit board testing device capable of adjusting azimuth coordinates |
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|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20170111 |
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| WD01 | Invention patent application deemed withdrawn after publication |