CN106325629A - ITO wiring design method capable of optimizing separation of chemical plated gold - Google Patents
ITO wiring design method capable of optimizing separation of chemical plated gold Download PDFInfo
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- CN106325629A CN106325629A CN201510386929.7A CN201510386929A CN106325629A CN 106325629 A CN106325629 A CN 106325629A CN 201510386929 A CN201510386929 A CN 201510386929A CN 106325629 A CN106325629 A CN 106325629A
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- gold
- plated
- ito
- independent
- precipitation
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- 238000000034 method Methods 0.000 title claims abstract description 38
- 238000013461 design Methods 0.000 title claims abstract description 18
- 239000000126 substance Substances 0.000 title claims abstract description 18
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 title abstract description 21
- 239000010931 gold Substances 0.000 title abstract description 21
- 229910052737 gold Inorganic materials 0.000 title abstract description 21
- 238000000926 separation method Methods 0.000 title abstract 3
- 230000006698 induction Effects 0.000 claims abstract description 37
- 239000011521 glass Substances 0.000 claims abstract description 28
- 238000012545 processing Methods 0.000 claims abstract description 24
- 238000001556 precipitation Methods 0.000 claims description 45
- 238000005520 cutting process Methods 0.000 claims description 9
- 238000007747 plating Methods 0.000 abstract description 7
- 238000005516 engineering process Methods 0.000 abstract description 3
- 230000001681 protective effect Effects 0.000 abstract 1
- 230000008054 signal transmission Effects 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 5
- 230000007774 longterm Effects 0.000 description 3
- 238000012827 research and development Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 125000000266 alpha-aminoacyl group Chemical group 0.000 description 1
- DNAUJKZXPLKYLD-UHFFFAOYSA-N alumane;molybdenum Chemical compound [AlH3].[Mo].[Mo] DNAUJKZXPLKYLD-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
Abstract
The invention relates to wiring design of capacitive touch screen, and in particular relates to an ITO wiring design method capable of optimizing separation of chemical plated gold. The ITO wiring design method capable of optimizing separation of chemical plated gold comprises processing a part to be plated with gold and a part not to be plated with gold of ITO glass, wherein wires are etched in driving areas of the part to be plated with gold and the part not to be plated with gold, the driving area of the part not to be plated with gold is covered with a plated gold protective film, and then the wires of each piece of touch glass are plated with gold by a chemical gold plating technology; an independent gold-plating treatment induction element is arranged in an area close to the part where the plated gold is not prone to be separated out and located at the part, where no wire is arranged, on the ITO glass; the part where the plated gold is not prone to be separated out is an area with small plated gold treatment area; and the independent gold-plating treatment induction element is an independent ITO pattern arranged on the IOT glass. According to method provided by the invention, the plated gold is more prone to be separated out, and the thickness of the plated gold is more uniform; and the capacitive touch screen is better in product stability and signal transmission capacity.
Description
Technical field
The present invention relates to the design of capacitive touch screen cabling, particularly relate to the ITO cabling Optimization Design that a kind of chemical gilding separates out.
Background technology
The capacitive touch screen using craft of gilding cabling is currently in development, is the volume production that has never been realized in the world.Compared with the most commonly used molybdenum aluminum molybdenum technique cabling, there are more preferable stability and corrosion resistance, and cost can be reduced due to process number less.Craft of gilding is applicable to vehicle-mounted, and industry control class etc. has the high-end product of strict quality requirement.The design of gold-plated cabling is the direct factor having influence on gold-plated result.
CN104281337A(2015-1-14) disclose a kind of capacitance plate edge cabling method for plating metal and capacitance plate, but the method does not proposes how that the ITO that can make gold-plated effective precipitation walks line design method.
Summary of the invention
It is an object of the invention to provide a kind of ITO optimizing chemical gilding precipitation that can make gold-plated effective precipitation and walk line design method.
The above-mentioned technical purpose of the present invention has the technical scheme that
A kind of ITO optimizing chemical gilding precipitation walks line design method; gold-plated part and the most gold-plated part is treated including ito glass; described treat that gold-plated part and the most gold-plated driving district are etched with cabling; the most gold-plated described driving district is coated with gold-plated protecting film, carries out gold-plated by chemical gilding technique to the cabling of every block of touch-control glass afterwards；It arranges independent gold-plated process induction part in the gold-plated proximate region being not easy to separate out and the non-trace portions that is positioned on described ito glass；The described gold-plated place being not easy to separate out is the region that gold-plated processing area is little；Described independent gold-plated process induction part is the independent ITO pattern being arranged on described ito glass.
Gold-plated precipitation of the present invention refers to not plate gold, gold-plated be not easy precipitation and refer to be not easy plated with gold.
Inventor, through long-term research and development test, finds that capacitive touch screen is gold-plated in gold plating process, there is following Rule Summary:
①
The gold-plated easy precipitation in place that cabling is intensive；
②
Gold-plated being not easy in place that cabling is the most intensive separates out；
③
The gold-plated easy precipitation of cabling that live width is big；
④
Gold-plated being not easy of cabling that live width is little separates out；
⑤
Region area if carried out gold-plated process is big, gold-plated easy precipitation；
⑥
Region area if carried out gold-plated process is little, and gold-plated being not easy separates out；
⑦
As exception 6., even if the area carrying out gold-plated processing region is little, if near there is the gold-plated processing region of larger area, will the gold-plated precipitation in induction small surfaces territory.
Inventor, through long-term research and development test, finds in addition to area ratio, and factors above also results in gold-plated precipitation, and this technology is a solution for such situation.Independent gold-plated induction part is set in the gold-plated proximate region being not easy to separate out, it will guide the gold-plated easier precipitation of ITO of little area.
As preferably, the region that described gold-plated processing area is little is the place that gold-plated cabling is connected with non-gold-plated drive area, the local near zone being connected with non-gold-plated drive area at gold-plated cabling and the non-trace portions being positioned on described ito glass arrange independent gold-plated induction part, in order to promote gold-plated precipitation.
It is highly preferred that the described independent ITO pattern that gold-plated induction part is independent chinampa structure.
As preferably, the region that described gold-plated processing area is little is the region that cabling is the most intensive, arranges independent gold-plated induction part, in order to promote gold-plated precipitation at the most intensive areas adjacent of cabling and the non-trace portions that is positioned on described ito glass.
It is highly preferred that the described independent ITO pattern that gold-plated induction part is independent chinampa structure.
As preferably, the region that described gold-plated processing area is little is the routing region that live width is little, discarded non-usage position arranges after glass-cutting independent gold-plated induction part, in order to promote gold-plated precipitation, after gold-plated precipitation, excises and discard non-usage position.
It is highly preferred that the described independent ITO pattern that gold-plated induction part is independent chinampa structure.
As preferably, the region that described gold-plated processing area is little is the region that cabling is the most intensive, widens GND earth lead in the region that cabling is the most intensive, in order to promote gold-plated precipitation.
As preferably, the region that described gold-plated processing area is little is the routing region that live width is little, and use position discarded after glass-cutting and the non-trace portions being positioned on described ito glass arrange independent gold-plated induction part, in order to promote gold-plated precipitation.
It is highly preferred that the described independent ITO pattern that gold-plated induction part is independent chinampa structure.
As preferably, the region that described gold-plated processing area is little is the routing region that live width is little, widens GND earth lead in the routing region that live width is little, in order to promote gold-plated precipitation.
The method using the present invention is unsatisfactory in original method for designing making the cabling gross area little as far as possible or makes gold-plated ito surface amass big principle as far as possible, it it is a kind of new method for designing, do not change existing gold-plated area, by arranging independent gold-plated process induction part in the gold-plated proximate region being not easy to separate out, make gold-plated easier precipitation, and gold plating thickness is evenly, capacitive touch screen product stability and transmission signal capabilities are more preferable.
Accompanying drawing explanation
Fig. 1 is the structural representation of the gold-plated easy precipitation part of ito glass;
Fig. 2 is the gold-plated structural representation being not easy precipitation part of ito glass of the present invention;
Fig. 3 is the structural representation of the gold-plated cabling of ito glass and non-gold-plated cabling coupling part；
Fig. 4 is that the gold-plated cabling of the present invention is connected near local area the structural representation arranging independent gold-plated induction part with non-gold-plated cabling；
Fig. 5 is the local structural representation that ito glass cabling is the most intensive；
Fig. 6 is that the present invention widens the structural representation of GND line at the most intensive local areas adjacent of cabling；
Fig. 7 is that the present invention arranges the structural representation of independent gold-plated induction part at the most intensive local areas adjacent of cabling；
Fig. 8 is the local structural representation that ito glass routing line width is little；
Fig. 9 is the structural representation that discarded non-usage position is arranged independent gold-plated induction part after glass-cutting by the present invention；
Figure 10 is the structural representation using position to arrange independent gold-plated induction part that the present invention is not discarded after glass-cutting；
Figure 11 is the structural representation that the present invention widens GND line near the local area that routing line width is little；
Figure 12 is ito glass independent cabling schematic diagram；
Figure 13 is ito glass majority cabling schematic diagram；
Figure 14 is to arrange large-area ITO pattern schematic diagram near the independent cabling of ito glass of the present invention；
Figure 15 is the ITO pattern schematic diagram using position to arrange independent chinampa structure that the present invention is not discarded after glass-cutting；
Figure 16 is the ITO pattern schematic diagram that the local near zone being connected with non-gold-plated drive area at gold-plated cabling arranges independent chinampa structure.
Detailed description of the invention
Below in conjunction with Fig. 1-Figure 16, the present invention is described in further detail.
Optimize that the ITO that chemical gilding separates out walks that line design method includes ito glass treats gold-plated part and the most gold-plated part; treat to be etched with cabling in gold-plated part and the most gold-plated driving district; the most gold-plated driving district is coated with gold-plated protecting film, carries out gold-plated by chemical gilding technique to the cabling of every block of touch-control glass afterwards；It arranges independent gold-plated process induction part in the gold-plated proximate region being not easy to separate out；The region that the gold-plated gold-plated processing area in place being not easy to separate out is little；Independent gold-plated process induction part is independent ITO pattern.
Inventor, through long-term research and development test, finds that capacitive touch screen is gold-plated in gold plating process, there is following Rule Summary:
①
The gold-plated easy precipitation in place that cabling is intensive, such as the B position in Fig. 1；
②
Gold-plated being not easy in place that cabling is the most intensive separates out, such as the D position in Fig. 2；
③
The gold-plated easy precipitation of cabling that live width is big, such as the aminoacyl site in Fig. 1；
④
Gold-plated being not easy of cabling that live width is little separates out, such as the E position in Fig. 2；
⑤
Region area if carried out gold-plated process is big, gold-plated easy precipitation；
⑥
Region area if carried out gold-plated process is little, and gold-plated being not easy separates out；
⑦
As exception 6., even if the area carrying out gold-plated processing region is little, if near there is the gold-plated processing region of larger area, will the gold-plated precipitation in induction small surfaces territory.
Such as gold-plated being not easy of independent cabling 1 in Figure 12 separates out；
But when there is large-area ITO pattern near the independent cabling 1 of Figure 13 majority cabling 1 or Figure 14, gold-plated easier precipitation.
Embodiment one
The region that gold-plated processing area is little is the place that gold-plated cabling is connected with non-gold-plated drive area, the most such as the C position in Fig. 2 or the C position in Fig. 3；C* position in local near zone such as Fig. 4 that gold-plated cabling is connected with non-gold-plated drive area arranges independent gold-plated induction part, in order to promote gold-plated precipitation.
Independent gold-plated induction part can be the ITO pattern of independent chinampa structure.The ITO pattern 2 of the chinampa structure such as added in Figure 16.
Embodiment two
The region that gold-plated processing area is little is the D position in the region that cabling is the most intensive, the most such as Fig. 5；Inventor D* position in the concrete such as Fig. 7 of the areas adjacent that cabling is the most intensive arranges independent gold-plated induction part, in order to promote gold-plated precipitation.Independent gold-plated induction part can be the ITO pattern of independent chinampa structure.
Embodiment three
The region that gold-plated processing area is little is the region that cabling is the most intensive, and inventor widens GND earth lead in the region that cabling is the most intensive, such as, widen GND line according to the D* position in Fig. 6, in order to promote gold-plated precipitation.
Embodiment four
The region that gold-plated processing area is little is the routing region that live width is little, such as E position in Fig. 2 or the E position in Fig. 8, E* position in discarded non-usage position such as Fig. 9 is arranged independent gold-plated induction part after glass-cutting by inventor, in order to promote gold-plated precipitation.
Independent gold-plated induction part can be the ITO pattern of independent chinampa structure.
Embodiment five
The region that gold-plated processing area is little is the E position in routing region such as Fig. 2 that live width is little or the E position in Fig. 8, and the E* position in use position such as Figure 10 that inventor is not discarded after glass-cutting arranges independent gold-plated induction part, in order to promote gold-plated precipitation.
Independent gold-plated induction part can be the ITO pattern of independent chinampa structure, such as the ITO pattern 2 of the chinampa structure added in Figure 15.
Embodiment six
The region that gold-plated processing area is little is the E position in routing region such as Fig. 2 that live width is little or the E position in Fig. 8, and inventor widens GND earth lead, such as, widens GND line according to the E* position in Figure 11 in the routing region that live width is little, in order to promote gold-plated precipitation.
This specific embodiment is only explanation of the invention; it is not limitation of the present invention; the present embodiment can be made after reading this specification by those skilled in the art as required does not has the amendment of creative contribution, but as long as all being protected by Patent Law in scope of the presently claimed invention.
Claims (6)
1. the ITO optimizing chemical gilding precipitation walks line design method; gold-plated part and the most gold-plated part is treated including ito glass; described treat that gold-plated part and the most gold-plated driving district are etched with cabling; the most gold-plated described driving district is coated with gold-plated protecting film, carries out gold-plated by chemical gilding technique to the cabling of every block of touch-control glass afterwards；It is characterized in that: independent gold-plated process induction part is set in the gold-plated proximate region being not easy to separate out and the non-trace portions that is positioned on described ito glass；The described gold-plated place being not easy to separate out is the region that gold-plated processing area is little；Described independent gold-plated process induction part is the independent ITO pattern being arranged on described ito glass.
A kind of ITO optimizing chemical gilding precipitation the most according to claim 1 walks line design method, it is characterized in that: the region that described gold-plated processing area is little is the place that gold-plated cabling is connected with non-gold-plated drive area, the local near zone being connected with non-gold-plated drive area at gold-plated cabling and the non-trace portions being positioned on described ito glass arrange independent gold-plated induction part, in order to promote gold-plated precipitation.
A kind of ITO optimizing chemical gilding precipitation the most according to claim 1 walks line design method, it is characterized in that: the region that described gold-plated processing area is little is the region that cabling is the most intensive, near the most intensive region of cabling and the non-trace portions that is positioned on described ito glass, independent gold-plated induction part is set, in order to promote gold-plated precipitation.
A kind of ITO optimizing chemical gilding precipitation the most according to claim 1 walks line design method, it is characterized in that: the region that described gold-plated processing area is little is the routing region that live width is little, after glass-cutting, discarded non-usage position is arranged independent gold-plated induction part, in order to promote gold-plated precipitation, after gold-plated precipitation, excise and discard non-usage position.
A kind of ITO optimizing chemical gilding precipitation the most according to claim 1 walks line design method, it is characterized in that: the region that described gold-plated processing area is little is the routing region that live width is little, use position discarded after glass-cutting and the non-trace portions being positioned on described ito glass arrange independent gold-plated induction part, in order to promote gold-plated precipitation.
6. walk line design method according to a kind of ITO optimizing chemical gilding precipitation described in any one of claim 1-5, it is characterised in that: the described independent ITO pattern that gold-plated induction part is independent chinampa structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510386929.7A CN106325629B (en) | 2015-07-06 | 2015-07-06 | ITO wiring design method for optimizing electroless gold plating precipitation |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510386929.7A CN106325629B (en) | 2015-07-06 | 2015-07-06 | ITO wiring design method for optimizing electroless gold plating precipitation |
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| Publication Number | Publication Date |
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| CN106325629A true CN106325629A (en) | 2017-01-11 |
| CN106325629B CN106325629B (en) | 2024-01-02 |
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| CN201510386929.7A Active CN106325629B (en) | 2015-07-06 | 2015-07-06 | ITO wiring design method for optimizing electroless gold plating precipitation |
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| CN104281337A (en) * | 2013-07-03 | 2015-01-14 | 向火平 | Capacitive screen edge cabling metallic coating method and capacitive screen |
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2015
- 2015-07-06 CN CN201510386929.7A patent/CN106325629B/en active Active
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|---|---|---|---|---|
| JPH10229280A (en) * | 1997-02-17 | 1998-08-25 | Okuno Chem Ind Co Ltd | Manufacture of printed wiring board |
| JP2000096283A (en) * | 1998-09-24 | 2000-04-04 | Sumitomo Metal Ind Ltd | Composite metallic net foil, its production and device |
| JP2000178752A (en) * | 1998-12-15 | 2000-06-27 | Okuno Chem Ind Co Ltd | Palladium catalyst removing agent for electroless plating |
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