CN106298619A - 一种硅片放置固定机构 - Google Patents
一种硅片放置固定机构 Download PDFInfo
- Publication number
- CN106298619A CN106298619A CN201610709923.3A CN201610709923A CN106298619A CN 106298619 A CN106298619 A CN 106298619A CN 201610709923 A CN201610709923 A CN 201610709923A CN 106298619 A CN106298619 A CN 106298619A
- Authority
- CN
- China
- Prior art keywords
- translation
- sleeve
- silicon chip
- sides
- fixed mechanism
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 53
- 239000010703 silicon Substances 0.000 title claims abstract description 53
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 52
- 230000001105 regulatory effect Effects 0.000 claims abstract description 24
- 230000006835 compression Effects 0.000 claims description 11
- 238000007906 compression Methods 0.000 claims description 11
- 239000011230 binding agent Substances 0.000 claims description 3
- 208000031481 Pathologic Constriction Diseases 0.000 claims 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims 1
- 239000007787 solid Substances 0.000 claims 1
- 210000001215 vagina Anatomy 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 10
- 238000000034 method Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 235000008216 herbs Nutrition 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 210000002268 wool Anatomy 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1804—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic Table
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1876—Particular processes or apparatus for batch treatment of the devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/547—Monocrystalline silicon PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Weting (AREA)
- Silicon Compounds (AREA)
- Photovoltaic Devices (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Abstract
Description
Claims (3)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810912493.4A CN109087972B (zh) | 2016-08-24 | 2016-08-24 | 一种晶体硅太阳电池生产用硅片放置固定机构的工作方法 |
CN201810912484.5A CN109037400A (zh) | 2016-08-24 | 2016-08-24 | 一种晶体硅太阳电池生产用硅片放置固定机构 |
CN201610709923.3A CN106298619B (zh) | 2016-08-24 | 2016-08-24 | 一种硅片放置固定机构 |
CN201811028022.3A CN109390269A (zh) | 2016-08-24 | 2016-08-24 | 一种提高加工效率的硅片放置固定机构 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610709923.3A CN106298619B (zh) | 2016-08-24 | 2016-08-24 | 一种硅片放置固定机构 |
Related Child Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201810912484.5A Division CN109037400A (zh) | 2016-08-24 | 2016-08-24 | 一种晶体硅太阳电池生产用硅片放置固定机构 |
CN201810912493.4A Division CN109087972B (zh) | 2016-08-24 | 2016-08-24 | 一种晶体硅太阳电池生产用硅片放置固定机构的工作方法 |
CN201811028022.3A Division CN109390269A (zh) | 2016-08-24 | 2016-08-24 | 一种提高加工效率的硅片放置固定机构 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN106298619A true CN106298619A (zh) | 2017-01-04 |
CN106298619B CN106298619B (zh) | 2018-09-28 |
Family
ID=57614701
Family Applications (4)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201810912484.5A Pending CN109037400A (zh) | 2016-08-24 | 2016-08-24 | 一种晶体硅太阳电池生产用硅片放置固定机构 |
CN201810912493.4A Expired - Fee Related CN109087972B (zh) | 2016-08-24 | 2016-08-24 | 一种晶体硅太阳电池生产用硅片放置固定机构的工作方法 |
CN201610709923.3A Active CN106298619B (zh) | 2016-08-24 | 2016-08-24 | 一种硅片放置固定机构 |
CN201811028022.3A Withdrawn CN109390269A (zh) | 2016-08-24 | 2016-08-24 | 一种提高加工效率的硅片放置固定机构 |
Family Applications Before (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201810912484.5A Pending CN109037400A (zh) | 2016-08-24 | 2016-08-24 | 一种晶体硅太阳电池生产用硅片放置固定机构 |
CN201810912493.4A Expired - Fee Related CN109087972B (zh) | 2016-08-24 | 2016-08-24 | 一种晶体硅太阳电池生产用硅片放置固定机构的工作方法 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201811028022.3A Withdrawn CN109390269A (zh) | 2016-08-24 | 2016-08-24 | 一种提高加工效率的硅片放置固定机构 |
Country Status (1)
Country | Link |
---|---|
CN (4) | CN109037400A (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108538770A (zh) * | 2018-03-12 | 2018-09-14 | 金华美诺机电有限公司 | 一种环保电力组件敷设机 |
CN109559970A (zh) * | 2019-01-21 | 2019-04-02 | 苏州赛森电子科技有限公司 | 一种射频等离子刻蚀用硅片固定装置及方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102368897A (zh) * | 2011-09-30 | 2012-03-07 | 东莞市新泽谷机械有限公司 | 插件机用长板工作台 |
CN102730469A (zh) * | 2012-07-16 | 2012-10-17 | 建科机械(天津)股份有限公司 | 焊接网片的无极调整对齐装置 |
CN104291135A (zh) * | 2014-09-15 | 2015-01-21 | 南通凯迪自动机械有限公司 | 多尺寸基材自动校正平台 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20030015851A1 (en) * | 2001-07-18 | 2003-01-23 | Hahn Richard D.W. | Combination toolbox, workbench, dispensing crib and stool |
NZ531574A (en) * | 2004-03-08 | 2004-06-25 | Ross Patrick Mathews | table with platforms projecting from at least three sides, each being adjustable longitudinally and vertically |
CN2838851Y (zh) * | 2005-08-19 | 2006-11-22 | 北京英讯通光电科技有限公司 | 倒角机 |
KR200431057Y1 (ko) * | 2006-08-30 | 2006-11-14 | 경신공업 주식회사 | 길이 가변형 작업대 |
CN201304641Y (zh) * | 2008-11-13 | 2009-09-09 | 青岛地恩地机电科技股份有限公司 | 一种便携式支架 |
CN202591957U (zh) * | 2012-04-28 | 2012-12-12 | 桂林电子科技大学 | 电磁启动器底板在适合高度可旋转可水平固定的组件组装装置 |
CN202583640U (zh) * | 2012-05-25 | 2012-12-05 | 深圳Tcl新技术有限公司 | 背光模组测试治具 |
TWI444267B (zh) * | 2012-12-25 | 2014-07-11 | Rexon Ind Corp Ltd | 可調整長度的工作台 |
CN203821076U (zh) * | 2014-03-10 | 2014-09-10 | 江苏大岛机械集团有限公司 | 一种多功能幅式绗绣机的压布装置 |
CN203804940U (zh) * | 2014-04-21 | 2014-09-03 | 王秀兰 | 多功能工装底座 |
CN204264993U (zh) * | 2014-11-27 | 2015-04-15 | 浙江尚源实业有限公司 | 一种硅片加工平移装置 |
CN204384441U (zh) * | 2015-01-07 | 2015-06-10 | 浙江尚源实业有限公司 | 一种硅片加工上料装置 |
CN205057979U (zh) * | 2015-09-28 | 2016-03-02 | 魏俊杰 | 一种圆管加工调节机构 |
CN205466797U (zh) * | 2016-03-15 | 2016-08-17 | 嘉兴能发电子科技有限公司 | 一种设置可调节料长结构的硅片切割设备 |
CN105619351B (zh) * | 2016-04-12 | 2019-02-12 | 藤县正钻门业有限公司 | 一种门框用伸缩工作台 |
CN105731054B (zh) * | 2016-04-30 | 2018-05-15 | 何华琼 | 一种钢管放置下料机构 |
CN106217328A (zh) * | 2016-08-24 | 2016-12-14 | 屠明州 | 一种板材加工翻转机构 |
-
2016
- 2016-08-24 CN CN201810912484.5A patent/CN109037400A/zh active Pending
- 2016-08-24 CN CN201810912493.4A patent/CN109087972B/zh not_active Expired - Fee Related
- 2016-08-24 CN CN201610709923.3A patent/CN106298619B/zh active Active
- 2016-08-24 CN CN201811028022.3A patent/CN109390269A/zh not_active Withdrawn
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102368897A (zh) * | 2011-09-30 | 2012-03-07 | 东莞市新泽谷机械有限公司 | 插件机用长板工作台 |
CN102730469A (zh) * | 2012-07-16 | 2012-10-17 | 建科机械(天津)股份有限公司 | 焊接网片的无极调整对齐装置 |
CN104291135A (zh) * | 2014-09-15 | 2015-01-21 | 南通凯迪自动机械有限公司 | 多尺寸基材自动校正平台 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108538770A (zh) * | 2018-03-12 | 2018-09-14 | 金华美诺机电有限公司 | 一种环保电力组件敷设机 |
CN109559970A (zh) * | 2019-01-21 | 2019-04-02 | 苏州赛森电子科技有限公司 | 一种射频等离子刻蚀用硅片固定装置及方法 |
Also Published As
Publication number | Publication date |
---|---|
CN109390269A (zh) | 2019-02-26 |
CN109037400A (zh) | 2018-12-18 |
CN109087972A (zh) | 2018-12-25 |
CN109087972B (zh) | 2020-03-17 |
CN106298619B (zh) | 2018-09-28 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN207751190U (zh) | 一种自动调节倾角的太阳能支架 | |
CN208369519U (zh) | 一种防风光伏组件*** | |
CN106298619A (zh) | 一种硅片放置固定机构 | |
CN107484376A (zh) | 一种密封效果好的防爆电气控制柜 | |
CN207339752U (zh) | 一种光伏供电多级生物膜污水处理光伏板安装支架 | |
CN206533324U (zh) | 一种太阳能电池板角度自动调节装置 | |
CN206212440U (zh) | 一种铝基板热压成型装置 | |
CN208986034U (zh) | 一种适用于新能源发电的蓄电池稳固装置 | |
CN112600493A (zh) | 太阳能光伏电板支架 | |
CN206947103U (zh) | 一种可稳定放置的变压器 | |
CN208046504U (zh) | 一种光伏组件的安装结构 | |
CN205888653U (zh) | 一种圆管放置固定机构 | |
CN207052705U (zh) | 一种夹爪模组 | |
CN205890112U (zh) | 一种太阳能电池背板生产装置的降温装置 | |
CN104006634A (zh) | 蒸汽直压式单板物料干燥装置 | |
CN106206398A (zh) | 一种硅片平移放置机构 | |
CN205751778U (zh) | 一种可拆卸式变压器油箱外壳 | |
CN207428267U (zh) | 一种便携式太阳能杀虫灯 | |
CN205874581U (zh) | 一种籽晶培养装置 | |
CN207200625U (zh) | 一种便于拆卸的光伏发电设备 | |
CN205911941U (zh) | 一种新型的使用热管散热器散热的压接式igbt两电平功率单元 | |
CN205584084U (zh) | 光伏组件安装处理*** | |
CN209495484U (zh) | 一种太阳能热水器用固定装置 | |
CN206686118U (zh) | 一种光伏组件压码结构 | |
CN206983455U (zh) | 一种高效率双玻组件预热式层压机 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20180824 Address after: 325600 111 Bole East Road, Yueqing, Zhejiang Applicant after: Wang Yongchao Address before: 314500 7 East Village, safety village, Shimen Town, Tongxiang City, Jiaxing, Zhejiang Applicant before: Tu Mingzhou |
|
TA01 | Transfer of patent application right | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20190620 Address after: 226000 West Group 8 of Sun Liqiao Village, Xingdong Town, Tongzhou District, Nantong City, Jiangsu Province Patentee after: Nantong Hualong microelectronics Limited by Share Ltd Address before: 325600 111 Bole East Road, Yueqing, Zhejiang Patentee before: Wang Yongchao |
|
TR01 | Transfer of patent right |