CN106281099A - A kind of preparation technology of LED conducting resinl - Google Patents
A kind of preparation technology of LED conducting resinl Download PDFInfo
- Publication number
- CN106281099A CN106281099A CN201610654945.4A CN201610654945A CN106281099A CN 106281099 A CN106281099 A CN 106281099A CN 201610654945 A CN201610654945 A CN 201610654945A CN 106281099 A CN106281099 A CN 106281099A
- Authority
- CN
- China
- Prior art keywords
- conducting resinl
- preparation
- parts
- alloyed powder
- powder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Conductive Materials (AREA)
- Epoxy Resins (AREA)
Abstract
The present invention relates to the preparation technology of a kind of LED conducting resinl, preparation process is as follows: the 1) preparation of alloyed powder, weighs nanometer silver powder, aluminium sesquioxide, nano zine oxide, copper powder, MTES, acetone；By each raw material by proportioning at 1500 DEG C～1650 DEG C, less than 10‑3The vacuum of torr is smelted into homogeneous alloy solution, and the gas low by activity prepares alloyed powder with the pressure peening of 20～30atm with moment atomization；2) preparation of conducting resinl, based on weight/mass percentage composition, by epoxy resin, chlorinated polypropylene, epoxy acrylic resin, organic binder, firming agent, stirs, is slowly added to alloyed powder, stir, froth in vacuum, prepares described LED conducting resinl.The technological merit of the present invention is: the alloyed powder in conducting resinl formula of the present invention has preferable dispersion stabilization, and prepared conducting resinl resistivity is low, thermal conductivity is high, adhesive property is good, service life is long.
Description
Technical field
The invention belongs to technical field of electronic materials, be specifically related to the preparation technology of a kind of LED conducting resinl.
Background technology
LED conducting resinl, is the connection for LED chip and base material, it is possible to realize the function of heat conduction and conduction simultaneously.Lead
Electric adhesive is also referred to as conducting resinl, is the solidification at a certain temperature being made up of matrix resin, firming agent and conductive filler or dry
After dry can adhesive base plate material effectively, can have again the special adhesive of electric conductivity.Conducting resinl can be divided by matrix composition
For structural type and the big class of filled-type two.Structural type refers to that the macromolecular material as conducting resinl matrix itself i.e. has electric conductivity
Conducting resinl；Filled-type refer to usual adhesive as matrix, and rely on interpolation electroconductive stuffing make glue have electric action
Conducting resinl.The preparation of conducting polymer composite at present also has bigger distance from reality application, and the most widely used being is filled out
Fill type conducting resinl.As epoxy resin adhesive can solidify in room temperature to 150 DEG C, far below more than 200 DEG C of tin-lead welding
Welding temperature, avoiding problems material deformation, the hot injury of electronic device and the formation of internal stress that welding high temperature may cause.
Simultaneously as the developing rapidly of the densification of the miniaturization of electronic component, miniaturization and printed circuit board (PCB) and Highgrade integration,
The minimum pitch of the 0.65mm of slicker solder welding can not meet far away the actual demand being conductively connected, and conducting resinl can make slurry
Material, it is achieved the highest linear resolution.
The developing direction of LED industry is to develop towards the high-power direction of high brightness, super brightness, thus proposes conducting resinl
Higher requirement, the great power LED thermal diffusivity to conducting resinl, traditional heat-conducting glue thermal conductivity is less than 10W/m K, and highlighted
The cooling requirements of degree high-power LED chip is higher than 20W/m K；Develop suitable curing system, make the conducting resinl can be the longest
Time stores, it is to avoid high cost of transportation and storage cost；The stability of contact resistance and the reliability of electric property.Cause
How this, develop the LED conducting resinl that resistivity is low, thermal conductivity is high, adhesive property is good the most urgent.
Summary of the invention
It is an object of the invention to provide the preparation technology of a kind of LED conducting resinl, effectively solve high-power LED chip long
Thermal diffusivity problem after phase work.
The technical scheme realizing the purpose of the present invention is: the preparation technology of a kind of LED conducting resinl, and preparation process is as follows:
1) preparation of alloyed powder
Weigh nanometer silver powder 80～100 parts, aluminium sesquioxide 8～15 parts, zinc oxide 20～30 parts, copper powder 40～50 parts,
MTES 10～15 parts, acetone 6～10 parts；By each raw material by proportioning at 1500 DEG C～1650 DEG C, less than 10- 3The vacuum of torr is smelted into homogeneous alloy solution, and the gas low by activity is atomized with moment with the pressure peening of 20～30atm
And prepare alloyed powder；
2) preparation of conducting resinl
Based on weight/mass percentage composition, by epoxy resin 10%～15%, chlorinated polypropylene 2%～5%, epoxy acrylic tree
Fat 4%～6%, organic binder 0.3%～0.7%, firming agent 3%～8%, stir, be slowly added to step 1) gained
The alloyed powder 65%～75% arrived, stirs, froth in vacuum, prepares described LED conducting resinl.
Preferably, firming agent of the present invention is THPA, methyl tetrahydro phthalic anhydride, HHPA, methyl hexahydrobenzene
One or more in acid anhydride, methylnadic anhydride, dodecyl maleic anhydride.
Preferably, organic binder of the present invention is polyvinyl butyral resin, ethyl cellulose, diethylene glycol
One or more in monobutyl ether, diethylene glycol monobutyl ether acetate.
Preferably, step 1 of the present invention) gas that the activity that uses is low is selected from argon or nitrogen.
The technological merit of the present invention is: the alloyed powder in conducting resinl formula of the present invention has preferable dispersion stabilization,
The conducting resinl resistivity prepared is low, thermal conductivity is high, adhesive property is good, service life is long.
Detailed description of the invention
Below in conjunction with embodiment, the present invention will be further described.
A kind of preparation technology of LED conducting resinl, preparation process is as follows:
Embodiment 1:
1) preparation of alloyed powder
Weigh nanometer silver powder 80 parts, aluminium sesquioxide 8 parts, zinc oxide 20 parts, copper powder 40 parts, MTES 10
Part, 6 parts of acetone；By each raw material by proportioning at 1500 DEG C～1650 DEG C, less than 10-3It is molten that the vacuum of torr is smelted into homogeneous alloy
Liquid, the gas low by activity prepares alloyed powder with the pressure peening of 20～30atm with moment atomization；
2) preparation of conducting resinl
Based on weight/mass percentage composition, by epoxy resin 10%, chlorinated polypropylene 2%, epoxy acrylic resin 4%, organic
Adhesive 0.3%, firming agent 3%, stir, be slowly added to step 1) obtained by alloyed powder 65%, stir, vacuum
De-bubble, prepares described LED conducting resinl.
Embodiment 2
1) preparation of alloyed powder
Weigh nanometer silver powder 100 parts, aluminium sesquioxide 15 parts, zinc oxide 30 parts, copper powder 50 parts, MTES
15 parts, 10 parts of acetone；By each raw material by proportioning at 1500 DEG C～1650 DEG C, less than 10-3The vacuum of torr is smelted into homogenizing and closes
Gold solution, the gas low by activity prepares alloyed powder with the pressure peening of 20～30atm with moment atomization；
2) preparation of conducting resinl
Based on weight/mass percentage composition, by epoxy resin 15%, chlorinated polypropylene 5%, epoxy acrylic resin 6%, organic
Adhesive 0.7%, firming agent 8%, stir, be slowly added to step 1) obtained by alloyed powder 75%, stir, vacuum
De-bubble, prepares described LED conducting resinl.
In above-described embodiment 1～2, selected firming agent is THPA, methyl tetrahydro phthalic anhydride, HHPA, methyl six
One or more in hydrogen phthalic anhydride, methylnadic anhydride, dodecyl maleic anhydride.Selected organic binder is poly-
One or many in vinyl butyral resin, ethyl cellulose, diethylene glycol monobutyl ether, diethylene glycol monobutyl ether acetate
Kind.The gas that selected activity is low is selected from argon or nitrogen.
Conducting resinl obtained by embodiment 1～2 is carried out the test of performance, specific insulation about 10-5～10-4Ω cm,
Heat conductivity about 24.0W/m K, viscosity about 48000mPa.s.
Meanwhile, carrying out the test of viscosity after the conducting resinl room temperature obtained by embodiment 1～2 being placed 2 months, viscosity is about
48100mPa.s, it can be seen that prepared conducting resinl has good viscosity stability.
Above-mentioned each embodiment is further illustrating of making of the foregoing to the present invention, but should not be construed as the present invention
The scope of above-mentioned theme is only limitted to above-described embodiment.It should be pointed out that, for those skilled in the art, not
On the premise of departing from the technology of the present invention principle, it is also possible to make some improvements and modifications, these improvements and modifications also should be regarded as this
The protection domain of invention.
Claims (4)
1. the preparation technology of a LED conducting resinl, it is characterised in that preparation process is as follows:
1) preparation of alloyed powder
Weigh nanometer silver powder 80～100 parts, aluminium sesquioxide 8～15 parts, zinc oxide 20～30 parts, copper powder 40～50 parts, methyl
Triethoxysilane 10～15 parts, acetone 6～10 parts；By each raw material by proportioning at 1500 DEG C～1650 DEG C, less than 10-3Torr's
Vacuum is smelted into homogeneous alloy solution, and the gas low by activity prepares with moment atomization with the pressure peening of 20～30atm
Alloyed powder；
2) preparation of conducting resinl
Based on weight/mass percentage composition, by epoxy resin 10%～15%, chlorinated polypropylene 2%～5%, epoxy acrylic resin
4%～6%, organic binder 0.3%～0.7%, firming agent 3%～8%, stir, be slowly added to step 1) obtained by
Alloyed powder 65%～75%, stir, froth in vacuum, prepare described LED conducting resinl.
The preparation technology of one or more LED conducting resinls the most according to claim 1, it is characterised in that: step 2) in
Described firming agent be THPA, methyl tetrahydro phthalic anhydride, HHPA, methyl hexahydrophthalic anhydride, methylnadic anhydride, 12
One or more in alkyl maleate acid anhydride.
The preparation technology of one or more LED conducting resinls the most according to claim 1, it is characterised in that: step 2) in
Described organic binder is polyvinyl butyral resin, ethyl cellulose, diethylene glycol monobutyl ether, diethylene glycol monobutyl ether
One or more in acetate.
The preparation technology of one or more LED conducting resinls the most according to claim 1, it is characterised in that: described step
Rapid 1) gas that the activity that uses is low is selected from argon or nitrogen.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610654945.4A CN106281099A (en) | 2016-08-11 | 2016-08-11 | A kind of preparation technology of LED conducting resinl |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610654945.4A CN106281099A (en) | 2016-08-11 | 2016-08-11 | A kind of preparation technology of LED conducting resinl |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106281099A true CN106281099A (en) | 2017-01-04 |
Family
ID=57669738
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610654945.4A Pending CN106281099A (en) | 2016-08-11 | 2016-08-11 | A kind of preparation technology of LED conducting resinl |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106281099A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102646458A (en) * | 2011-02-16 | 2012-08-22 | 中国钢铁股份有限公司 | Lead-free conducting resin and manufacture method thereof |
| CN103740309A (en) * | 2013-12-10 | 2014-04-23 | 江苏瑞德新能源科技有限公司 | Repairable conductive adhesive and preparation method thereof |
| CN105419672A (en) * | 2015-12-24 | 2016-03-23 | 常熟昊虞电子信息科技有限公司 | Preparation method of high-heat-dissipation electric-conductive glue used for high-power LED |
-
2016
- 2016-08-11 CN CN201610654945.4A patent/CN106281099A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102646458A (en) * | 2011-02-16 | 2012-08-22 | 中国钢铁股份有限公司 | Lead-free conducting resin and manufacture method thereof |
| CN103740309A (en) * | 2013-12-10 | 2014-04-23 | 江苏瑞德新能源科技有限公司 | Repairable conductive adhesive and preparation method thereof |
| CN105419672A (en) * | 2015-12-24 | 2016-03-23 | 常熟昊虞电子信息科技有限公司 | Preparation method of high-heat-dissipation electric-conductive glue used for high-power LED |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4389148B2 (en) | Conductive paste | |
| CN104046315B (en) | UV-light dual cure conductive adhesive and preparation method thereof | |
| JP4235887B2 (en) | Conductive paste | |
| CN102086364A (en) | Conductive silver paste for microelectronic packaging and preparation method thereof | |
| CN109135611A (en) | One kind is i.e. with low temperature curing type liquid metal conducting resinl in using and preparation method thereof | |
| CN107207935A (en) | Thermal conductivity conductive adhesive composition | |
| CN104178076A (en) | Heat-conducting electric-insulating epoxy resin potting adhesive and preparation method thereof | |
| CN103409083B (en) | Graphite carbon black conductive adhesive and preparation method thereof | |
| CN102002336A (en) | Solvent-free high-performance conductive adhesive | |
| CN102093665B (en) | Heat conduction insulating casting glue and preparation method thereof | |
| JP4235888B2 (en) | Conductive paste | |
| CN108795354A (en) | A kind of heat conduction modified epoxide resin adhesive and preparation method | |
| CN105419672A (en) | Preparation method of high-heat-dissipation electric-conductive glue used for high-power LED | |
| CN104479606A (en) | High-temperature-resistant high-thermal-conductivity boron-dopedorganosilicon epoxy pouring sealant as well as preparation method and application thereof | |
| CN105131881A (en) | Conductive silver adhesive with low solid content and capable of being rapidly cured at medium and normal temperature | |
| CN107236485A (en) | A kind of dendritic heat curing-type pastes conducting resinl and preparation method thereof | |
| CN106190008A (en) | A kind of preparation technology of LED high heat conductance conducting resinl | |
| CN104341774A (en) | Molding composition for semiconductor package and semiconductor package using same | |
| CN105860898A (en) | Lead-free electroconductive adhesive and preparation process thereof | |
| CN109887639A (en) | A kind of solderable low temperature curing type function silver paste and preparation method thereof | |
| CN109337624A (en) | Low-temperature setting wicker copper conducting resinl and preparation method thereof | |
| CN101735558A (en) | Glue solution for copper-clad plate | |
| CN106281203A (en) | A kind of preparation technology of LED high viscosity conducting resinl | |
| CN106189974A (en) | A kind of preparation technology of the good conducting resinl of LED caking property | |
| JP4273399B2 (en) | Conductive paste and method for producing the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20170104 |