CN106271118A - A kind of device and method improving multiple aperture micropore Laser Processing quality - Google Patents

A kind of device and method improving multiple aperture micropore Laser Processing quality Download PDF

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Publication number
CN106271118A
CN106271118A CN201610871249.9A CN201610871249A CN106271118A CN 106271118 A CN106271118 A CN 106271118A CN 201610871249 A CN201610871249 A CN 201610871249A CN 106271118 A CN106271118 A CN 106271118A
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CN
China
Prior art keywords
prism
laser
lens barrel
biprism
processing quality
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201610871249.9A
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Chinese (zh)
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CN106271118B (en
Inventor
周蕊
沈丹鸿
韩世华
蒋飞
胥加伟
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INNO MACHINING Co Ltd
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INNO MACHINING Co Ltd
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Priority to CN201610871249.9A priority Critical patent/CN106271118B/en
Publication of CN106271118A publication Critical patent/CN106271118A/en
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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/38Removing material by boring or cutting
    • B23K26/382Removing material by boring or cutting by boring
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0652Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising prisms
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/083Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

The invention discloses the device and method improving multiple aperture micropore Laser Processing quality, device includes: laser instrument;Beam expanding lens, after being located at laser instrument;Rotate biprism assembly, after being located at beam expanding lens, with the offset distance at regulation laser beam center;Focus lamp, after being located at rotation biprism assembly;Platform, towards the light emission side of focus lamp, is used for placing workpiece or driving workpiece to move;And computer, under control of the computer, rotate biprism assembly rotation regulation laser beam central role and be positioned at the radius of workpiece on platform, complete quick pass machining.The device and method of this raising multiple aperture micropore Laser Processing quality, use solid state laser, ensure crudy and precision, use biprism adjusting means simultaneously, reduce the cost of process equipment, and quickly regulating of different pore size capillary processing can be realized, further increase processing quality and efficiency, collocation X Y mobile platform can arrange machining path, meets diverse graphical process requirements.

Description

A kind of device and method improving multiple aperture micropore Laser Processing quality
Technical field
The present invention relates to laser process equipment technical field, particularly relate to a kind of multiple aperture micropore that improves and laser machine quality Device and method.
Background technology
In recent years, laser processing technology is widely used in the boring of multiple material, cutting technique, especially retrofit Field, laser works mechanism is that the high power density laser bundle of line focus irradiates material surface, makes irradiated material rapid Fusing or vaporization, form groove.During Drilling operation, behind light beam multiple scanning closed figure edge or filling figure, remove figure Middle material, thus realize the Laser Processing of workpiece through-hole and blind hole.
Mostly the boring of material in the market, cutting are that the mechanism using carbon dioxide laser or optical fiber laser is carried out Processing, the method cutting efficiency is high, relatively more effective for large-sized boring, cutting, but its zlasing mode is poor, focal beam spot Big feature, causes, when processing fine hole, the situation of pass weak effect and poor dimensional precision occur.The light beam of solid state laser Pattern is good, and focal beam spot is little, will be better than carbon dioxide laser and light in retrofit field, processing effect and dimensional accuracy Fibre laser, but solid state laser power is the highest causes cutting efficiency low.Existing laser process equipment, due to platform The restriction of translational speed, can cause laser energy to be accumulated, and not only forms bigger heat effect region, and for hard brittle material, holds Easily cause material breaks, it is impossible to processing.And the processing mode that only platform moves limits the process requirements of multiple apertures.
Summary of the invention
It is an object of the invention to provide a kind of device and method improving multiple aperture micropore Laser Processing quality, be used for solving The certainly technical problem of existing laser processing device cost high-quality difference.
For reaching above-mentioned purpose, technical scheme proposed by the invention is:
A kind of device improving multiple aperture micropore Laser Processing quality of the present invention, comprising:
One laser instrument, is used for launching laser;
One beam expanding lens, if after laser instrument, for expanding laser;
One rotates biprism assembly, after being located at beam expanding lens, with the offset distance at regulation laser beam center;
One focus lamp, after being located at rotation biprism assembly, for being focused light beam;
One platform, towards the light emission side of focus lamp, is used for placing workpiece or driving workpiece to move;And
One computer, controls laser instrument, expands device and platform, to arrange laser parameter and machined parameters;
Wherein, under the control of described computer, described rotation biprism assembly rotates regulation laser beam central role Being positioned at the radius of workpiece on platform, laser scanning completes quick pass machining.
Wherein, described laser instrument is solid state laser.
Wherein, the reflecting mirror in a change laser beam direction it is additionally provided with between described rotation biprism assembly and focus lamp.
Wherein, described platform is X-Y axle mobile platform, and on same workpiece during Continuous maching micropore, described X-Y axle moves Moving platform drives workpiece to move;When processing single hole, described X-Y axle mobile platform can arrange fine motion path.
Wherein, described rotation biprism assembly includes: biprism adjusting means, is located in described biprism adjusting means Two prisms, and drive the driving motor that described biprism adjusting means rotates.
Wherein, two described prisms are two prism wedges.
Wherein, described biprism adjusting means includes: for the prism lens barrel of fixed prism, is used for fixing another prism Prism regulation lens barrel, be connected by a connection piece between described prism lens barrel and prism regulation lens barrel;Wherein, described prism is adjusted The outer wall of joint lens barrel is set with at least one bearing, and the outer wall of described bearing supports described connector, described prism regulation lens barrel with It is additionally provided with a limit screw between connector, when rotary prism regulation lens barrel is to appropriate location, screws described limit screw, Gu Determine prism regulation lens barrel and connector.
Wherein, described bearing is needle bearing, and the number of described needle bearing is two, and two needle bearing parallel sleeves are loaded on On prism regulation lens barrel.
A kind of method improving material laser processing quality, it comprises the following steps:
The first step, is positioned over hard crisp workpiece to be processed on the platform of processing;
Second step, processes the relative position of the radius regulation biprism of micropore as required;
3rd step, arranges laser parameter and machined parameters, opens laser instrument, makes light beam process micropore on workpiece.
Wherein, described laser instrument is fixed laser, and described biprism includes relative to the adjusting means of position: for solid Determine the prism lens barrel of prism, for fixing the prism regulation lens barrel of another prism, described prism lens barrel and prism regulation lens barrel it Between connected by a connection piece;Wherein, the outer wall of described prism regulation lens barrel is set with at least one bearing, described bearing Outer wall supports described connector, is additionally provided with a limit screw between described prism regulation lens barrel and connector, when rotary prism is adjusted When joint lens barrel is to appropriate location, screw described limit screw, fixed prism regulation lens barrel and connector.
The device and method of raising multiple aperture micropore disclosed by the invention Laser Processing quality, it is compared to existing technologies Have the beneficial effects that, use the novel biprism adjusting means that can quickly regulate, improve Drilling operation efficiency, reduce micropore The cost of process equipment, reduces the heat affecting that rapidoprint produces, improves processing quality.And different pore size micropore can be realized The quick regulation of processing, collocation X-Y mobile platform can arrange different machining path, can meet diverse graphical demand.
Accompanying drawing explanation
Fig. 1 is the functional block diagram that the present invention improves the device of multiple aperture micropore Laser Processing quality.
Fig. 2 is the rotation biprism components section view that the present invention improves the device of multiple aperture micropore Laser Processing quality Figure.
Fig. 3 is the flow chart that the present invention improves the method for material laser processing quality.
Detailed description of the invention
Below with reference to accompanying drawing, the present invention is given elaboration further.
Refer to accompanying drawing 1 to accompanying drawing 2, in the present embodiment, the device of this raising multiple aperture micropore Laser Processing quality, its Including:
One laser instrument 11, is used for launching laser;
One beam expanding lens 12, if after laser instrument 11, for expanding laser;
One rotates biprism assembly 13, after being located at beam expanding lens, with the offset distance at regulation laser beam center;
One focus lamp 15, after being located at rotation biprism assembly 13, for being focused light beam;
One platform 16, towards the light emission side of focus lamp 15, is used for placing workpiece or driving workpiece to move;And
One computer 17, controls laser instrument 11, expands device 12 and platform 16, to arrange laser parameter and processing ginseng Number;
Wherein, under the control of described computer, control laser instrument 11 according to required laser parameter and launch laser, described rotation Turning biprism assembly 13 rotation regulation laser beam central role and be positioned at the radius of workpiece on platform, laser scanning completes workpiece The quick pass machining of 10.
In order to save equipment cost, in the present embodiment, described laser instrument 11 uses solid state laser.
Wherein, the reflection in a change laser beam direction it is additionally provided with between described rotation biprism assembly 13 and focus lamp 15 Mirror 14.
Wherein, described platform 16 is X-Y axle mobile platform, on same workpiece during Continuous maching micropore, and described X-Y axle Mobile platform drives workpiece to move, and after i.e. completing the processing in a hole, is moved by platform, continues processing another location Hole;Platform can also arrange fine motion path processing single hole when.
Referring to accompanying drawing 2, described rotation biprism assembly 13 includes: biprism adjusting means, is located at described double Two prisms in prism adjusting means, and drive the driving motor that described biprism adjusting means rotates.In the present embodiment, Two described prisms are two prism wedges, and this two prism wedge rotates coaxially, thus drives laser beam to move in a circle, from And complete circular hole processing.When needing the diameter changing processing circular hole, regulate the relative angle of this two prism wedge.
Wherein, the sectional view of the biprism adjusting means that 2, accompanying drawing is described, comprising: for the prism mirror of fixed prism Cylinder 1, for fixing the prism regulation lens barrel 5 of another prism, between described prism lens barrel 1 and prism regulation lens barrel 5 by one even Fitting 2 connects;Wherein, the outer wall of described prism regulation lens barrel 5 is set with at least one bearing, the in the present embodiment number of bearing Being two, respectively bearing 3 and bearing 4, the outer wall of described bearing supports described connector 2, and described prism regulates lens barrel 5 and is connected It is additionally provided with a limit screw 8 between part 2, when rotary prism regulation lens barrel 5 to appropriate location, screws described limit screw 8, Gu Determine prism regulation lens barrel 5 and connector 2.Wherein, the first prism 6 is fixedly installed in the prism lens barrel 1 of wedge shape, the second prism 9 It is fixedly installed on prism regulation lens barrel 5.One end of prism regulation lens barrel 5 is additionally provided with one and fixes catch 7, above-mentioned for fixing Bearing 3 and bearing 4.When needing the relative angle adjusting the first prism 6 and the second prism 9, the prism tune that manual rotation is above-mentioned Joint lens barrel 5, to the position needed, according to the biprism refraction action to light beam, thus changes the offset distance of beam center.When When biprism rotates coaxially at a high speed, the light beam of skew just forms a circular trace, thus realizes circular hole processing.
In the present embodiment, described bearing is needle bearing, and the number of described needle bearing is two, and two needle bearings are put down Row is set on prism regulation lens barrel 5.
The present embodiment also discloses a kind of method improving material laser processing quality, and it comprises the following steps:
First step S1, is positioned over hard crisp workpiece to be processed on the platform of processing;This platform can move along X-Y axle, root According to needs, if carrying out workpiece continuous poriferous adding man-hour, platform move drive workpiece and move, thus carry out micro-at diverse location Hole machined.
Second step S2, processes the relative angle of the radius regulation biprism of micropore as required;Owing to different workpieces needs Process different size of hole, therefore by the relative angle between this regulation biprism, change the offset distance of laser, at prism During high speed rotating, it is achieved Fast Circle hole machined.
3rd step S3, arranges laser parameter and machined parameters, opens laser instrument, makes light beam scan high speed rotating on workpiece Processing micropore.
The method of this raising material laser processing quality uses the device of above-mentioned raising multiple aperture micropore Laser Processing quality.
Further, described laser instrument is fixed laser, and described biprism includes relative to the adjusting means of position: use In the prism lens barrel 1 of fixed prism, for fixing the prism regulation lens barrel 5 of another prism, described prism lens barrel 1 regulates with prism Connected by a connection piece 2 between lens barrel 5;Wherein, the outer wall of described prism regulation lens barrel 5 is set with at least one bearing, at this The number of embodiment middle (center) bearing is two, respectively bearing 3 and bearing 4, and the outer wall of described bearing supports described connector 2, described It is additionally provided with a limit screw 8 between prism regulation lens barrel 5 and connector 2, when rotary prism regulation lens barrel 5 to appropriate location, Screw described limit screw 8, fixed prism regulation lens barrel 5 and connector 2.Wherein, the first prism 6 is fixedly installed in the rib of wedge shape In mirror lens barrel 1, the second prism 9 is fixedly installed on prism regulation lens barrel 5.One end of prism regulation lens barrel 5 is additionally provided with one and fixes Catch 7, for fixing above-mentioned bearing 3 and bearing 4.
The device and method of this raising multiple aperture micropore Laser Processing quality, by installing biprism adjusting means additional, makes to swash Light beam high speed rotating, reduces LASER HEAT impact, improves drilling efficiency, can pass through adjusting means simultaneously, quickly realize different pore size Hole machined, coordinate X-Y mobile platform motion, it is achieved the processing of multiple apertures, meet the process requirements of diverse graphical.
Foregoing, only presently preferred embodiments of the present invention, be not intended to limit embodiment of the present invention, and this area is general Logical technical staff, according to the central scope of the present invention and spirit, can carry out corresponding flexible or amendment very easily, therefore this The protection domain of invention should be as the criterion with the protection domain required by claims.

Claims (10)

1. the device improving multiple aperture micropore Laser Processing quality, it is characterised in that including:
One laser instrument, is used for launching laser;
One beam expanding lens, after being located at laser instrument, for expanding laser;
One rotates biprism assembly, after being located at beam expanding lens, with the offset distance at regulation laser beam center;
One focus lamp, after being located at rotation biprism assembly, for being focused light beam;
One platform, towards the light emission side of focus lamp, is used for placing workpiece or driving workpiece to move;And
One computer, controls laser instrument, platform, to arrange laser parameter and machined parameters;
Wherein, under the control of described computer, described rotation biprism assembly rotate regulation laser beam central role position The radius of workpiece on platform, laser scanning completes quick pass machining.
2. the device improving multiple aperture micropore Laser Processing quality as claimed in claim 1, it is characterised in that described laser Device is solid state laser.
3. the device improving multiple aperture micropore Laser Processing quality as claimed in claim 1, it is characterised in that described rotation is double The reflecting mirror in a change laser beam direction it is additionally provided with between prism assemblies and focus lamp.
4. the device improving multiple aperture micropore Laser Processing quality as claimed in claim 1, it is characterised in that described platform For X-Y axle mobile platform, on same workpiece during Continuous maching micropore, described X-Y axle mobile platform drives workpiece to move;Adding During work order hole, described X-Y axle mobile platform can arrange fine motion path.
5. the device improving multiple aperture micropore Laser Processing quality as claimed in claim 1, it is characterised in that described rotation Biprism assembly includes: biprism adjusting means, is located at two prisms in described biprism adjusting means, and drives described double The driving motor that prism adjusting means rotates.
6. the device improving multiple aperture micropore Laser Processing quality as claimed in claim 5, it is characterised in that two described ribs Mirror is two prism wedges.
7. the device improving multiple aperture micropore Laser Processing quality as claimed in claim 5, it is characterised in that described double ribs Mirror adjusting means includes: for the prism lens barrel of fixed prism, for fixing the prism regulation lens barrel of another prism, described prism It is connected by a connection piece between lens barrel with prism regulation lens barrel;Wherein, the outer wall of described prism regulation lens barrel is set with at least One bearing, the outer wall of described bearing is supported described connector, is additionally provided with a stop between described prism regulation lens barrel and connector Screw, when rotary prism regulation lens barrel is to appropriate location, screws described limit screw, and fixed prism regulates lens barrel and is connected Part.
8. the device improving multiple aperture micropore Laser Processing quality as claimed in claim 7, it is characterised in that described bearing For needle bearing, the number of described needle bearing is two, and two needle bearing parallel sleeves are loaded on prism regulation lens barrel.
9. the method improving material laser processing quality, it is characterised in that comprise the following steps:
The first step, is positioned over workpiece level to be processed on the platform of processing;
Second step, processes the relative position of the radius regulation biprism of micropore as required;
3rd step, arranges laser parameter and machined parameters, opens laser instrument, makes light beam process micropore on workpiece.
10. the method improving material laser processing quality as claimed in claim 9, it is characterised in that described laser instrument is Fixed laser, described biprism includes relative to the adjusting means of position: for the prism lens barrel of fixed prism, for fixing another The prism regulation lens barrel of one prism, is connected by a connection piece between described prism lens barrel with prism regulation lens barrel;Wherein, described The outer wall of described prism regulation lens barrel is set with at least one bearing, and the outer wall of described bearing supports described connector, described prism It is additionally provided with a limit screw between regulation lens barrel and connector, when rotary prism regulation lens barrel is to appropriate location, screws described Limit screw, fixed prism regulation lens barrel and connector.
CN201610871249.9A 2016-09-29 2016-09-29 A kind of device and method improving multiple aperture micropore laser processing quality Active CN106271118B (en)

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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108559835A (en) * 2018-03-22 2018-09-21 江苏大学 A kind of device and method of laser processing ball bearing outer rollaway nest
CN110253160A (en) * 2019-05-28 2019-09-20 广东工业大学 A kind of high speed and precision laser boring platform and its control method
CN111872579A (en) * 2020-06-16 2020-11-03 江苏亚威艾欧斯激光科技有限公司 Laser drilling equipment
CN113103577A (en) * 2021-03-17 2021-07-13 中国科学院福建物质结构研究所 Array type rotating double-prism 3D printing equipment and printing method
WO2021226733A1 (en) * 2020-05-12 2021-11-18 济南森峰科技有限公司 Laser apparatus with frustum-shaped rotating mirror
WO2021226732A1 (en) * 2020-05-12 2021-11-18 济南森峰科技有限公司 Laser processing equipment having rotating mirror
RU2782513C1 (en) * 2020-05-12 2022-10-28 Цзинань СЭНЬФЭН Текнолоджи Ко., Лтд. Laser device with prismatic rotating mirror

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JP2011011917A (en) * 2009-06-30 2011-01-20 Mitsuboshi Diamond Industrial Co Ltd Glass substrate processing device using laser beam
CN105008086A (en) * 2013-02-27 2015-10-28 三菱重工业株式会社 Machining device and machining method
CN206065692U (en) * 2016-09-29 2017-04-05 常州英诺激光科技有限公司 A kind of device for improving multiple aperture micropore laser processing quality

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Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108559835A (en) * 2018-03-22 2018-09-21 江苏大学 A kind of device and method of laser processing ball bearing outer rollaway nest
CN110253160A (en) * 2019-05-28 2019-09-20 广东工业大学 A kind of high speed and precision laser boring platform and its control method
CN110253160B (en) * 2019-05-28 2021-04-30 佛山市华道超精科技有限公司 High-speed precise laser drilling platform and control method thereof
WO2021226733A1 (en) * 2020-05-12 2021-11-18 济南森峰科技有限公司 Laser apparatus with frustum-shaped rotating mirror
WO2021226732A1 (en) * 2020-05-12 2021-11-18 济南森峰科技有限公司 Laser processing equipment having rotating mirror
RU2782513C1 (en) * 2020-05-12 2022-10-28 Цзинань СЭНЬФЭН Текнолоджи Ко., Лтд. Laser device with prismatic rotating mirror
CN111872579A (en) * 2020-06-16 2020-11-03 江苏亚威艾欧斯激光科技有限公司 Laser drilling equipment
CN113103577A (en) * 2021-03-17 2021-07-13 中国科学院福建物质结构研究所 Array type rotating double-prism 3D printing equipment and printing method
CN113103577B (en) * 2021-03-17 2022-06-10 中国科学院福建物质结构研究所 Array type rotating double-prism 3D printing equipment and printing method

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