CN106271058B - Technique of the laser cutting less than plate thickness diameter circular aperture is carried out on plank - Google Patents
Technique of the laser cutting less than plate thickness diameter circular aperture is carried out on plank Download PDFInfo
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- CN106271058B CN106271058B CN201610746660.3A CN201610746660A CN106271058B CN 106271058 B CN106271058 B CN 106271058B CN 201610746660 A CN201610746660 A CN 201610746660A CN 106271058 B CN106271058 B CN 106271058B
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
Abstract
The present invention relates to technique of the laser cutting less than plate thickness diameter circular aperture is carried out on a kind of plank, characterized in that specific as follows：First stage：Laser power control is in 400~500W, and for FREQUENCY CONTROL in 10~50Hz, cutting gas pressure is 0.6~0.75Bar, and the control of cutting grease head highness is irradiated 0.8~1.2 second, the pit of plate surface generation at this time from plate surface 10mm in plate surface；Second stage：The purging carried out 0.5~1 second using cutting gas is cooled down, then cutting head is reduced to from plate surface 2mm, by power control in 400~550W, by FREQUENCY CONTROL in 40~80Hz, the control of cutting gas pressure is in 0.75~0.85Bar, until plank is completely penetrated through；Phase III, after perforation completely penetrates through, the purging carried out 0.85~1.2 second using cutting gas is cooled down；Then it is normally cut, is cut into the profile of circular hole.The present invention can make perforation become smaller, and the phenomenon that plank will not be caused directly to melt because of high temperature in cutting process.
Description
Technical field
The present invention relates to a kind of laser cutting parameter, it is straight less than plate thickness that laser cutting is carried out on especially a kind of plank
The technique of diameter circular hole.
Background technology
Optical-fiber laser cutting machine is using optical-fiber laser generator as the laser cutting machine of light source.In the prior art, light
Fine laser cutting machine is less than the circular hole of plate thickness in cutting diameter or is being more than that the carbon steel sheet of 8mm is punched to thickness
When technique, there are problems that perforation is excessive or can not process.
Invention content
The purpose of the present invention is overcoming the deficiencies in the prior art, provides and carry out laser cutting on a kind of plank and be less than
The technique of plate thickness diameter circular aperture makes perforation become smaller, and is not in because high temperature leads to plate in cutting process
The phenomenon that material directly melts.
Laser cutting is carried out according to technical solution provided by the invention, on the plank less than plate thickness diameter circular aperture
Technique, characterized in that perforated using low-frequency pulse, point 3 stages are specific as follows into eleven punch 11：
First stage：Laser power control is in 400~500W, and for FREQUENCY CONTROL in 10~50Hz, cutting gas pressure is 0.6
~0.75Bar, the control of cutting grease head highness irradiate 0.8~1.2 second from plate surface 10mm, in plate surface, at this time plank
Surface generates pit；
Second stage：The purging carried out 0.5~1 second using cutting gas is cooled down, and then cutting head is reduced to from plate
Material surface 2mm, by power control in 400~550W, by FREQUENCY CONTROL in 40~80Hz, the control of cutting gas pressure 0.75~
0.85Bar, until plank is completely penetrated through；
Phase III, after perforation completely penetrates through, the purging carried out 0.85~1.2 second using cutting gas is cooled down；So
After normally cut, be cut into the profile of circular hole.
Further, the pit diameter that first stage plate surface generates is 1 mm or so.
Further, the cutting gas is oxygen.
Further, when plate material thickness is 8 mm or less, the laser power of first~phase III tapers off trend；
When plate material thickness is 8 mm or more, the laser power of first~phase III is in increasing trend.
Further, when plate material thickness is 8 mm or more, the laser of the laser power of second stage than the first stage
The laser power of power increment 10% or so, phase III is incremented by 10% or so than the laser power of second stage.
Further, the penetration hole diameter obtained after second stage perforation completely penetrates through is in 1.5mm or less.
Further, it is diameter 3mm circular holes below that the phase III obtains circular hole through normal cutting.
The technique that laser cutting circular hole is carried out on plank of the present invention, is perforated using low-frequency pulse, and point 3 stages will wear
The diameter control in the hole gone out is within 1.5mm；Overcome prior art middle punch it is excessive lead to not processing be less than plate thickness
The circular hole of diameter, the present invention can allow perforation to become smaller, and addition appropriate cools down, make be not in cutting process because
For plank is caused directly to melt for high temperature and can not cut.
Specific implementation mode
The present invention is further explained in the light of specific embodiments.
Embodiment one：Technique of the laser cutting less than plate thickness diameter circular aperture is carried out on a kind of plank, using low frequency arteries and veins
Hole is punched through, point 3 stages, plate thickness was 8mm hereinafter, detailed process is as follows into eleven punch 11：
First stage：Laser power control cuts head height in 450W, FREQUENCY CONTROL in 20Hz, oxygen pressure 0.6Bar
Degree control irradiates 1 second from plate surface 10mm, in plate surface, and plate surface generates the recessed of a diameter of 1 mm or so at this time
Hole；
Second stage：The purging carried out 0.5 second using cutting gas is cooled down, and then cutting head is reduced to from plank table
Face 2mm, by power control in 420W, by FREQUENCY CONTROL in 50Hz, the control of cutting gas pressure is in 0.8Bar, until plank is complete
It penetrates entirely；
Phase III, after perforation completely penetrates through, penetration hole diameter is in 1.5mm hereinafter, being carried out 1 second using cutting gas
Purging cooling；Then it is normally cut, is cut into the profile of circular hole, circular hole is generally diameter 3mm circular holes below.
Embodiment two：Technique of the laser cutting less than plate thickness diameter circular aperture is carried out on a kind of plank, using low frequency arteries and veins
Hole is punched through, point 3 stages, plate thickness was 8mm hereinafter, specific as follows into eleven punch 11：
First stage：Laser power control cuts head height in 500W, FREQUENCY CONTROL in 50Hz, oxygen pressure 0.6Bar
Degree control irradiates 0.8 second from plate surface 10mm, in plate surface, and plate surface generates a diameter of 1 mm's or so at this time
Pit；
Second stage：The purging carried out 0.5 second using cutting gas is cooled down, and then cutting head is reduced to from plank table
Face 2mm, by power control in 450W, by FREQUENCY CONTROL in 80Hz, the control of cutting gas pressure is in 0.75Bar, until by plank
It completely penetrates through；
Phase III, after perforation completely penetrates through, penetration hole diameter is in 1.5mm hereinafter, being carried out 0.85 second using cutting gas
The purging of clock cools down；Then it is normally cut, is cut into the profile of circular hole, circular hole is generally diameter 3mm circular holes below.
Embodiment three：Technique of the laser cutting less than plate thickness diameter circular aperture is carried out on a kind of plank, using low frequency arteries and veins
Hole is punched through, point 3 stages, plate thickness was 8mm or more, specific as follows into eleven punch 11：
First stage：Laser power control cuts head height in 400W, FREQUENCY CONTROL in 10Hz, oxygen pressure 0.75Bar
Degree control irradiates 1.2 seconds from plate surface 10mm, in plate surface, and plate surface generates a diameter of 1 mm's or so at this time
Pit；
Second stage：The purging carried out 1 second using cutting gas is cooled down, and then cutting head is reduced to from plate surface
2mm, by power control in 440W, by FREQUENCY CONTROL in 80Hz, the control of cutting gas pressure is in 0.75Bar, until plank is complete
It penetrates entirely；
Phase III, after perforation completely penetrates through, penetration hole diameter is in 1.5mm hereinafter, being carried out 1.2 seconds using cutting gas
Purging cooling；Then it is normally cut, is cut into the profile of circular hole, circular hole is generally diameter 3mm circular holes below.
Claims (3)
1. carrying out technique of the laser cutting less than plate thickness diameter circular aperture on a kind of plank, characterized in that use low-frequency pulse
Perforation, point 3 stages are specific as follows into eleven punch 11：
First stage：Laser power control in 400~500W, FREQUENCY CONTROL in 10~50Hz, cutting gas pressure is 0.6~
0.75Bar, the control of cutting grease head highness irradiate 0.8~1.2 second from plate surface 10mm, in plate surface, at this time plank table
Face generates pit；The pit diameter that first stage plate surface generates is 1 mm or so；
Second stage：The purging carried out 0.5~1 second using cutting gas is cooled down, and then cutting head is reduced to from plank table
Face 2mm, by power control in 400~550W, by FREQUENCY CONTROL in 40~80Hz, the control of cutting gas pressure 0.75~
0.85Bar, until plank is completely penetrated through；The penetration hole diameter obtained after second stage perforation completely penetrates through is in 1.5mm or less；
When plate material thickness is 8 mm or less, the laser power of first~phase III tapers off trend；Work as plate material thickness
For 8 mm or more when, the laser power of first~phase III is in increasing trend；
Phase III, after perforation completely penetrates through, the purging carried out 0.85~1.2 second using cutting gas is cooled down；Then into
The normal cutting of row, is cut into the profile of circular hole；It is diameter 3mm circles below that the phase III obtains circular hole through normal cutting
Hole.
2. technique of the laser cutting less than plate thickness diameter circular aperture is carried out on plank as described in claim 1, it is characterized in that：
The cutting gas is oxygen.
3. technique of the laser cutting less than plate thickness diameter circular aperture is carried out on plank as described in claim 1, it is characterized in that：
When plate material thickness is 8 mm or more, the laser power of second stage is more incremental by 10% or so than the laser power of first stage, the
Triphasic laser power is incremented by 10% or so than the laser power of second stage.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610746660.3A CN106271058B (en) | 2016-08-29 | 2016-08-29 | Technique of the laser cutting less than plate thickness diameter circular aperture is carried out on plank |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610746660.3A CN106271058B (en) | 2016-08-29 | 2016-08-29 | Technique of the laser cutting less than plate thickness diameter circular aperture is carried out on plank |
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| Publication Number | Publication Date |
|---|---|
| CN106271058A CN106271058A (en) | 2017-01-04 |
| CN106271058B true CN106271058B (en) | 2018-07-27 |
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| CN201610746660.3A Active CN106271058B (en) | 2016-08-29 | 2016-08-29 | Technique of the laser cutting less than plate thickness diameter circular aperture is carried out on plank |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110355468A (en) * | 2018-04-10 | 2019-10-22 | 上海柏楚电子科技股份有限公司 | A kind of piercing process and its side-blown device for laser cutting |
| CN109530933B (en) * | 2018-11-15 | 2020-11-10 | 无锡洲翔激光设备有限公司 | Process for rapidly perforating and cutting small hole in thick plate |
| CN110014237B (en) * | 2019-04-10 | 2020-11-10 | 无锡洲翔激光设备有限公司 | Rapid punching process for medium-thickness stainless steel plate |
| CN113977112A (en) * | 2021-11-12 | 2022-01-28 | 武汉威士登自动化控制技术有限公司 | High-speed laser perforation method |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000237886A (en) * | 1999-02-19 | 2000-09-05 | Koike Sanso Kogyo Co Ltd | Laser beam piercing method |
| CN102756214A (en) * | 2011-04-29 | 2012-10-31 | 深圳市大族激光科技股份有限公司 | Laser perforation method |
| CN103878494A (en) * | 2014-03-31 | 2014-06-25 | 深圳市大族激光科技股份有限公司 | Laser perforation method and method for cutting through hole through lasers |
| CN105436718A (en) * | 2014-08-26 | 2016-03-30 | 安捷利电子科技（苏州）有限公司 | UV laser drilling method for preparing blind holes controllable in taper |
-
2016
- 2016-08-29 CN CN201610746660.3A patent/CN106271058B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000237886A (en) * | 1999-02-19 | 2000-09-05 | Koike Sanso Kogyo Co Ltd | Laser beam piercing method |
| CN102756214A (en) * | 2011-04-29 | 2012-10-31 | 深圳市大族激光科技股份有限公司 | Laser perforation method |
| CN103878494A (en) * | 2014-03-31 | 2014-06-25 | 深圳市大族激光科技股份有限公司 | Laser perforation method and method for cutting through hole through lasers |
| CN105436718A (en) * | 2014-08-26 | 2016-03-30 | 安捷利电子科技（苏州）有限公司 | UV laser drilling method for preparing blind holes controllable in taper |
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| CN106271058A (en) | 2017-01-04 |
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Effective date of registration: 20170220 Address after: 214196 Donggang Industrial Park, Donggang Town, Xishan District, Jiangsu, Wuxi Applicant after: Wuxi Zhouxiang Laser Machinery Co., Ltd. Address before: 214196 Donggang Industrial Park, Donggang Town, Xishan District, Jiangsu, Wuxi Applicant before: Wuxi Zhouxiang Complete Set of Welding Equipment Co., Ltd. |
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Effective date of registration: 20181214 Address after: 214196 Donggang Industrial Park, Donggang Town, Xishan District, Wuxi City, Jiangsu Province Patentee after: Wuxi Zhouxiang Complete Set of Welding Equipment Co., Ltd. Address before: 214196 Donggang Industrial Park, Donggang Town, Xishan District, Wuxi City, Jiangsu Province Patentee before: Wuxi Zhouxiang Laser Machinery Co., Ltd. |
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Effective date of registration: 20191115 Address after: 214196 Donggang Industrial Park, Donggang Town, Xishan District, Jiangsu, Wuxi Patentee after: Wuxi Zhouxiang Laser Machinery Co., Ltd. Address before: Donggang Industrial Park, Donggang Town, Xishan District Patentee before: Wuxi Zhouxiang Complete Set of Welding Equipment Co., Ltd. |
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