CN110355468A - A kind of piercing process and its side-blown device for laser cutting - Google Patents
A kind of piercing process and its side-blown device for laser cutting Download PDFInfo
- Publication number
- CN110355468A CN110355468A CN201810317071.2A CN201810317071A CN110355468A CN 110355468 A CN110355468 A CN 110355468A CN 201810317071 A CN201810317071 A CN 201810317071A CN 110355468 A CN110355468 A CN 110355468A
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- China
- Prior art keywords
- blown
- perforation
- laser
- level
- height
- Prior art date
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Links
- 238000003698 laser cutting Methods 0.000 title claims abstract description 36
- 238000000034 method Methods 0.000 title claims abstract description 26
- 238000007664 blowing Methods 0.000 claims abstract description 29
- 238000005520 cutting process Methods 0.000 claims abstract description 14
- 239000007789 gas Substances 0.000 claims description 46
- 230000001681 protective effect Effects 0.000 claims description 24
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 20
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 16
- 239000001301 oxygen Substances 0.000 claims description 16
- 229910052760 oxygen Inorganic materials 0.000 claims description 16
- 229910052757 nitrogen Inorganic materials 0.000 claims description 10
- 239000000919 ceramic Substances 0.000 claims description 7
- 238000007789 sealing Methods 0.000 claims description 7
- 230000003287 optical effect Effects 0.000 claims description 6
- 230000000149 penetrating effect Effects 0.000 claims 1
- 238000005516 engineering process Methods 0.000 abstract description 2
- 239000002893 slag Substances 0.000 description 9
- 238000010586 diagram Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229910000975 Carbon steel Inorganic materials 0.000 description 1
- 239000010962 carbon steel Substances 0.000 description 1
- 239000000112 cooling gas Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000007540 photo-reduction reaction Methods 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/142—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor for the removal of by-products
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The present invention relates to laser cutting field, specifically a kind of piercing processes and its side-blown device for laser cutting.Include the following steps: that S1, opening side blowing apparatus, Height-adjusting device control laser head are moved to three-level perforation height；S2, carries out three-level perforation, and laser cutting machine power is completely run；S3, stops light air blowing for the first time, and Height-adjusting device control laser head is moved to second level perforation height；S4, switch protecting gas；S5 carries out second level perforation, laser cutting machine low power run；S6, stops light air blowing for the second time, and Height-adjusting device control laser head is moved to level-one perforation height；S7 carries out level-one perforation；S8 stops light air blowing；S9 judges whether the aperture of perforation is too small, if too small then follow the steps 10, otherwise executes step 11；S10 carries out reaming；S11, close side blowing apparatus；S12, punch off.Compared with the existing technology, structure is simple by the present invention, for cutting thicker plate, the cutting stability of great improving laser cutting heavy-gauge sheeting by the way of three-level perforation, and reduces the time of laser cutting heavy-gauge sheeting.
Description
Technical field
The present invention relates to laser cutting field, specifically a kind of piercing processes and its side-blown dress for laser cutting
It sets.
Background technique
In the laser cutting for plate, laser cutting machine needs first perforate to plate, could carry out to plate
Cutting, however in the laser cutting process for thick carbon steel plate, since the thickness of plate is thicker, laser cutting is caused to be worn
The time in hole is excessively slow and is easy unstable.
Summary of the invention
The present invention in order to overcome the deficiencies of the prior art, designs a kind of piercing process for laser cutting and its side-blown dress
It sets, perforation can be performed in multiple times for thick plate, the aperture edge after the aperture time is shorter and perforation is smooth, it can be ensured that
The cut quality of laser cutting parameter.
To achieve the above object, a kind of piercing process for laser cutting is designed, it is characterized in that including the following steps:
S1, opening side blowing apparatus, Height-adjusting device control laser head are moved to three-level perforation height；S2, carries out three-level perforation, and protective gas makes
With nitrogen, laser cutting machine power is completely run；S3, stops light air blowing for the first time, and Height-adjusting device control laser head is moved to second level perforation
Highly；S4, switch protecting gas；S5, carries out second level perforation, and protective gas uses oxygen, laser cutting machine low power run；
S6, stops light air blowing for the second time, and Height-adjusting device control laser head is moved to level-one perforation height；S7 carries out level-one perforation, protective gas
Use oxygen；S8 stops light air blowing；S9 judges whether the aperture of perforation is too small, if too small then follow the steps 10, otherwise executes step
Rapid 11；S10 carries out reaming；S11, close side blowing apparatus；S12, punch off.
The height that three-level is perforated in the step S2 is 10mm, and protective gas uses nitrogen, cutting machine laser power and accounts for
Sky ratio is all 100%, out long 100-200ms when light.
The height that second level is perforated in the step S5 is 50-70mm, and protective gas uses oxygen, and cutting machine power uses
20% or so, long 100-200ms when light out.
The height that level-one is perforated in the step S7 is 3-5mm, and protective gas uses oxygen, using expiring for laser cutting machine
Power is until penetrate plate.
A kind of side-blown device for laser cut perforations technique, including laser optics, it is characterized in that: the laser
The side of Optical devices is equipped with side-blown air inlet, and the lower section of laser optics is equipped with nozzle, the laser light positioned at nozzle side
It learns and is equipped with side-blown shell below device, the inside of the side-blown shell offers side-blown gas circuit, and the bottom of the side-blown gas circuit is set
There is side-blown nozzle, the top of the outlet face nozzle of the side-blown nozzle, side-blown gas circuit through side-blown shell and is embedded in laser
In the side wall of Optical devices, the top connecting side blown joint mouth of side-blown gas circuit, the side-blown interface is connected in side-blown air inlet.
Be equipped with sealing ring in the side wall of the laser optics, the sealing ring be set in laser optics with it is side-blown
Outside the side-blown gas circuit that shell mutually connects.
It is equipped with ceramic shell between the nozzle and laser optics, is embedded at the top of the ceramic shell in laser light
In the bottom for learning device.
Compared with the existing technology, structure is simple by the present invention, for cutting thicker plate by the way of three-level perforation,
The cutting stability of great improving laser cutting heavy-gauge sheeting, and reduce the time of laser cutting heavy-gauge sheeting.
Detailed description of the invention
Fig. 1 is cross-sectional view of the invention.
Fig. 2 is front view of the invention.
Fig. 3 is side view of the invention.
Fig. 4 is process flow chart of the invention.
Fig. 5 is the schematic diagram of three-level perforation in the present invention.
Fig. 6 is the schematic diagram of second level perforation in the present invention.
Fig. 7 is the schematic diagram of level-one perforation in the present invention.
Referring to FIG. 1 to FIG. 7, wherein 1 is side-blown interface, and 2 be side-blown gas circuit, and 3 be sealing ring, and 4 be side-blown shell, and 5 be side
Mouth is blowed and sprayed, 6 be nozzle, and 7 be ceramic shell, and 8 be side-blown air inlet, and 9 be laser optics.
Specific embodiment
The invention will now be described in further detail with reference to the accompanying drawings.
It is as shown in FIG. 1 to 3 the side-blown device in the present invention, including laser optics, it is characterized in that: the laser
The side of Optical devices 9 is equipped with side-blown air inlet 8, and the lower section of laser optics 9 is equipped with nozzle 6, positioned at swashing for 6 side of nozzle
Side-blown shell 4 is equipped with below light Optical devices 9, the inside of the side-blown shell 4 offers side-blown gas circuit 2, the side-blown gas circuit 2
Bottom be equipped with side-blown nozzle 5, the outlet face nozzle 6 of the side-blown nozzle 5, side-blown shell 4 is run through at the top of side-blown gas circuit 2
And be embedded in the side wall of laser optics 9, the top connecting side blown joint mouth 1 of side-blown gas circuit 2, the side-blown interface 1 is in side
Port 8 is blown into be connected.
Be equipped with sealing ring 3 in the side wall of the laser optics 9, the sealing ring 3 be set in laser optics 9 with
Outside the side-blown gas circuit 2 that side-blown 4 phase of shell connects.
Ceramic shell 7 is equipped between the nozzle 6 and laser optics 9, the top of the ceramic shell 7, which is embedded, is swashing
In the bottom of light Optical devices 9.
As shown in figure 4, a kind of piercing process for laser cutting is opened side-blown it is characterized in that including the following steps: S1
Device, Height-adjusting device control laser head are moved to three-level perforation height；S2, carries out three-level perforation, and protective gas uses nitrogen, laser
Cutting machine power is completely run；S3, stops light air blowing for the first time, and Height-adjusting device control laser head is moved to second level perforation height；S4, switching
Protective gas；S5, carries out second level perforation, and protective gas uses oxygen, laser cutting machine low power run；S6 stops light for the second time
It blows, Height-adjusting device control laser head is moved to level-one perforation height；S7, carries out level-one perforation, and protective gas uses oxygen；S8,
Stop light air blowing；S9 judges whether the aperture of perforation is too small, if too small then follow the steps 10, otherwise executes step 11；S10 is carried out
Reaming；S11, close side blowing apparatus；S12, punch off.
The height that three-level is perforated in the step S2 is 10mm, and protective gas uses nitrogen, cutting machine laser power and accounts for
Sky ratio is all 100%, out long 100-200ms when light.
The height that second level is perforated in the step S5 is 50-70mm, and protective gas uses oxygen, and cutting machine power uses
20% or so, long 100-200ms when light out.
The height that level-one is perforated in the step S7 is 3-5mm, and protective gas uses oxygen, using expiring for laser cutting machine
Power is until penetrate plate.
Embodiment:
As shown in Fig. 5~Fig. 7, in use, being first turned on side-blown device, Height-adjusting device air-breathing laser head is moved to apart from plate 10mm
Height, then carry out three-level perforation, be illustrated in figure 5 three-level perforation schematic diagram, three-level perforation in, the height of perforation is
10mm, protective gas use nitrogen, the time of laser cutting machine Operation at full power 150s；After the completion of three-level perforation, stop light air blowing,
Stop the transmitting of laser, continues side-blown air blowing, while Height-adjusting device control laser head is moved to the height apart from plate 50mm, carries out
Second level perforation；It is illustrated in figure 6 the schematic diagram of second level perforation, in second level perforation, the height of perforation is 50mm, and protective gas uses
Oxygen, laser cutting machine is with the time of 20% operation 150s of full power；After the completion of second level perforation, stops light air blowing, stop laser
Transmitting continues side-blown air blowing, while Height-adjusting device control laser head is moved to the height apart from plate 5mm, carries out level-one perforation；Such as
7 for level-one perforation schematic diagrames, in level-one perforation, perforation height is 5mm, and protective gas uses oxygen, and laser cutting machine is with full
Power operation is until penetrate plate；After the completion of level-one perforation, stops light air blowing, stop the transmitting of laser, continue side-blown air blowing；Judgement
Whether the aperture of perforation is too small, carries out chambering process to perforation if too small, and then stop blowing simultaneously close side blowing apparatus, knot
Beam perforation；On the contrary then direct close side blowing apparatus terminates perforation.
The present invention in use, cutting process for different phase perforation use two kinds of protective gas of nitrogen and oxygen, and
And the switching of protective gas is carried out in the process.And traditional laser cut perforations are only with oxygen, and due to nitrogen have compared with
Laser can be reached full power state using nitrogen in first order perforation, and can reduced subsequent by good cooling effect
The blast hole risk of perforation.
Meanwhile traditional piercing process whole process goes out light, therefore heat is not easy to control, easily causes plate overheat and even results in
Blast hole problem.And during the empty shifting of the multistage perforation of the present invention, it, can be rapid by closing laser and persistently blowing cooling gas
Cooling plate.While ensureing every level-one perforation effect, heat redundancy will not be caused.
Many slags can be adhered to after the completion of third level perforation around hole, these slags will affect the servo-actuated of Height-adjusting device,
To reduce cut quality when starting.Traditional piercing process perforation height is all within 20mm, in order to evade the production of slag
It is raw, often to sacrifice piercing efficiency.And the present invention will perforate the second level perforate elevated height to 50mm it is even higher after, due to tool
There is very big positive out of focus, the spot size beaten on iron plate is bigger, and the adhering range of slag can be completely covered.This
In the case of small-power go out light in short-term for slag heating and melting, easily slag can be blown down using auxiliary gas.
Also, second level perforation eminence goes out light other than being conducive to deslagging, also radius can be brought larger, shallower oblique of depth
Slope.In perforation procedure later, slag can be cooled down preferably after being blown out by the slope, and be easier to blow down.
In photoreduction process of perforating out, side-blown gas can directly blow the molten slag of splashing side-blown device in the present invention
It removes, while side-blown gas also contributes to second stage and removes the attachment slag after heating.The position of side-blown device and angle for
Side-blown effect has a significant impact, and the air pressure of air blowing gas then will specifically be adjusted according to technique.System is by sending different simulations
The control to air pressure may be implemented in amount control proportioning valve.
Finally, in order to complete the perforation of slab, lesser hot spot generally can be all used, the aperture being pierced by also very little may
It is not able to satisfy the requirement of cutting, has kept the cutting effect of knife very poor.In order to improve the phenomenon, after hole penetrates, pass through expansion
Spot size improves defocusing amount and continues light out, and the expansion to aperture may be implemented.
Claims (7)
1. a kind of piercing process for laser cutting, it is characterized in that include the following steps: S1, opening side blowing apparatus, Height-adjusting device
Control laser head is moved to three-level perforation height；S2, carries out three-level perforation, and protective gas uses nitrogen, laser cutting machine power
Full operation；S3, stops light air blowing for the first time, and Height-adjusting device control laser head is moved to second level perforation height；S4, switch protecting gas；
S5, carries out second level perforation, and protective gas uses oxygen, laser cutting machine low power run；S6 stops light air blowing for the second time, is turned up
Device control laser head is moved to level-one perforation height；S7, carries out level-one perforation, and protective gas uses oxygen；S8 stops light air blowing；
S9 judges whether the aperture of perforation is too small, if too small then follow the steps 10, otherwise executes step 11；S10 carries out reaming；S11,
Close side blowing apparatus；S12, punch off.
2. a kind of piercing process for laser cutting according to claim 1, it is characterized in that: three-level in the step S2
The height of perforation is 10mm, and protective gas uses nitrogen, and cutting machine laser power and duty ratio are all 100%, out long 100- when light
200ms。
3. a kind of piercing process for laser cutting according to claim 1, it is characterized in that: second level in the step S5
The height of perforation is 50-70mm, and protective gas uses oxygen, and cutting machine power uses 20% or so, out long 100-200ms when light.
4. a kind of piercing process for laser cutting according to claim 1, it is characterized in that: level-one in the step S7
The height of perforation is 3-5mm, and protective gas uses oxygen, using the full power of laser cutting machine until penetrating plate.
5. a kind of a kind of side-blown device for laser cut perforations technique as described in claim 1, including laser optics dress
It sets, it is characterized in that: the side of the laser optics (9) is equipped with side-blown air inlet (8), the lower section of laser optics (9)
Equipped with nozzle (6), it is located at below the laser optics (9) of nozzle (6) side and is equipped with side-blown shell (4), the side-blown shell
(4) inside offers side-blown gas circuit (2), and the bottom of the side-blown gas circuit (2) is equipped with side-blown nozzle (5), the side-blown nozzle
(5) top of outlet face nozzle (6), side-blown gas circuit (2) through side-blown shell (4) and is embedded in laser optics (9)
Side wall in, the top connecting side blown joint mouth (1) of side-blown gas circuit (2), the side-blown interface (1) in side-blown air inlet (8) be connected.
6. a kind of side-blown device for laser cut perforations technique according to claim 5, it is characterized in that: the laser
Sealing ring (3) are equipped in the side wall of Optical devices (9), the sealing ring (3) is set in laser optics (9) and side-blown shell
(4) the side-blown gas circuit (2) mutually connected is outside.
7. a kind of side-blown device for laser cut perforations technique according to claim 5, it is characterized in that: the nozzle
(6) ceramic shell (7) are equipped between laser optics (9), are embedded at the top of the ceramic shell (7) and are filled in laser optics
In the bottom for setting (9).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810317071.2A CN110355468A (en) | 2018-04-10 | 2018-04-10 | A kind of piercing process and its side-blown device for laser cutting |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810317071.2A CN110355468A (en) | 2018-04-10 | 2018-04-10 | A kind of piercing process and its side-blown device for laser cutting |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110355468A true CN110355468A (en) | 2019-10-22 |
Family
ID=68212977
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810317071.2A Pending CN110355468A (en) | 2018-04-10 | 2018-04-10 | A kind of piercing process and its side-blown device for laser cutting |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110355468A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113118650A (en) * | 2019-12-31 | 2021-07-16 | 江苏亚威机床股份有限公司 | Thick plate laser perforation processing method |
| CN113977112A (en) * | 2021-11-12 | 2022-01-28 | 武汉威士登自动化控制技术有限公司 | High-speed laser perforation method |
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| DE102013210845A1 (en) * | 2013-06-11 | 2014-12-11 | Trumpf Werkzeugmaschinen Gmbh + Co. Kg | Method for piercing into metallic workpieces by means of a laser beam |
| CN105339129A (en) * | 2013-06-11 | 2016-02-17 | 通快机床两合公司 | Method for piercing metal workpieces by means of laser beam |
| CN205587837U (en) * | 2016-04-27 | 2016-09-21 | 深圳欧斯普瑞智能科技有限公司 | Laser cutting head blows protection gas device |
| CN106112280A (en) * | 2016-07-11 | 2016-11-16 | 长沙理工大学 | A kind of laser perforation method |
| CN205798702U (en) * | 2016-07-15 | 2016-12-14 | 奔腾激光(温州)有限公司 | The side-blown mechanism of laser cutting machine |
| CN106271058A (en) * | 2016-08-29 | 2017-01-04 | 无锡洲翔成套焊接设备有限公司 | The cut technique less than sheet metal thickness diameter circular aperture is carried out on sheet material |
| CN206605154U (en) * | 2016-12-29 | 2017-11-03 | 大族激光科技产业集团股份有限公司 | The side-blown device of air of laser cutting head |
| CN107584209A (en) * | 2016-07-08 | 2018-01-16 | 京东方科技集团股份有限公司 | Laser cutting device |
| CN208231078U (en) * | 2018-04-10 | 2018-12-14 | 上海柏楚电子科技股份有限公司 | A kind of side-blown device for laser cut perforations technique |
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2018
- 2018-04-10 CN CN201810317071.2A patent/CN110355468A/en active Pending
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08290285A (en) * | 1995-04-19 | 1996-11-05 | Mitsubishi Electric Corp | Laser machining method |
| DE102013210845A1 (en) * | 2013-06-11 | 2014-12-11 | Trumpf Werkzeugmaschinen Gmbh + Co. Kg | Method for piercing into metallic workpieces by means of a laser beam |
| CN105339129A (en) * | 2013-06-11 | 2016-02-17 | 通快机床两合公司 | Method for piercing metal workpieces by means of laser beam |
| CN205587837U (en) * | 2016-04-27 | 2016-09-21 | 深圳欧斯普瑞智能科技有限公司 | Laser cutting head blows protection gas device |
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| CN205798702U (en) * | 2016-07-15 | 2016-12-14 | 奔腾激光(温州)有限公司 | The side-blown mechanism of laser cutting machine |
| CN106271058A (en) * | 2016-08-29 | 2017-01-04 | 无锡洲翔成套焊接设备有限公司 | The cut technique less than sheet metal thickness diameter circular aperture is carried out on sheet material |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113118650A (en) * | 2019-12-31 | 2021-07-16 | 江苏亚威机床股份有限公司 | Thick plate laser perforation processing method |
| CN113118650B (en) * | 2019-12-31 | 2022-03-15 | 江苏亚威机床股份有限公司 | Thick plate laser perforation processing method |
| CN113977112A (en) * | 2021-11-12 | 2022-01-28 | 武汉威士登自动化控制技术有限公司 | High-speed laser perforation method |
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| CB02 | Change of applicant information | ||
| CB02 | Change of applicant information |
Address after: 200241 No. 1000, Lanxiang Hunan Road, Minhang District, Shanghai Applicant after: SHANGHAI FRIENDESS ELECTRONIC TECHNOLOGY Co.,Ltd. Address before: 200240 No. 953 lane, Jianchuan Road, Minhang District, Shanghai 322 Applicant before: SHANGHAI FRIENDESS ELECTRONIC TECHNOLOGY Co.,Ltd. |