CN106255349A - The manufacture method of a kind of PCB and PCB - Google Patents
The manufacture method of a kind of PCB and PCB Download PDFInfo
- Publication number
- CN106255349A CN106255349A CN201610674421.1A CN201610674421A CN106255349A CN 106255349 A CN106255349 A CN 106255349A CN 201610674421 A CN201610674421 A CN 201610674421A CN 106255349 A CN106255349 A CN 106255349A
- Authority
- CN
- China
- Prior art keywords
- pcb
- step trough
- metal layer
- layer
- line pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0707—Shielding
- H05K2201/0723—Shielding provided by an inner layer of PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09036—Recesses or grooves in insulating substrate
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The present invention discloses manufacture method and the PCB of a kind of PCB, relates to printed substrate technical field.The manufacture method of described PCB includes: plate the first metal layer in the step trough offered on PCB after laminating, carries out metalized；The logicalnot circuit graphics field of the bottom land of described step trough covers plating resist film；Line pattern region overlay corrosion resistant metal layer at the bottom land of described step trough；Described the first metal layer under etching plating resist film covering；Decorporate the described corrosion resistant metal layer in described line pattern region.Described PCB offers step trough；Described step trough has metallized cell wall, and bottom land has line pattern.The present invention can realize the metallization of step trough cell wall, thus the effect of enhancing signal shielding, simultaneously, additionally it is possible to the step trough bottom land at PCB makes accurate line pattern.
Description
Technical field
The present invention relates to printed circuit board make field, particularly relate to a kind of PCB manufacture method and
PCB。
Background technology
PCB (Printed Circuit Board), Chinese is printed circuit board, also known as printed substrate, is important
Electronic unit, be the supporter of electronic devices and components, be electronic devices and components electrical connection carrier.
When assembling and assemble, often need to produce step trough in PCB local；For meet modular assembly reduces volume and
Improving the demand of wiring density, the PCB application containing step trough design is more and more extensive.Containing circuit bottom conventional step trough
The PCB processing technology of graphic designs has a following deficiency:
1, bottom land line pattern makes pressing again on central layer, and after pressing, the gummosis on figure is difficult to control to.
2, the cell wall of the step trough containing bottom land line pattern is typically designed as non-metallic cell wall, and metallization cell wall is difficult to
Make.
Summary of the invention
It is an object of the invention to, propose the manufacture method of a kind of PCB, it is possible to realize the metal of the step trough cell wall of PCB
Change, and make line pattern at step trough bottom land.
Further object is that, propose a kind of PCB possess metallized step trough cell wall, and step trough
Bottom land possesses line pattern.
For reaching this purpose, the present invention by the following technical solutions:
On the one hand, the present invention provides the manufacture method of a kind of PCB, including:
Plate the first metal layer in the step trough offered on PCB after laminating, carry out metalized；
The logicalnot circuit graphics field of the bottom land of described step trough covers plating resist film；
Line pattern region overlay corrosion resistant metal layer at the bottom land of described step trough；
Described the first metal layer under etching plating resist film covering；
Decorporate the described corrosion resistant metal layer in described line pattern region.
Wherein, the described the first metal layer under the covering of described etching plating resist film, including:
Remove the plating resist film covered on described logicalnot circuit graphics field；
Etch the described the first metal layer of described logicalnot circuit graphics field.
Further, described in decorporate the described corrosion resistant metal layer in described line pattern region, the most also include:
Cell wall and described line pattern region to described step trough carry out turmeric process.
Further, plate the first metal layer in the step trough that described PCB after laminating offers, the most also include:
The multi-layer coreboard of PCB is laminated；
On PCB, step trough is offered in the position of step trough to be formed.
Wherein, the described multi-layer coreboard to PCB is laminated, including:
First central layer, prepreg, the second central layer and the 3rd central layer are provided, the second central layer makes line pattern；
On prepreg and the second central layer, the position of step trough to be formed carries out slot treatment；
Resistance glue gasket is placed, by the first central layer, prepreg, the second central layer in the fluting of prepreg and the second central layer
And the 3rd central layer be stacked together according to predetermined laminated layer sequence；
The multi-layer coreboard stacked is laminated, is formed at the embedding PCB having resistance glue gasket in position of step trough to be formed.
Wherein, described on PCB the position of step trough to be formed offer step trough, including:
The embedding PCB having resistance glue gasket in position of step trough to be formed is carried out controlled depth milling, takes out resistance glue gasket, form rank
Ladder groove.
Further, described the first metal layer is layers of copper.
Further, described corrosion resistant metal layer is tin layers.
On the other hand, the present invention provides a kind of PCB:
Use the manufacture method of above-mentioned PCB；
Described PCB offers step trough；Described step trough has metallized cell wall；The bottom land of described step trough has line
Road figure.
The invention have the benefit that
The present invention carries out metalized, then the bottom land at described step trough to the step trough offered on the PCB after lamination
Logicalnot circuit graphics field on cover plating resist film, line pattern region overlay corrosion resistant metal layer, etching plating resist film cover under
Metal level, then the corrosion resistant metal layer in described line pattern region of decorporating, the most i.e. can get trough line road figure.Energy of the present invention
Enough realize the metallization of step trough cell wall, the effect of enhancing signal shielding, additionally it is possible to the step trough bottom land at PCB makes layout
Shape, and ensure bottom land line pattern cleaning, pollution-free.
Accompanying drawing explanation
Fig. 1 is the flow chart of the manufacture method of the PCB that the embodiment of the present invention one provides；
Fig. 2 is the flow chart of the manufacture method of the PCB of the improvement that the embodiment of the present invention two provides；
Fig. 3 is the generalized section being laminated PCB in the embodiment of the present invention two；
Fig. 4 is the generalized section of the PCB after offering step trough in the embodiment of the present invention two；
Fig. 5 is the generalized section of the PCB in the embodiment of the present invention two after heavy copper plating step trough；
Fig. 6 is the schematic top plan view of the bottom land of step trough in the embodiment of the present invention two.
In figure: 11, the first central layer；12, prepreg；13, the second central layer；14, the 3rd central layer；15, resistance glue gasket；16、
Layers of copper；17, line pattern region；18, logicalnot circuit graphics field；20, step trough.
Detailed description of the invention
Technical scheme and the technique effect reached for making to present invention solves the technical problem that, using are clearer, below
By combining accompanying drawing, the technical scheme of the embodiment of the present invention is described in further detail, it is clear that described embodiment is only
It is a part of embodiment of the present invention rather than whole embodiments.
Embodiment one
Fig. 1 is the flow chart of the manufacture method of the PCB that the embodiment of the present invention one provides, as it is shown in figure 1, the present embodiment provides
The manufacture method of a kind of PCB, for making metallized step trough on PCB, and step trough bottom land is provided with line pattern.Described
Manufacture method comprises the steps:
S100, plates the first metal layer in the step trough that PCB after laminating offers, and carries out metalized.
PCB after being laminated and making step trough is carried out chemical plating or plating, it is thus achieved that metallized step trough, step trough
Cell wall and bottom land plate the first metal layer.Described the first metal layer is that layers of copper, layer gold or other this areas are for rank of metallizing
The metal level of ladder groove.Preferably, the present embodiment uses the mode of heavy copper plating to make described step trough metallize.
S101, covers plating resist film on the logicalnot circuit graphics field of the bottom land of described step trough.
Described plating resist film can be selected for dry film or wet film, and the logicalnot circuit graphics field that plating resist film covers will not be coated with gold
Belong to layer.The present embodiment is preferably ink, uses the spraying of ink flush coater or other modes, bottom land non-of described step trough
Ink is covered on line pattern region.
S102, at the line pattern region overlay corrosion resistant metal layer of the bottom land of described step trough.
The bottom land of described step trough is plated corrosion resistant metal layer, under the covering of the plating resist film of step S101 spraying, non-
Line pattern region will not plate described corrosion resistant metal layer, and line pattern region is protected by described corrosion resistant metal layer.
Described corrosion resistant metal layer is that tin layers, layer gold or other this areas are for anti-etching metal level.In the present embodiment excellent
Elect tin layers as.
S103, the described the first metal layer under etching plating resist film covering.
The ink covered on laser ablation logicalnot circuit graphics field, exposes the described the first metal layer under ink covers, erosion
Carve described the first metal layer.If plating resist film is other materials, can use and move back film liquid and move back film.
In step S102, circuit graphics field is protected by corrosion resistant metal layer, will not damage in etching process.
S104, the described corrosion resistant metal layer in described line pattern region of decorporating.
For described corrosion resistant metal layer, corresponding method is used to be decorporated.In the present embodiment, it is preferred to use tin stripping liquid will
Stannum is moved back in described line pattern region, exposes the line pattern made.
In the present embodiment, first by step trough bulk metal, then by a series of step by logicalnot circuit graphics field
Metal level is removed, and i.e. can get the metallization of step trough cell wall, bottom land has the PCB of line pattern, and the present embodiment can be at ladder
The bottom land of groove makes line pattern, and ensure bottom land line pattern cleaning, free of contamination in the case of, it is achieved step trough cell wall
Metallization, the effect of enhancing signal shielding.
Embodiment two
Fig. 2 is the flow chart of the manufacture method of the PCB of the improvement that the embodiment of the present invention two provides, as in figure 2 it is shown, above-mentioned
On the basis of embodiment, described manufacture method is carried out perfect, make with line pattern before adding step trough metallization
Step afterwards.
Described manufacture method comprises the steps:
S200, is laminated the multi-layer coreboard of PCB.
As shown in Figure 3, it is provided that the first central layer 11, prepreg the 12, second central layer 13 and the 3rd central layer 14, at the second central layer
Line pattern is made on 13；On prepreg 12 and the second central layer 13, the position of step trough to be formed carries out slot treatment；?
The fluting of prepreg 12 and the second central layer 13 is placed resistance glue gasket 15, by the first central layer 11, prepreg the 12, second central layer
13 and the 3rd central layer 14 be stacked together according to predetermined laminated layer sequence；The multi-layer coreboard stacked is laminated, is formed at desire
Form the embedding PCB having resistance glue gasket 15 in position of step trough.
S201, on PCB, step trough is offered in the position of step trough to be formed.
As shown in Figure 4, the embedding PCB having resistance glue gasket 15 in position of step trough to be formed is carried out controlled depth milling, by first
The position part of the step trough to be formed of central layer 11 mills out, and takes out resistance glue gasket 15, forms step trough 20.
S202, carries out heavy copper plating to the step trough offered on the PCB after lamination.
As it is shown in figure 5, the PCB after lamination to be carried out heavy copper plating, it is thus achieved that metallized step trough 20, i.e. step trough 20
Cell wall and bottom land cover layers of copper 16.
S203, covers ink on the logicalnot circuit graphics field of the bottom land of described step trough.
Fig. 6 is the schematic top plan view of the bottom land of step trough 20 in the embodiment of the present invention two, as shown in Figure 6, at described ladder
On the logicalnot circuit graphics field 18 of the bottom land of groove 20, use ink flush coater, cover ink for described logicalnot circuit graphics field 18.
S204, by tin plating for the line pattern region of the bottom land of described step trough.
Bottom land to described step trough 20 is tin plating, sprays ink through step S203, and logicalnot circuit graphics field 18 is at ink
Covering under, tin layers will not be coated with, but line pattern region 17 then plates tin layers, the layers of copper 16 in line pattern region 17 is by stannum
The protection of layer, will not be etched liquid corrosion in subsequent step and carve.
S205, the ink that logicalnot circuit graphics field described in ablation covers.
By laser drilling machine, the ink covered on logicalnot circuit graphics field 18 is ablated off, then uses ultrasonic cleaning apparatus
At the bottom of rinse bath, expose the layers of copper 16 of logicalnot circuit graphics field 18.
S206, etches the layers of copper of described logicalnot circuit graphics field.
Etch the layers of copper 16 that described logicalnot circuit graphics field 18 exposes, now obtain the line pattern of bottom land.
S207, moves back stannum by described line pattern region.
By in step S204, cover the tin layers on circuit graphics field 17, carry out moving back stannum by tin stripping liquid and process, expose
The line pattern made.
S208, cell wall and described line pattern region to described step trough carry out turmeric process.
By turmeric technique, cell wall and described line pattern region 17 to described step trough 20 are protected.
The present embodiment, on the basis of above-described embodiment, first passes through slotting position on the central layer of PCB and places resistance glue gasket,
Again each layer central layer is laminated, produces step trough finally by controlled depth milling, gummosis in lamination process can be prevented to pollute step trough,
Make line pattern on PCB after pressing, can guarantee that the cleaning of line pattern；Metallized area and line pattern to step trough
Carrying out turmeric protection, make PCB surface keep colour stable, brightness is good, and coating is smooth, good weldability.
Embodiment three
The present embodiment provides a kind of PCB, uses the manufacture method of the PCB described in above-described embodiment to make, described PCB
Offer step trough；Described step trough has metallized cell wall；The bottom land of described step trough has line pattern.
Preferably, metallized cell wall is the cell wall covering layers of copper.
Using the PCB that the manufacture method of the PCB described in above-described embodiment makes, its step trough has good signal shielding
Effect, and the bottom land of step trough has line pattern, line pattern cleanliness without any pollution, PCB surface colour stable, brightness is good,
Coating is smooth, good weldability.
The know-why of the present invention is described above in association with specific embodiment.These describe and are intended merely to explain the present invention's
Principle, and limiting the scope of the invention can not be construed to by any way.Based on explanation herein, the technology of this area
Personnel need not pay performing creative labour can associate other detailed description of the invention of the present invention, and these modes fall within
Within protection scope of the present invention.
Claims (9)
1. the manufacture method of a PCB, it is characterised in that:
Plate the first metal layer in the step trough offered on PCB after laminating, carry out metalized；
The logicalnot circuit graphics field of the bottom land of described step trough covers plating resist film；
Line pattern region overlay corrosion resistant metal layer at the bottom land of described step trough；
Described the first metal layer under etching plating resist film covering；
Decorporate the described corrosion resistant metal layer in described line pattern region.
The manufacture method of PCB the most according to claim 1, it is characterised in that the institute under the covering of described etching plating resist film
State the first metal layer, including:
Remove the plating resist film covered on described logicalnot circuit graphics field；
Etch the described the first metal layer of described logicalnot circuit graphics field.
The manufacture method of PCB the most according to claim 1, it is characterised in that described in decorporate described line pattern region
Described corrosion resistant metal layer, the most also includes:
Cell wall and described line pattern region to described step trough carry out turmeric process.
The manufacture method of PCB the most according to claim 1, it is characterised in that the rank offered on described PCB after laminating
Plate the first metal layer in ladder groove, the most also include:
The multi-layer coreboard of PCB is laminated；
On PCB, step trough is offered in the position of step trough to be formed.
The manufacture method of PCB the most according to claim 4, it is characterised in that the described multi-layer coreboard to PCB carries out layer
Pressure, including:
First central layer, prepreg, the second central layer and the 3rd central layer are provided, the second central layer makes line pattern；
On prepreg and the second central layer, the position of step trough to be formed carries out slot treatment；
Resistance glue gasket is placed, by the first central layer, prepreg, the second central layer and the in the fluting of prepreg and the second central layer
Three central layers are stacked together according to predetermined laminated layer sequence；
The multi-layer coreboard stacked is laminated, is formed at the embedding PCB having resistance glue gasket in position of step trough to be formed.
The manufacture method of PCB the most according to claim 5, it is characterised in that the described position of step trough to be formed on PCB
Put and offer step trough, including:
The embedding PCB having resistance glue gasket in position of step trough to be formed is carried out controlled depth milling, takes out resistance glue gasket, form ladder
Groove.
7. according to the manufacture method of the PCB described in any one of claim 1 to 6, it is characterised in that:
Described the first metal layer is layers of copper.
8. according to the manufacture method of the PCB described in any one of claim 1 to 6, it is characterised in that:
Described corrosion resistant metal layer is tin layers.
9. a PCB, it is characterised in that:
The manufacture method using the PCB described in any one of claim 1 to 6 makes；
Described PCB offers step trough；Described step trough has metallized cell wall；The bottom land of described step trough has layout
Shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610674421.1A CN106255349A (en) | 2016-08-16 | 2016-08-16 | The manufacture method of a kind of PCB and PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610674421.1A CN106255349A (en) | 2016-08-16 | 2016-08-16 | The manufacture method of a kind of PCB and PCB |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106255349A true CN106255349A (en) | 2016-12-21 |
Family
ID=57591634
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610674421.1A Pending CN106255349A (en) | 2016-08-16 | 2016-08-16 | The manufacture method of a kind of PCB and PCB |
Country Status (1)
| Country | Link |
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| CN (1) | CN106255349A (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106793589A (en) * | 2016-12-29 | 2017-05-31 | 生益电子股份有限公司 | A kind of preparation method of wiring board bottom land figure |
| CN106973526A (en) * | 2017-05-09 | 2017-07-21 | 生益电子股份有限公司 | A kind of PCB preparation method and PCB |
| CN108012404A (en) * | 2017-11-29 | 2018-05-08 | 生益电子股份有限公司 | A kind of PCB equipped with step groove |
| CN108012465A (en) * | 2017-11-29 | 2018-05-08 | 生益电子股份有限公司 | A kind of preparation method of the PCB equipped with step groove |
| CN108323040A (en) * | 2018-02-02 | 2018-07-24 | 生益电子股份有限公司 | A kind of production method and PCB of the PCB with stepped groove |
| CN113316310A (en) * | 2021-05-18 | 2021-08-27 | 南京宏睿普林微波技术股份有限公司 | Microwave multilayer board and manufacturing method thereof |
| CN114916141A (en) * | 2022-05-27 | 2022-08-16 | 深圳市八达通电路科技有限公司 | Sunken circuit board manufacturing method and circuit board |
| WO2022170953A1 (en) * | 2021-02-09 | 2022-08-18 | 景旺电子科技(珠海)有限公司 | Circuit board and manufacturing method therefor |
| WO2023184729A1 (en) * | 2022-03-31 | 2023-10-05 | 生益电子股份有限公司 | Circuit-buried pcb manufacturing method and circuit-buried pcb |
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Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106793589A (en) * | 2016-12-29 | 2017-05-31 | 生益电子股份有限公司 | A kind of preparation method of wiring board bottom land figure |
| CN106793589B (en) * | 2016-12-29 | 2019-04-16 | 生益电子股份有限公司 | A kind of production method of wiring board slot bottom figure |
| CN106973526A (en) * | 2017-05-09 | 2017-07-21 | 生益电子股份有限公司 | A kind of PCB preparation method and PCB |
| CN108012404A (en) * | 2017-11-29 | 2018-05-08 | 生益电子股份有限公司 | A kind of PCB equipped with step groove |
| CN108012465A (en) * | 2017-11-29 | 2018-05-08 | 生益电子股份有限公司 | A kind of preparation method of the PCB equipped with step groove |
| CN108323040A (en) * | 2018-02-02 | 2018-07-24 | 生益电子股份有限公司 | A kind of production method and PCB of the PCB with stepped groove |
| WO2022170953A1 (en) * | 2021-02-09 | 2022-08-18 | 景旺电子科技(珠海)有限公司 | Circuit board and manufacturing method therefor |
| CN113316310A (en) * | 2021-05-18 | 2021-08-27 | 南京宏睿普林微波技术股份有限公司 | Microwave multilayer board and manufacturing method thereof |
| WO2023184729A1 (en) * | 2022-03-31 | 2023-10-05 | 生益电子股份有限公司 | Circuit-buried pcb manufacturing method and circuit-buried pcb |
| CN114916141A (en) * | 2022-05-27 | 2022-08-16 | 深圳市八达通电路科技有限公司 | Sunken circuit board manufacturing method and circuit board |
| CN114916141B (en) * | 2022-05-27 | 2023-03-10 | 深圳市八达通电路科技有限公司 | Sunken circuit board manufacturing method and circuit board |
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Application publication date: 20161221 |
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