CN101990371B - Manufacture method of ceramic-based interconnection flexible circuit board - Google Patents
Manufacture method of ceramic-based interconnection flexible circuit board Download PDFInfo
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- CN101990371B CN101990371B CN2010102490736A CN201010249073A CN101990371B CN 101990371 B CN101990371 B CN 101990371B CN 2010102490736 A CN2010102490736 A CN 2010102490736A CN 201010249073 A CN201010249073 A CN 201010249073A CN 101990371 B CN101990371 B CN 101990371B
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Abstract
The invention discloses a manufacture method of a ceramic-based interconnection flexible circuit board, which is characterized by comprising the following steps of: A, manufacturing an aluminum nitride ceramic circuit board; B, manufacturing a flexible circuit board; C, laminating the aluminum nitride ceramic circuit board and the flexible circuit board; D, manufacturing a through hole penetrating the upper surface and the lower surface of a multilayer board in the step C on the multilayer boardby adopting a laser punching device, penetrating the through hole by adopting a conductive material and then drying to ensure that the through hole becomes a conducting hole; E, printing welding-preventing ink on the place of the multilayer board where no electric component is welded; F, silk-screening characters on the preset place of the multilayer board; and G, cutting the circuit boards into preset specifications by adopting a laser cutting device to obtain the ceramic-based rigid flexible multilayer circuit board. The invention aims at overcoming the defects in the prior art, and provides the manufacture method of the ceramic-based interconnection flexible circuit board with excellent 3D connection characteristic and better thermal conductivity.
Description
Technical field
The present invention relates to the manufacturing approach of the interconnected flexible electric circuit board of a kind of ceramic base.
Background technology
In the industry ordinary epoxy resin multi-layer sheet is arranged at present, flexible electric circuit board (soft board) is arranged, the rigid-flexible combined circuit plate of epoxy resin+flexible electric circuit board is arranged, have with common Al
2O
3Be the ceramic circuit board of main component, their pluses and minuses are following:
The ordinary epoxy resin multi-layer sheet: there is the number of plies many, series of advantages such as wiring density height, technical maturity, easy welding component, but its thermal conductivity and poor radiation, the harmomegathus size is difficult to control, and reliability also is difficult to promote;
Flexible electric circuit board (soft board): it is little, in light weight, removable to have a volume, bending, and torsional surface can not damage lead, can defer to difformity and special package dimension, and 3D assembling and dynamic application scope are wide; Weakness is the dimensional stability extreme difference, and wiring density is low, and non-refractory also is not easy to process multi-layer sheet.
Common aluminium oxide ceramic circuit board: have high-cooling property and corrosion-resistant, have higher insulation property and excellent high frequency characteristics, the coefficient of expansion low, advantage such as stable chemical performance and thermal conductivity are high, and be nontoxic; But owing to it has the characteristic of high rigidity simultaneously, so matter is crisp, the machine work difficulty is big, and simultaneously owing to its surfacing, difficult the realization interlayer conduction also is difficult to and the effective formation multilayer circuit board that combines of other layer through electroplating;
Traditional circuit board advantage is single, can not have high thermal conductivity simultaneously, and high integration and 3D linkage function can not satisfy market circuit board is had high connectivity, high density, the demand that thermal conductivity is good.
Summary of the invention
The objective of the invention is in order to overcome weak point of the prior art, provide a kind of technology simple, have a manufacturing approach of the interconnected flexible electric circuit board of ceramic base of good 3D connection performance and good thermal conductivity.
In order to achieve the above object, the present invention adopts following scheme:
The manufacturing approach of the interconnected flexible electric circuit board of a kind of ceramic base is characterized in that may further comprise the steps:
A, making aluminium nitride ceramics circuit board:
A1, in the aluminium nitride ceramics copper-clad plate of pre-treatment, making layer pattern;
A2, utilize laser drilling device on preposition, to offer location hole;
B, making flexible electric circuit board:
B1, flexibility coat copper plate is cut into the size suitable with ceramic copper-clad plate;
B2, on the flexibility coat copper plate preposition, offer the hole of implementing the flexibility coat copper plate upper and lower faces;
B3, plating one deck conductive layer makes it become via on above-mentioned hole;
B4, the circuit diagram on the film is transferred on the flexibility coat copper plate;
B5, on the flexibility coat copper plate of completing steps b4 the hot pressing layer protecting film;
B6, that its naked copper surface to be welded of flexibility coat copper plate of hot pressing diaphragm is carried out the exposed position of surface treatment protection is not oxidized;
B7, on above-mentioned flexibility coat copper plate according to designing requirement silk-screen character;
B8, the processing combination of on above-mentioned flexibility coat copper plate, assembling secondary material or auxiliary material;
C, pressing aluminium nitride ceramics circuit board and flexible electric circuit board:
C1, between aluminium nitride ceramics circuit board and flexible electric circuit board, dielectric layer is set;
The mode of c2, employing hot pressing is pressed into one with aluminium nitride ceramics circuit board and flexible electric circuit board, becomes multi-layer sheet;
Adopt laser drilling device to make the through hole that runs through said multi-layer sheet upper and lower surface on D, the multi-layer sheet in step C, adopt the electric conducting material perforation, oven dry makes it become via then;
E, do not need the printing ink of solder-mask printing in the localities of soldering of electronic components at above-mentioned multi-layer sheet;
F, on the multi-layer sheet preposition character silk printing;
G, employing laser cutting device cut into predetermined specification to circuit board, promptly get ceramic base flex-rigid multiple-layer circuit board.
The manufacturing approach of the interconnected flexible electric circuit board of aforesaid a kind of ceramic base is characterized in that the pre-treatment described in the steps A comprises the operation of inspection to the ceramic copper-clad board raw material, oil removing, pickling, oven dry.
The manufacturing approach of the interconnected flexible electric circuit board of aforesaid a kind of ceramic base; It is characterized in that the making internal layer figure described in the steps A is included in covers one deck light-sensitive medium on the copper layer of ceramic copper-clad plate; The film of on light-sensitive medium, placing the band predetermined pattern makes public, and develops then, etching, dries after moving back film.
The manufacturing approach of the interconnected flexible electric circuit board of aforesaid a kind of ceramic base is characterized in that the conductive layer described in the step b3 is a kind of in copper coating or the silvering.
The manufacturing approach of the interconnected flexible electric circuit board of aforesaid a kind of ceramic base is characterized in that the transfer of circuit diagram described in the step b4 comprises pad pasting, exposure, development, etching, five operations of stripping.
The manufacturing approach of the interconnected flexible electric circuit board of aforesaid a kind of ceramic base is characterized in that the diaphragm described in the step b5 is the insulating properties material.
The manufacturing approach of the interconnected flexible electric circuit board of aforesaid a kind of ceramic base is characterized in that the surface treatment described in the step b6 is to be coated with a kind of in machine aided weldering protective agent or the plated metal coating.
The manufacturing approach of the interconnected flexible electric circuit board of aforesaid a kind of ceramic base is characterized in that pair material described in the step b8 or auxiliary material are that stiffening plate, gum, part mount, in conductive fabric, drawstring or the tilt material one or more.
The manufacturing approach of the interconnected flexible electric circuit board of aforesaid a kind of ceramic base is characterized in that the dielectric layer described in the step C is PP layer and PI layer.
The manufacturing approach of the interconnected flexible electric circuit board of aforesaid a kind of ceramic base is characterized in that a kind of in silver slurry or the copper slurry of the electric conducting material described in the step D.
In sum, beneficial effect of the present invention:
One, adopts laser drilling device and laser cutting device the aluminium nitride ceramics circuit board to be punched and cut among the present invention and effectively overcome problems such as al nitride ceramic board matter is crisp, difficulty of processing is big;
Two, solved al nitride ceramic board through the mode that adopts silver slurry or copper to starch perforation because its surfacing is difficult for through electroplating the problem of realization interlayer conduction;
Three, the present invention reaches combining closely of aluminium nitride ceramics circuit board and flexible electric circuit board through prolonging hot pressing time and combining to reduce pressing-in temp, efficiently solves the problem of flexible electric circuit board non-refractory;
Four, circuit board of the present invention has good 3D connection performance and good thermal conductivity simultaneously, for electronic package provides new technology platform.
Description of drawings
Fig. 1 is a flow chart of the present invention.
Embodiment
Below in conjunction with embodiment and description of drawings the present invention is done and to further describe:
Embodiment 1
The manufacturing approach of the interconnected flexible electric circuit board of a kind of ceramic base of the present invention may further comprise the steps:
A, making aluminium nitride ceramics circuit board:
A1, in the aluminium nitride ceramics copper-clad plate of pre-treatment, making layer pattern;
Mainly comprise: supplied materials inspection → oil removing → pickling → oven dry → press mold → exposure → development → etching → striping → operations such as oven dry;
Concrete way is: the aluminium nitride ceramics copper-clad base plate to through passed examination carries out surface clean; With sodium peroxydisulfate the copper layer that covers of aluminium nitride ceramics copper-clad base plate is carried out little erosion; The greasy dirt and surperficial oxide on the copper layer covered in removal; This cleans circuit board substrate with respect to the method that adopts physics, more effectively prevents the damage of aluminium nitride ceramics copper-clad base plate, dries through after the aluminium nitride ceramics copper-clad base plate pickling of little erosion; Printing one deck photosensitive-ink or the subsides light-sensitive surface on the copper layer of covering at the aluminium nitride ceramics copper-clad base plate; Treat after photosensitive-ink or the light-sensitive surface drying, paint the circuitous pattern film with the light of having made and be placed on covering on the copper layer of aluminium nitride ceramics copper-clad base plate, carry out circuit pattern exposure; Aluminium nitride ceramics copper-clad base plate to after the exposure develops; Demonstrate through exposure light solid circuitous pattern, the aluminium nitride ceramics copper-clad base plate after adopting etching solution to above-mentioned exposure carries out etching, wherein will carry out three etchings; Etching speed is undertaken by 1.5m/min for the first time; Etching speed is undertaken by 2.0m/min for the second time, and etching speed is undertaken by 5.5m/min for the third time, moves back film oven dry back and removes defective products with the automated optical Equipment Inspection; Cleaning, drying gets into next step operation then;
A2, utilize laser drilling device on preposition, to offer location hole;
Mainly comprise: laser drilling → cleaning → operations such as oven dry;
Specific practice is: utilize laser drilling device to offer the location hole that connects upper and lower two-tier circuit plate in the place of setting to above-mentioned aluminium nitride ceramics copper-clad base plate, after cleaning up and dry with clean water, get into next step operation;
B, making flexible electric circuit board:
B1, flexibility coat copper plate is cut into the size suitable with ceramic copper-clad plate;
Because flexibility coat copper plate is a web-like, so adopt the weblike material automatic blanking machine that flexibility coat copper plate is cut out;
B2, employing machine drilling, methods such as radium-shine laser drill or punching are offered the hole of implementing the flexibility coat copper plate upper and lower faces on the flexibility coat copper plate preposition; These holes can be location hole, instrument connection or hole in piece part etc., and hole of the present invention is mainly hole in piece part.
B3, plating one deck conductive layer makes it become via on above-mentioned hole;
Flexibility coat copper plate after boring is two-layer up and down leads the real conducting of copper body; Must on borehole wall, plate conductive layer metallizes the resin of the non-conductor part of hole wall; To carry out electro-coppering operation afterwards, accomplish the metal hole wall that enough conducts electricity and weld; Remove dirt in the hole after the boring earlier, sink copper then, carry out full plate copper facing behind the heavy copper, carry out the full plate copper facing of secondary after pasting the dried film, move back the film then; The copper that the wherein inferior complete copper-plated purpose of plate is the thickening hole wall is thick.
B4, the circuit diagram on the film is transferred on the flexibility coat copper plate;
Mainly comprise pad pasting → exposure → development → etching → five operations such as stripping;
Concrete way is:
Pad pasting:
After making the via completion, utilize heating roller pressing mode, the dry film of on the flexibility coat copper plate of cleaning, fitting is as etching resistance agent; Because dry film is to ultraviolet-sensitive, promptly react for avoiding dry film not fit accomplishing, dry film is fitted should operation in the yellow light area environment; Wherein used dry film is meant as photosensitive resist agent anti-etching or that anti-plate is used, is made up of polyester film, photoresist film and three parts of polyethylene protective film.
Wherein photoresist is a kind of photosensitive material.Photoresist film is the main body of dry film, is mostly the photosensitive material of negativity, and its thickness is looked its purposes difference has some kinds of specifications, and the thinnest can be tens microns, and the thickest reaches 100 microns.The main component of photosensitive layer photoresist is photo polymerization monomer, light trigger, binding agent.
Polyester film is the carrier that supports photosensitive layer, makes the photosensitive material photoresist apply film forming, and thickness is generally 25um.Polyester film is removed before developing after exposure.Oxygen spreads to resist layer when preventing to make public, and destroys free radical, causes that photosensitivity descends.
Polyethylene protective film is the diaphragm that covers on the photosensitive layer, prevents dirt pollution dry films such as dust, and avoids when the volume film, and is inter-adhesive between every layer of resist film.Polyethylene protective film is removed when pad pasting.
Exposure:
The flexible copper-clad panel material that pad pasting is accomplished utilizes the mode of image transfer, and the circuit pattern on the work egative film (film) that design is accomplished adopts fully automatic exposure machine or semi-automatic exposure machine with ultraviolet exposure, is transferred on the dry film.The work egative film (film) of exposure usefulness is taked the negative film mode, and the part of hollowed-out translucent is circuit and Liu Tong district.
Develop:
The flexible copper-clad panel material that exposure is accomplished, ultraviolet irradiation be the partially polymerized sclerosis of dry film in zone excessively.Through the specific liquid medicine Na that develops
2CO
3The weakly alkaline solution flushing can expose material copper layer with partly washing out without light stiffening.Through the material that develops and accomplish, can find out the shape, the form that form circuit.
Etching:
Through the flexible copper-clad panel material that develops and accomplish, through the acid CuCl of etching liquid medicine
2Flushing, can the copper layer exposed part without dry film protection be removed, and stay protected circuit.
The material that etching is accomplished promptly is that our required line type becomes, and etching is the crucial processing procedure of circuit moulding.
Stripping:
Material through etching is accomplished still leaves the dry film that has hardened on the plate face, utilize stripping soup NaOH, and dry film is separated with material fully, and first pickling neutralization washing again makes circuit exposed fully, and the copper layer exposes fully.
B5, on the flexibility coat copper plate of completing steps b4 the hot pressing layer protecting film;
Be protection circuit, on the line the coating layer protecting film.Diaphragm not only plays resistance weldering effect, and makes flexible circuit not receive the erosion of dust, moisture, chemicals and reduce stress influence in the BENDING PROCESS, and diaphragm can be restrained oneself long-term deflection.During operation, the coverlay that will pass through boring, windowing is behind aligned position, and false then being attached on the copper foil material that clean crosses is pressed onto on the flexible board in HTHP lower floor again.
B6, that its naked copper surface to be welded of flexibility coat copper plate of hot pressing diaphragm is carried out the exposed position of surface treatment protection is not oxidized;
Be coated with machine aided weldering protective agent, to protect exposed part not reoxidize and to guarantee to meet performance requirement.
B7, on above-mentioned flexibility coat copper plate according to designing requirement silk-screen character;
On the one side that flexibility coat copper plate is not with the aluminium nitride ceramics circuit board combines according to the designing requirement silk-screen on character such as numeral number;
B8, the processing combination of on above-mentioned flexibility coat copper plate, assembling secondary material or auxiliary material;
Wherein said secondary material or auxiliary material are stiffening plate, one or both in the gum.
C, pressing aluminium nitride ceramics circuit board and flexible electric circuit board:
C1, between aluminium nitride ceramics circuit board and flexible electric circuit board, dielectric layer is set;
Described dielectric layer PP layer and PI layer.
The mode of c2, employing hot pressing will be pressed into one at aluminium nitride ceramics circuit board and flexible electric circuit board, become multi-layer sheet;
Realize that through prolonging hot pressing time and combining to reduce pressing-in temp aluminium nitride ceramics circuit board and flexible electric circuit board combine closely.
Adopt laser drilling device to make the through hole that runs through said multi-layer sheet upper and lower surface on D, the multi-layer sheet in step C, adopt the electric conducting material perforation, oven dry makes it become via then;
Utilize laser drilling device to offer the through hole that connects the multi-layer sheet upper and lower surface, after cleaning up and dry with clean water, utilize silver slurry grout in the place of setting; Fill up the silver slurry to the hole that needs conducting; Wherein said silver slurry is the commercially available prod, and drying forming makes it become via then.
E, do not need the printing ink of solder-mask printing in the localities of soldering of electronic components at above-mentioned multi-layer sheet;
After above-mentioned multi-layer sheet carries out cleaning, drying, do not needing the local solder-mask printing printing ink of soldering of electronic components; In drying baker, make public after the low temperature prebake and develop, and then carry out hot curing; When solder-mask printing printing ink can effectively prevent soldering of electronic components, scolding tin was bonded at non-welding zone, and solder-mask printing printing ink some conductting layers on also can protective circuit plate erosion of not making moist simultaneously increases the aesthetic measure of product simultaneously;
F, on the multi-layer sheet preposition character silk printing;
According to designing requirement in the character silk printing hot curing then in the localities accordingly of above-mentioned multi-layer sheet; So that production and processing is again at corresponding local soldering of electronic components; For the assembling production of circuit board brings convenience.
G, adopt laser cutting device to cut into predetermined specification to circuit board, after detection of electrons, the qualified ceramic base flex-rigid multiple-layer circuit board that is is packed then and is got final product with the clear water cleaning and drying.
Embodiment 2
The manufacturing approach of the interconnected flexible electric circuit board of a kind of ceramic base of the present invention may further comprise the steps:
A, making aluminium nitride ceramics circuit board:
A1, in the aluminium nitride ceramics copper-clad plate of pre-treatment, making layer pattern;
Mainly comprise: supplied materials inspection → oil removing → pickling → oven dry → press mold → exposure → development → etching → striping → operations such as oven dry;
Concrete way is: the aluminium nitride ceramics copper-clad base plate to through passed examination carries out surface clean; With ammonium persulfate the copper layer that covers of aluminium nitride ceramics copper-clad base plate is carried out little erosion; The greasy dirt and surperficial oxide on the copper layer covered in removal; This cleans circuit board substrate with respect to the method that adopts physics, more effectively prevents the damage of aluminium nitride ceramics copper-clad base plate, dries through after the aluminium nitride ceramics copper-clad base plate pickling of little erosion; Printing one deck photosensitive-ink or the subsides light-sensitive surface on the copper layer of covering at the aluminium nitride ceramics copper-clad base plate; Treat after photosensitive-ink or the light-sensitive surface drying, paint the circuitous pattern film with the light of having made and be placed on covering on the copper layer of aluminium nitride ceramics copper-clad base plate, carry out circuit pattern exposure; Aluminium nitride ceramics copper-clad base plate to after the exposure develops; Demonstrate through exposure light solid circuitous pattern, the aluminium nitride ceramics copper-clad base plate after adopting etching machine to above-mentioned exposure carries out etching, wherein will carry out three etchings; Etching speed is undertaken by 1.5m/min for the first time; Etching speed is undertaken by 2.0m/min for the second time, and etching speed is undertaken by 5.5m/min for the third time, moves back film oven dry back and removes defective products with the automated optical Equipment Inspection; Cleaning, drying gets into next step operation then;
A2, utilize laser drilling device on preposition, to offer location hole;
Mainly comprise: laser drilling → cleaning → operations such as oven dry;
Specific practice is: utilize laser drilling device to offer the location hole that connects upper and lower two-tier circuit plate in the place of setting to above-mentioned aluminium nitride ceramics copper-clad base plate, after cleaning up and dry with clean water, get into next step operation;
B, making flexible electric circuit board:
B1, flexibility coat copper plate is cut into the size suitable with ceramic copper-clad plate;
Because flexibility coat copper plate is a web-like, so adopt the weblike material automatic blanking machine that flexibility coat copper plate is cut out;
Methods such as b2, using plasma etching, chemical etching or photic pore-forming are offered the hole of implementing the flexibility coat copper plate upper and lower faces on the flexibility coat copper plate preposition; These holes can be location hole, instrument connection or hole in piece part etc., and hole of the present invention is mainly hole in piece part.
B3, plating one deck conductive layer makes it become via on above-mentioned hole;
Flexibility coat copper plate after boring is two-layer up and down leads the real conducting of copper body; Must on borehole wall, plate conductive layer metallizes the resin of the non-conductor part of hole wall; To carry out electro-coppering operation afterwards, accomplish the metal hole wall that enough conducts electricity and weld; Remove dirt in the hole after the boring earlier, sink copper then, carry out full plate copper facing behind the heavy copper, carry out the full plate copper facing of secondary after pasting the dried film, move back the film then; Wherein the copper-plated purpose of the full plate of secondary be the thickening hole wall copper thick.
B4, the circuit diagram on the film is transferred on the flexibility coat copper plate;
Mainly comprise pad pasting → exposure → development → etching → five operations such as stripping;
Concrete way is:
Pad pasting:
After making the via completion, utilize heating roller pressing mode, the dry film of on the flexibility coat copper plate of cleaning, fitting is as etching resistance agent; Because dry film is to ultraviolet-sensitive, promptly react for avoiding dry film not fit accomplishing, dry film is fitted should operation in the yellow light area environment; Wherein used dry film is meant as photosensitive resist agent anti-etching or that anti-plate is used, is made up of polyester film, photoresist film and three parts of polyethylene protective film.
Wherein photoresist is a kind of photosensitive material.Photoresist film is the main body of dry film, is mostly the photosensitive material of negativity, and its thickness is looked its purposes difference has some kinds of specifications, and the thinnest can be tens microns, and the thickest reaches 100 microns.The main component of photosensitive layer photoresist is photo polymerization monomer, light trigger, binding agent.
Polyester film is the carrier that supports photosensitive layer, makes the photosensitive material photoresist apply film forming, and thickness is generally 25um.Polyester film is removed before developing after exposure.Oxygen spreads to resist layer when preventing to make public, and destroys free radical, causes that photosensitivity descends.
Polyethylene protective film is the diaphragm that covers on the photosensitive layer, prevents dirt pollution dry films such as dust, and avoids when the volume film, and is inter-adhesive between every layer of resist film.Polyethylene protective film is removed when pad pasting.
Exposure:
The flexible copper-clad panel material that pad pasting is accomplished utilizes the mode of image transfer, and the circuit pattern on the work egative film (film) that design is accomplished adopts fully automatic exposure machine or semi-automatic exposure machine with ultraviolet exposure, is transferred on the dry film.The work egative film (film) of exposure usefulness is taked the negative film mode, and the part of hollowed-out translucent is circuit and Liu Tong district.
Develop:
The flexible copper-clad panel material that exposure is accomplished, ultraviolet irradiation be the partially polymerized sclerosis of dry film in zone excessively.Through the specific liquid medicine K that develops
2CO
3The weakly alkaline solution flushing can expose material copper layer with partly washing out without light stiffening.Through the material that develops and accomplish, can find out the shape, the form that form circuit.
Etching:
Through the flexible copper-clad panel material that develops and accomplish, through the acid CuCl of etching liquid medicine
2Flushing, can the copper layer exposed part without dry film protection be removed, and stay protected circuit.
The material that etching is accomplished promptly is that our required line type becomes, and etching is the crucial processing procedure of circuit moulding.
Stripping:
Material through etching is accomplished still leaves the dry film that has hardened on the plate face, utilize stripping soup NaOH, and dry film is separated with material fully, and right pickling neutralization washing again makes circuit exposed fully, and the copper layer exposes fully.
B5, on the flexibility coat copper plate of completing steps b4 the hot pressing layer protecting film;
Be protection circuit, on the line the coating layer protecting film.Diaphragm not only plays resistance weldering effect, and makes flexible circuit not receive the erosion of dust, moisture, chemicals and reduce stress influence in the BENDING PROCESS, and diaphragm can be restrained oneself long-term deflection.During operation, the coverlay that will pass through boring, windowing is behind aligned position, and false then being attached on the copper foil material that clean crosses is pressed onto on the flexible board in HTHP lower floor again.
B6, that its naked copper surface to be welded of flexibility coat copper plate of hot pressing hot pressing diaphragm is carried out the exposed position of surface treatment protection is not oxidized;
Plate the coats of metal such as leypewter, nickel, gold, tin, silver, palladium with plating/chemical plating mode, to protect exposed part not reoxidize and to guarantee to meet performance requirement.
B7, on above-mentioned flexibility coat copper plate according to designing requirement silk-screen character;
On the one side that flexibility coat copper plate is not with the aluminium nitride ceramics circuit board combines according to the designing requirement silk-screen on character such as numeral number;
B8, the processing combination of on above-mentioned flexibility coat copper plate, assembling secondary material or auxiliary material;
Wherein said secondary material or auxiliary material are that part mounts, conductive fabric, one or more in drawstring or the tilt material.
C, pressing aluminium nitride ceramics circuit board and flexible electric circuit board:
C1, between aluminium nitride ceramics circuit board and flexible electric circuit board, dielectric layer is set;
Described dielectric layer PP layer and PI layer.
The mode of c2, employing hot pressing will be pressed into one at aluminium nitride ceramics circuit board and flexible electric circuit board, become multi-layer sheet;
Realize that through prolonging hot pressing time and combining to reduce pressing-in temp aluminium nitride ceramics circuit board and flexible electric circuit board combine closely.(a concrete hot pressing time and the pressing-in temp given)
Adopt laser drilling device to make the through hole that runs through said multi-layer sheet upper and lower surface on D, the multi-layer sheet in step C, adopt the electric conducting material perforation, oven dry makes it become via then;
Utilize laser drilling device to offer the through hole that connects the multi-layer sheet upper and lower surface, after cleaning up and dry with clean water, utilize copper slurry grout in the place of setting; Fill up the copper slurry to the hole that needs conducting; Wherein said copper slurry is the commercially available prod, and drying forming makes it become via then.
E, do not need the printing ink of solder-mask printing in the localities of soldering of electronic components at above-mentioned multi-layer sheet;
After above-mentioned multi-layer sheet carries out cleaning, drying, do not needing the local solder-mask printing printing ink of soldering of electronic components; In drying baker, make public after the low temperature prebake and develop, and then carry out hot curing; When solder-mask printing printing ink can effectively prevent soldering of electronic components, scolding tin was bonded at non-welding zone, and solder-mask printing printing ink some conductting layers on also can protective circuit plate erosion of not making moist simultaneously increases the aesthetic measure of product simultaneously;
F, on the multi-layer sheet preposition character silk printing;
According to designing requirement in the character silk printing hot curing then in the localities accordingly of above-mentioned multi-layer sheet; So that production and processing is again at corresponding local soldering of electronic components; For the assembling production of circuit board brings convenience.
G, adopt laser cutting device to cut into predetermined specification to circuit board, after detection of electrons, the qualified ceramic base flex-rigid multiple-layer circuit board that is is packed then and is got final product with the clear water cleaning and drying.
Claims (10)
1. the manufacturing approach of the interconnected flexible electric circuit board of ceramic base is characterized in that may further comprise the steps:
A, making aluminium nitride ceramics circuit board:
A1, in the aluminium nitride ceramics copper-clad plate of pre-treatment, making layer pattern;
A2, utilize laser drilling device on preposition, to offer location hole;
B, making flexible electric circuit board:
B1, flexibility coat copper plate is cut into the size suitable with ceramic copper-clad plate;
B2, on the flexibility coat copper plate preposition, offer the hole of implementing the flexibility coat copper plate upper and lower faces;
B3, plating one deck conductive layer makes it become via on above-mentioned hole;
B4, the circuit diagram on the film is transferred on the flexibility coat copper plate;
B5, on the flexibility coat copper plate of completing steps b4 the hot pressing layer protecting film;
B6, that its naked copper surface to be welded of flexibility coat copper plate of hot pressing diaphragm is carried out the exposed position of surface treatment protection is not oxidized;
B7, on above-mentioned flexibility coat copper plate according to designing requirement silk-screen character;
B8, the processing combination of on above-mentioned flexibility coat copper plate, assembling secondary material or auxiliary material;
C, pressing aluminium nitride ceramics circuit board and flexible electric circuit board:
C1, between aluminium nitride ceramics circuit board and flexible electric circuit board, dielectric layer is set;
The mode of c2, employing hot pressing is pressed into one with aluminium nitride ceramics circuit board and flexible electric circuit board, becomes multi-layer sheet;
Adopt laser drilling device to make the through hole that runs through said multi-layer sheet upper and lower surface on D, the multi-layer sheet in step C, adopt the electric conducting material perforation, oven dry makes it become via then;
E, do not need the printing ink of solder-mask printing in the localities of soldering of electronic components at above-mentioned multi-layer sheet;
F, on the multi-layer sheet preposition character silk printing;
G, employing laser cutting device cut into predetermined specification to circuit board, promptly get ceramic base flex-rigid multiple-layer circuit board.
2. the manufacturing approach of the interconnected flexible electric circuit board of a kind of ceramic base according to claim 1 is characterized in that the pre-treatment described in the steps A comprises the operation of inspection to the ceramic copper-clad board raw material, oil removing, pickling, oven dry.
3. the manufacturing approach of the interconnected flexible electric circuit board of a kind of ceramic base according to claim 1; It is characterized in that the making internal layer figure described in the steps A is included in covers one deck light-sensitive medium on the copper layer of ceramic copper-clad plate; The film of on light-sensitive medium, placing the band predetermined pattern makes public, and develops then, etching, dries after moving back film.
4. the manufacturing approach of the interconnected flexible electric circuit board of a kind of ceramic base according to claim 1 is characterized in that the conductive layer described in the step b3 is a kind of in copper coating or the silvering.
5. the manufacturing approach of the interconnected flexible electric circuit board of a kind of ceramic base according to claim 1 is characterized in that the transfer of circuit diagram described in the step b4 comprises pad pasting, exposure, development, etching, five operations of stripping.
6. the manufacturing approach of the interconnected flexible electric circuit board of a kind of ceramic base according to claim 1 is characterized in that the diaphragm described in the step b5 is the insulating properties material.
7. the manufacturing approach of the interconnected flexible electric circuit board of a kind of ceramic base according to claim 1 is characterized in that the surface treatment described in the step b6 is to be coated with a kind of in machine aided weldering protective agent or the plated metal coating.
8. the manufacturing approach of the interconnected flexible electric circuit board of a kind of ceramic base according to claim 1 is characterized in that pair material described in the step b8 or auxiliary material are that stiffening plate, gum, part mount, in conductive fabric, drawstring or the tilt material one or more.
9. the manufacturing approach of the interconnected flexible electric circuit board of a kind of ceramic base according to claim 1 is characterized in that the dielectric layer described in the step C is PP layer and PI layer.
10. the manufacturing approach of the interconnected flexible electric circuit board of a kind of ceramic base according to claim 1 is characterized in that a kind of in silver slurry or the copper slurry of the electric conducting material described in the step D.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102490736A CN101990371B (en) | 2010-08-03 | 2010-08-03 | Manufacture method of ceramic-based interconnection flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102490736A CN101990371B (en) | 2010-08-03 | 2010-08-03 | Manufacture method of ceramic-based interconnection flexible circuit board |
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| CN101990371B true CN101990371B (en) | 2012-08-22 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101990371B (en) * | 2010-08-03 | 2012-08-22 | 广东达进电子科技有限公司 | Manufacture method of ceramic-based interconnection flexible circuit board |
| CN101990373B (en) * | 2010-08-03 | 2012-08-22 | 广东达进电子科技有限公司 | Method for manufacturing ceramic-based interconnected rigid flexible combined multilayer circuit board |
| US10485107B2 (en) | 2016-12-01 | 2019-11-19 | Schlumberger Technology Corporation | Downhole equipment using flexible circuits |
| CN107645834A (en) * | 2017-08-30 | 2018-01-30 | 景旺电子科技(龙川)有限公司 | A kind of etching method substitutes machining making and destroyed or force to yield method for product |
| CN108161253B (en) * | 2017-11-13 | 2019-10-15 | 上海申和热磁电子有限公司 | A kind of method of aperture on double-sided copper-clad ceramic substrate single side copper foil |
| CN109819585A (en) * | 2017-11-20 | 2019-05-28 | 鹏鼎控股(深圳)股份有限公司 | Circuit board and preparation method thereof |
| CN112888170A (en) * | 2020-12-30 | 2021-06-01 | 厦门柔性电子研究院有限公司 | PI (polyimide) reinforcement processing method, manufacturing method of flexible circuit board with PI reinforcement and flexible circuit board |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0282625A2 (en) * | 1987-03-19 | 1988-09-21 | Furukawa Denki Kogyo Kabushiki Kaisha | Method for producing rigid-type multilayer printed wiring board |
| CN101304639A (en) * | 2008-05-21 | 2008-11-12 | 松维线路板（深圳）有限公司 | Method for producing printed circuit board |
| WO2008146487A1 (en) * | 2007-05-29 | 2008-12-04 | Panasonic Corporation | Circuit board and method for manufacturing the same |
| CN101711098A (en) * | 2009-04-16 | 2010-05-19 | 深圳市精诚达电路有限公司 | Twice laminating technique of flexible printed circuits |
| CN101990371A (en) * | 2010-08-03 | 2011-03-23 | 广东达进电子科技有限公司 | Manufacture method of ceramic-based interconnection flexible circuit board |
-
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0282625A2 (en) * | 1987-03-19 | 1988-09-21 | Furukawa Denki Kogyo Kabushiki Kaisha | Method for producing rigid-type multilayer printed wiring board |
| WO2008146487A1 (en) * | 2007-05-29 | 2008-12-04 | Panasonic Corporation | Circuit board and method for manufacturing the same |
| CN101304639A (en) * | 2008-05-21 | 2008-11-12 | 松维线路板（深圳）有限公司 | Method for producing printed circuit board |
| CN101711098A (en) * | 2009-04-16 | 2010-05-19 | 深圳市精诚达电路有限公司 | Twice laminating technique of flexible printed circuits |
| CN101990371A (en) * | 2010-08-03 | 2011-03-23 | 广东达进电子科技有限公司 | Manufacture method of ceramic-based interconnection flexible circuit board |
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