CN106231883A - Pcb board assembly and there is its mobile terminal - Google Patents
Pcb board assembly and there is its mobile terminal Download PDFInfo
- Publication number
- CN106231883A CN106231883A CN201610607446.XA CN201610607446A CN106231883A CN 106231883 A CN106231883 A CN 106231883A CN 201610607446 A CN201610607446 A CN 201610607446A CN 106231883 A CN106231883 A CN 106231883A
- Authority
- CN
- China
- Prior art keywords
- heat
- battery
- conducting layer
- pcb board
- board assembly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/60—Heating or cooling; Temperature control
- H01M10/61—Types of temperature control
- H01M10/613—Cooling or keeping cold
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/60—Heating or cooling; Temperature control
- H01M10/65—Means for temperature control structurally associated with the cells
- H01M10/655—Solid structures for heat exchange or heat conduction
- H01M10/6554—Rods or plates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Telephone Set Structure (AREA)
Abstract
The invention discloses a kind of pcb board assembly and have its mobile terminal, wherein, pcb board assembly includes plate body, battery and the first heat-conducting layer, and plate body is provided with radome, and at least part of battery is located on radome, and the first heat-conducting layer is folded between radome and battery.Pcb board assembly according to the present invention, by at least part of battery is located on radome, and the first heat-conducting layer is set between radome and battery, heat on battery can be importing directly on radome by the first heat-conducting layer, and dispelled the heat by radome, the speed of battery heat radiation can be mentioned, thus mention the life-span of battery.
Description
Technical field
The present invention relates to technical field of mobile terminals, especially relate to a kind of pcb board assembly and there is its mobile terminal.
Background technology
In correlation technique, cell phone mainboard is provided with radome, and battery is located at outside mainboard and is fixed on interior of mobile phone with colloid,
Battery can be delivered to the heat of battery on shell dispel the heat by colloid, but the thermal resistance of colloid is relatively big, dispels the heat slower.
Summary of the invention
It is contemplated that one of technical problem solved the most to a certain extent in correlation technique.To this end, the present invention carries
Go out a kind of pcb board assembly, the advantage that described pcb board assembly has battery rapid heat dissipation.
The present invention also proposes a kind of mobile terminal, and described mobile terminal includes above-mentioned pcb board assembly.
Pcb board assembly according to embodiments of the present invention, including: plate body, described plate body is provided with radome；Battery, at least
The described battery of part is located on described radome；With the first heat-conducting layer, described first heat-conducting layer is folded in described radome and institute
State between battery.
Pcb board assembly according to embodiments of the present invention, by being located at least part of battery on radome, and at radome
And the first heat-conducting layer is set between battery, the heat on battery can be importing directly on radome by the first heat-conducting layer,
And dispelled the heat by radome, the speed of battery heat radiation can be mentioned, thus mention the life-span of battery.
According to some embodiments of the present invention, described first heat-conducting layer is silica gel heat-conducting layer.
According in some embodiments of the present invention, described first heat-conducting layer is metal conducting strip.
Mobile terminal according to embodiments of the present invention, including: housing；Above-mentioned pcb board assembly, described pcb board assembly sets
In described housing.
Mobile terminal according to embodiments of the present invention, by arranging above-mentioned pcb board assembly, can improve battery of mobile terminal
Radiating effect, thus improve the life-span of battery, and then improve the life-span of mobile terminal.
According to some embodiments of the present invention, the described battery of described pcb board assembly contacts with described shell inner surface.
In some embodiments of the invention, the position described battery contacted with described shell inner surface is coated with
Two heat-conducting layers.
In some embodiments of the invention, described second heat-conducting layer is silica gel heat-conducting layer.
According to some embodiments of the present invention, between the described battery of described pcb board assembly and described shell inner surface have
Gap.
In some embodiments of the invention, also to include that heat-conducting piece, described heat-conducting piece are folded in described for described mobile terminal
Between battery and described shell inner surface.
Accompanying drawing explanation
Fig. 1 is the structural representation of pcb board assembly according to embodiments of the present invention.
Reference:
Pcb board assembly 100, plate body 1, radome 2, battery 3.
Detailed description of the invention
Embodiments of the invention are described below in detail, and the example of described embodiment is shown in the drawings.Below with reference to
The embodiment that accompanying drawing describes is exemplary, it is intended to is used for explaining the present invention, and is not considered as limiting the invention.
Below with reference to Fig. 1, pcb board assembly 100 according to embodiments of the present invention is described.
As it is shown in figure 1, pcb board assembly 100 according to embodiments of the present invention, including plate body 1, battery 3 and the first heat-conducting layer.
Specifically, plate body 1 is provided with radome 2, and radome 2 can be used to shield electronic signal, can be on plate body 1
Element plays shielding action.At least partly battery 3 is located on radome 2, and the first heat-conducting layer is folded between radome 2 and battery 3.
Thus, the heat on battery 3 can be importing directly on radome 2 by the first heat-conducting layer, and is dissipated by radome 2
Heat, can improve the radiating rate of battery 3, thus improve the life-span of battery 3.
Pcb board assembly 100 according to embodiments of the present invention, by least part of battery 3 is located on radome 2, and
First heat-conducting layer is set between radome 2 and battery 3, the heat on battery 3 can be importing directly into by the first heat-conducting layer
On radome 2, and dispelled the heat by radome 2, the speed of battery 3 heat radiation can be mentioned, thus mention the life-span of battery 3.
In some embodiments of the invention, the first heat-conducting layer is silica gel heat-conducting layer, and such as, the first heat-conducting layer can be to lead
Hot silica gel.Silica gel heat-conducting layer has a high thermal conductivity, splendid heat conductivity, good electricity property absolutely, wider use temperature, well
Stability in use, relatively low denseness and good workability.Certainly, the invention is not restricted to this, the first heat-conducting layer can also be
Metal conducting strip.Metal conducting strip has preferable heat conductivity equally.
Below with reference to Fig. 1, mobile terminal according to embodiments of the present invention is described.
As it is shown in figure 1, mobile terminal according to embodiments of the present invention, including housing and above-mentioned pcb board assembly 100, wherein,
Pcb board assembly 100 is located in housing.Mobile terminal according to embodiments of the present invention, by arranging above-mentioned pcb board assembly 100, can
With the radiating effect of battery 3 in raising mobile terminal, thus improve the life-span of battery 3, and then improve the life-span of mobile terminal.
In some embodiments of the invention, the battery 3 of pcb board assembly 100 contacts with shell inner surface.Thus, battery 3
On heat for delivery on housing, and can be dispelled the heat by housing, further increase the radiating efficiency of battery 3, thus
Further increase the life-span of battery 3, and then improve the life-span of mobile terminal.
Further, position battery 3 contacted with shell inner surface is coated with the second heat-conducting layer.Thus, on battery 3
Heat can be delivered on housing by the second heat-conducting layer, then dispelled the heat by housing, improve between battery 3 and housing
Heat transfer efficiency, thus improve the radiating efficiency of battery 3, and then improve the life-span of battery 3 and the life-span of mobile terminal.
Specifically, the second heat-conducting layer is silica gel heat-conducting layer.Such as, the first heat-conducting layer can be heat conductive silica gel.Silica gel heat conduction
Layer has a high thermal conductivity, splendid heat conductivity, good electricity property absolutely, wider use temperature, and good stability in use is relatively low
Denseness and good workability.
In some embodiments of the invention, the battery 3 of pcb board assembly 100 has gap with shell inner surface.Thus may be used
So that mobile terminal internal structure is arranged more reasonable, compact.Alternatively, mobile terminal also includes heat-conducting piece, heat-conducting piece sandwiched
Between battery 3 and shell inner surface.Thus, it is possible to quickly the heat on battery 3 is conducted to housing by heat-conducting piece,
And dispelled the heat by housing, improve the radiating efficiency of battery 3, thus improve the life-span of battery 3, and then improve mobile terminal
Life-span.
Below with reference to Fig. 1, the mobile terminal according to one specific embodiment of the present invention is described, described below the most exemplary
, it is intended to it is used for explaining the present invention, and is not considered as limiting the invention.
As it is shown in figure 1, mobile terminal according to embodiments of the present invention, including housing and pcb board assembly 100, pcb board assembly
100 are located in housing.
Wherein, pcb board assembly 100 includes plate body 1, battery 3 and the first heat-conducting layer.Plate body 1 is provided with for shielded signal
Radome 2, battery 3 is located on radome 2, and is provided with the first heat-conducting layer between radome 2 and battery 3, thus, on battery 3
Heat quickly can be imported on radome 2 by the first heat-conducting layer, and dispelled the heat by radome 2, can improve
The radiating efficiency of battery 3, thus improve the service life of battery 3.Wherein, the first heat-conducting layer is silica gel heat-conducting layer.
It addition, the battery 3 on pcb board assembly 100 contacts with the inner surface of housing, and connect with shell inner surface on battery 3
The position touched is coated with the second heat-conducting layer, and thus, the heat of battery 3 can also quickly import to shell by the second heat-conducting layer
On body, and dispelled the heat by housing, further increasing the radiating efficiency of battery 3, thus further increase battery 3
Life-span, and then improve the life-span of mobile terminal.Wherein, the second heat-conducting layer is silica gel heat-conducting layer.
In describing the invention, it is to be understood that orientation or the position relationship of the instruction such as term " interior ", " outward " are base
In orientation shown in the drawings or position relationship, it is for only for ease of the description present invention and simplifies description rather than instruction or hint
The device of indication or element must have specific orientation, with specific azimuth configuration and operation, therefore it is not intended that to this
The restriction of invention.Additionally, term " first ", " second " are only used for describing purpose, and it is not intended that instruction or imply relatively heavy
The property wanted or the implicit quantity indicating indicated technical characteristic.Thus, define " first ", the feature of " second " can be expressed
Or implicitly include at least one this feature.
In the present invention, unless otherwise clearly defined and limited, term " install ", " being connected ", " connection ", " fixing " etc.
Term should be interpreted broadly, and connects for example, it may be fixing, it is also possible to be to removably connect, or integral；Can be that machinery connects
Connect, it is also possible to be electrical connection or each other can communication；Can be to be joined directly together, it is also possible to be indirectly connected to by intermediary, permissible
It is connection or the interaction relationship of two elements of two element internals, unless otherwise clear and definite restriction.For this area
For those of ordinary skill, above-mentioned term concrete meaning in the present invention can be understood as the case may be.
In the description of this specification, reference term " embodiment ", " some embodiments ", " example ", " specifically show
Example " or the description of " some examples " etc. means to combine this embodiment or example describes specific features, structure, material or spy
Point is contained at least one embodiment or the example of the present invention.In this manual, to the schematic representation of above-mentioned term not
Identical embodiment or example must be directed to.And, the specific features of description, structure, material or feature can be in office
One or more embodiments or example combine in an appropriate manner.Additionally, in the case of the most conflicting, the skill of this area
The feature of the different embodiments described in this specification or example and different embodiment or example can be tied by art personnel
Close and combination.
Although above it has been shown and described that embodiments of the invention, it is to be understood that above-described embodiment is example
Property, it is impossible to being interpreted as limitation of the present invention, those of ordinary skill in the art within the scope of the invention can be to above-mentioned
Embodiment is changed, revises, replaces and modification.
Claims (9)
1. a pcb board assembly, it is characterised in that including:
Plate body, described plate body is provided with radome；
Battery, at least part of described battery is located on described radome；With
First heat-conducting layer, described first heat-conducting layer is folded between described radome and described battery.
Pcb board assembly the most according to claim 1, it is characterised in that described first heat-conducting layer is silica gel heat-conducting layer.
Pcb board assembly the most according to claim 1, it is characterised in that described first heat-conducting layer is metal conducting strip.
4. a mobile terminal, it is characterised in that including:
Housing；
According to the pcb board assembly according to any one of claim 1-3, described pcb board assembly is located in described housing.
Mobile terminal the most according to claim 4, it is characterised in that the described battery of described pcb board assembly and described shell
Internal surface contacts.
Mobile terminal the most according to claim 5, it is characterised in that contact with described shell inner surface on described battery
Position is coated with the second heat-conducting layer.
Mobile terminal the most according to claim 6, it is characterised in that described second heat-conducting layer is silica gel heat-conducting layer.
Mobile terminal the most according to claim 4, it is characterised in that the described battery of described pcb board assembly and described shell
Internal surface has gap.
Mobile terminal the most according to claim 8, it is characterised in that described mobile terminal also includes heat-conducting piece, described in lead
Warmware is folded between described battery and described shell inner surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610607446.XA CN106231883A (en) | 2016-07-28 | 2016-07-28 | Pcb board assembly and there is its mobile terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610607446.XA CN106231883A (en) | 2016-07-28 | 2016-07-28 | Pcb board assembly and there is its mobile terminal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106231883A true CN106231883A (en) | 2016-12-14 |
Family
ID=57533933
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610607446.XA Pending CN106231883A (en) | 2016-07-28 | 2016-07-28 | Pcb board assembly and there is its mobile terminal |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106231883A (en) |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101516174A (en) * | 2008-02-21 | 2009-08-26 | 黄干元 | Radiating shield case |
| JP2010103342A (en) * | 2008-10-24 | 2010-05-06 | Mitsubishi Electric Corp | Heat dissipating structure of electronic component |
| JP2010171232A (en) * | 2009-01-23 | 2010-08-05 | Casio Computer Co Ltd | Electronic apparatus |
| JP2010258263A (en) * | 2009-04-27 | 2010-11-11 | Funai Electric Co Ltd | Heat dissipation mechanism of electronic apparatus |
| CN202210818U (en) * | 2011-09-22 | 2012-05-02 | 吴福兴 | Mobile phone provided with multifunctional accessory |
| US20140192480A1 (en) * | 2013-01-09 | 2014-07-10 | Motorola Mobility Llc | Mobile computing device dock station with headset jack heat pipe interface |
| CN203933704U (en) * | 2014-05-13 | 2014-11-05 | 启东优思电子有限公司 | Quick heat radiating type cell phone mainboard |
| CN104768340A (en) * | 2014-01-03 | 2015-07-08 | 富泰华精密电子（郑州）有限公司 | Mobile terminal |
| CN205179142U (en) * | 2015-12-01 | 2016-04-20 | 深圳市添正弘业科技有限公司 | Modified heat dissipation type mobile phone motherboard |
| CN205284011U (en) * | 2015-08-13 | 2016-06-01 | 东莞钱锋特殊胶粘制品有限公司 | Heat dissipation buffering conductive composite forming structure of mobile electronic device |
-
2016
- 2016-07-28 CN CN201610607446.XA patent/CN106231883A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101516174A (en) * | 2008-02-21 | 2009-08-26 | 黄干元 | Radiating shield case |
| JP2010103342A (en) * | 2008-10-24 | 2010-05-06 | Mitsubishi Electric Corp | Heat dissipating structure of electronic component |
| JP2010171232A (en) * | 2009-01-23 | 2010-08-05 | Casio Computer Co Ltd | Electronic apparatus |
| JP2010258263A (en) * | 2009-04-27 | 2010-11-11 | Funai Electric Co Ltd | Heat dissipation mechanism of electronic apparatus |
| CN202210818U (en) * | 2011-09-22 | 2012-05-02 | 吴福兴 | Mobile phone provided with multifunctional accessory |
| US20140192480A1 (en) * | 2013-01-09 | 2014-07-10 | Motorola Mobility Llc | Mobile computing device dock station with headset jack heat pipe interface |
| CN104768340A (en) * | 2014-01-03 | 2015-07-08 | 富泰华精密电子（郑州）有限公司 | Mobile terminal |
| CN203933704U (en) * | 2014-05-13 | 2014-11-05 | 启东优思电子有限公司 | Quick heat radiating type cell phone mainboard |
| CN205284011U (en) * | 2015-08-13 | 2016-06-01 | 东莞钱锋特殊胶粘制品有限公司 | Heat dissipation buffering conductive composite forming structure of mobile electronic device |
| CN205179142U (en) * | 2015-12-01 | 2016-04-20 | 深圳市添正弘业科技有限公司 | Modified heat dissipation type mobile phone motherboard |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20161214 |
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| RJ01 | Rejection of invention patent application after publication |