CN106211553A - Pcb board assembly and there is its mobile terminal - Google Patents
Pcb board assembly and there is its mobile terminal Download PDFInfo
- Publication number
- CN106211553A CN106211553A CN201610608583.5A CN201610608583A CN106211553A CN 106211553 A CN106211553 A CN 106211553A CN 201610608583 A CN201610608583 A CN 201610608583A CN 106211553 A CN106211553 A CN 106211553A
- Authority
- CN
- China
- Prior art keywords
- charging circuit
- radome
- pcb board
- board assembly
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Telephone Set Structure (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a kind of pcb board assembly and have its mobile terminal, wherein, pcb board assembly includes: plate body；Radome, radome is located on plate body；Be suitable for battery charging charging circuit, charging circuit is located on the outer surface of radome.Pcb board assembly according to embodiments of the present invention, by charging circuit is located on the outer surface of radome, heat on charging circuit can be directly passed on radome, and dispelled the heat by radome, the speed of charging circuit heat radiation can be accelerated, improve the life-span of charging circuit, meet the use demand of user.
Description
Technical field
The present invention relates to technical field of mobile terminals, especially relate to a kind of pcb board assembly and there is its mobile terminal.
Background technology
In correlation technique, charging quickly road is located on PCB main board, and the heat on charging quickly road can be by pcb board
Copper sheet dispels the heat, but radiating effect is bad, easily causes complete machine temperature and rises, reduces the life-span on charging quickly road, the most also shadow
Ring the experience of user.
Summary of the invention
It is contemplated that one of technical problem solved the most to a certain extent in correlation technique.To this end, the present invention carries
Going out a kind of pcb board assembly, described pcb board assembly has the advantage making charging circuit rapid heat dissipation.
The present invention also proposes a kind of mobile terminal, and described mobile terminal includes above-mentioned pcb board assembly.
Pcb board assembly according to embodiments of the present invention, including: plate body；Radome, described radome is located at described plate body
On；Be suitable for battery charging charging circuit, described charging circuit is located on the outer surface of described radome.
Pcb board assembly according to embodiments of the present invention, by charging circuit is located on the outer surface of radome, charged electrical
Heat on road can be directly passed on radome, and is dispelled the heat by radome, can accelerate charging circuit heat radiation
Speed, improves the life-span of charging circuit, meets the use demand of user.
According to some embodiments of the present invention, described charging circuit is located on the outer top wall surface of described radome.
In some embodiments of the invention, described charging circuit is positioned at the middle part of outer top wall surface of described radome.
According in some embodiments of the present invention, also including: insulating trip, described insulating trip folder is laid on described radome
And between described charging circuit and described radome.
In some embodiments of the invention, described insulating trip is PP sheet.
According to the mobile terminal of the present invention, including: housing；Above-mentioned pcb board assembly, described pcb board assembly is located at described
In housing.
Mobile terminal according to embodiments of the present invention, by arranging above-mentioned pcb board assembly, can improve pcb board assembly and dissipate
The speed of heat, thus improve the radiating rate of mobile terminal complete machine, control the temperature rise of mobile terminal complete machine, thus improve mobile whole
The life-span of end.
According to some embodiments of the present invention, the described charging circuit of described pcb board assembly connects with described shell inner surface
Touch.
In some embodiments of the invention, the position coating described charging circuit contacted with described shell inner surface
There is heat-conducting layer.
In some embodiments of the invention, described heat-conducting layer is silica gel heat-conducting layer.
According to some embodiments of the present invention, the described charging circuit of described pcb board assembly has with described shell inner surface
There is gap.
In some embodiments of the invention, also to include that heat-conducting piece, described heat-conducting piece are folded in described for described mobile terminal
Between charging circuit and described shell inner surface.
In some embodiments of the invention, described heat-conducting piece is silica gel heat-conducting piece.
Accompanying drawing explanation
Fig. 1 is the structural representation of pcb board assembly according to embodiments of the present invention；
Fig. 2 is the structural representation of mobile terminal according to embodiments of the present invention；
Fig. 3 is the structural representation of mobile terminal according to embodiments of the present invention.
Reference:
Mobile terminal 100,
Pcb board assembly 1,
Plate body 11, radome 12, charging circuit 13,
Housing 2, heat-conducting piece 3.
Detailed description of the invention
Embodiments of the invention are described below in detail, and the example of described embodiment is shown in the drawings.Below with reference to
The embodiment that accompanying drawing describes is exemplary, it is intended to is used for explaining the present invention, and is not considered as limiting the invention.
Below with reference to Fig. 1, pcb board assembly 1 according to embodiments of the present invention is described.
As it is shown in figure 1, pcb board assembly 1 according to embodiments of the present invention, including: plate body 11, radome 12 and charging circuit
13。
Specifically, radome 12 is located on plate body 11, and such as radome 12 can be welded on plate body 11, is mainly used to shield
Cover electronic signal.Charging circuit 13 is suitable for battery charging, and charging circuit 13 is located at the outer surface of radome 12.Radome 12 can
To play the effect of fin, the heat on charging circuit 13 can be importing directly on radome 12, and by radome 12
Dispel the heat, accelerate the speed of charging circuit 13 heat radiation, improve the life-span of charging circuit 13, meet the use demand of user.
In correlation technique, charging circuit is located on PCB main board, and is dispelled the heat by the copper sheet on PCB main board, but
So, the radiating rate of charging circuit is slower, it is not easy to heat radiation, and the temperature being easily caused complete machine rises, and reduces charging circuit
Life-span.
Pcb board assembly 1 according to embodiments of the present invention, by charging circuit 13 being located on the outer surface of radome 12,
Heat on charging circuit 13 can be directly passed on radome 12, and is dispelled the heat by radome 12, can accelerate to fill
The speed of electricity circuit 13 heat radiation, improves the life-span of charging circuit 13, meets the use demand of user.
In some embodiments of the invention, as it is shown in figure 1, charging circuit 13 is located on the outer roof of radome 12.Screen
Cover cover 12 and be welded on plate body 11 for shielded signal, electric elements etc. between radome 12 and plate body 11, can be provided with, when
When charging circuit 13 is located on the outer roof of radome 12, charging circuit 13 can be avoided to occur with the electric elements on plate body 11
Interfere, simultaneously facilitate the heat radiation of charging circuit 13, improve the radiating rate of charging circuit 13, thus improve the longevity of charging circuit 13
Life.
Further, as it is shown in figure 1, charging circuit 13 is positioned at the middle part of the outer top wall surface of radome 12.Thus it is easy to fill
The setting of electricity circuit 13 and processing, it is ensured that charging circuit 13 is entirely located on the outer roof of radome 12, consequently facilitating fill
The heat radiation of electricity circuit 13, improves the radiating rate of charging circuit 13, improves the service life of charging circuit 13.
In some embodiments of the invention, pcb board assembly 1 also includes that insulating trip, insulating trip folder are laid on radome 12
Go up and between charging circuit 13 and radome 12.Thus, insulating trip can realize the exhausted of charging circuit 13 and radome 12
Edge, prevents when charging circuit 13 is located on radome 12, and radome 12 causes charging circuit 13 to be short-circuited equivalent risk, from
And improve the reliability of the work of charging circuit 13.
Specifically, insulating trip is PP (polypropylene) sheet, and polyacrylic degree of crystallinity is high, compound with regular structure, thus has excellent
Mechanical property, polypropylene has good thermostability, and polyacrylic chemical stability is fine, and decapacitation is invaded by concentrated sulphuric acid, concentrated nitric acid
Outside erosion, the most more stable to other various chemical reagent, it has higher dielectric coefficient, and with the rising of temperature, can be used to
Make the electrical apparatus insulation goods being heated.
Below with reference to Fig. 2 and Fig. 3, mobile terminal 100 according to embodiments of the present invention is described.
As shown in Figures 2 and 3, mobile terminal 100 according to embodiments of the present invention, including housing 2 and above-mentioned pcb board assembly
1.Wherein, in pcb board assembly 1 is located at housing 2.Thus, after above-mentioned pcb board assembly 1 is set in the housing 2 of mobile terminal 100,
The radiating rate of charging circuit 13 on pcb board assembly 1 can be improved, the temperature rise of mobile terminal 100 complete machine can be controlled, improve and move
The life-span of dynamic terminal 100.
Mobile terminal 100 according to embodiments of the present invention, by arranging above-mentioned pcb board assembly 1, can improve pcb board group
The speed of part 1 heat radiation, thus improve the radiating rate of mobile terminal 100 complete machine, control the temperature rise of mobile terminal 100 complete machine, from
And improve the life-span of mobile terminal 100.
In some embodiments of the invention, as in figure 2 it is shown, the interior table of the charging circuit 13 of pcb board assembly 1 and housing 2
Face contacts.In pcb board assembly 1 is located at housing 2, and when charging circuit 13 is located at the outer surface of radome 12, due to radome
Between 12 and plate body 11, there is a certain distance, therefore there is between charging circuit 13 and plate body 11 a certain distance, charged electrical
The relative plate body 11 in road 13 has certain height, and charging circuit 13 can contact with the inner surface of housing 2, thus charging circuit 13
Can also be dispelled the heat by housing 2, improve the radiating rate of charging circuit 13, thus control the temperature rise of complete machine, improve charging
Circuit 13 and the life-span of mobile terminal 100.
Further, position charging circuit 13 contacted with housing 2 inner surface is coated with heat-conducting layer.Thus, both may be used
Damage charging circuit 13 to prevent housing 2 and charging circuit 13 from rubbing, the heat on charging circuit 13 can be made again quick
It is transferred on the housing 2 of mobile terminal 100, and is dispelled the heat by housing 2, thus improve the radiating rate of charging circuit 13,
Control the temperature rise of mobile terminal 100 complete machine, improve charging circuit 13 and the life-span of mobile terminal 100.
Further, heat-conducting layer is silica gel heat-conducting layer.Silica gel heat-conducting layer is high-end heat conduction compound, and will not consolidate
Body, the characteristic that will not conduct electricity can avoid such as charging circuit 13 short circuit equivalent risk, and additionally its high-adhesion can be able to will fill
Electricity circuit 13 links together closely with the inner surface of housing 2, prevents charging circuit 13 from moving in housing 2 and damaging.
In some embodiments of the invention, as it is shown on figure 3, the charging circuit 13 of pcb board assembly 1 and housing 2 inner surface
There is gap.Thus it can be prevented that and between the charging circuit 13 of pcb board assembly 1 and housing 2 inner surface, occur friction to cause filling
Electricity circuit 13 damages.Further, mobile terminal 100 also includes that heat-conducting piece 3, heat-conducting piece 3 are located at charging circuit 13 and housing 2
Between inner surface.Thus, it is possible to the heat on charging circuit 13 is quickly transferred on housing 2, and dissipated by housing 2
Heat, thus improve the radiating rate of charging circuit 13, control the temperature rise of mobile terminal 100 complete machine, improve charging circuit 13 and move
The life-span of dynamic terminal 100.
Alternatively, heat-conducting piece 3 is silica gel heat-conducting piece, and silica gel heat-conducting piece is high-end heat conduction compound, and will not solid
Changing, the characteristic that will not conduct electricity can avoid such as charging circuit 13 short circuit equivalent risk.
In some embodiments of the invention, mobile terminal 100 can be mobile phone, panel computer or notebook computer etc..
After mobile phone, panel computer or notebook computer etc. use above-mentioned pcb board assembly 1, mobile phone, panel computer or notes can be controlled
The temperature rise of this computer etc., improves the life-span of charging circuit 13 and mobile phone, panel computer or notebook computer etc..
Describe according to the mobile terminal 100 of one specific embodiment of the present invention below with reference to Fig. 1-Fig. 3, described below only with
Mobile terminal 100 illustrates for as a example by mobile phone, described below the most exemplary, it is intended to be used for explaining the present invention, and can not
It is interpreted as limitation of the present invention.
Mobile terminal 100 according to embodiments of the present invention, such as mobile phone, including housing 2 and pcb board assembly 1.
Wherein, as it is shown in figure 1, pcb board assembly 1 according to embodiments of the present invention, including plate body 11, radome 12, charging
Circuit 13 and insulating trip.Radome 12 is welded on plate body 11 for shielded signal, and charging circuit 13 is located at radome 12
Thinking that battery charges on outer roof, charging circuit 13 is located on the outer roof of radome 12 and is positioned at the middle part of radome 12, fills
The heat of electricity circuit 13 for delivery on radome 12, and can be dispelled the heat by radome 12, can improve charging circuit 13
Radiating rate, improve charging circuit 13 life-span.Insulating trip is insulation PP sheet, and insulation PP sheet is laid on radome 12 and position
Between charging circuit 13 and radome 12, thus play make charging circuit 13 and radome 12 insulation effect, prevent due to
The effect of radome 12 and cause charging circuit 13 to be short-circuited equivalent risk.
Wherein, charging circuit is for filling charging circuit soon.Filling charging circuit soon is that charging current is more than 2.5 amperes, charged electrical
Pressure is about 5V.Thus, it is possible to accelerate the power supply adaptor charging rate to mobile terminal, meet the use demand of user.
As in figure 2 it is shown, pcb board assembly 1 is located in housing 2, the charging circuit 13 of pcb board assembly 1 and the inner surface of housing 2
Contact, and the position that charging circuit 13 contacts with housing 2 inner surface is provided with heat-conducting layer, such as silica gel heat-conducting layer.On the one hand,
Heat on pcb board assembly 1 quickly can be delivered on housing 2 by heat-conducting layer, and is dispelled the heat by housing 2, permissible
Improve the radiating rate of charging circuit 13, control the temperature rise of the mobile terminals 100 such as mobile phone, improve charging circuit 13 and mobile phone etc. and move
The life-span of dynamic terminal 100.On the other hand, silica gel heat-conducting layer is set between charging circuit 13 and housing 2, not only can avoid filling
Electricity circuit 13 directly contacts with housing 2 inner surface and receives damage because rubbing, it is also possible to by charging circuit 13 and the interior table of housing 2
Face fits tightly together.
Certainly, the invention is not restricted to this, as it is shown on figure 3, the inner surface of the charging circuit 13 of pcb board assembly 1 and housing 2 it
Between be also provided with gap, in the gap between charging circuit 13 and housing 2 inner surface, heat-conducting piece 3, such as silica gel are set
Heat-conducting piece 3, is thus easy to processing and the assembling of mobile terminal 100, and can quickly be passed by the heat on charging circuit 13
It is handed on housing 2, and is dispelled the heat by housing 2.
In describing the invention, it is to be understood that term " " center ", " highly ", " on ", D score, " top ", " end "
Orientation or the position relationship of the instruction such as " interior ", " outward " are based on orientation shown in the drawings or position relationship, are for only for ease of and retouch
State the present invention and simplify description rather than instruction or imply that the device of indication or element must have specific orientation, with specific
Azimuth configuration and operation, be therefore not considered as limiting the invention.
In the present invention, unless otherwise clearly defined and limited, term " install ", " being connected ", " connection ", " fixing " etc.
Term should be interpreted broadly, and connects for example, it may be fixing, it is also possible to be to removably connect, or integral；Can be that machinery connects
Connect, it is also possible to be electrical connection or each other can communication；Can be to be joined directly together, it is also possible to be indirectly connected to by intermediary, permissible
It is connection or the interaction relationship of two elements of two element internals, unless otherwise clear and definite restriction.For this area
For those of ordinary skill, above-mentioned term concrete meaning in the present invention can be understood as the case may be.
In the description of this specification, reference term " embodiment ", " some embodiments ", " example ", " specifically show
Example " or the description of " some examples " etc. means to combine this embodiment or example describes specific features, structure, material or spy
Point is contained at least one embodiment or the example of the present invention.In this manual, to the schematic representation of above-mentioned term not
Identical embodiment or example must be directed to.And, the specific features of description, structure, material or feature can be in office
One or more embodiments or example combine in an appropriate manner.Additionally, in the case of the most conflicting, the skill of this area
The feature of the different embodiments described in this specification or example and different embodiment or example can be tied by art personnel
Close and combination.
Although above it has been shown and described that embodiments of the invention, it is to be understood that above-described embodiment is example
Property, it is impossible to being interpreted as limitation of the present invention, those of ordinary skill in the art within the scope of the invention can be to above-mentioned
Embodiment is changed, revises, replaces and modification.
Claims (12)
1. a pcb board assembly, it is characterised in that including:
Plate body；
Radome, described radome is located on described plate body；With
Being suitable for the charging circuit of battery charging, described charging circuit is located on the outer surface of described radome.
Pcb board assembly the most according to claim 1, it is characterised in that described charging circuit is located at outside described radome
On top wall surface.
Pcb board assembly the most according to claim 2, it is characterised in that described charging circuit is positioned at outside described radome
The middle part of top wall surface.
Pcb board assembly the most according to claim 1, it is characterised in that also include:
Insulating trip, described insulating trip folder is laid on described radome and between described charging circuit and described radome.
Pcb board assembly the most according to claim 1, it is characterised in that described insulating trip is PP sheet.
6. a mobile terminal, it is characterised in that including:
Housing；
According to the pcb board assembly according to any one of claim 1-5, described pcb board assembly is located in described housing.
Mobile terminal the most according to claim 6, it is characterised in that the described charging circuit of described pcb board assembly and institute
State shell inner surface contact.
Mobile terminal the most according to claim 7, it is characterised in that connect with described shell inner surface on described charging circuit
The position touched is coated with heat-conducting layer.
Mobile terminal the most according to claim 8, it is characterised in that described heat-conducting layer is silica gel heat-conducting layer.
Mobile terminal the most according to claim 6, it is characterised in that the described charging circuit of described pcb board assembly and institute
State shell inner surface and there is gap.
11. mobile terminals according to claim 10, it is characterised in that described mobile terminal also includes heat-conducting piece, described
Heat-conducting piece is folded between described charging circuit and described shell inner surface.
12. mobile terminals according to claim 11, it is characterised in that described heat-conducting piece is silica gel heat-conducting piece.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610608583.5A CN106211553B (en) | 2016-07-28 | 2016-07-28 | Pcb board component and mobile terminal with it |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610608583.5A CN106211553B (en) | 2016-07-28 | 2016-07-28 | Pcb board component and mobile terminal with it |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106211553A true CN106211553A (en) | 2016-12-07 |
| CN106211553B CN106211553B (en) | 2019-04-19 |
Family
ID=57495746
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610608583.5A Active CN106211553B (en) | 2016-07-28 | 2016-07-28 | Pcb board component and mobile terminal with it |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106211553B (en) |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN106211553B (en) | 2019-04-19 |
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| Date | Code | Title | Description |
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| C06 | Publication | ||
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| C10 | Entry into substantive examination | ||
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| CB02 | Change of applicant information |
Address after: 523860 No. 18, Wu Sha Beach Road, Changan Town, Dongguan, Guangdong Applicant after: OPPO Guangdong Mobile Communications Co., Ltd. Address before: 523860 No. 18, Wu Sha Beach Road, Changan Town, Dongguan, Guangdong Applicant before: Guangdong OPPO Mobile Communications Co., Ltd. |
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