CN103037040A - Mobile phone centralized type heat dissipation mechanism - Google Patents
Mobile phone centralized type heat dissipation mechanism Download PDFInfo
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- CN103037040A CN103037040A CN2012103699273A CN201210369927A CN103037040A CN 103037040 A CN103037040 A CN 103037040A CN 2012103699273 A CN2012103699273 A CN 2012103699273A CN 201210369927 A CN201210369927 A CN 201210369927A CN 103037040 A CN103037040 A CN 103037040A
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Abstract
The invention discloses a mobile phone centralized type heat dissipation mechanism. The mobile phone centralized type heat dissipation mechanism is arranged on a steel slice support of a mobile phone, the steel slice support bears a Printed Circuit Board (PCB) plate, the PCB plate is provided with a plurality of electron components which are electrically connected with each other, and all the electron components conduct shielding signal disturbing through shielding covers which are covered on the electron components. The heat dissipation mechanism comprises a heat conduction layer which connects all the shielding covers and cooling fins which are connected with the steel slice support. The heat conduction layer concentrates and conducts the heat of the components which are arranged on the PCB plate to the cooling fins to dissipate the heat. Due to the method of combining concentrated heat dissipation with the cooling fins, when all the electron components in the inner portion of the mobile phone work and send out heat, the heat connects the shielding covers of the electron components through the heat conduction layer which is made of copper foil or grapheme, the heat of all the electron components are conducted to the steel plate support and is conducted concentrated dissipation through the cooling fins which are arranged on the steel plate support. The mobile phone centralized type heat dissipation mechanism is capable of conducting the working heat of the electron components such as CPU, dissipates the heat outside the mobile phone, and avoids phenomenon of heat and burning of the mobile phone after being used for a long time.
Description
Technical field
The present invention relates to heat abstractor, refer to especially be arranged at the centralized radiator structure of interior of mobile phone.
Background technology
The volume of existing digital product such as mobile phone is more and more less, performance is more and more higher, heat dissipation problem also day by day highlights, because the restriction of structure and volume, at present main radiating mode are the heats at position that the caloric values such as central processing unit, memory is large to be transmitted to by air or heat conductive silica gel uniformly and to realize heat radiation on the fuselage metallic shield frame everywhere.Although this mode can import to the heat of device in the screening cover and realize local heat radiation on the screening cover, relative and mobile phone complete machine, heat is failed to fall apart equably inner to mobile phone, causes the local area heating higher.The structure of present interior of mobile phone has accomplishes both to have saved on the steel disc support way that cost also is beneficial to heat radiation with the metallic shield frame, but considers that mobile phone is more and more thinner, stacking becoming increasingly complex, and most of interior of mobile phone can not be accomplished this structure.
Therefore, demand urgently providing the excellent efficiently mobile phone radiator structure of a kind of heat dispersion to address the above problem real being necessary
Summary of the invention
Based on the deficiencies in the prior art, main purpose of the present invention is to provide a kind of concentrated heat radiation in conjunction with the centralized radiator structure of the mobile phone of fin.
The invention provides the centralized radiator structure of a kind of mobile phone, be installed on the mobile phone steel disc support, carry pcb board on the steel disc support, pcb board is provided with several electronic devices and components that mutually are electrically connected, carry out the shielded signal interference by the screening cover that covers thereon between each electronic devices and components, described radiator structure comprises the heat-conducting layer that links to each other between each screening cover, and is connected in the fin on the steel disc support, and heat-conducting layer is concentrated the heat of the components and parts on the pcb board and is transmitted to the fin heat radiation.
In the present invention, heat-conducting layer is preferably copper foil layer or graphene layer, and its heat-conducting effect is better.By heat-conducting layer screening cover is connected with the steel disc support, heat-conducting layer is surrounded on the periphery of screening cover, the heat of the electronic devices and components on the pcb board concentrated conduct on the steel disc support, dispel the heat by the fin that is installed on the steel disc support, like this, can concentrate and efficiently with the dissipation of heat on the PCB to outer handset.
Fin is comb shape, and fin is provided with the strip radiating groove that is parallel to each other.Adopt the radiating groove of strip comb shape, increase itself and the contact area of air, enlarged contact area, the raising radiating efficiency.
Compared with prior art, adopt this concentrated heat radiation in conjunction with the mode of fin, each electronic devices and components work and adstante febre when interior of mobile phone, its heat is continuous with the screening cover of electronic devices and components by the heat-conducting layer of being made by Copper Foil or Graphene, and conduct its heat on the stainless steel strut, concentrate heat radiation through the fin on the stainless steel strut again, can be better with the work calories conduction of the electronic devices and components such as CPU and dispel the heat to mobile phone, avoided the long-time hot phenomenon of heating of using of mobile phone.
Description of drawings
Fig. 1 is the structural representation of the centralized radiator structure of a kind of mobile phone of the present invention;
Fig. 2 is the fin sectional view of the centralized radiator structure of a kind of mobile phone of the present invention.
Embodiment
With reference to shown in Figure 1, the invention provides the centralized radiator structure of a kind of mobile phone, be installed on the mobile phone steel disc support 1, carrying pcb board 2 on the steel disc support 1, pcb board 2 is provided with several electronic devices and components that mutually are electrically connected, carry out the shielded signal interference by the screening cover 3 that covers thereon between each electronic devices and components, described radiator structure comprises the heat-conducting layer 4 that links to each other between each screening cover 3, with the fin 5 that is connected on the steel disc support, heat-conducting layer 4 is concentrated the heat of the components and parts on the pcb board 2 and is transmitted to fin 5 heat radiations.
In the present invention, mobile phone steel disc support 1 is installed in the mobile phone back, is used for supporting and carrying pcb board 2, and the work calories of the power supply components and parts on the pcb board 2 is dispelled the heat.Electronic devices and components such as central processing unit, memory etc. are welded on the pcb board 2 by the pin that is electrically connected.Screening cover 3 is made of metal, and it is covered on the electronic devices and components by the scolding tin welding, and is suitable according to the big or small profile of electronic devices and components.Difference in height between screening cover 3 and the electronic devices and components is filled with heat conductive silica gel,, simultaneously, the work calories of electronic devices and components is dispelled the heat so that each electronic devices and components time signal does not interfere with each other by screening cover 3.
In a preferred embodiment of the invention, heat-conducting layer 4 is copper foil layer or graphene layer, and it is connected screening cover 3 being pasted on simultaneously on the periphery and steel disc support 1 of screening cover 3 with steel disc support 1.By heat-conducting layer 4 heat that screening cover 3 interior hot-electron devices occurred frequently produce is conducted to steel disc support 1.Heat-conducting layer 4 adopts Copper Foils or Graphene to make, and it has higher heat transfer efficiency, can be rapidly the heat of screening cover 3 and electronic devices and components be conducted to concentrate heat radiation on the steel disc support 1.Heat-conducting layer 4 Thickness Ratios are thinner, are suitable for the more and more thinner thickness demand of mobile phone, also have customizable characteristics, according to the shape of the actual stack manner customization film of interior of mobile phone, to adapt to the diversity of internal structure of mobile phone.As shown in Figure 1, dotted line is the shape of heat-conducting layer 4, in order to avoid having dug a rectangle aperture in the middle of the battery connector.
With reference to shown in Figure 2, described fin 5 is installed on the stainless steel strut 1, and a side that is positioned at pcb board 2 is terminal, does not have structural interference to get final product between fin and the pcb board, specifically decides by project is actual stacking.Fin is comb shape, and it has the strip radiating groove 50 that is parallel to each other, and the spacing between the radiating groove 50 is 0.2-0.5mm, and preferred distance is 0.2mm, and the width of fin 5 is 5mm, and length is 45mm, can decide according to the concrete dimension scale of electronic product.Fin 5 is mounted on the stainless steel strut 1 by the mode of laser welding.Fin 5 is arranged to comb shape, can increase with the contact area of air so that heat radiation, and certainly, fin 5 also can be designed to other shapes, not as limit.Fin can be made by metal materials such as steel discs, excellent in heat dissipation effect, and processing cost is low.
When using mobile phone, each electronic devices and components work of interior of mobile phone and heating, its heat reaches the heat-conducting layer 4 that is connected with screening cover 3 by screening cover 3 and conducts on the stainless steel strut 1, concentrate heat radiation through the fin 5 on the stainless steel strut 1 again, adopt this concentrated heat radiation in conjunction with the mode of fin, can be better with the work calories conduction of the electronic devices and components such as CPU and dispel the heat to mobile phone, avoided the long-time hot phenomenon of heating of using of mobile phone.
Above embodiment has been described in detail the present invention, but these are not to be construed as limiting the invention.Protection scope of the present invention is not limited with above-mentioned execution mode, as long as the equivalence that those of ordinary skills do according to disclosed content is modified or changed, all should include in the protection range of putting down in writing in claims.
Claims (7)
1. centralized radiator structure of mobile phone, be installed on the mobile phone steel disc support, carry pcb board on the described steel disc support, described pcb board is provided with several electronic devices and components that mutually are electrically connected, carry out the shielded signal interference by the screening cover that covers thereon between described each electronic devices and components, it is characterized in that: described radiator structure comprises the heat-conducting layer that links to each other between described each screening cover, with the fin that is connected on the described steel disc support, described heat-conducting layer is concentrated the heat of the components and parts on the described pcb board and is transmitted to described fin heat radiation.
2. the centralized radiator structure of mobile phone according to claim 1, it is characterized in that: described heat-conducting layer is copper foil layer or graphene layer.
3. the centralized radiator structure of mobile phone according to claim 1, it is characterized in that: described heat-conducting layer is connected described screening cover with described steel disc support.
4. the centralized radiator structure of mobile phone according to claim 3, it is characterized in that: described heat-conducting layer is surrounded on the periphery of described screening cover.
5. the centralized radiator structure of mobile phone according to claim 1, it is characterized in that: described fin is comb shape.
6. the centralized radiator structure of mobile phone according to claim 1, it is characterized in that: described fin is provided with the strip radiating groove that is parallel to each other.
7. the centralized radiator structure of mobile phone according to claim 6, it is characterized in that: the spacing of described radiating groove is 0.2mm-0.5mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012103699273A CN103037040A (en) | 2012-09-28 | 2012-09-28 | Mobile phone centralized type heat dissipation mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012103699273A CN103037040A (en) | 2012-09-28 | 2012-09-28 | Mobile phone centralized type heat dissipation mechanism |
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| CN103037040A true CN103037040A (en) | 2013-04-10 |
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| CN2012103699273A Pending CN103037040A (en) | 2012-09-28 | 2012-09-28 | Mobile phone centralized type heat dissipation mechanism |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104883859A (en) * | 2015-05-29 | 2015-09-02 | 联想(北京)有限公司 | Electronic device and housing |
| CN104994713A (en) * | 2015-07-14 | 2015-10-21 | 广东欧珀移动通信有限公司 | Mobile terminal and heat radiation structure thereof |
| CN105050369A (en) * | 2015-08-26 | 2015-11-11 | 广东欧珀移动通信有限公司 | Intelligent terminal |
| CN105228410A (en) * | 2014-09-25 | 2016-01-06 | 维沃移动通信有限公司 | A kind of heat abstractor of terminal and terminal |
| CN105338783A (en) * | 2014-07-01 | 2016-02-17 | 联想(北京)有限公司 | Heat dissipation device for electronic equipment |
| CN106023806A (en) * | 2016-08-05 | 2016-10-12 | 深圳市众易畅科技有限公司 | Circuit integration modularization system and method for man-machine interaction display screen of motor vehicle |
| CN106231874A (en) * | 2016-08-26 | 2016-12-14 | 浙江众合科技股份有限公司 | A kind of radiator heat conducting gum mud operated pressing tool and board radiator structure |
| CN107147826A (en) * | 2017-05-17 | 2017-09-08 | 广东欧珀移动通信有限公司 | Imaging device component and electronic installation |
| CN107562161A (en) * | 2017-10-25 | 2018-01-09 | 四川云玦科技有限公司 | A kind of main frame radiator |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6016083A (en) * | 1996-08-27 | 2000-01-18 | Nec Corporation | Electronic circuit apparatus for suppressing electromagnetic radiation |
| CN101192440A (en) * | 2006-11-29 | 2008-06-04 | 英业达股份有限公司 | Radiator for hard disc |
| CN101877958A (en) * | 2009-04-28 | 2010-11-03 | 英业达股份有限公司 | Electronic device having electromagnetic shielding and heat radiation and assembling method thereof |
| CN102548365A (en) * | 2012-01-18 | 2012-07-04 | 惠州Tcl移动通信有限公司 | Mobile terminal with high heat radiation performance |
| CN202798851U (en) * | 2012-09-28 | 2013-03-13 | 共青城赛龙通信技术有限责任公司 | Mobile phone centralized heat radiation structure |
-
2012
- 2012-09-28 CN CN2012103699273A patent/CN103037040A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6016083A (en) * | 1996-08-27 | 2000-01-18 | Nec Corporation | Electronic circuit apparatus for suppressing electromagnetic radiation |
| CN101192440A (en) * | 2006-11-29 | 2008-06-04 | 英业达股份有限公司 | Radiator for hard disc |
| CN101877958A (en) * | 2009-04-28 | 2010-11-03 | 英业达股份有限公司 | Electronic device having electromagnetic shielding and heat radiation and assembling method thereof |
| CN102548365A (en) * | 2012-01-18 | 2012-07-04 | 惠州Tcl移动通信有限公司 | Mobile terminal with high heat radiation performance |
| CN202798851U (en) * | 2012-09-28 | 2013-03-13 | 共青城赛龙通信技术有限责任公司 | Mobile phone centralized heat radiation structure |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105338783A (en) * | 2014-07-01 | 2016-02-17 | 联想(北京)有限公司 | Heat dissipation device for electronic equipment |
| CN105338783B (en) * | 2014-07-01 | 2018-08-31 | 联想(北京)有限公司 | A kind of electronic equipment and radiator for electronic equipment |
| CN105228410A (en) * | 2014-09-25 | 2016-01-06 | 维沃移动通信有限公司 | A kind of heat abstractor of terminal and terminal |
| CN104883859A (en) * | 2015-05-29 | 2015-09-02 | 联想(北京)有限公司 | Electronic device and housing |
| CN104994713B (en) * | 2015-07-14 | 2018-03-09 | 广东欧珀移动通信有限公司 | The radiator structure and mobile terminal of a kind of mobile terminal |
| CN104994713A (en) * | 2015-07-14 | 2015-10-21 | 广东欧珀移动通信有限公司 | Mobile terminal and heat radiation structure thereof |
| CN105050369A (en) * | 2015-08-26 | 2015-11-11 | 广东欧珀移动通信有限公司 | Intelligent terminal |
| CN105050369B (en) * | 2015-08-26 | 2018-04-27 | 广东欧珀移动通信有限公司 | A kind of intelligent terminal |
| CN106023806A (en) * | 2016-08-05 | 2016-10-12 | 深圳市众易畅科技有限公司 | Circuit integration modularization system and method for man-machine interaction display screen of motor vehicle |
| CN106231874A (en) * | 2016-08-26 | 2016-12-14 | 浙江众合科技股份有限公司 | A kind of radiator heat conducting gum mud operated pressing tool and board radiator structure |
| CN106231874B (en) * | 2016-08-26 | 2018-07-13 | 浙江众合科技股份有限公司 | A kind of radiator heat conducting gum mud operated pressing tool and board radiator structure |
| CN107147826A (en) * | 2017-05-17 | 2017-09-08 | 广东欧珀移动通信有限公司 | Imaging device component and electronic installation |
| CN107147826B (en) * | 2017-05-17 | 2023-01-20 | 深圳市欢太科技有限公司 | Imaging device assembly and electronic device |
| CN107562161A (en) * | 2017-10-25 | 2018-01-09 | 四川云玦科技有限公司 | A kind of main frame radiator |
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| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20130410 |