CN106227511A - General chip mounter program visualization Simulation Program method - Google Patents
General chip mounter program visualization Simulation Program method Download PDFInfo
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- CN106227511A CN106227511A CN201610538949.6A CN201610538949A CN106227511A CN 106227511 A CN106227511 A CN 106227511A CN 201610538949 A CN201610538949 A CN 201610538949A CN 106227511 A CN106227511 A CN 106227511A
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- chip mounter
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F8/00—Arrangements for software engineering
- G06F8/30—Creation or generation of source code
- G06F8/34—Graphical or visual programming
Abstract
The invention discloses a kind of general chip mounter program visualization Simulation Program method, comprise the following steps: step one: chip mounter module is grouped, sets up 2D and the 3D phantom of this module respectively；Step 2: read in EDA design document, carries out 2D emulation: use Object-oriented Technique and OpenGL technology to carry out the 2D Simulation Program of each module in step one under VC++6.0 environment；Step 3: carry out 3D emulation: use graph transformation technology and dual-cache mechanism, the chip mounter carrying out each module in step one assembles motion 3D dynamic simulation, according to 3D dynamic simulation, carries out paster correction to program and re-optimization.On present invention main flow chip mounter type Research foundation abroad, successfully develop a kind of general chip mounter program visualization Simulation Program method, software engineering for one of chip mounter production domesticization key technology provides a solution, can be widely applied in domestic chip mounter.
Description
Technical field
The present invention relates to a kind of general chip mounter program visualization Simulation Program method.
Background technology
" China's IT industry development annual report " display that Digital CHINA 2015 summit is issued, 2014, China's IT industry
Scale grows steadily, and the electronics and information industry output value is more than 14,000,000,000,000, and wherein electronic information manufacturing industry income from sales breaks through 10 first
Trillion, increase by 11.5% on a year-on-year basis.Electronic manufacture equipment is one of most important key technology promoting electronics manufacturing development.
Since two thousand three, the development that domestic SMT equipment brand is advanced by leaps and bounds, such as: printer, reflow ovens, AOI, X-
Ray, wave-soldering, SPI and inserter etc., the national brand leading indicator of these products and foreign brand name close to and the ratio of performance to price
It is better than same kind of products at abroad, has captured a part of the domestic market and started outlet.Chip mounter is most critical in SMT production line
Equipment, typically constitutes more than the 60% of the investment of whole piece SMT production line, is the bottleneck of SMT production line efficiency.A new generation's chip mounter
Paster speed is enhanced, and just develops towards flexibility and modular construction direction.It is maximum, the heaviest that China has become the whole world
The SMT market wanted, chip mounter recoverable amount more than 100,000, production line more than 2.5 ten thousand.But, for a long time, external chip mounter
Unify market and technology.Since 1988, China import chip mounter amount of money nearly 10,000,000,000 every year on average.
China Electronics manufacturer never stopped the development to chip mounter.From 1989 to 1999 years primary electron portion tissues too
Chip mounter is developed by the units such as former two institutes, institute of Chengdu 715 factory two, Hefei 43 institute, Shanghai 4506 factory, and achieves certain
Scientific achievement.And private enterprise numerous state-run from 2000 to 2009 years has carried out crossing chip mounter research and development, such as: Guangzhou science and technology, Bears
Cat electronics, FENGHUA ADVANCED TECHNOLOGY, Shanghai modern, Shanghai microelectronics, Guangdong lift company etc., from 2010, existing 20 Yu Jia private enterprises ground
Make LED chip mounter.Due to many reasons such as technology and system, the most domestic chip mounter really puts goods on the market.
We can make atomic bomb, and we can make high ferro, but can not make general chip mounter.Chip mounter " Made in China " has become electronics system
The Chinese dream made children.
The crucial difficulty of research and development chip mounter is mainly visual movement control technology and the software engineering etc. of high-speed, high precision.Cause
Processing object pcb board and components and parts for chip mounter are ever-changing, and chip mounter must have Intelligent Programming System for Signal Processing and method,
Up to 1000 remainder parameters can be set.Additionally external chip mounter kind and type are numerous, mutually maintain secrecy, do not have unified programming side
Method and standard, bring great difficulty to chip mounter production domesticization research.
Summary of the invention
It is an object of the invention to provide a kind of general chip mounter program visualization Simulation Program method.
The technical scheme realizing the object of the invention is general chip mounter program visualization Simulation Program method, including following step
Rapid:
Step one: chip mounter module is grouped, sets up 2D and the 3D phantom of this module respectively；
Step 2: read in EDA design document, carry out 2D emulation: use under VC++6.0 environment Object-oriented Technique and
OpenGL technology carries out the 2D Simulation Program of each module in step one；
Step 3: carry out 3D emulation: use graph transformation technology and dual-cache mechanism, carry out the patch of each module in step one
The dynamic 3D dynamic simulation of sheet unit shipment, according to 3D dynamic simulation, carries out paster correction to program and re-optimization.
In described step one, by the method that chip mounter module is grouped it is: be divided into 7 kinds of single card head according to chip mounter type
Tandem module and the parallel module of 7 kinds of double applying head parallel connections.
The tandem module of described 7 kinds of single card head is respectively as follows: a single swivel head high speed machine, two single swivel heads at a high speed
Machine, three single swivel head high speed machines, a single IC head height precision machine ,+one single IC head height precision of a single swivel head high speed machine
Machine ,+one single IC head height precision machine of two single swivel head high speed machines and+two single IC head height precision of two single swivel head high speed machines
Machine；Described 7 kinds of double applying head parallel module in parallel is respectively as follows: before a platform after swivel head before the Multi Role Aircraft of IC head, two platforms
The Multi Role Aircraft of IC head, dual rotary head high speed machine, two dual rotary head high speed machines, dual rotary head height speed after swivel head
Before machine+platform, after swivel head, the Multi Role Aircraft of IC head ,+one double IC head height precision machine of a dual rotary head high speed machine and two are double
The double IC head height precision machine of swivel head high speed machine+.
Described step 2 specifically includes:
Read in EDA design document, set up PCB dynamic 2D phantom, PCB dynamic 2D phantom carries out substrate and sets
Meter；
The 2D phantom that each chip mounter module and PCB combine is carried out visualize components and parts design；
The 2D phantom that each chip mounter module and PCB combine carries out visualizing paster program and motion path optimization
Design；Guarantee that 6-12 suction nozzle of placement head is disposably filled components and parts, according to feed appliance figure on machine model picking up sheet position
In shape and PCB model, paster is arranged, and redistributes feed appliance and motion path, graph position and paster programming document data
Unify mutually.
Described on PCB dynamic 2D phantom, carry out substrate design method be: make EDA by Offset origin correction
The PCB Coordinate Conversion of design becomes chip mounter machine coordinates, then carries out visualizing substrate design；Described visualization substrate design bag
Include: PCB substrate size, jigsaw are arranged and Mark label location.
The 2D phantom that chip mounter module and PCB combine carries out visualize components and parts design and includes the position of feed appliance
Number and coordinate arrange, pick up sheet coordinate arrange, paster coordinate arrange and vision centering.
In described step 3, first set up each chip mounter module and the 3D phantom of PCB combination, then carry out chip mounter mould
Group assembles motion 3D dynamic simulation, finally carries out paster correction to program and re-optimization.
After have employed technique scheme, the present invention has a positive effect: (1) present invention main flow chip mounter machine abroad
On type Research foundation, successfully develop a kind of general chip mounter program visualization Simulation Program method, close for chip mounter production domesticization
The software engineering of one of key technology provides a solution, can be widely applied in domestic chip mounter.
(2) method of the present invention is applicable to existing domestic and international main flow chip mounter type, as Yamaha, Siemens,
Panasonic, Samsung, Juki, Fuji, have the most intelligent, programs simple and quick, can shorten chip mounter programming and change
Line time, reduction cost, raising production efficiency.
(3) present invention uses graph transformation technology and dual-cache mechanism, and the 3D combined at chip mounter module and PCB emulates mould
Carry out in type chip mounter assemble motion 3D dynamic simulation, can on computers by the paster process of chip mounter with directly perceived, lively, smart
True mode is simulated out, it is provided that visual error foundation, replaces traditional test-run a machine process, and the programming of re-optimization paster program sets
Meter.
Accompanying drawing explanation
It is clearly understood to make present disclosure be easier to, below according to specific embodiment and combine accompanying drawing, right
The present invention is described in further detail, wherein
Fig. 1 is the flow chart of the present invention.
Fig. 2 is 14 kinds of chip mounter modules of the present invention.
Detailed description of the invention
(embodiment 1)
See Fig. 1, the general chip mounter program visualization Simulation Program method of the present embodiment, comprise the following steps:
Step one: chip mounter module is grouped, sets up 2D and the 3D phantom of this module respectively；See Fig. 2, by chip mounter
The method of module packet is: be divided into the tandem module of 7 kinds of single card head according to chip mounter type and 7 kinds of double applying head are in parallel
Parallel module.The tandem module of 7 kinds of single card head is respectively as follows: a single swivel head high speed machine, two single swivel heads at a high speed
Machine, three single swivel head high speed machines, a single IC head height precision machine ,+one single IC head height precision of a single swivel head high speed machine
Machine ,+one single IC head height precision machine of two single swivel head high speed machines and+two single IC head height precision of two single swivel head high speed machines
Machine；7 kinds of double applying head parallel module in parallel rotates before the Multi Role Aircraft of IC head, two platforms after swivel head before being respectively as follows: a platform
The Multi Role Aircraft of IC head after Tou, dual rotary head high speed machine, two dual rotary head high speed machines, dual rotary head high speed machine+
The Multi Role Aircraft of IC head after swivel head ,+one double IC head height precision machine of a dual rotary head high speed machine and two bispins before one platform
The double IC head height precision machine of rotary head high speed machine+.Packet take into account domestic and international main flow chip mounter type and frame limit for width.High
Speed machine is packed in bag dish, in high precision machine dish in bulk, if paster uses packed dish and dish in bulk to mix, then uses Multi Role Aircraft.
Step 2: read in EDA design document, carry out 2D emulation: use under VC++6.0 environment Object-oriented Technique and
OpenGL technology carries out the 2D Simulation Program of each module in step one；Particularly as follows:
Read in EDA design document, set up PCB dynamic 2D phantom, PCB dynamic 2D phantom carries out substrate and sets
Meter；The method of substrate design is: the PCB Coordinate Conversion making EDA design by Offset origin correction becomes chip mounter machine coordinates,
Then carry out visualizing substrate design；Described visualization substrate design includes: PCB substrate size, jigsaw are arranged and Mark label
Location.
The 2D phantom that each chip mounter module and PCB combine is carried out visualize components and parts design；Visualization unit device
Part design includes that the item of feed appliance and coordinate arrange, pick up the setting of sheet coordinate, the setting of paster coordinate and vision centering.
The 2D phantom that each chip mounter module and PCB combine carries out visualizing paster program and motion path optimization
Design；Guarantee that 6-12 suction nozzle of placement head is disposably filled components and parts, according to feed appliance figure on machine model picking up sheet position
In shape and PCB model, paster is arranged, and redistributes feed appliance and motion path, graph position and paster programming document data
Unify mutually.
Step 3: carry out 3D emulation: first set up each chip mounter module and the 3D phantom of PCB combination, use figure deformation
Changing technology and dual-cache mechanism, the chip mounter carrying out each module in step one assembles motion 3D dynamic simulation, on computers will
The paster process of chip mounter is simulated out in mode directly perceived, lively, accurate, it is provided that visual error foundation, replaces traditional examination
Machine process, according to 3D dynamic simulation, carries out paster correction to program and re-optimization.
Particular embodiments described above, has been carried out the purpose of the present invention, technical scheme and beneficial effect the most in detail
Describe in detail bright, be it should be understood that the specific embodiment that the foregoing is only the present invention, be not limited to the present invention, all
Within the spirit and principles in the present invention, any modification, equivalent substitution and improvement etc. done, should be included in the guarantor of the present invention
Within the scope of protecting.
Claims (7)
- The most general chip mounter program visualization Simulation Program method, it is characterised in that comprise the following steps:Step one: chip mounter module is grouped, sets up 2D and the 3D phantom of this module respectively；Step 2: read in EDA design document, carries out 2D emulation: use Object-oriented Technique and OpenGL under VC++6.0 environment Technology carries out the 2D Simulation Program of each module in step one；Step 3: carry out 3D emulation: use graph transformation technology and dual-cache mechanism, carry out the chip mounter of each module in step one Assemble motion 3D dynamic simulation, according to 3D dynamic simulation, carry out paster correction to program and re-optimization.
- General chip mounter program visualization Simulation Program method the most according to claim 1, it is characterised in that: described step In one, by the method that chip mounter module is grouped it is: be divided into the tandem module of 7 kinds of single card head and 7 kinds according to chip mounter type The parallel module that double applying head are in parallel.
- General chip mounter program visualization Simulation Program method the most according to claim 2, it is characterised in that: described 7 kinds The tandem module of single card head is respectively as follows: a single swivel head high speed machine, two single swivel head high speed machines, three single swivel heads High speed machine, a single IC head height precision machine, a single swivel head high speed machine+one single IC head height precision machine, two single swivel heads High speed machine+one single IC head height precision machine and+two single IC head height precision machines of two single swivel head high speed machines；Described 7 kinds of double applyings The in parallel parallel module of head is respectively as follows: before a platform after swivel head before the Multi Role Aircraft of IC head, two platforms IC head after swivel head Rotate before Multi Role Aircraft, dual rotary head high speed machine, two dual rotary head high speed machines, dual rotary head high speed machine+platforms The Multi Role Aircraft of IC head after Tou ,+one double IC head height precision machine of a dual rotary head high speed machine and two dual rotary head high speed machines+ One double IC head height precision machine.
- General chip mounter program visualization Simulation Program method the most according to claim 3, it is characterised in that: described step Two specifically include:Read in EDA design document, set up PCB dynamic 2D phantom, PCB dynamic 2D phantom carries out substrate design；The 2D phantom that each chip mounter module and PCB combine is carried out visualize components and parts design；The 2D phantom that each chip mounter module and PCB combine carries out visualizing paster program and motion path optimization sets Meter；Guarantee that 6-12 suction nozzle of placement head is disposably filled components and parts, according to feed appliance figure on machine model picking up sheet position Arrange with paster on PCB model, redistribute feed appliance and motion path, graph position and paster programming document data phase Unified.
- General chip mounter program visualization Simulation Program method the most according to claim 4, it is characterised in that: described The method carrying out substrate design on PCB dynamic 2D phantom is: the PCB coordinate making EDA design by Offset origin correction It is converted into chip mounter machine coordinates, then carries out visualizing substrate design；Described visualization substrate design includes: PCB substrate chi Very little, jigsaw is arranged and Mark label location.
- General chip mounter program visualization Simulation Program method the most according to claim 4, it is characterised in that: at chip mounter Carry out visualizing components and parts design on the 2D phantom of module and PCB combination and include that the item of feed appliance and coordinate arrange, pick up Sheet coordinate is arranged, paster coordinate is arranged and vision centering.
- General chip mounter program visualization Simulation Program method the most according to claim 6, it is characterised in that: described step In three, first set up each chip mounter module and the 3D phantom of PCB combination, then carry out chip mounter module group assembling motion 3D dynamic Emulation, finally carries out paster correction to program and re-optimization.
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| CN201610538949.6A CN106227511A (en) | 2016-07-08 | 2016-07-08 | General chip mounter program visualization Simulation Program method |
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Cited By (5)
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|---|---|---|---|---|
| CN107133724A (en) * | 2017-04-18 | 2017-09-05 | 冀月斌 | A kind of chip mounter imports bearing calibration and the system of creation data |
| CN107272422A (en) * | 2017-08-10 | 2017-10-20 | 哈尔滨工业大学 | The robust multivariable predictive control method of chip mounter drive system based on reference regulator |
| CN107357259A (en) * | 2017-06-06 | 2017-11-17 | 西安微电子技术研究所 | A kind of chip mounter off-line programing information processing method |
| CN109241681A (en) * | 2018-10-30 | 2019-01-18 | 上海望友信息科技有限公司 | Simulation optimization method, system, computer storage medium and the equipment of Reflow Soldering |
| CN109561651A (en) * | 2018-12-30 | 2019-04-02 | 深圳捷创电子科技有限公司 | A kind of SMT surface mount elements position control method and its system |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107133724A (en) * | 2017-04-18 | 2017-09-05 | 冀月斌 | A kind of chip mounter imports bearing calibration and the system of creation data |
| WO2018192251A1 (en) * | 2017-04-18 | 2018-10-25 | 冀月斌 | Method and system for correcting imported production data of surface-mount device |
| CN107357259A (en) * | 2017-06-06 | 2017-11-17 | 西安微电子技术研究所 | A kind of chip mounter off-line programing information processing method |
| CN107357259B (en) * | 2017-06-06 | 2019-08-06 | 西安微电子技术研究所 | A kind of chip mounter off-line programing information processing method |
| CN107272422A (en) * | 2017-08-10 | 2017-10-20 | 哈尔滨工业大学 | The robust multivariable predictive control method of chip mounter drive system based on reference regulator |
| CN107272422B (en) * | 2017-08-10 | 2020-05-12 | 哈尔滨工业大学 | Multivariable constraint control method of chip mounter driving system based on reference regulator |
| CN109241681A (en) * | 2018-10-30 | 2019-01-18 | 上海望友信息科技有限公司 | Simulation optimization method, system, computer storage medium and the equipment of Reflow Soldering |
| CN109241681B (en) * | 2018-10-30 | 2020-09-08 | 上海望友信息科技有限公司 | Reflow soldering simulation optimization method and system, computer storage medium and equipment |
| CN109561651A (en) * | 2018-12-30 | 2019-04-02 | 深圳捷创电子科技有限公司 | A kind of SMT surface mount elements position control method and its system |
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