CN101986316A - Printed circuit board virtual manufacturing system of electronic design automation of electronic product and realization method thereof - Google Patents
Printed circuit board virtual manufacturing system of electronic design automation of electronic product and realization method thereof Download PDFInfo
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Abstract
The invention relates to a printed circuit board (PCB) virtual manufacturing system of the electronic design automation (EDA) of the electronic product and a realization method thereof. The realization method comprises the following steps: all types of EDA design files can be extracted and converted to an EDA simulation file with the same format and data are input in a database; the PCB static (three-dimensional) 3D simulation and assembly 3D simulation are performed under the VC++ 6.0 environment; and finally PCB manufacturability analysis is performed to extract the simulation information and the judgement parameters of each element, the judgement parameters of each element are detected one by one according to the manufacturability design criteria in a rule database, and the PCB physical parameter error and assembly error of the EDA of the electronic product are displayed and filed instantly. By adopting the method of the invention, the relationship between the PCB design and the manufacture of the isolated island can be built and the visual basis can be provided for the data modification of the EDA optimal deign in the shortest time, thus the aim of optimizing the development cycle and the cost and maximizing the production efficiency can be achieved.
Description
Technical field
The present invention relates to PCB dummy manufacturing system and its implementation of a kind of electronic product EDA design.
Background technology
In the Electronic Product SMT surface-assembled was produced, design generally was to utilize multiple computer-aided design (CAD) EDA (as Protel, PowerPCB, OrCAD, Candence, Mentor) instrument to finish on computers by the design engineer.Electronic product is before assembling is produced, the design engineer often will spend great amount of manpower and time and go to carry out the error detection and the adjustment of EDA design, compare with the manufacturability design criteria one by one by way of manual operation, these work are inefficiency not only, and makes a mistake easily.
Along with the aggravation of market competition, the product delivery cycle must shorten, and production cost must be controlled.At present, all be various EDA design switch technologies of exploitation and bug check technology both at home and abroad, but can not 3D the layout of pcb board of visual demonstration EDA directly perceived design and the SMT assembling PCB situation after producing, can not 3D the physical parameter mistake and the assembling capacity mistake of pcb board of visual demonstration EDA directly perceived design, also need produce as a trial repeatedly and adjust.If therefore the PCB dummy manufacturing system and the method thereof of a cover electronic product EDA design can be provided, between PCB design and manufacturing " isolated island ", set up contact, can improve the efficient and the correctness of electronic product EDA design.
Summary of the invention
The technical problem to be solved in the present invention is: PCB dummy manufacturing system and its implementation of proposing a kind of electronic product EDA design.This system can be after importing the EDA design document, under the VC++6.0 environment, adopt Object-oriented Technique and OpenGL technology to carry out static 3D emulation of PCB and assembling 3D emulation automatically, the SMT manufacture process of the PCB of simulation electronic product E DA design, and carry out the PCB manufacturability analysis, in simulation process, the mistake in the pcb board design is detected real-time prompting and file.The present invention can and make and set up contact between " isolated island " in PCB design, in the shortest time for the data modification for the EDA optimal design provides foundation directly perceived, with the purpose of the maximum of the optimization that reaches construction cycle and cost, production efficiency.
The technical solution adopted in the present invention is: a kind of PCB dummy manufacturing system of electronic product EDA design, and this system comprises 4 modules:
1, EDA information extraction modules: read in the EDA design document, therefrom extract the information and the discriminant parameter of pcb board design, and it is saved as the middle EDA simulation document of consolidation form, and enter data in the database.
2, the static and assembling 3D emulation module of PCB: according to the artificial intelligence of extracting in the EDA information extraction modules, set up the realistic model of dummy manufacturing system, under the VC++6.0 environment, adopt Object-oriented Technique and OpenGL technology to carry out the static 3D emulation of PCB automatically, adopt graph transformation technology and two caching technology to carry out PCB assembling 3D emulation automatically.The static 3D emulation of PCB is used for the static PCB situation that shows after assembling is produced, comprise: the emulation of PCB substrate, PCB paster device simulation, the emulation of PCB soldering paste, the emulation of PCB solder joint, the emulation of PCB glue point, every type is divided into positive STATIC SIMULATION and reverse side STATIC SIMULATION again, scalable, rotation, translation.PCB assembling 3D emulation is used for showing the dynamic running process of pcb board in the SMT production technology, comprising: the emulation of PCB paster, the emulation of PCB silk-screen, the emulation of PCB point glue, PCB reflow soldering emulation, the emulation of PCB wave soldering, PCB AOI emulation.
3, PCB manufacturability analysis module: the discriminant parameter of each element that extracts from the EDA information extraction modules, detect one by one according to the manufacturability design criteria, show in real time and the PCB physical parameter mistake and the assembling capacity mistake of file electronic product EDA design; The mistake that shows and file comprises: the type of error code and sequence number, mistake, mistake numbering and position.The detection of mistake has adopted eight to method for detecting area, checks whether a certain element conflicts with coming misjudgment in 8 direction rectangular areas on every side.
4, database module: comprise components and parts physical parametric data storehouse, rule database, mount database; PCB physical parameter error criterion and assembling capacity error criterion.Mounting database comprises: mounted substrate data, label Fiducial data, mount the components and parts data.
Described EDA information extraction modules output terminal connects database module, 3D emulation module and PCB manufacturability analysis module, the output terminal connection PCB manufacturability analysis module of 3D emulation mould, database module connect described EDA information extraction modules, PCB is static and assembling 3D emulation module, PCB manufacturability analysis module and database module.
The present invention also provides a kind of method of utilizing the virtual manufacturing of PCB dummy manufacturing system realization PCB of electronic product EDA design, and this method may further comprise the steps:
1) the 3D information extraction modules is read in the EDA design document, therefrom extract artificial intelligence and be used for emulation, the discriminant parameter that extracts components and parts and pcb board is used for the PCB manufacturability analysis, and it is saved as the middle EDA simulation document of consolidation form, and enters data in the database;
2) manufacture process of the PCB of PCB static state and assembling 3D emulation module 3D visual Simulation electronic product EDA design, according to the artificial intelligence of extracting in the EDA information extraction modules, under the VC++6.0 environment, adopt Object-oriented Technique and OpenGL technology to carry out the static 3D emulation of PCB automatically, adopt graph transformation technology and two caching technology to carry out PCB assembling 3D emulation automatically;
3) discriminant parameter of each element of extracting from the EDA information extraction modules of PCB manufacturability analysis module, detect one by one according to the manufacturability design criteria in the rule database, show in real time and the PCB physical parameter mistake and the assembling capacity mistake of file electronic product EDA design.
The invention has the beneficial effects as follows: 1,3D visual simulation system of the present invention, can with the PCB configuration of SMT after producing present with directly perceived, lively, accurate way on computers, mode with the dynamic running process of (as chip mounter, screen printer, point gum machine, reflow soldering, wave-soldering furnace, AOI test machine etc.) in SMT assembling production technology of analog PCB plate on computers replaces traditional test-run a machine process, has saved a large amount of time and production cost; 2, PCB manufacturability analysis of the present invention system can also detect physical parameter mistake and the assembling capacity mistake that exists in the EDA design automatically, while misregistration information, can in 3D visual simulating process, provide prompting with real-time display mode, the device position place that allows the user in the shortest time, know to make a mistake in mode the most intuitively, and the reason that makes a mistake, save a large amount of wrong search time and manpower, shortened the manufacturing cycle thereby reach, the purpose that reduces production costs.
Description of drawings
The present invention is further described below in conjunction with drawings and Examples
Fig. 1 is the structural drawing of the PCB dummy manufacturing system of electronic product EDA design of the present invention;
Fig. 2 is the process flow diagram of the implementation method of the PCB dummy manufacturing system of electronic product EDA design of the present invention;
Fig. 3 is the process flow diagram of PCB static state of the present invention and assembling 3D emulation mode;
Fig. 4 is the process flow diagram of PCB manufacturability analysis system mistake detection method of the present invention.
Embodiment
The present invention is further detailed explanation with preferred embodiment in conjunction with the accompanying drawings now.These accompanying drawings are the synoptic diagram of simplification, basic structure of the present invention only is described in a schematic way, so it only show the formation relevant with the present invention.
Present embodiment is the PCB dummy manufacturing system of a kind of electronic product EDA design, and system architecture as shown in Figure 1 comprises:
1) EDA information extraction modules: read in the EDA design document, therefrom extract the information and the discriminant parameter of pcb board design, and it is saved as the middle EDA simulation document of consolidation form, and enter data in the database;
2) the static and assembling 3D emulation module of PCB: according to the artificial intelligence of extracting in the EDA information extraction modules, set up the realistic model of dummy manufacturing system, under the VC++6.0 environment, adopt Object-oriented Technique and OpenGL technology to carry out the static 3D emulation of PCB automatically, adopt graph transformation technology and two caching technology to carry out PCB assembling 3D emulation automatically;
3) PCB manufacturability analysis module: the discriminant parameter of each element that extracts from the EDA information extraction modules, detect one by one according to the manufacturability design criteria, show in real time and the PCB physical parameter mistake and the assembling capacity mistake of file electronic product EDA design;
4) database module: comprise components and parts physical parametric data storehouse, rule database, mount database.
EDA information extraction modules output terminal connects database module, 3D emulation module and PCB manufacturability analysis module, the output terminal connection PCB manufacturability analysis module of 3D emulation mould, and database module connects all modules.
Described system carries out the implementation method of the PCB dummy manufacturing system of electronic product EDA design, and this method may further comprise the steps:
1) the 3D information extraction modules is read in the EDA design document, therefrom extract artificial intelligence and be used for emulation, the discriminant parameter that extracts components and parts and pcb board is used for the PCB manufacturability analysis, and it is saved as the middle EDA simulation document of consolidation form, and enters data in the database.
2) manufacture process of the PCB of PCB static state and assembling 3D emulation module 3D visual Simulation electronic product EDA design, according to the artificial intelligence of extracting in the EDA information extraction modules, under the VC++6.0 environment, adopt Object-oriented Technique and OpenGL technology to carry out the static 3D emulation of PCB, adopt graph transformation technology and two caching technology to carry out PCB assembling 3D emulation.The static 3D emulation of PCB comprises positive STATIC SIMULATION and reverse side STATIC SIMULATION, comprising: substrate emulation, paster device simulation, soldering paste emulation, solder joint emulation, the emulation of glue point.PCB assembling 3D emulation comprises: the emulation of PCB paster, the emulation of PCB silk-screen, the emulation of PCB point glue, reflow soldering emulation, wave soldering emulation, AOI motion simulation.
3) discriminant parameter of each element of extracting from the EDA information extraction modules of PCB manufacturability analysis module, detect one by one according to the manufacturability design criteria in the rule database, show in real time and the PCB physical parameter mistake and the assembling capacity mistake of file electronic product EDA design.The PCB manufacturability analysis comprises: PCB physical parameter error-detecting and assembling capacity error-detecting show and the mistake of filing comprises: the type of error code and sequence number, mistake, mistake numbering and position.The detection of mistake has adopted eight to method for detecting area, checks whether a certain element conflicts with coming misjudgment in 8 direction rectangular areas on every side.
Fig. 2 then is the main operation workflow of the PCB dummy manufacturing system of electronic product EDA design of the present invention, mainly be divided into following step: read in the EDA design document, extract artificial intelligence by the 3D information extraction modules and be used for 3D emulation, simultaneously, the discriminant parameter of extraction components and parts and pcb board is used for the PCB manufacturability analysis; Then carry out the static and assembling 3D emulation of PCB, wherein more detailed steps will illustrate by Fig. 3; Carry out the PCB manufacturability analysis at last, wherein more detailed steps will illustrate by Fig. 4.Before 3D emulation, show the PCB physical parameter error message of all EDA designs, and deposit all these mistakes in the error listing file; Then the 3D analogue system begins to simulate assembling process, shows the false alarm of PCB assembling capacity in the assembling simulation process in real time, upgrades the error listing file simultaneously; Emulation can be checked physical parameter error listing file and assembling capacity error listing file after finishing.
Fig. 3 then is the process description of PCB static state of the present invention and assembling 3D emulation mode: in PCB 3D analogue system master interface, click the positive STATIC SIMULATION of PCB, enter the positive STATIC SIMULATION of PCB interface, click substrate emulation, paster device simulation, soldering paste emulation, solder joint emulation, phase modulation is answered subroutine, corresponding demonstration 3D realistic model; Click PCB reverse side STATIC SIMULATION, enter " PCB reverse side STATIC SIMULATION " interface, click substrate emulation, paster device simulation, soldering paste emulation, the emulation of glue point, solder joint emulation, phase modulation is answered subroutine, corresponding demonstration 3D realistic model; Click PCB assembling emulation button, enter PCB assembling emulation interface, click the emulation of PCB paster, the emulation of PCB silk-screen, the emulation of PCB point glue, reflow soldering emulation, wave soldering emulation, AOI motion simulation, phase modulation is answered subroutine, corresponding demonstration 3D animation.
Fig. 4 then is the process description of PCB manufacturability analysis system mistake detection method of the present invention: in PCB manufacturability analysis system master interface, click the check of PCB design parameter, enter the check interface of PCB design parameter, click the check of PCB assembling capacity, enter PCB assembling capacity check interface, every kind of check is divided into positive check of PCB and reverse side check again.Detection method of the present invention is that system extracts an element (except the PCB bare board, element refers to each components and parts), in rule base, find all physical parameter error criterion relevant then with the discriminant parameter of this element, its error criterion also comprises static error criterion and collision error criterion, only need compare one by one for non-conflict error criterion gets final product, and for conflict property error criterion, then adopts eight to method for detecting area, if wrong, misregistration information; Similarly, find all assembling capacity error criterion relevant with the discriminant parameter of this element in rule base, the detection of wherein non-conflict mistake and conflict property mistake is the same, if wrong, misregistration information; After this element has detected, extract next element and detect again, all detect up to all elements and finish, so far finish the flow process of whole error detection.
Just the specific embodiment of the present invention of describing in the above instructions, various not illustrating is construed as limiting flesh and blood of the present invention, the person of an ordinary skill in the technical field after having read instructions can to before described embodiment make an amendment or be out of shape, and do not deviate from essence of an invention and scope.
Claims (6)
1. the PCB dummy manufacturing system of electronic product EDA design is characterized in that this system comprises:
EDA information extraction modules: read in the EDA design document, therefrom extract the information and the discriminant parameter of pcb board design, and it is saved as the middle EDA simulation document of consolidation form, and enter data in the database;
Static and the assembling 3D emulation module of PCB: according to the artificial intelligence of extracting in the EDA information extraction modules, set up the realistic model of dummy manufacturing system, under the VC++6.0 environment, adopt Object-oriented Technique and OpenGL technology to carry out the static 3D emulation of PCB automatically, adopt graph transformation technology and two caching technology to carry out PCB assembling 3D emulation automatically;
PCB manufacturability analysis module: the discriminant parameter of each element that extracts from the EDA information extraction modules, detect one by one according to the manufacturability design criteria, show in real time and the PCB physical parameter mistake and the assembling capacity mistake of file electronic product EDA design;
Database module: comprise components and parts physical parametric data storehouse, rule database, mount database;
Described EDA information extraction modules output terminal connects database module, 3D emulation module and PCB manufacturability analysis module, the output terminal connection PCB manufacturability analysis module of 3D emulation mould, database module connect described EDA information extraction modules, PCB is static and assembling 3D emulation module, PCB manufacturability analysis module and database module.
2. the PCB dummy manufacturing system of a kind of electronic product EDA design as claimed in claim 1, it is characterized in that: the SMT manufacture process of the PCB of described automatic 3D visual Simulation electronic product EDA design, between PCB design and manufacturing " isolated island ", set up contact, in the 3D simulation process, the mistake in the pcb board design is detected, real-time prompting and file, when the deviser will revise design, from document library, extract wrong document viewing.
3. one kind is utilized the method for the virtual manufacturing of the realization PCB of system according to claim 1, it is characterized in that this method may further comprise the steps:
1) the 3D information extraction modules is read in the EDA design document, therefrom extract artificial intelligence and be used for emulation, the discriminant parameter that extracts components and parts and pcb board is used for the PCB manufacturability analysis, and it is saved as the middle EDA simulation document of consolidation form, and enters data in the database;
2) manufacture process of the PCB of PCB static state and assembling 3D emulation module 3D visual Simulation electronic product EDA design, according to the artificial intelligence of extracting in the EDA information extraction modules, under the VC++6.0 environment, adopt Object-oriented Technique and OpenGL technology to carry out the static 3D emulation of PCB automatically, adopt graph transformation technology and two caching technology to carry out PCB assembling 3D emulation automatically;
3) discriminant parameter of each element of extracting from the EDA information extraction modules of PCB manufacturability analysis module, detect one by one according to the manufacturability design criteria in the rule database, show in real time and the PCB physical parameter mistake and the assembling capacity mistake of file electronic product EDA design.
4. the method for the virtual manufacturing of realization PCB as claimed in claim 3, it is characterized in that: the static 3D emulation of described PCB comprises positive STATIC SIMULATION and reverse side STATIC SIMULATION, and described positive STATIC SIMULATION and reverse side STATIC SIMULATION comprise: the emulation of PCB substrate, PCB paster device simulation, the emulation of PCB soldering paste, the emulation of PCB solder joint and the emulation of PCB glue point; Described PCB assembling 3D emulation comprises: the emulation of PCB paster, the emulation of PCB silk-screen, the emulation of PCB point glue, PCB reflow soldering emulation, the emulation of PCB wave soldering and PCB AOI emulation.
5. the method for the virtual manufacturing of realization as claimed in claim 3 PCB, it is characterized in that: described database comprises: components and parts physical parametric data storehouse, rule database, mount database; Rule database comprises: PCB physical parameter error criterion and assembling capacity error criterion; Mounting database comprises: mounted substrate data, label Fiducial data and mount the components and parts data.
6. the method for the virtual manufacturing of realization PCB as claimed in claim 3, it is characterized in that: described PCB manufacturability analysis comprises: PCB physical parameter error-detecting and assembling capacity error-detecting; The mistake that shows and file comprises: the type of error code and sequence number, mistake, mistake numbering and position; The detection of mistake has adopted eight to method for detecting area, checks whether a certain element conflicts with coming misjudgment in 8 direction rectangular areas on every side.
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102231146A (en) * | 2011-07-11 | 2011-11-02 | 西安电子科技大学 | Automatic extraction and normalization storage method of manufacturing data of heterogeneous electronic design automation (EDA) design |
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| CN102930114A (en) * | 2012-11-14 | 2013-02-13 | 常州奥施特信息科技有限公司 | Visualization detection method of electronic product electronic design automation (EAD) design manufacturability |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030220920A1 (en) * | 2002-05-24 | 2003-11-27 | Mentor Graphics Corporation | Matching database fields in an electronic design automation environment |
| CN101071449A (en) * | 2006-05-12 | 2007-11-14 | 中国科学院微电子研究所 | PI solution method based on IC package PCB co-design |
| CN101178750A (en) * | 2007-12-13 | 2008-05-14 | 来新泉 | PCB emulation system have error detection function and realization method thereof |
-
2010
- 2010-11-19 CN CN 201010551897 patent/CN101986316A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030220920A1 (en) * | 2002-05-24 | 2003-11-27 | Mentor Graphics Corporation | Matching database fields in an electronic design automation environment |
| CN101071449A (en) * | 2006-05-12 | 2007-11-14 | 中国科学院微电子研究所 | PI solution method based on IC package PCB co-design |
| CN101178750A (en) * | 2007-12-13 | 2008-05-14 | 来新泉 | PCB emulation system have error detection function and realization method thereof |
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| CN106156393B (en) * | 2014-12-11 | 2019-05-31 | 韩华精密机械株式会社 | data management device and method |
| CN104657560A (en) * | 2015-03-05 | 2015-05-27 | 常州奥施特信息科技有限公司 | IC (integrated circuit) virtual manufacturing system and implementing method thereof |
| CN105590143A (en) * | 2015-12-17 | 2016-05-18 | 兰州理工大学 | Optimization method for balancing loads of multiple chip mounters in assembly line in PCB assembling technology |
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| CN105632964A (en) * | 2016-03-23 | 2016-06-01 | 福州瑞芯微电子股份有限公司 | Chip automatic packaging analysis policy-making platform and analysis policy-making method |
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Application publication date: 20110316 |