WO2014109357A1 - Method for producing wiring board and laminate with supporting material - Google Patents

Method for producing wiring board and laminate with supporting material Download PDF

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Publication number
WO2014109357A1
WO2014109357A1 PCT/JP2014/050229 JP2014050229W WO2014109357A1 WO 2014109357 A1 WO2014109357 A1 WO 2014109357A1 JP 2014050229 W JP2014050229 W JP 2014050229W WO 2014109357 A1 WO2014109357 A1 WO 2014109357A1
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WO
WIPO (PCT)
Prior art keywords
copper foil
prepreg
support material
wiring board
peelable
Prior art date
Application number
PCT/JP2014/050229
Other languages
French (fr)
Japanese (ja)
Inventor
和夫 森下
清男 服部
貴紀 西田
Original Assignee
日立化成株式会社
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Publication of WO2014109357A1 publication Critical patent/WO2014109357A1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4682—Manufacture of core-less build-up multilayer circuits on a temporary carrier or on a metal foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09509—Blind vias, i.e. vias having one side closed
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0152—Temporary metallic carrier, e.g. for transferring material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1536—Temporarily stacked PCBs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/007—Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates

Definitions

  • the present invention relates to a method for manufacturing a wiring board and a laminate with a support material, and more particularly, to a method for manufacturing a wiring board using a coreless method and a laminate with a support material used for the coreless method.
  • a copper-clad laminate 8 is used as a support material 7, and on the copper foil A ⁇ b> 1 of the copper-clad laminate 8, a slightly smaller copper foil B ⁇ b> 2, prepreg B ⁇ b> 6,
  • the copper foil C4 is arranged and configured in this order, and is heat-pressed to form the laminated body 11 with the support material in which the outer peripheral portion of the copper foil B2 is sealed with the prepreg B6, and further, the circuit, the interlayer connection, the insulating layer, etc.
  • the outer peripheral portion of the laminated body 11 with the support material is cut and removed by the cutting line 14 to separate and remove the copper-clad laminate 8 which is the support material 7 from the laminated body 17.
  • Patent Document 1 There is a method of manufacturing a wiring board from 17 (Patent Document 1).
  • an ultra-thin copper foil (thickness 1 to 5 ⁇ m) with a carrier copper foil is laminated on the insulating resin with the ultra-thin copper foil on top, and then patterned copper plating on the ultra-thin copper foil on the surface , Prepreg and copper foil are placed on top of each other, laminated to form a laminated body with a support material, and further after forming an interlayer connection, between the ultrathin copper foil and the carrier copper foil, There is a method of separating and removing a laminate from an insulating resin that is a support material, and manufacturing a wiring board from the laminate (Patent Document 2).
  • the present invention has been made in view of the above problems, and in the coreless construction method, a method for manufacturing a wiring board and a laminate with a support material that can reduce material cost by reducing the margin for cutting and removing, and that has good workability. provide.
  • a peelable copper foil having a copper foil A and a copper foil B is disposed on both sides of the prepreg A, and further a prepreg B and a copper foil C are disposed and laminated on both sides. It is a manufacturing method of a wiring board which has the process (1) which forms a body.
  • the present invention has a support material in which a peelable copper foil having copper foil A and copper foil B is disposed on both sides of the prepreg A, and the prepreg B and copper foil C are disposed on both sides and laminated. It is a laminate.
  • the copper foil A on the support material side and the base of the wiring board formed thereon Separation from the resulting laminate can be performed using the peelability of copper foil A and copper foil B. For this reason, when separating the support material and the laminate, it is not necessary to largely cut the entire outer peripheral portion of the laminate as in Patent Document 1, which is a conventional technique, and waste of materials and labor can be saved.
  • the support material and the wiring can be obtained simply by disposing a peelable copper foil having copper foil A and copper foil B on both sides of the prepreg A, and further laminating the prepreg B and copper foil C on both sides. Since the laminated body on which the substrate is based can be formed at the same time, the configuration work becomes easy.
  • the peelable copper foil having the copper foil A and the copper foil B is disposed on both sides of the prepreg A, and the prepreg B and the copper foil C are further disposed on both sides and laminated.
  • the step (2) of forming an interlayer connection hole from the copper foil C to the copper foil B of the laminate with support material, and with the support material By forming a copper plating on the interlayer connection hole and the copper foil B of the laminate, an interlayer connection for connecting the copper foil C and the copper foil B, and a conductor layer having the copper foil C and the copper plating, And a step (3) of forming a wiring board.
  • the laminate with a support material provides rigidity that can withstand handling in the manufacturing process, so that workability is greatly improved even when a wiring board that is required to be thin is manufactured.
  • the so-called coreless method of manufacturing the wiring board by separating the supporting material and proceeding to the final process after the manufacturing process has been progressed halfway using a supporting material that does not constitute the wiring board itself as a product is easy. Become.
  • the prepreg A is thinner than the prepreg B.
  • the glass cloth of the prepreg A serving as a support material is thin, the unevenness due to the glass cloth is small, so that the unevenness of the glass cloth is difficult to transfer to the copper foil B of the laminate on which the wiring board is based. This is advantageous when forming a fine circuit using B.
  • the size of the peelable copper foil is smaller than the prepregs A and B laminated on both sides of the peelable copper foil.
  • it can comprise so that prepreg A, B may protrude from the outer periphery of peelable, and it becomes possible to seal the edge part of peelable copper foil with resin of prepreg A, B.
  • it can control that copper foil A and copper foil B exfoliate by handling in a manufacturing process, etc., or a processing liquid enters between copper foil A and copper foil B, and workability improves.
  • the prepregs A and B may be about 5 mm larger than the peelable copper foil. Therefore, when separating between the copper foil A and the copper foil B, the end portion may be cut by about 5 mm. There is little waste of material.
  • the peelable copper foil does not protrude from the prepregs A and B laminated on both sides of the peelable copper foil. Composed. This makes it possible to reliably cover the outer periphery of the peelable with the prepregs A and B. For this reason, workability
  • the periphery of the three-layer peelable copper foil is sealed with prepregs A and B laminated on both sides of the peelable copper foil. (Sealed). Thereby, it can suppress reliably that copper foil A and copper foil B peel by handling in a manufacturing process, etc., or a process liquid enters between copper foil A and copper foil B, and workability
  • the coreless construction method it is possible to provide a method for manufacturing a wiring board and a laminate with a support material that can reduce material costs by reducing margins for cutting and removing, and that have good workability.
  • peelable copper foil 3 having copper foil A1 and copper foil B2 is arranged on both sides of prepreg A5, and prepreg B6 and copper foil C4 are arranged on both sides.
  • the peelable copper foil 3 which has the copper foil A1 and the copper foil B2 is provided on both sides which pinched
  • the prepreg B6 and the copper foil C4 are further arranged and laminated on both sides to form a laminated body 11 with a support material.
  • the prepreg A5, the peelable copper foil 3, the prepreg B6, and the copper foil C4 are prepared, and the peelable copper foil 3, the prepreg B6, and the copper foil C4 are arranged in this order on both sides of the prepreg A5, and these materials are heated. Adhere by pressing.
  • the peelable copper foil 3 is a copper foil having a two-layer structure in which a physically peelable copper foil B2 is provided on one side of a copper foil A1 serving as a carrier.
  • the peelable copper foil 3 may be a known copper foil with a carrier used in a wiring board.
  • the prepreg A5 and the copper foil A (carrier) of the peelable copper foil 3 laminated on both sides thereof become the support material 7, and the upper layer side from the copper foil B2 of the peelable copper foil 3 is It becomes the laminated body 17 which becomes the base of a wiring board.
  • the support material 7 is used only during the manufacturing process, but is not used as a material constituting the wiring board as a product.
  • an insulating material generally used in a wiring board can be used, and examples thereof include a glass cloth impregnated with an epoxy resin or a polyimide resin.
  • copper foil C4 the copper foil generally used for a wiring board can be used.
  • Lamination means that the insulating resin in the prepreg is melted and cured by heating and pressing with a hot press, and the copper foil is bonded.
  • the copper foil A by the side of a support material and Separation from the laminate on which the wiring board is formed can be performed using the peelability of the copper foil A and the copper foil B.
  • Patent Document 1 which is a conventional technique, and waste of materials and labor can be saved.
  • the support material and the wiring can be obtained simply by disposing a peelable copper foil having copper foil A and copper foil B on both sides of the prepreg A, and further laminating the prepreg B and copper foil C on both sides. Since the laminated body on which the substrate is based can be formed at the same time, the configuration work becomes easy. Therefore, in the coreless construction method, it is possible to provide a method for manufacturing a wiring board that can reduce the material cost by reducing the margin for cutting and removing, and has good workability.
  • an interlayer connection hole 12 extending from the copper foil C4 to the copper foil B2 of the laminated body 11 with the support material is formed.
  • an opening is provided at a predetermined location of the interlayer connection hole 12 by etching in the copper foil C4 by a conformal mask method, and the opening is irradiated with a laser to remove the prepreg B6.
  • the interlayer connection hole 12 is a hole for forming the interlayer connection 18 by conducting the copper foil C4 and the copper foil B2 disposed on both sides of the prepreg B6 that is an insulating material.
  • a direct laser method in which the copper foil C4 and the prepreg B6 are removed without providing an opening in the copper foil C4 may be used. .
  • the process (3) of the manufacturing method of the wiring board of this Embodiment by forming the copper plating 13 on the interlayer connection hole 12 and the copper foil C4 of the laminated body 11 with the support material, An interlayer connection 18 for connecting the copper foil C4 and the copper foil B2 and a conductor layer 19 having the copper foil C4 and the copper plating 13 are formed.
  • the interlayer connection hole 12 formed in the step (2) is filled with the copper plating 13, and the copper plating 13 is also formed on the surface of the copper foil C4 to form the conductor layer 19. That is, in the present embodiment, the conductor layer 19 is formed of two layers of the copper foil C4 and the copper plating 13.
  • the laminate 17 including the copper foil B ⁇ b> 2 is separated from the copper foil A ⁇ b> 1 that is the support material 7.
  • the copper foil A1 which is a part of the support material 7 and the copper foil B2 which is a part of the laminate 17 which is the basis of the wiring board have releasability, they can be easily peeled off. can do.
  • the insulating resin of the prepregs A5 and B6 flows out and is cured at the end of the laminated body 11 with the support material by lamination using a hot press, for example, at the cutting line 14 in FIG. Separation is possible by cutting about 5 mm at the end (outer periphery) of the laminate 11 with material. For this reason, there is little waste of material compared with the past.
  • the conductor layer 19 having the copper foil C4 and the copper plating 13 and the copper foil B2 are processed into a circuit, and the inner layer circuit 15 is formed.
  • an etching resist generally used for manufacturing a wiring board is formed on the conductor layer 19 and the copper foil B2, and can be formed by a known subtractive method.
  • the prepreg C10 and the copper foil D9 are arranged and laminated on the inner layer circuit 15 in this order. Furthermore, an interlayer connection (not shown) is provided, and an upper layer circuit (not shown) is formed by performing plating and circuit processing.
  • the laminate 11 with a support material provides rigidity that can withstand handling in the manufacturing process, so even when manufacturing the wiring board 16 that is required to be thin, Workability is greatly improved.
  • the manufacturing process is advanced halfway using the support material 7 that does not constitute the product wiring board 16 itself, and then the support material 7 is separated and then advanced to the final process to manufacture the wiring board 16. The construction method becomes easy.
  • a laminated body with a support material which is an example of an embodiment of the present invention will be described below with reference to FIG.
  • the laminated body 11 with a support material of this Embodiment arrange
  • the laminated body 11 with a support material of this Embodiment since the laminated body 11 with a support material is formed using the peelable copper foil 3 having the copper foil A1 and the copper foil B2, the copper foil on the support material 7 side. Separation between A1 and the laminated body 17 serving as a base of the wiring board 16 formed thereon can be performed using the peelability of the copper foil A1 and the copper foil B2. For this reason, when separating the support material 7 and the laminated body 17, it is not necessary to cut the entire outer peripheral portion of the laminated body 17 as in the prior art, and material waste and labor can be saved.
  • the peelable copper foil 3 having the copper foil A1 and the copper foil B2 is arranged on both sides of the prepreg A5, and the prepreg B6 and the copper foil C4 are further arranged on both sides to be laminated.
  • the laminated body 17 on which the wiring board 16 is based can be formed at the same time, which facilitates the configuration work. Therefore, in the coreless construction method, it is possible to provide a laminate with a support material that can reduce the material cost by reducing the margin for cutting and removing, and has good workability.
  • a prepreg A that uses a glass cloth thinner than the prepreg B is preferably used.
  • the prepreg A serving as a support material is thin, the unevenness due to the glass cloth is small, so that the unevenness of the glass cloth is difficult to transfer to the copper foil B of the laminate on which the wiring board is based, and the copper foil B is used. This is advantageous when forming a fine circuit.
  • the size of the peelable copper foil 3 is on both sides of the peelable copper foil 3 as shown in FIG. 9A. It is smaller than the prepregs A5 and B6 to be laminated. Thereby, it can comprise so that prepreg A5, B6 may protrude from the outer periphery of peelable copper foil 3, and it seals the edge part of peelable copper foil 3 with resin of prepreg A5, B6 (seal part 20 of FIG. 9B). Is possible. For this reason, it can suppress that copper foil A1 and copper foil B2 peel by handling in a manufacturing process, etc., or a process liquid etc.
  • the prepregs A5 and B6 may be about 5 mm larger than the peelable copper foil 3, when separating between the copper foil A1 and the copper foil B2, the end may be cut by about 5 mm (FIG. 9C). Cutting line 14), cutting effort and material waste are small.
  • the peelable copper foil 3 is laminated on both sides of the peelable copper foil 3 as shown in FIG. 9A. It is configured not to protrude from the prepregs A5 and B6. Thereby, it becomes possible to reliably cover the outer periphery of the peelable copper foil 3 with the prepregs A5 and B6 (the seal portion 20 in FIG. 9B). For this reason, workability
  • the periphery of the peelable copper foil 3 is laminated on both sides of the peelable copper foil 3 as shown in FIG. 9B.
  • the prepregs A5 and B6 are sealed (seal part 20).
  • GEA-679FG (trade name, manufactured by Hitachi Chemical Co., Ltd., nominal thickness 30 ⁇ m)
  • carrier copper foil A1 having a thickness of 35 ⁇ m
  • pole having a thickness of 3 ⁇ m 3FD-P3 / 35 (trade name, manufactured by Furukawa Circuit Foil Co., Ltd.) to which thin copper foil B2 is bonded
  • GEA-679FG (trade name, manufactured by Hitachi Chemical Co., Ltd., nominal thickness 60 ⁇ m) as prepreg B6, copper foil C4 MT-18S5DH (manufactured by Mitsui Mining & Smelting Co., Ltd., trade name, thickness 5 ⁇ m) was constructed.
  • the size of the peelable copper foil 3 is about 5 mm smaller than the prepregs A5 and B6 laminated on both sides of the peelable copper foil 3, and the peelable copper foil 3 is made of the peelable copper foil 3
  • the prepregs A and B stacked on both sides of the prepreg were configured so as not to protrude.
  • the laminated body 11 with a support material was formed by heating and pressing with a hot press.
  • the insulating resin of the prepreg A5 flowed out and hardened to the end portion of the laminated body 11 with the support material by lamination using a hot press, and the end portion of the peelable copper foil 3 was sealed (seal portion 20).
  • the copper foil C4 of the laminated body 11 with the support material is removed by etching to form a conformal mask opening having a diameter of 60 to 80 ⁇ m, and a laser is applied to the opening from which the copper foil C4 has been removed. Irradiation was performed to remove the prepreg B6 to form an interlayer connection hole 12.
  • the end of the outer periphery of the laminated body 11 with the support material on which the interlayer connection 18 is formed is cut along the cutting line 14, and the laminated body 17 from between the copper foil A ⁇ b> 1 and the copper foil B ⁇ b> 2 of the peelable copper foil 3. Separated.
  • the end of the laminated body 11 with the support body may be cut by about 5 mm, and there was little time and effort for cutting and waste of materials.
  • the size of the laminated body 17 at this time was 600 mm long and 510 mm wide.
  • the inner layer circuit 15 was formed by circuit processing of the conductor layer 19 by etching.
  • a copper-clad laminate 8 (manufactured by Hitachi Chemical Co., Ltd., trade name, MCL-E-679FG, overall thickness 0.2 mm, copper foil thickness 12 ⁇ m) is used as a support material.
  • a slightly smaller copper foil B2 (3EC-M3-VLP, manufactured by Furukawa Circuit Foil Co., Ltd., product name, thickness 18 ⁇ m), prepreg B6 (GEA-679FG, manufactured by Hitachi Chemical Co., Ltd.) , Product name (nominal thickness 60 um), copper foil C4 (MT-18S5DH, manufactured by Mitsui Mining & Smelting Co., Ltd., product name, thickness 5 ⁇ m).
  • a laminated body 11 with a support material in which the outer peripheral portion of the copper foil B ⁇ b> 2 was sealed with the prepreg A ⁇ b> 5 was formed by laminating using a hot press.
  • the outer peripheral portion of the laminated body 11 with the support material is cut and removed by the cutting line 14. From 17, the copper-clad laminate 8 as the support material 7 was separated and removed. The size of the laminated body 17 at this time was 510 mm in length and 410 mm in width at the maximum. Next, a wiring board was manufactured from the laminate 17 in the same manner as in the example.
  • the method for producing a wiring board and a laminate with a support material according to the present invention are industrially effective because the material cost can be reduced by reducing the margin for cutting and removing in the coreless method, and the workability is good.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

A method for producing a wiring board, which comprises a step (1) wherein peelable copper foils, each of which has a copper foil (A) and a copper foil (B), are arranged on both sides of a prepreg (A) so as to sandwich the prepreg (A), and a prepreg (B) and a copper foil (C) are arranged and laminated on the outer side of each peelable copper foil, thereby forming a laminate with a supporting material. A laminate with a supporting material, wherein peelable copper foils, each of which has a copper foil (A) and a copper foil (B), are arranged on both sides of a prepreg (A) so as to sandwich the prepreg (A), and a prepreg (B) and a copper foil (C) are arranged and laminated on the outer side of each peelable copper foil.

Description

配線基板の製造方法及び支持材付き積層体Wiring substrate manufacturing method and laminate with support material
　本発明は、配線基板の製造方法及び支持材付き積層体に関し、特にはコアレス工法を用いた配線基板の製造方法及びコアレス工法に用いる支持材付き積層体に関する。 The present invention relates to a method for manufacturing a wiring board and a laminate with a support material, and more particularly, to a method for manufacturing a wiring board using a coreless method and a laminate with a support material used for the coreless method.
　近年、配線基板の薄型化に伴い、銅張り積層板をコアとして用いて多層化を行なうビルドアップ工法では対応が困難となっている。一方、コアとして銅張り積層板を用いなければ薄型化に対応できるが、この場合は、剛性が小さいため、製造プロセスでのハンドリングが困難となり、作業性が悪い。そこで、作業性を確保しつつ、薄型化に対応すべく、製品としての配線基板自体を構成しない支持材を用いて製造プロセスを途中まで進めた後、この支持材を分離してから最終プロセスまで進めて配線基板を製造する、いわゆるコアレス工法が用いられるようになった。 In recent years, with the thinning of the wiring board, it is difficult to cope with the build-up method in which the copper-clad laminate is used as a core and multilayered. On the other hand, if a copper-clad laminate is not used as a core, it can cope with a reduction in thickness, but in this case, since rigidity is small, handling in the manufacturing process becomes difficult and workability is poor. Therefore, after securing the workability and proceeding to the middle of the manufacturing process using a support material that does not constitute the circuit board itself as a product in order to cope with the reduction in thickness, the support material is separated until the final process. The so-called coreless method of manufacturing a wiring board by proceeding has come to be used.
　このようなコアレス工法としては、図１に示すように、支持材７として銅張り積層板８を用い、この銅張り積層板８の銅箔Ａ１上に、一回り小さい銅箔Ｂ２、プリプレグＢ６、銅箔Ｃ４の順に配置して構成し、熱プレスすることで、銅箔Ｂ２の外周部がプリプレグＢ６でシールされた支持材付き積層体１１を形成し、さらに回路、層間接続、絶縁層等を形成して多層化した後、支持材付き積層体１１の外周部を切断線１４で切断除去することで、積層体１７から支持材７である銅張り積層板８を分離除去し、この積層体１７から配線基板を製造する方法がある（特許文献１）。 As such a coreless construction method, as shown in FIG. 1, a copper-clad laminate 8 is used as a support material 7, and on the copper foil A <b> 1 of the copper-clad laminate 8, a slightly smaller copper foil B <b> 2, prepreg B <b> 6, The copper foil C4 is arranged and configured in this order, and is heat-pressed to form the laminated body 11 with the support material in which the outer peripheral portion of the copper foil B2 is sealed with the prepreg B6, and further, the circuit, the interlayer connection, the insulating layer, etc. After forming and multilayering, the outer peripheral portion of the laminated body 11 with the support material is cut and removed by the cutting line 14 to separate and remove the copper-clad laminate 8 which is the support material 7 from the laminated body 17. There is a method of manufacturing a wiring board from 17 (Patent Document 1).
　また、絶縁樹脂上に、キャリア銅箔付きの極薄銅箔（厚さ１～５μｍ）を、極薄銅箔を上側にして重ねて積層した後、表面の極薄銅箔上にパターン銅めっきを行い、その上にプリプレグと銅箔を重ねて配置し、積層することによって支持材付き積層体を形成し、さらに層間接続を形成した後、極薄銅箔とキャリア銅箔との間で、支持材であった絶縁樹脂から積層体を分離除去し、この積層体から配線基板を製造する方法がある（特許文献２）。 In addition, an ultra-thin copper foil (thickness 1 to 5 μm) with a carrier copper foil is laminated on the insulating resin with the ultra-thin copper foil on top, and then patterned copper plating on the ultra-thin copper foil on the surface , Prepreg and copper foil are placed on top of each other, laminated to form a laminated body with a support material, and further after forming an interlayer connection, between the ultrathin copper foil and the carrier copper foil, There is a method of separating and removing a laminate from an insulating resin that is a support material, and manufacturing a wiring board from the laminate (Patent Document 2).
特許第５０２９９１１号公報Japanese Patent No. 5029911 特許第４２７３８９５号公報Japanese Patent No. 4273895
　しかしながら、特許文献１の方法では、支持材として銅張り積層板を用いる必要があること、また、積層体と支持材とを分離する際に、切断除去する余白（外周部）が、積層体の端部から約１５ｍｍ程度と大きく、材料コスト面で問題がある。 However, in the method of Patent Document 1, it is necessary to use a copper-clad laminate as a support material, and when separating the laminate and the support material, the margin to be cut and removed (outer peripheral portion) There is a problem in terms of material cost because it is as large as about 15 mm from the end.
　また、特許文献２の方法では、支持材付きの積層体を形成する際に、支持材となる絶縁樹脂の両側に、キャリア銅箔付き極薄銅箔を積層し、パターン銅めっきを行い、さらにプリプレグと銅箔を積層し、層間接続を形成する必要があり、積層の回数が多いため、作業性の問題がある。また、支持材となる絶縁樹脂とキャリア銅箔の両者が、製品となる積層体から分離除去されるので、材料の無駄が多い問題がある。 In the method of Patent Document 2, when forming a laminate with a support material, an ultrathin copper foil with a carrier copper foil is laminated on both sides of an insulating resin to be a support material, pattern copper plating is performed, and It is necessary to form a prepreg and a copper foil to form an interlayer connection, and there is a problem in workability because the number of times of lamination is large. In addition, since both the insulating resin as the support material and the carrier copper foil are separated and removed from the laminate as the product, there is a problem that the material is wasted.
　本発明は、上記問題点に鑑みなされたものであり、コアレス工法において、切断除去する余白を少なして材料コストが低減でき、しかも作業性のよい配線基板の製造方法及び支持材付き積層体を提供する。 The present invention has been made in view of the above problems, and in the coreless construction method, a method for manufacturing a wiring board and a laminate with a support material that can reduce material cost by reducing the margin for cutting and removing, and that has good workability. provide.
　本発明は、プリプレグＡを挟んだ両側に、銅箔Ａと銅箔Ｂとを有するピーラブル銅箔を配置し、さらに両側にプリプレグＢと銅箔Ｃとを配置して積層し、支持材付き積層体を形成する工程（１）を有する配線基板の製造方法である。また、本発明は、プリプレグＡを挟んだ両側に、銅箔Ａと銅箔Ｂとを有するピーラブル銅箔を配置し、さらに両側にプリプレグＢと銅箔Ｃとを配置して積層した支持材付き積層体である。 In the present invention, a peelable copper foil having a copper foil A and a copper foil B is disposed on both sides of the prepreg A, and further a prepreg B and a copper foil C are disposed and laminated on both sides. It is a manufacturing method of a wiring board which has the process (1) which forms a body. In addition, the present invention has a support material in which a peelable copper foil having copper foil A and copper foil B is disposed on both sides of the prepreg A, and the prepreg B and copper foil C are disposed on both sides and laminated. It is a laminate.
　本発明によれば、銅箔Ａと銅箔Ｂとを有するピーラブル銅箔を用いて支持材付き積層体を形成するため、支持材側の銅箔Ａとその上に形成した配線基板の基となる積層体との分離を、銅箔Ａと銅箔Ｂの剥離性を利用して行なうことができる。このため、支持材と積層体との分離の際、従来技術である特許文献１のように、積層体の外周部全体を大きく切断する必要がなく、材料の無駄や手間を省くことができる。しかも、プリプレグＡを挟んだ両側に、銅箔Ａと銅箔Ｂとを有するピーラブル銅箔を配置し、さらに両側にプリプレグＢと銅箔Ｃとを配置して積層するだけで、支持材と配線基板の基になる積層体とを同時に形成できるので、構成作業が容易になる。 According to the present invention, in order to form a laminated body with a support material using a peelable copper foil having a copper foil A and a copper foil B, the copper foil A on the support material side and the base of the wiring board formed thereon Separation from the resulting laminate can be performed using the peelability of copper foil A and copper foil B. For this reason, when separating the support material and the laminate, it is not necessary to largely cut the entire outer peripheral portion of the laminate as in Patent Document 1, which is a conventional technique, and waste of materials and labor can be saved. Moreover, the support material and the wiring can be obtained simply by disposing a peelable copper foil having copper foil A and copper foil B on both sides of the prepreg A, and further laminating the prepreg B and copper foil C on both sides. Since the laminated body on which the substrate is based can be formed at the same time, the configuration work becomes easy.
　本発明は、上記のように、プリプレグＡを挟んだ両側に、銅箔Ａと銅箔Ｂとを有するピーラブル銅箔を配置し、さらに両側にプリプレグＢと銅箔Ｃとを配置して積層し、支持材付き積層体を形成する工程（１）に加えて、前記支持材付き積層体の銅箔Ｃから銅箔Ｂに到る層間接続孔を形成する工程（２）と、前記支持材付き積層体の層間接続孔及び銅箔Ｂ上に銅めっきを形成することにより、前記銅箔Ｃと銅箔Ｂとを接続する層間接続と、前記銅箔Ｃ及び銅めっきを有する導体層と、を形成する工程（３）と、を有する配線基板の製造方法である。 In the present invention, as described above, the peelable copper foil having the copper foil A and the copper foil B is disposed on both sides of the prepreg A, and the prepreg B and the copper foil C are further disposed on both sides and laminated. In addition to the step (1) of forming the laminate with support material, the step (2) of forming an interlayer connection hole from the copper foil C to the copper foil B of the laminate with support material, and with the support material By forming a copper plating on the interlayer connection hole and the copper foil B of the laminate, an interlayer connection for connecting the copper foil C and the copper foil B, and a conductor layer having the copper foil C and the copper plating, And a step (3) of forming a wiring board.
　本発明によれば、支持材付き積層体によって、製造プロセスでのハンドリングに耐え得る剛性が得られるため、薄型化が求められる配線基板を製造する場合でも、作業性が大幅に改善される。また、製品としての配線基板自体を構成しない支持材を用いて製造プロセスを途中まで進めた後、この支持材を分離してから最終プロセスまで進めて配線基板を製造する、いわゆるコアレス工法が容易となる。 According to the present invention, the laminate with a support material provides rigidity that can withstand handling in the manufacturing process, so that workability is greatly improved even when a wiring board that is required to be thin is manufactured. In addition, the so-called coreless method of manufacturing the wiring board by separating the supporting material and proceeding to the final process after the manufacturing process has been progressed halfway using a supporting material that does not constitute the wiring board itself as a product is easy. Become.
　上記の配線基板の製造方法の工程（１）又は上記の支持材付き積層体において、好ましくは、プリプレグＡとして、プリプレグＢよりも薄いものを使用する。つまり、支持材となるプリプレグＡのガラスクロスが薄ければ、ガラスクロスによる凹凸が小さいので、ガラスクロスの凹凸が、配線基板の基になる積層体の銅箔Ｂに転写し難くなり、銅箔Ｂを用いた微細回路形成の際に有利となる。 In the step (1) of the above-described method for manufacturing a wiring substrate or the above laminate with a support material, preferably, the prepreg A is thinner than the prepreg B. In other words, if the glass cloth of the prepreg A serving as a support material is thin, the unevenness due to the glass cloth is small, so that the unevenness of the glass cloth is difficult to transfer to the copper foil B of the laminate on which the wiring board is based. This is advantageous when forming a fine circuit using B.
　上記の配線基板の製造方法の工程（１）又は上記の支持材付き積層体において、好ましくは、ピーラブル銅箔の大きさが、このピーラブル銅箔の両側に積層されるプリプレグＡ、Ｂより小さい。これにより、ピーラブルの外周からプリプレグＡ、Ｂがはみ出すように構成することができ、ピーラブル銅箔の端部をプリプレグＡ、Ｂの樹脂でシールすることが可能になる。このため、製造プロセスでのハンドリング等で銅箔Ａと銅箔Ｂが剥離したり、銅箔Ａと銅箔Ｂとの間に処理液等が入り込むのを抑制でき、作業性が向上する。なお、プリプレグＡ、Ｂは、ピーラブル銅箔よりも５ｍｍ大きい程度でよいので、銅箔Ａと銅箔Ｂとの間で分離する際は、端部を５ｍｍ程度切断すればよく、切断の手間や材料の無駄が少ない。 In the step (1) of the above method for manufacturing a wiring board or the above laminate with a support material, preferably, the size of the peelable copper foil is smaller than the prepregs A and B laminated on both sides of the peelable copper foil. Thereby, it can comprise so that prepreg A, B may protrude from the outer periphery of peelable, and it becomes possible to seal the edge part of peelable copper foil with resin of prepreg A, B. For this reason, it can control that copper foil A and copper foil B exfoliate by handling in a manufacturing process, etc., or a processing liquid enters between copper foil A and copper foil B, and workability improves. The prepregs A and B may be about 5 mm larger than the peelable copper foil. Therefore, when separating between the copper foil A and the copper foil B, the end portion may be cut by about 5 mm. There is little waste of material.
　上記の配線基板の製造方法の工程（１）又は上記の支持材付き積層体において、好ましくは、ピーラブル銅箔が、このピーラブル銅箔の両側に積層されるプリプレグＡ、Ｂからはみ出さないように構成される。これにより、ピーラブルの外周を、確実にプリプレグＡ、Ｂで覆うことが可能になる。このため、作業性が向上する。 In the step (1) of the method for producing a wiring board or the laminate with a support material, preferably, the peelable copper foil does not protrude from the prepregs A and B laminated on both sides of the peelable copper foil. Composed. This makes it possible to reliably cover the outer periphery of the peelable with the prepregs A and B. For this reason, workability | operativity improves.
　上記の配線基板の製造方法の工程（１）又は上記の支持材付き積層体において、好ましくは、３層ピーラブル銅箔の周囲が、このピーラブル銅箔の両側に積層されるプリプレグＡ、Ｂによりシール（密封）される。これにより、製造プロセスでのハンドリング等で銅箔Ａと銅箔Ｂが剥離したり、銅箔Ａと銅箔Ｂとの間に処理液等が入り込むのを確実に抑制でき、作業性が向上する。 In the step (1) of the method for producing a wiring board or the laminate with a support material, preferably, the periphery of the three-layer peelable copper foil is sealed with prepregs A and B laminated on both sides of the peelable copper foil. (Sealed). Thereby, it can suppress reliably that copper foil A and copper foil B peel by handling in a manufacturing process, etc., or a process liquid enters between copper foil A and copper foil B, and workability | operativity improves. .
　本発明によれば、コアレス工法において、切断除去する余白を少なして材料コストが低減でき、しかも作業性のよい配線基板の製造方法及び支持材付き積層体を提供することができる。 According to the present invention, in the coreless construction method, it is possible to provide a method for manufacturing a wiring board and a laminate with a support material that can reduce material costs by reducing margins for cutting and removing, and that have good workability.
従来の配線基板の製造方法の一部を表すフロー図である。It is a flowchart showing a part of manufacturing method of the conventional wiring board. 本実施の形態の配線基板の製造方法の一部を表すフロー図である。It is a flowchart showing a part of manufacturing method of the wiring board of this Embodiment. 本実施の形態の配線基板の製造方法の一部を表すフロー図又は本実施の形態の支持材付き積層体の断面図である。It is a flowchart showing a part of manufacturing method of the wiring board of this Embodiment, or sectional drawing of the laminated body with a support material of this Embodiment. 本実施の形態の配線基板の製造方法の一部を表すフロー図である。It is a flowchart showing a part of manufacturing method of the wiring board of this Embodiment. 本実施の形態の配線基板の製造方法の一部を表すフロー図である。It is a flowchart showing a part of manufacturing method of the wiring board of this Embodiment. 本実施の形態の配線基板の製造方法の一部を表すフロー図である。It is a flowchart showing a part of manufacturing method of the wiring board of this Embodiment. 本実施の形態の配線基板の製造方法の一部を表すフロー図である。It is a flowchart showing a part of manufacturing method of the wiring board of this Embodiment. 本実施の形態の配線基板の製造方法の一部を表すフロー図である。It is a flowchart showing a part of manufacturing method of the wiring board of this Embodiment. 本実施の形態の配線基板の製造方法の一部を表すフロー図又は本実施の形態の支持材付き積層体の断面図である。It is a flowchart showing a part of manufacturing method of the wiring board of this Embodiment, or sectional drawing of the laminated body with a support material of this Embodiment.
　本発明の実施の形態の一例である配線基板の製造方法について、図２～図９を用いて以下に説明する。 A method for manufacturing a wiring board as an example of an embodiment of the present invention will be described below with reference to FIGS.
　本実施の形態の配線基板の製造方法は、プリプレグＡ５を挟んだ両側に、銅箔Ａ１と銅箔Ｂ２とを有するピーラブル銅箔３を配置し、さらに両側にプリプレグＢ６と銅箔Ｃ４とを配置して積層し、支持材付き積層体１１を形成する工程（１）と、前記支持材付き積層体１１の銅箔Ｃ４から銅箔Ｂ２に到る層間接続穴１２を形成する工程（２）と、前記支持材付き積層体１１の層間接続穴１２及び銅箔Ｂ２上に銅めっき１３を形成することにより、前記銅箔Ｃ４と銅箔Ｂ２とを接続する層間接続１８と、前記銅箔Ｃ４及び銅めっき１３を有する導体層１９と、を形成する工程（３）と、を有する。 In the method for manufacturing a wiring board according to the present embodiment, peelable copper foil 3 having copper foil A1 and copper foil B2 is arranged on both sides of prepreg A5, and prepreg B6 and copper foil C4 are arranged on both sides. And (1) forming the laminated body 11 with the support material, and (2) forming the interlayer connection hole 12 from the copper foil C4 of the laminated body 11 with the support material to the copper foil B2. By forming the copper plating 13 on the interlayer connection hole 12 and the copper foil B2 of the laminated body 11 with the support material, the interlayer connection 18 that connects the copper foil C4 and the copper foil B2, and the copper foil C4 and A step (3) of forming a conductor layer 19 having a copper plating 13.
　図２及び図３に示すように、本実施の形態の配線基板の製造方法の工程（１）では、プリプレグＡ５を挟んだ両側に、銅箔Ａ１と銅箔Ｂ２とを有するピーラブル銅箔３を配置し、さらに両側にプリプレグＢ６と銅箔Ｃ４とを配置して積層し、支持材付き積層体１１を形成する。具体的には、プリプレグＡ５、ピーラブル銅箔３、プリプレグＢ６及び銅箔Ｃ４を準備し、プリプレグＡ５の両側に、ピーラブル銅箔３、プリプレグＢ６、銅箔Ｃ４の順に配置し、これらの材料を熱プレスにより接着させる。ピーラブル銅箔３とは、キャリアとなる銅箔Ａ１の片側に、物理的に剥離可能な銅箔Ｂ２を設けた２層構造を有する銅箔である。ピーラブル銅箔３は、配線基板において用いられる、公知のキャリア付き銅箔を用いることができる。本実施の形態の配線基板の製造方法において、プリプレグＡ５とその両側に積層されたピーラブル銅箔３の銅箔Ａ（キャリア）までが支持材７となり、ピーラブル銅箔３の銅箔Ｂ２から上層側が配線基板の基となる積層体１７となる。支持材７は、製造プロセス中でのみ用いられるが、製品としての配線基板を構成する材料としては用いられないものである。プリプレグＡ５、Ｂ６としては、配線基板において一般的に用いられる絶縁材を用いることができ、例えば、ガラスクロスにエポキシ樹脂又はポリイミド樹脂等を含浸させたものが挙げられる。銅箔Ｃ４としては、配線基板に一般的に用いられる銅箔を用いることができる。積層とは、熱プレスにて加熱・加圧することで、プリプレグ中の絶縁樹脂を溶融・硬化させて、銅箔を接着させることである。 As shown in FIG.2 and FIG.3, in the process (1) of the manufacturing method of the wiring board of this Embodiment, the peelable copper foil 3 which has the copper foil A1 and the copper foil B2 is provided on both sides which pinched | interposed the prepreg A5. The prepreg B6 and the copper foil C4 are further arranged and laminated on both sides to form a laminated body 11 with a support material. Specifically, the prepreg A5, the peelable copper foil 3, the prepreg B6, and the copper foil C4 are prepared, and the peelable copper foil 3, the prepreg B6, and the copper foil C4 are arranged in this order on both sides of the prepreg A5, and these materials are heated. Adhere by pressing. The peelable copper foil 3 is a copper foil having a two-layer structure in which a physically peelable copper foil B2 is provided on one side of a copper foil A1 serving as a carrier. The peelable copper foil 3 may be a known copper foil with a carrier used in a wiring board. In the manufacturing method of the wiring board of the present embodiment, the prepreg A5 and the copper foil A (carrier) of the peelable copper foil 3 laminated on both sides thereof become the support material 7, and the upper layer side from the copper foil B2 of the peelable copper foil 3 is It becomes the laminated body 17 which becomes the base of a wiring board. The support material 7 is used only during the manufacturing process, but is not used as a material constituting the wiring board as a product. As the prepregs A5 and B6, an insulating material generally used in a wiring board can be used, and examples thereof include a glass cloth impregnated with an epoxy resin or a polyimide resin. As copper foil C4, the copper foil generally used for a wiring board can be used. Lamination means that the insulating resin in the prepreg is melted and cured by heating and pressing with a hot press, and the copper foil is bonded.
　このように、本実施の形態の配線基板の製造方法では、銅箔Ａと銅箔Ｂとを有するピーラブル銅箔を用いて支持材付き積層体を形成するため、支持材側の銅箔Ａとその上に形成した配線基板の基となる積層体との分離を、銅箔Ａと銅箔Ｂの剥離性を利用して行なうことができる。このため、支持材と積層体との分離の際、従来技術である特許文献１のように、積層体の外周部全体を大きく切断する必要がなく、材料の無駄や手間を省くことができる。しかも、プリプレグＡを挟んだ両側に、銅箔Ａと銅箔Ｂとを有するピーラブル銅箔を配置し、さらに両側にプリプレグＢと銅箔Ｃとを配置して積層するだけで、支持材と配線基板の基になる積層体とを同時に形成できるので、構成作業が容易になる。したがって、コアレス工法において、切断除去する余白を少なして材料コストが低減でき、しかも作業性のよい配線基板の製造方法を提供することができる。 Thus, in the manufacturing method of the wiring board of this Embodiment, in order to form the laminated body with a support material using the peelable copper foil which has the copper foil A and the copper foil B, the copper foil A by the side of a support material and Separation from the laminate on which the wiring board is formed can be performed using the peelability of the copper foil A and the copper foil B. For this reason, when separating the support material and the laminate, it is not necessary to largely cut the entire outer peripheral portion of the laminate as in Patent Document 1, which is a conventional technique, and waste of materials and labor can be saved. Moreover, the support material and the wiring can be obtained simply by disposing a peelable copper foil having copper foil A and copper foil B on both sides of the prepreg A, and further laminating the prepreg B and copper foil C on both sides. Since the laminated body on which the substrate is based can be formed at the same time, the configuration work becomes easy. Therefore, in the coreless construction method, it is possible to provide a method for manufacturing a wiring board that can reduce the material cost by reducing the margin for cutting and removing, and has good workability.
　図４に示すように、本実施の形態の配線基板の製造方法の工程（２）では、支持材付き積層体１１の銅箔Ｃ４から銅箔Ｂ２に到る層間接続穴１２を形成する。具体的には、コンフォーマルマスク法により、銅箔Ｃ４にエッチングで層間接続穴１２の予定箇所に開口を設け、その開口にレーザーを照射し、プリプレグＢ６を除去する。層間接続穴１２とは、絶縁材であるプリプレグＢ６の両側に配置された銅箔Ｃ４と銅箔Ｂ２を導通させて層間接続１８を形成するための穴である。この層間接続穴１２の形成方法としては、上記のコンフォーマルマスク法以外にも、銅箔Ｃ４に開口を設けずに、銅箔Ｃ４とプリプレグＢ６とを除去する、ダイレクトレーザ法を用いてもよい。 As shown in FIG. 4, in the step (2) of the method of manufacturing the wiring board according to the present embodiment, an interlayer connection hole 12 extending from the copper foil C4 to the copper foil B2 of the laminated body 11 with the support material is formed. Specifically, an opening is provided at a predetermined location of the interlayer connection hole 12 by etching in the copper foil C4 by a conformal mask method, and the opening is irradiated with a laser to remove the prepreg B6. The interlayer connection hole 12 is a hole for forming the interlayer connection 18 by conducting the copper foil C4 and the copper foil B2 disposed on both sides of the prepreg B6 that is an insulating material. As a method for forming the interlayer connection hole 12, in addition to the above-described conformal mask method, a direct laser method in which the copper foil C4 and the prepreg B6 are removed without providing an opening in the copper foil C4 may be used. .
　図５に示すように、本実施の形態の配線基板の製造方法の工程（３）では、支持材付き積層体１１の層間接続穴１２及び銅箔Ｃ４上に銅めっき１３を形成することにより、銅箔Ｃ４と銅箔Ｂ２とを接続する層間接続１８と、銅箔Ｃ４及び銅めっき１３を有する導体層１９と、を形成する。具体的には、工程（２）で形成された層間接続穴１２内を銅めっき１３で充填させ、かつ銅箔Ｃ４表面上にも銅めっき１３を形成し、導体層１９を形成する。つまり、本実施の形態において、導体層１９は、銅箔Ｃ４と銅めっき１３の２層で形成される。 As shown in FIG. 5, in the process (3) of the manufacturing method of the wiring board of this Embodiment, by forming the copper plating 13 on the interlayer connection hole 12 and the copper foil C4 of the laminated body 11 with the support material, An interlayer connection 18 for connecting the copper foil C4 and the copper foil B2 and a conductor layer 19 having the copper foil C4 and the copper plating 13 are formed. Specifically, the interlayer connection hole 12 formed in the step (2) is filled with the copper plating 13, and the copper plating 13 is also formed on the surface of the copper foil C4 to form the conductor layer 19. That is, in the present embodiment, the conductor layer 19 is formed of two layers of the copper foil C4 and the copper plating 13.
　図６に示すように、本実施の形態の配線基板の製造方法の工程（４）では、銅箔Ｂ２を含む積層体１７を、支持材７である銅箔Ａ１から分離する。具体的には、支持材７の一部である銅箔Ａ１と、配線基板の基になる積層体１７の一部である銅箔Ｂ２とは、剥離性を有しているので、容易に剥離することができる。なお、支持材付き積層体１１の端部に、熱プレスを用いた積層によって、プリプレグＡ５、Ｂ６の絶縁樹脂が流れ出して硬化している場合でも、例えば、図５の切断線１４のところで、支持材付き積層体１１の端部（外周）を５ｍｍ程度切断することで剥離が可能である。このため、従来に比べて材料の無駄が少ない。 As shown in FIG. 6, in step (4) of the method for manufacturing a wiring board according to the present embodiment, the laminate 17 including the copper foil B <b> 2 is separated from the copper foil A <b> 1 that is the support material 7. Specifically, since the copper foil A1 which is a part of the support material 7 and the copper foil B2 which is a part of the laminate 17 which is the basis of the wiring board have releasability, they can be easily peeled off. can do. Even when the insulating resin of the prepregs A5 and B6 flows out and is cured at the end of the laminated body 11 with the support material by lamination using a hot press, for example, at the cutting line 14 in FIG. Separation is possible by cutting about 5 mm at the end (outer periphery) of the laminate 11 with material. For this reason, there is little waste of material compared with the past.
　図７に示すように、本実施の形態の配線基板の製造方法の工程（５）では、銅箔Ｃ４及び銅めっき１３を有する導体層１９と、銅箔Ｂ２を回路加工し、内層回路１５を形成する。具体的には、配線基板の製造に一般に用いられるエッチングレジストを導体層１９と銅箔Ｂ２に形成し、公知のサブトラクト法で形成できる。 As shown in FIG. 7, in the process (5) of the manufacturing method of the wiring board of the present embodiment, the conductor layer 19 having the copper foil C4 and the copper plating 13 and the copper foil B2 are processed into a circuit, and the inner layer circuit 15 is formed. Form. Specifically, an etching resist generally used for manufacturing a wiring board is formed on the conductor layer 19 and the copper foil B2, and can be formed by a known subtractive method.
　図８に示すように、本実施の形態の配線基板の製造方法では、内層回路１５上に、プリプレグＣ１０、銅箔Ｄ９の順に配置し、積層する。さらに層間接続（図示しない。）を設け、めっき処理及び回路加工を行なうことで上層回路（図示しない。）を形成する。 As shown in FIG. 8, in the method for manufacturing a wiring board according to the present embodiment, the prepreg C10 and the copper foil D9 are arranged and laminated on the inner layer circuit 15 in this order. Furthermore, an interlayer connection (not shown) is provided, and an upper layer circuit (not shown) is formed by performing plating and circuit processing.
　本実施の形態の配線基板の製造方法によれば、支持材付き積層体１１によって、製造プロセスでのハンドリングに耐え得る剛性が得られるため、薄型化が求められる配線基板１６を製造する場合でも、作業性が大幅に改善される。また、製品としての配線基板１６自体を構成しない支持材７を用いて製造プロセスを途中まで進めた後、この支持材７を分離してから最終プロセスまで進めて配線基板１６を製造する、いわゆるコアレス工法が容易となる。 According to the method for manufacturing a wiring board of the present embodiment, the laminate 11 with a support material provides rigidity that can withstand handling in the manufacturing process, so even when manufacturing the wiring board 16 that is required to be thin, Workability is greatly improved. In addition, the manufacturing process is advanced halfway using the support material 7 that does not constitute the product wiring board 16 itself, and then the support material 7 is separated and then advanced to the final process to manufacture the wiring board 16. The construction method becomes easy.
　本発明の実施形態の一例である支持材付き積層体について、図３を用いて以下に説明する。 A laminated body with a support material which is an example of an embodiment of the present invention will be described below with reference to FIG.
　本実施の形態の支持材付き積層体１１は、プリプレグＡ５を挟んだ両側に、銅箔Ａ１と銅箔Ｂ２とを有するピーラブル銅箔３を配置し、さらに両側にプリプレグＢ６と銅箔Ｃ４とを配置して積層した支持材付き積層体１１である。 The laminated body 11 with a support material of this Embodiment arrange | positions the peelable copper foil 3 which has copper foil A1 and copper foil B2 on both sides which pinched | interposed the prepreg A5, and also has prepreg B6 and copper foil C4 on both sides. It is the laminated body 11 with a support material which has been arranged and laminated.
　本実施の形態の支持材付き積層体１１によれば、銅箔Ａ１と銅箔Ｂ２とを有するピーラブル銅箔３を用いて支持材付き積層体１１を形成するため、支持材７側の銅箔Ａ１とその上に形成した配線基板１６の基となる積層体１７との分離を、銅箔Ａ１と銅箔Ｂ２の剥離性を利用して行なうことができる。このため、支持材７と積層体１７との分離の際、従来のように、積層体１７の外周部全体を切断する必要がなく、材料の無駄や手間を省くことができる。しかも、プリプレグＡ５を挟んだ両側に、銅箔Ａ１と銅箔Ｂ２とを有するピーラブル銅箔３を配置し、さらに両側にプリプレグＢ６と銅箔Ｃ４とを配置して積層するだけで、支持材７と配線基板１６の基になる積層体１７とを同時に形成できるので、構成作業が容易になる。したがって、コアレス工法において、切断除去する余白を少なして材料コストが低減でき、しかも作業性のよい支持材付き積層体を提供することができる。 According to the laminated body 11 with a support material of this Embodiment, since the laminated body 11 with a support material is formed using the peelable copper foil 3 having the copper foil A1 and the copper foil B2, the copper foil on the support material 7 side. Separation between A1 and the laminated body 17 serving as a base of the wiring board 16 formed thereon can be performed using the peelability of the copper foil A1 and the copper foil B2. For this reason, when separating the support material 7 and the laminated body 17, it is not necessary to cut the entire outer peripheral portion of the laminated body 17 as in the prior art, and material waste and labor can be saved. In addition, the peelable copper foil 3 having the copper foil A1 and the copper foil B2 is arranged on both sides of the prepreg A5, and the prepreg B6 and the copper foil C4 are further arranged on both sides to be laminated. And the laminated body 17 on which the wiring board 16 is based can be formed at the same time, which facilitates the configuration work. Therefore, in the coreless construction method, it is possible to provide a laminate with a support material that can reduce the material cost by reducing the margin for cutting and removing, and has good workability.
　上記実施の形態の配線基板の製造方法の工程（１）又は支持材付き積層体において、好ましくは、プリプレグＡとして、プリプレグＢよりも薄いガラスクロスを用いたものを使用する。つまり、支持材となるプリプレグＡが薄ければ、ガラスクロスによる凹凸が小さいので、ガラスクロスの凹凸が、配線基板の基になる積層体の銅箔Ｂに転写し難くなり、銅箔Ｂを用いた微細回路形成の際に有利となる。 In the step (1) of the method for manufacturing a wiring board according to the above-described embodiment or the laminate with a support material, a prepreg A that uses a glass cloth thinner than the prepreg B is preferably used. In other words, if the prepreg A serving as a support material is thin, the unevenness due to the glass cloth is small, so that the unevenness of the glass cloth is difficult to transfer to the copper foil B of the laminate on which the wiring board is based, and the copper foil B is used. This is advantageous when forming a fine circuit.
　上記実施の形態の配線基板の製造方法の工程（１）又は支持材付き積層体において、好ましくは、図９Ａに示すように、ピーラブル銅箔３の大きさが、このピーラブル銅箔３の両側に積層されるプリプレグＡ５、Ｂ６より小さい。これにより、ピーラブル銅箔３の外周からプリプレグＡ５、Ｂ６がはみ出すように構成することができ、ピーラブル銅箔３の端部をプリプレグＡ５、Ｂ６の樹脂でシール（図９Ｂのシール部２０）することが可能になる。このため、製造プロセスでのハンドリング等で銅箔Ａ１と銅箔Ｂ２が剥離したり、銅箔Ａ１と銅箔Ｂ２との間に処理液等が入り込むのを抑制でき、作業性が向上する。なお、プリプレグＡ５、Ｂ６は、ピーラブル銅箔３よりも５ｍｍ大きい程度でよいので、銅箔Ａ１と銅箔Ｂ２との間で分離する際は、端部を５ｍｍ程度切断すればよく（図９Ｃの切断線１４）、切断の手間や材料の無駄が少ない。 In the step (1) of the manufacturing method of the wiring board of the above embodiment or the laminated body with a support material, preferably, the size of the peelable copper foil 3 is on both sides of the peelable copper foil 3 as shown in FIG. 9A. It is smaller than the prepregs A5 and B6 to be laminated. Thereby, it can comprise so that prepreg A5, B6 may protrude from the outer periphery of peelable copper foil 3, and it seals the edge part of peelable copper foil 3 with resin of prepreg A5, B6 (seal part 20 of FIG. 9B). Is possible. For this reason, it can suppress that copper foil A1 and copper foil B2 peel by handling in a manufacturing process, etc., or a process liquid etc. enter | penetrate between copper foil A1 and copper foil B2, and workability | operativity improves. In addition, since the prepregs A5 and B6 may be about 5 mm larger than the peelable copper foil 3, when separating between the copper foil A1 and the copper foil B2, the end may be cut by about 5 mm (FIG. 9C). Cutting line 14), cutting effort and material waste are small.
　上記実施の形態の配線基板の製造方法の工程（１）又は支持材付き積層体において、好ましくは、図９Ａに示すように、ピーラブル銅箔３が、このピーラブル銅箔３の両側に積層されるプリプレグＡ５、Ｂ６からはみ出さないように構成される。これにより、ピーラブル銅箔３の外周を、確実にプリプレグＡ５、Ｂ６で覆うことが可能になる（図９Ｂのシール部２０）。このため、作業性が向上する。 In the step (1) of the method for manufacturing a wiring board of the above embodiment or the laminate with a support material, preferably, the peelable copper foil 3 is laminated on both sides of the peelable copper foil 3 as shown in FIG. 9A. It is configured not to protrude from the prepregs A5 and B6. Thereby, it becomes possible to reliably cover the outer periphery of the peelable copper foil 3 with the prepregs A5 and B6 (the seal portion 20 in FIG. 9B). For this reason, workability | operativity improves.
　上記実施の形態の配線基板の製造方法の工程（１）又は支持材付き積層体において、好ましくは、図９Ｂに示すように、ピーラブル銅箔３の周囲が、このピーラブル銅箔３の両側に積層されるプリプレグＡ５、Ｂ６によりシールされる（シール部２０）。これにより、製造プロセスでのハンドリング等で銅箔Ａ１と銅箔Ｂ２が剥離したり、銅箔Ａ１と銅箔Ｂ２との間に処理液等が入り込むのを確実に抑制でき、作業性が向上する。 In the step (1) of the method for manufacturing a wiring board according to the above embodiment or the laminated body with a support material, preferably, the periphery of the peelable copper foil 3 is laminated on both sides of the peelable copper foil 3 as shown in FIG. 9B. The prepregs A5 and B6 are sealed (seal part 20). Thereby, it can suppress reliably that copper foil A1 and copper foil B2 peel by handling in a manufacturing process, or a process liquid enters between copper foil A1 and copper foil B2, and workability | operativity improves. .
　以下に、本発明の実施例を説明するが、本発明は本実施例に限定されない。 Examples of the present invention will be described below, but the present invention is not limited to the examples.
　図９Ａに示すように、プリプレグＡ５として、ＧＥＡ－６７９ＦＧ（日立化成株式会社製、商品名。公称厚み３０μｍ）、ピーラブル銅箔３として、厚さ３５μｍのキャリア銅箔Ａ１に、厚さ３μｍの極薄銅箔Ｂ２が貼り合わされた３ＦＤ－Ｐ３／３５（古河サーキットフォイル株式会社製、商品名）、プリプレグＢ６として、ＧＥＡ－６７９ＦＧ（日立化成株式会社製、商品名。公称厚み６０μｍ）、銅箔Ｃ４として、ＭＴ－１８Ｓ５ＤＨ（三井金属鉱業株式会社製、商品名。厚さ５μｍ）を構成した。このように、プリプレグＡ５として、プリプレグＢ６よりも薄いものを使用した。また、ピーラブル銅箔３の大きさが、このピーラブル銅箔３の両側に積層されるプリプレグＡ５、Ｂ６よりも、縦横とも５ｍｍ程度小さいものを準備し、ピーラブル銅箔３が、このピーラブル銅箔３の両側に積層されるプリプレグＡ、Ｂからはみ出さないように構成した。 As shown in FIG. 9A, as prepreg A5, GEA-679FG (trade name, manufactured by Hitachi Chemical Co., Ltd., nominal thickness 30 μm), as peelable copper foil 3, carrier copper foil A1 having a thickness of 35 μm, pole having a thickness of 3 μm 3FD-P3 / 35 (trade name, manufactured by Furukawa Circuit Foil Co., Ltd.) to which thin copper foil B2 is bonded, GEA-679FG (trade name, manufactured by Hitachi Chemical Co., Ltd., nominal thickness 60 μm) as prepreg B6, copper foil C4 MT-18S5DH (manufactured by Mitsui Mining & Smelting Co., Ltd., trade name, thickness 5 μm) was constructed. Thus, as prepreg A5, what was thinner than prepreg B6 was used. Moreover, the size of the peelable copper foil 3 is about 5 mm smaller than the prepregs A5 and B6 laminated on both sides of the peelable copper foil 3, and the peelable copper foil 3 is made of the peelable copper foil 3 The prepregs A and B stacked on both sides of the prepreg were configured so as not to protrude.
　次に、図９Ｂに示すように、熱プレスで加熱・加圧して支持材付き積層体１１を形成した。このとき、支持材付き積層体１１の端部に、熱プレスを用いた積層によって、プリプレグＡ５の絶縁樹脂が流れ出して硬化し、ピーラブル銅箔３の端部がシール（シール部２０）されていた。 Next, as shown in FIG. 9B, the laminated body 11 with a support material was formed by heating and pressing with a hot press. At this time, the insulating resin of the prepreg A5 flowed out and hardened to the end portion of the laminated body 11 with the support material by lamination using a hot press, and the end portion of the peelable copper foil 3 was sealed (seal portion 20). .
　図９Ｃに示すように、支持材付き積層体１１の銅箔Ｃ４をエッチングで除去することで、直径６０～８０μｍのコンフォーマルマスク用の開口を形成し、銅箔Ｃ４を除去した開口にレーザーを照射し、プリプレグＢ６を除去して層間接続穴１２を形成した。 As shown in FIG. 9C, the copper foil C4 of the laminated body 11 with the support material is removed by etching to form a conformal mask opening having a diameter of 60 to 80 μm, and a laser is applied to the opening from which the copper foil C4 has been removed. Irradiation was performed to remove the prepreg B6 to form an interlayer connection hole 12.
　図９Ｃに示すように、銅めっき処理を行ない、層間接続穴１２内をフィルドめっきを用いた銅めっき１３で充填し、層間接続１８と導体層１９を形成した。 As shown in FIG. 9C, a copper plating process was performed, and the interlayer connection hole 12 was filled with a copper plating 13 using filled plating to form an interlayer connection 18 and a conductor layer 19.
　図９Ｃに示すように、層間接続１８を形成した支持材付き積層体１１の外周の端部を切断線１４で切断し、ピーラブル銅箔３の銅箔Ａ１と銅箔Ｂ２の間から積層体１７を分離した。このとき、支持体付き積層体１１の端部を５ｍｍ程度切断すればよく、切断の手間や材料の無駄は少なかった。このときの積層体１７のサイズは、縦６００ｍｍ、横５１０ｍｍであった。 As shown in FIG. 9C, the end of the outer periphery of the laminated body 11 with the support material on which the interlayer connection 18 is formed is cut along the cutting line 14, and the laminated body 17 from between the copper foil A <b> 1 and the copper foil B <b> 2 of the peelable copper foil 3. Separated. At this time, the end of the laminated body 11 with the support body may be cut by about 5 mm, and there was little time and effort for cutting and waste of materials. The size of the laminated body 17 at this time was 600 mm long and 510 mm wide.
　図７に示すように、エッチングにて導体層１９を回路加工することで、内層回路１５を形成した。 As shown in FIG. 7, the inner layer circuit 15 was formed by circuit processing of the conductor layer 19 by etching.
　図８に示すように、内層回路１５上に、プリプレグＣ１０として、ＧＥＡ－６７９ＦＧ（日立化成株式会社製、製品名。公称厚み３０μｍ）、銅箔Ｄ９として、ＭＴ－１８Ｓ５ＤＨ（三井金属鉱業株式会社製、製品名。厚さ５μｍ）の順に配置し、熱プレスで加熱・加圧することで、プリプレグＣ１０と銅箔Ｄ９を接着させ、配線基板１６を作製した。 As shown in FIG. 8, on the inner layer circuit 15, as prepreg C10, GEA-679FG (manufactured by Hitachi Chemical Co., Ltd., product name; nominal thickness 30 μm) and as copper foil D9, MT-18S5DH (manufactured by Mitsui Mining & Smelting Co., Ltd.) , Product name (thickness: 5 μm) in this order, and heated and pressed with a hot press to bond the prepreg C10 and the copper foil D9 to produce the wiring board 16.
（比較例）
　図１Ａに示すように、支持材として銅張り積層板８（日立化成株式会社製、商品名、ＭＣＬ－Ｅ－６７９ＦＧ、全体厚さ０．２ｍｍ、銅箔厚さ１２μｍ）を用い、この銅張り積層板８の銅箔Ａ１上に、一回り小さい銅箔Ｂ２（３ＥＣ－Ｍ３－ＶＬＰ、古河サーキットフォイル株式会社製、商品名。厚さ１８μｍ）、プリプレグＢ６（ＧＥＡ－６７９ＦＧ、日立化成株式会社製、製品名。公称厚み６０ｕｍ）、銅箔Ｃ４（ＭＴ－１８Ｓ５ＤＨ、三井金属鉱業株式会社製、製品名。厚さ５μｍ）の順に配置して構成した。次に、図１Ｂに示すように、熱プレスを用いて積層することで、銅箔Ｂ２の外周部がプリプレグＡ５でシールされた支持材付き積層体１１を形成した。次に、図１Ｃに示すように、層間接続穴１２、層間接続１８となる銅めっき１３を形成した後、支持材付き積層体１１の外周部を切断線１４で切断除去することで、積層体１７から支持材７である銅張り積層板８を分離除去した。このときの積層体１７のサイズは、最大でも、縦５１０ｍｍ、横４１０ｍｍであった。次に、実施例と同様にして、この積層体１７から配線基板を製造した。 (Comparative example)
As shown in FIG. 1A, a copper-clad laminate 8 (manufactured by Hitachi Chemical Co., Ltd., trade name, MCL-E-679FG, overall thickness 0.2 mm, copper foil thickness 12 μm) is used as a support material. On the copper foil A1 of the laminated plate 8, a slightly smaller copper foil B2 (3EC-M3-VLP, manufactured by Furukawa Circuit Foil Co., Ltd., product name, thickness 18 μm), prepreg B6 (GEA-679FG, manufactured by Hitachi Chemical Co., Ltd.) , Product name (nominal thickness 60 um), copper foil C4 (MT-18S5DH, manufactured by Mitsui Mining & Smelting Co., Ltd., product name, thickness 5 μm). Next, as shown in FIG. 1B, a laminated body 11 with a support material in which the outer peripheral portion of the copper foil B <b> 2 was sealed with the prepreg A <b> 5 was formed by laminating using a hot press. Next, as shown in FIG. 1C, after forming the copper plating 13 to be the interlayer connection hole 12 and the interlayer connection 18, the outer peripheral portion of the laminated body 11 with the support material is cut and removed by the cutting line 14. From 17, the copper-clad laminate 8 as the support material 7 was separated and removed. The size of the laminated body 17 at this time was 510 mm in length and 410 mm in width at the maximum. Next, a wiring board was manufactured from the laminate 17 in the same manner as in the example.
　実施例と比較例で作製した、支持材と分離した後の積層体の面積比と製品取数を比較した。この結果を、表１に示す。実施例は、面積比と製品取数にて比較すると、比較例（従来工法）に対して何れも増加した。 The area ratio of the laminates separated from the support materials produced in the examples and comparative examples and the number of products obtained were compared. The results are shown in Table 1. When compared with the comparative example (conventional method), the examples increased in comparison with the area ratio and the number of products.
Figure JPOXMLDOC01-appb-T000001
Figure JPOXMLDOC01-appb-T000001
　本発明の配線基板の製造方法及び支持材付き積層体は、コアレス工法において、切断除去する余白を少なして材料コストが低減でき、しかも作業性がよいため、産業上有効である。 The method for producing a wiring board and a laminate with a support material according to the present invention are industrially effective because the material cost can be reduced by reducing the margin for cutting and removing in the coreless method, and the workability is good.
１：銅箔Ａ
２：銅箔Ｂ
３：ピーラブル銅箔
４：銅箔Ｃ
５：プリプレグＡ
６：プリプレグＢ
７：支持材
８：銅張り積層板
９：銅箔Ｄ
１０：プリプレグＣ
１１：支持材付き積層体
１２：層間接続穴
１３：銅めっき
１４：切断線
１５：内層回路
１６：配線基板
１７：積層体
１８：層間接続
１９：導体層
２０：シール部 1: Copper foil A
2: Copper foil B
3: Peelable copper foil 4: Copper foil C
5: Prepreg A
6: Prepreg B
7: Support material 8: Copper-clad laminate 9: Copper foil D
10: Prepreg C
11: Laminated body with support material 12: Interlayer connection hole 13: Copper plating 14: Cutting line 15: Inner layer circuit 16: Wiring board 17: Laminate body 18: Interlayer connection 19: Conductive layer 20: Seal portion

Claims (11)

  1. 　プリプレグＡを挟んだ両側に、銅箔Ａと銅箔Ｂとを有するピーラブル銅箔を配置し、さらに両側にプリプレグＢと銅箔Ｃとを配置して積層し、支持材付き積層体を形成する工程（１）を有する配線基板の製造方法。 A peelable copper foil having a copper foil A and a copper foil B is arranged on both sides of the prepreg A, and a prepreg B and a copper foil C are arranged on both sides and laminated to form a laminated body with a support material. A method for manufacturing a wiring board, comprising the step (1).
  2. 　請求項１のプリプレグＡを挟んだ両側に、銅箔Ａと銅箔Ｂとを有するピーラブル銅箔を配置し、さらに両側にプリプレグＢと銅箔Ｃとを配置して積層し、支持材付き積層体を形成する工程（１）と、前記支持材付き積層体の銅箔Ｃから銅箔Ｂに到る層間接続孔を形成する工程（２）と、前記支持材付き積層体の層間接続孔及び銅箔Ｂ上に銅めっきを形成することにより、前記銅箔Ｃと銅箔Ｂとを接続する層間接続と、前記銅箔Ｃ及び銅めっきを有する導体層と、を形成する工程（３）と、を有する配線基板の製造方法。 A peelable copper foil having a copper foil A and a copper foil B is disposed on both sides of the prepreg A of claim 1, and a prepreg B and a copper foil C are further disposed on both sides and laminated. A step (1) of forming a body, a step (2) of forming an interlayer connection hole from the copper foil C to the copper foil B of the laminate with a support material, an interlayer connection hole of the laminate with a support material, and Forming a copper plating on the copper foil B, thereby forming an interlayer connection for connecting the copper foil C and the copper foil B, and a conductor layer having the copper foil C and the copper plating (3); The manufacturing method of the wiring board which has these.
  3. 　請求項１又は２において、工程（１）では、プリプレグＡとして、プリプレグＢよりも薄いものを使用する配線基板の製造方法。 3. The method of manufacturing a wiring board according to claim 1, wherein in step (1), the prepreg A is thinner than the prepreg B.
  4. 　請求項１から３の何れか１項において、工程（１）では、ピーラブル銅箔の大きさが、このピーラブル銅箔の両側に配置されるプリプレグＡ、Ｂより小さい配線基板の製造方法。 4. The method of manufacturing a wiring board according to any one of claims 1 to 3, wherein in step (1), the size of the peelable copper foil is smaller than the prepregs A and B arranged on both sides of the peelable copper foil.
  5. 　請求項１から４の何れか１項において、工程（１）では、ピーラブル銅箔が、このピーラブル銅箔の両側に積層されるプリプレグＡ、Ｂからはみ出さないように構成される配線基板の製造方法。 5. The wiring board according to claim 1, wherein in step (1), the peelable copper foil is configured not to protrude from the prepregs A and B laminated on both sides of the peelable copper foil. Method.
  6. 　請求項１から５の何れか１項において、工程（１）では、ピーラブル銅箔の周囲が、このピーラブル銅箔の両側に積層されるプリプレグＡ、Ｂによりシールされる配線基板の製造方法。 6. The method of manufacturing a wiring board according to any one of claims 1 to 5, wherein in step (1), the periphery of the peelable copper foil is sealed by the prepregs A and B laminated on both sides of the peelable copper foil.
  7. 　プリプレグＡを挟んだ両側に、銅箔Ａと銅箔Ｂとを有するピーラブル銅箔を配置し、さらに両側にプリプレグＢと銅箔Ｃとを配置して積層した支持材付き積層体。 A laminate with a support material in which a peelable copper foil having copper foil A and copper foil B is disposed on both sides of the prepreg A, and prepreg B and copper foil C are disposed on both sides and laminated.
  8. 　請求項７において、プリプレグＡの厚さが、プリプレグＢよりも薄い支持材付き積層体。 The laminate with a support material according to claim 7, wherein the thickness of the prepreg A is thinner than that of the prepreg B.
  9. 　請求項７又は８において、ピーラブル銅箔の大きさが、このピーラブル銅箔の両側に配置されるプリプレグＡ、Ｂより小さい支持材付き積層体。 9. The laminated body with a support material according to claim 7 or 8, wherein the size of the peelable copper foil is smaller than the prepregs A and B arranged on both sides of the peelable copper foil.
  10. 　請求項７から９の何れか１項において、ピーラブル銅箔が、このピーラブル銅箔の両側に積層されるプリプレグＡ、Ｂからはみ出さないように構成される支持材付き積層体。 10. The laminated body with a support material according to any one of claims 7 to 9, wherein the peelable copper foil is configured not to protrude from the prepregs A and B laminated on both sides of the peelable copper foil.
  11. 　請求項７から１０の何れか１項において、ピーラブル銅箔の周囲が、このピーラブル銅箔の両側に積層されるプリプレグＡ、Ｂによりシールされる支持材付き積層体。 11. The laminated body with a support material according to any one of claims 7 to 10, wherein the periphery of the peelable copper foil is sealed by the prepregs A and B laminated on both sides of the peelable copper foil.
PCT/JP2014/050229 2013-01-09 2014-01-09 Method for producing wiring board and laminate with supporting material WO2014109357A1 (en)

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