CN106190005A - A kind of preparation technology of LED good stability conducting resinl - Google Patents
A kind of preparation technology of LED good stability conducting resinl Download PDFInfo
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- CN106190005A CN106190005A CN201610662613.0A CN201610662613A CN106190005A CN 106190005 A CN106190005 A CN 106190005A CN 201610662613 A CN201610662613 A CN 201610662613A CN 106190005 A CN106190005 A CN 106190005A
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- Prior art keywords
- conducting resinl
- good stability
- preparation
- parts
- alloyed powder
- Prior art date
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- 238000002360 preparation method Methods 0.000 title claims abstract description 26
- 239000000843 powder Substances 0.000 claims abstract description 17
- 239000000203 mixture Substances 0.000 claims abstract description 12
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 claims abstract description 10
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 10
- 238000003756 stirring Methods 0.000 claims abstract description 10
- 230000000694 effects Effects 0.000 claims abstract description 8
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims abstract description 6
- 239000003822 epoxy resin Substances 0.000 claims abstract description 6
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims abstract description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 5
- QVQLCTNNEUAWMS-UHFFFAOYSA-N barium oxide Inorganic materials [Ba]=O QVQLCTNNEUAWMS-UHFFFAOYSA-N 0.000 claims abstract description 5
- CSSYLTMKCUORDA-UHFFFAOYSA-N barium(2+);oxygen(2-) Chemical compound [O-2].[Ba+2] CSSYLTMKCUORDA-UHFFFAOYSA-N 0.000 claims abstract description 5
- 229920001721 polyimide Polymers 0.000 claims abstract description 5
- 239000009719 polyimide resin Substances 0.000 claims abstract description 5
- 239000002994 raw material Substances 0.000 claims abstract description 5
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 claims abstract description 5
- IBVAQQYNSHJXBV-UHFFFAOYSA-N adipic acid dihydrazide Chemical compound NNC(=O)CCCCC(=O)NN IBVAQQYNSHJXBV-UHFFFAOYSA-N 0.000 claims abstract description 4
- 239000000956 alloy Substances 0.000 claims abstract description 4
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 4
- 238000000889 atomisation Methods 0.000 claims abstract description 4
- 239000007789 gas Substances 0.000 claims description 7
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical group [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 6
- 125000003118 aryl group Chemical group 0.000 claims description 4
- -1 halogenated aromatic isocyanates Chemical class 0.000 claims description 4
- KMOUUZVZFBCRAM-UHFFFAOYSA-N 1,2,3,6-tetrahydrophthalic anhydride Chemical compound C1C=CCC2C(=O)OC(=O)C21 KMOUUZVZFBCRAM-UHFFFAOYSA-N 0.000 claims description 3
- BRLPEEKPYKAERE-UHFFFAOYSA-N 3-dodecylfuran-2,5-dione Chemical compound CCCCCCCCCCCCC1=CC(=O)OC1=O BRLPEEKPYKAERE-UHFFFAOYSA-N 0.000 claims description 3
- MWSKJDNQKGCKPA-UHFFFAOYSA-N 6-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1CC(C)=CC2C(=O)OC(=O)C12 MWSKJDNQKGCKPA-UHFFFAOYSA-N 0.000 claims description 3
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 claims description 3
- 125000002723 alicyclic group Chemical group 0.000 claims description 3
- 125000001931 aliphatic group Chemical group 0.000 claims description 3
- 229910052786 argon Inorganic materials 0.000 claims description 3
- 239000004202 carbamide Substances 0.000 claims description 3
- HPNMFZURTQLUMO-UHFFFAOYSA-N diethylamine Chemical compound CCNCC HPNMFZURTQLUMO-UHFFFAOYSA-N 0.000 claims description 3
- MUTGBJKUEZFXGO-UHFFFAOYSA-N hexahydrophthalic anhydride Chemical compound C1CCCC2C(=O)OC(=O)C21 MUTGBJKUEZFXGO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052757 nitrogen Inorganic materials 0.000 claims description 3
- UFDHBDMSHIXOKF-UHFFFAOYSA-N tetrahydrophthalic acid Natural products OC(=O)C1=C(C(O)=O)CCCC1 UFDHBDMSHIXOKF-UHFFFAOYSA-N 0.000 claims description 3
- 239000012948 isocyanate Substances 0.000 claims description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 2
- BAVYZALUXZFZLV-UHFFFAOYSA-N Methylamine Chemical compound NC BAVYZALUXZFZLV-UHFFFAOYSA-N 0.000 claims 2
- 150000008064 anhydrides Chemical class 0.000 claims 1
- VYKXQOYUCMREIS-UHFFFAOYSA-N methylhexahydrophthalic anhydride Chemical compound C1CCCC2C(=O)OC(=O)C21C VYKXQOYUCMREIS-UHFFFAOYSA-N 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 abstract description 8
- 238000002454 metastable transfer emission spectrometry Methods 0.000 abstract description 4
- 239000006185 dispersion Substances 0.000 abstract description 2
- 230000006641 stabilisation Effects 0.000 abstract description 2
- 238000011105 stabilization Methods 0.000 abstract description 2
- 239000000853 adhesive Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- ROSDSFDQCJNGOL-UHFFFAOYSA-N Dimethylamine Chemical compound CNC ROSDSFDQCJNGOL-UHFFFAOYSA-N 0.000 description 4
- 239000011159 matrix material Substances 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- LTVUCOSIZFEASK-MPXCPUAZSA-N (3ar,4s,7r,7as)-3a-methyl-3a,4,7,7a-tetrahydro-4,7-methano-2-benzofuran-1,3-dione Chemical compound C([C@H]1C=C2)[C@H]2[C@H]2[C@]1(C)C(=O)OC2=O LTVUCOSIZFEASK-MPXCPUAZSA-N 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 description 1
- 241000500881 Lepisma Species 0.000 description 1
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 1
- 208000027418 Wounds and injury Diseases 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000002322 conducting polymer Substances 0.000 description 1
- 239000011231 conductive filler Substances 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- OAKJQQAXSVQMHS-UHFFFAOYSA-N hydrazine Substances NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 208000014674 injury Diseases 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- UAEPNZWRGJTJPN-UHFFFAOYSA-N methylcyclohexane Chemical compound CC1CCCCC1 UAEPNZWRGJTJPN-UHFFFAOYSA-N 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
- C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Epoxy Resins (AREA)
Abstract
The present invention relates to the preparation technology of a kind of LED good stability conducting resinl, preparation process is as follows: the 1) preparation of alloyed powder, weighs nanometer silver powder, Barium monoxide, nano-aluminium oxide, iron powder, MTES, butanone;By each raw material by proportioning at 1500 DEG C~1650 DEG C, less than 10‑3The vacuum of torr is smelted into homogeneous alloy solution, and the gas low by activity prepares alloyed powder with the pressure peening of 20~30atm with moment atomization;2) preparation of conducting resinl, based on weight/mass percentage composition, by polyimide resin, epoxy resin, adipic dihydrazide, subsidence feed, firming agent, stir, be slowly added to alloyed powder, stir, froth in vacuum, prepares described LED good stability conducting resinl.Alloyed powder in conducting resinl formula of the present invention has preferable dispersion stabilization, and prepared conducting resinl resistivity is low, thermal conductivity is high, adhesive property is good, good stability, service life are long.
Description
Technical field
The invention belongs to technical field of electronic materials, be specifically related to the preparation technology of a kind of LED good stability conducting resinl.
Background technology
LED conducting resinl, is the connection for LED chip and base material, it is possible to realize the function of heat conduction and conduction simultaneously.Lead
Electric adhesive is also referred to as conducting resinl, is the solidification at a certain temperature being made up of matrix resin, firming agent and conductive filler or dry
After dry can adhesive base plate material effectively, can have again the special adhesive of electric conductivity.Conducting resinl can be divided by matrix composition
For structural type and the big class of filled-type two.Structural type refers to that the macromolecular material as conducting resinl matrix itself i.e. has electric conductivity
Conducting resinl;Filled-type refer to usual adhesive as matrix, and rely on interpolation electroconductive stuffing make glue have electric action
Conducting resinl.The preparation of conducting polymer composite at present also has bigger distance from reality application, and the most widely used being is filled out
Fill type conducting resinl.As epoxy resin adhesive can solidify in room temperature to 150 DEG C, far below more than 200 DEG C of tin-lead welding
Welding temperature, avoiding problems material deformation, the hot injury of electronic device and the formation of internal stress that welding high temperature may cause.
Simultaneously as the developing rapidly of the densification of the miniaturization of electronic component, miniaturization and printed circuit board (PCB) and Highgrade integration,
The minimum pitch of the 0.65mm of slicker solder welding can not meet far away the actual demand being conductively connected, and conducting resinl can make slurry
Material, it is achieved the highest linear resolution.
The developing direction of LED industry is to develop towards the high-power direction of high brightness, super brightness, thus proposes conducting resinl
Higher requirement, the great power LED thermal diffusivity to conducting resinl, traditional heat-conducting glue thermal conductivity is less than 10W/m K, and highlighted
The cooling requirements of degree high-power LED chip is higher than 20W/m K;Develop suitable curing system, make the conducting resinl can be the longest
Time stores, it is to avoid high cost of transportation and storage cost;The stability of contact resistance and the reliability of electric property.Cause
How this, develop the LED conducting resinl that resistivity is low, thermal conductivity is high, good stability, adhesive property are good the most urgent.
Summary of the invention
It is an object of the invention to provide the preparation technology of a kind of LED good stability conducting resinl, effectively solve high-power
Thermal diffusivity problem after LED chip long-term work.
The technical scheme realizing the purpose of the present invention is: the preparation technology of a kind of LED good stability conducting resinl, preparation step
Rapid as follows:
1) preparation of alloyed powder
Weigh nanometer silver powder 80~100 parts, Barium monoxide 8~15 parts, aluminium sesquioxide 20~30 parts, iron powder 40~50 parts,
MTES 10~15 parts, butanone 6~10 parts;By each raw material by proportioning at 1500 DEG C~1650 DEG C, less than 10- 3The vacuum of torr is smelted into homogeneous alloy solution, and the gas low by activity is atomized with moment with the pressure peening of 20~30atm
And prepare alloyed powder;
2) preparation of conducting resinl
Based on weight/mass percentage composition, by polyimide resin 10%~15%, epoxy resin 2%~5%, adipic acid two acyl
Hydrazine 4%~6%, subsidence feed 0.3%~0.7%, firming agent 3%~8%, stir, be slowly added to step 1) institute
The alloyed powder 65%~75% obtained, stirs, froth in vacuum, prepares described LED good stability conducting resinl.
Preferably, firming agent of the present invention is THPA, methyl tetrahydro phthalic anhydride, HHPA, methyl hexahydrobenzene
One or more mixture in acid anhydride, methylnadic anhydride, dodecyl maleic anhydride.
Preferably, subsidence feed of the present invention is aliphatic, alicyclic, aromatic series and halogenated aromatic isocyanide
The urea that acid esters reacts with dimethylamine or diethylamine.
Preferably, step 1 of the present invention) gas that the activity that uses is low is selected from argon or nitrogen.
The technological merit of the present invention is: the alloyed powder in conducting resinl formula of the present invention has preferable dispersion stabilization,
The conducting resinl resistivity prepared is low, thermal conductivity is high, adhesive property is good, good stability, service life are long.
Detailed description of the invention
Below in conjunction with embodiment, the present invention will be further described.
A kind of preparation technology of LED good stability conducting resinl, preparation process is as follows:
Embodiment 1:
1) preparation of alloyed powder
Weigh nanometer silver powder 80 parts, Barium monoxide 8 parts, aluminium sesquioxide 20 parts, iron powder 40 parts, MTES 10
Part, butanone 6 parts;By each raw material by proportioning at 1500 DEG C~1650 DEG C, less than 10-3It is molten that the vacuum of torr is smelted into homogeneous alloy
Liquid, the gas low by activity prepares alloyed powder with the pressure peening of 20~30atm with moment atomization;
2) preparation of conducting resinl
Based on weight/mass percentage composition, by polyimide resin 10%, epoxy resin 2%, adipic dihydrazide 4%, hide
Property accelerator 0.3%, firming agent 3%, stir, be slowly added to step 1) obtained by alloyed powder 65%, stir, very
Empty de-bubble, prepares described LED good stability conducting resinl.
Embodiment 2
1) preparation of alloyed powder
Weigh nanometer silver powder 100 parts, Barium monoxide 15 parts, aluminium sesquioxide 30 parts, iron powder 50 parts, MTES
15 parts, butanone 10 parts;By each raw material by proportioning at 1500 DEG C~1650 DEG C, less than 10-3The vacuum of torr is smelted into homogenizing and closes
Gold solution, the gas low by activity prepares alloyed powder with the pressure peening of 20~30atm with moment atomization;
2) preparation of conducting resinl
Based on weight/mass percentage composition, by polyimide resin 15%, epoxy resin 5%, adipic dihydrazide 6%, hide
Property accelerator 0.7%, firming agent 8%, stir, be slowly added to step 1) obtained by alloyed powder 75%, stir, very
Empty de-bubble, prepares described LED good stability conducting resinl.
In above-described embodiment 1~2, selected firming agent is THPA, methyl tetrahydro phthalic anhydride, HHPA, methyl six
One or more mixture in hydrogen phthalic anhydride, methylnadic anhydride, dodecyl maleic anhydride.Selected latency promotees
Entering agent is the urea that aliphatic, alicyclic, aromatic series and halogenated aromatic isocyanates react with dimethylamine or diethylamine.Institute
The gas that the activity of choosing is low is selected from argon or nitrogen.
Conducting resinl obtained by embodiment 1~2 is carried out the test of performance, specific insulation about 10-5~10-4Ω cm,
Heat conductivity about 24.0W/m K, viscosity about 48200mPa.s.
Meanwhile, carrying out the test of viscosity after the conducting resinl room temperature obtained by embodiment 1~2 being placed 2 months, viscosity is about
48300mPa.s, it can be seen that prepared conducting resinl has good viscosity stability.
Above-mentioned each embodiment is further illustrating of making of the foregoing to the present invention, but should not be construed as the present invention
The scope of above-mentioned theme is only limitted to above-described embodiment.It should be pointed out that, for those skilled in the art, not
On the premise of departing from the technology of the present invention principle, it is also possible to make some improvements and modifications, these improvements and modifications also should be regarded as this
The protection domain of invention.
Claims (4)
1. the LED preparation technology of good stability conducting resinl, it is characterised in that preparation process is as follows:
1) preparation of alloyed powder
Weigh nanometer silver powder 80~100 parts, Barium monoxide 8~15 parts, aluminium sesquioxide 20~30 parts, iron powder 40~50 parts, methyl
Triethoxysilane 10~15 parts, butanone 6~10 parts;By each raw material by proportioning at 1500 DEG C~1650 DEG C, less than 10-3Torr's
Vacuum is smelted into homogeneous alloy solution, and the gas low by activity prepares with moment atomization with the pressure peening of 20~30atm
Alloyed powder;
2) preparation of conducting resinl
Based on weight/mass percentage composition, by polyimide resin 10%~15%, epoxy resin 2%~5%, adipic dihydrazide
4%~6%, subsidence feed 0.3%~0.7%, firming agent 3%~8%, stir, be slowly added to step 1) gained
The alloyed powder 65%~75% arrived, stirs, froth in vacuum, prepares described LED good stability conducting resinl.
The preparation technology of one or more mixture LED good stability conducting resinl the most according to claim 1, its feature
Be: step 2) described in firming agent be that THPA, methyl tetrahydro phthalic anhydride, HHPA, methyl hexahydrophthalic anhydride, methyl are received
One or more mixture in Dick anhydride, dodecyl maleic anhydride.
The preparation technology of one or more mixture LED good stability conducting resinl the most according to claim 1, its feature
Be: step 2) described in subsidence feed be aliphatic, alicyclic, aromatic series and halogenated aromatic isocyanates and two
Methylamine or the urea of diethylamine reaction.
The preparation technology of one or more mixture LED good stability conducting resinl the most according to claim 1, its feature
It being: described step 1) gas that the activity that uses is low is selected from argon or nitrogen.
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CN201610662613.0A CN106190005A (en) | 2016-08-11 | 2016-08-11 | A kind of preparation technology of LED good stability conducting resinl |
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CN201610662613.0A CN106190005A (en) | 2016-08-11 | 2016-08-11 | A kind of preparation technology of LED good stability conducting resinl |
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CN201610662613.0A Withdrawn CN106190005A (en) | 2016-08-11 | 2016-08-11 | A kind of preparation technology of LED good stability conducting resinl |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108219730A (en) * | 2018-01-16 | 2018-06-29 | 黑龙江省科学院石油化学研究院 | The preparation method and its conductive adhesive of a kind of conductive adhesive |
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CN102127386A (en) * | 2010-12-29 | 2011-07-20 | 东莞市新懿电子材料技术有限公司 | Photocuring and thermocuring conductive adhesive and preparation method |
CN102646458A (en) * | 2011-02-16 | 2012-08-22 | 中国钢铁股份有限公司 | Lead-free conducting resin and manufacture method thereof |
CN103436197A (en) * | 2013-09-02 | 2013-12-11 | 南京萨特科技发展有限公司 | Conductive adhesive for over-temperature overcurrent protective element and production method thereof |
CN105419672A (en) * | 2015-12-24 | 2016-03-23 | 常熟昊虞电子信息科技有限公司 | Preparation method of high-heat-dissipation electric-conductive glue used for high-power LED |
-
2016
- 2016-08-11 CN CN201610662613.0A patent/CN106190005A/en not_active Withdrawn
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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CN102127386A (en) * | 2010-12-29 | 2011-07-20 | 东莞市新懿电子材料技术有限公司 | Photocuring and thermocuring conductive adhesive and preparation method |
CN102646458A (en) * | 2011-02-16 | 2012-08-22 | 中国钢铁股份有限公司 | Lead-free conducting resin and manufacture method thereof |
CN103436197A (en) * | 2013-09-02 | 2013-12-11 | 南京萨特科技发展有限公司 | Conductive adhesive for over-temperature overcurrent protective element and production method thereof |
CN105419672A (en) * | 2015-12-24 | 2016-03-23 | 常熟昊虞电子信息科技有限公司 | Preparation method of high-heat-dissipation electric-conductive glue used for high-power LED |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108219730A (en) * | 2018-01-16 | 2018-06-29 | 黑龙江省科学院石油化学研究院 | The preparation method and its conductive adhesive of a kind of conductive adhesive |
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