CN106181108A - 一种SnBiZn系低温无铅焊料及其制备方法 - Google Patents
一种SnBiZn系低温无铅焊料及其制备方法 Download PDFInfo
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- CN106181108A CN106181108A CN201610657055.9A CN201610657055A CN106181108A CN 106181108 A CN106181108 A CN 106181108A CN 201610657055 A CN201610657055 A CN 201610657055A CN 106181108 A CN106181108 A CN 106181108A
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- alloy
- solder
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/264—Bi as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
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CN201610657055.9A CN106181108B (zh) | 2016-08-11 | 2016-08-11 | 一种SnBiZn系低温无铅焊料及其制备方法 |
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CN201610657055.9A CN106181108B (zh) | 2016-08-11 | 2016-08-11 | 一种SnBiZn系低温无铅焊料及其制备方法 |
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CN106181108A true CN106181108A (zh) | 2016-12-07 |
CN106181108B CN106181108B (zh) | 2018-08-24 |
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106695161A (zh) * | 2016-12-29 | 2017-05-24 | 安徽华众焊业有限公司 | 一种锡铋合金的无铅焊料及其制备方法 |
CN106825979A (zh) * | 2017-01-04 | 2017-06-13 | 南京信息工程大学 | 一种低熔点Sn‑Zn‑Bi‑Mg系无铅焊料及其制备方法 |
CN109518019A (zh) * | 2018-10-12 | 2019-03-26 | 北京康普锡威科技有限公司 | 一种改性SnBi系亚共晶合金的方法及得到的合金 |
CN112342417A (zh) * | 2020-11-17 | 2021-02-09 | 昆明理工大学 | 一种锡基焊料及其制备方法 |
CN115041864A (zh) * | 2022-07-08 | 2022-09-13 | 深圳市博士达焊锡制品有限公司 | 一种高可靠性低温无铅焊料及制备方法 |
Citations (7)
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JP2001239392A (ja) * | 2000-02-29 | 2001-09-04 | Mitsubishi Electric Corp | 鉛フリーはんだ、並びにこれを用いたはんだ接合部とはんだ接合法 |
US6503338B1 (en) * | 2000-04-28 | 2003-01-07 | Senju Metal Industry Co., Ltd. | Lead-free solder alloys |
CN101380700A (zh) * | 2007-09-05 | 2009-03-11 | 北京康普锡威焊料有限公司 | 一种锡铋铜系无铅焊料及其制备方法 |
CN101618484A (zh) * | 2008-07-02 | 2010-01-06 | 比亚迪股份有限公司 | 一种无铅焊料及其制备方法 |
CN101700605A (zh) * | 2009-11-13 | 2010-05-05 | 苏州优诺电子材料科技有限公司 | 低熔点无铅焊料合金 |
CN101733575A (zh) * | 2008-11-13 | 2010-06-16 | 北京有色金属研究总院 | 一种低成本锡锌铋铜无铅焊料及其焊点 |
CN103264237A (zh) * | 2013-05-23 | 2013-08-28 | 东莞市焊宏爱法电子科技有限公司 | 一种新型的合金焊锡膏及其制备方法 |
-
2016
- 2016-08-11 CN CN201610657055.9A patent/CN106181108B/zh active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001239392A (ja) * | 2000-02-29 | 2001-09-04 | Mitsubishi Electric Corp | 鉛フリーはんだ、並びにこれを用いたはんだ接合部とはんだ接合法 |
US6503338B1 (en) * | 2000-04-28 | 2003-01-07 | Senju Metal Industry Co., Ltd. | Lead-free solder alloys |
CN101380700A (zh) * | 2007-09-05 | 2009-03-11 | 北京康普锡威焊料有限公司 | 一种锡铋铜系无铅焊料及其制备方法 |
CN101618484A (zh) * | 2008-07-02 | 2010-01-06 | 比亚迪股份有限公司 | 一种无铅焊料及其制备方法 |
CN101733575A (zh) * | 2008-11-13 | 2010-06-16 | 北京有色金属研究总院 | 一种低成本锡锌铋铜无铅焊料及其焊点 |
CN101700605A (zh) * | 2009-11-13 | 2010-05-05 | 苏州优诺电子材料科技有限公司 | 低熔点无铅焊料合金 |
CN103264237A (zh) * | 2013-05-23 | 2013-08-28 | 东莞市焊宏爱法电子科技有限公司 | 一种新型的合金焊锡膏及其制备方法 |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106695161A (zh) * | 2016-12-29 | 2017-05-24 | 安徽华众焊业有限公司 | 一种锡铋合金的无铅焊料及其制备方法 |
CN106825979A (zh) * | 2017-01-04 | 2017-06-13 | 南京信息工程大学 | 一种低熔点Sn‑Zn‑Bi‑Mg系无铅焊料及其制备方法 |
CN106825979B (zh) * | 2017-01-04 | 2019-11-12 | 南京信息工程大学 | 一种低熔点Sn-Zn-Bi-Mg系无铅焊料及其制备方法 |
CN109518019A (zh) * | 2018-10-12 | 2019-03-26 | 北京康普锡威科技有限公司 | 一种改性SnBi系亚共晶合金的方法及得到的合金 |
CN109518019B (zh) * | 2018-10-12 | 2020-06-19 | 北京康普锡威科技有限公司 | 一种改性SnBi系亚共晶合金的方法及得到的合金 |
CN112342417A (zh) * | 2020-11-17 | 2021-02-09 | 昆明理工大学 | 一种锡基焊料及其制备方法 |
CN115041864A (zh) * | 2022-07-08 | 2022-09-13 | 深圳市博士达焊锡制品有限公司 | 一种高可靠性低温无铅焊料及制备方法 |
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CN106181108B (zh) | 2018-08-24 |
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Inventor after: Zhang Shaoming Inventor after: Li Cuan Inventor after: He Huijun Inventor after: Liu Xixue Inventor after: Sun Yanbin Inventor after: Wang Zhigang Inventor after: Hu Qiang Inventor after: Zhu Zhihua Inventor after: Xu Lei Inventor after: Li Xiaoqiang Inventor before: He Huijun Inventor before: Liu Xixue Inventor before: Sun Yanbin Inventor before: Wang Zhigang Inventor before: Hu Qiang Inventor before: Zhu Zhihua Inventor before: Xu Lei Inventor before: Li Xiaoqiang Inventor before: Li Cuan |
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