CN106149019A - A kind of mixing electro-plating method - Google Patents
A kind of mixing electro-plating method Download PDFInfo
- Publication number
- CN106149019A CN106149019A CN201610713572.3A CN201610713572A CN106149019A CN 106149019 A CN106149019 A CN 106149019A CN 201610713572 A CN201610713572 A CN 201610713572A CN 106149019 A CN106149019 A CN 106149019A
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- CN
- China
- Prior art keywords
- plate
- surfacing
- template
- production
- quantities
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The present invention provides a kind of mixing electro-plating method, and mantissa's plate collocation of small quantities of template and production in enormous quantities is electroplated by described method simultaneously；Amassed by order from big to small by electroplating bath both sides to medial exhaust by surfacing according to plate is actual during plating；During plating, current parameters is set by by the long-pending minimum plate of surfacing.Size is electroplated together with the mantissa's plate collocation being amassed close small quantities of template and production in enormous quantities by surfacing by the present invention, the electroplating quality being effectively ensured by the discharging modes controlling electroplating current and plate simultaneously, improve work efficiency simultaneously, reduce entreprise cost.
Description
Technical field
The present invention relates to board production technical field.
Background technology
Along with the propelling in electronic information epoch, the update of electronic product is increasingly faster, and corresponding PCB enterprise is to product
Can demand the most increasing, date of delivery is also shorter and shorter, how in the condition of existing equipment and guarantee the premise of quality
Lower raising production efficiency, reduce cost, increase production capacity, shorten the production cycle and have become as the primary study project of industry.
Summary of the invention
For the problems referred to above, the present invention provides a kind of mixing electro-plating method, and described method is by raw to small quantities of template and high-volume
The mantissa's plate collocation produced is electroplated simultaneously；Amassed by order from big to small by electroplating bath by surfacing according to plate reality during plating
Both sides are to medial exhaust；During plating, current parameters is set by by the long-pending minimum plate of surfacing.
Preferably, mantissa's plate of described small quantities of template and production in enormous quantities is by within the long-pending difference ± 8% of surfacing.
Preferably, within the size difference ± 10% of mantissa's plate of described small quantities of template and production in enormous quantities.
Mixing electro-plating method of the present invention amasss close small quantities of template and the tail of production in enormous quantities by size with by surfacing
Number plate collocation is electroplated the most simultaneously, plating space can be avoided to waste, improve work efficiency, reduce entreprise cost；The most described
The electroplating quality that method is effectively ensured by the discharging modes controlling electroplating current and plate.
Detailed description of the invention
The present invention is done the most in detail below in conjunction with specific embodiment for the ease of it will be appreciated by those skilled in the art that
Describe.
Described mixing electro-plating method: by mantissa's plate collocation of small quantities of template and production in enormous quantities is electroplated simultaneously；
During plating, amassed by order from big to small by electroplating bath both sides to medial exhaust by surfacing according to plate is actual；Electric current ginseng during plating
Number is set by by the long-pending minimum plate of surfacing.
During plating, amassed by order from big to small by electroplating bath both sides to medial exhaust by surfacing, such as according to plate is actual:
It is 3 ft that small quantities of template is amassed by surfacing2, and being amassed by surfacing of the mantissa's plate produced in enormous quantities is 2.75 ft2, then 3 will be amassed by surfacing
ft2Plate be put into electroplating bath both sides, and amassed 2.75 ft by surfacing2Plate be put into the position in the middle of electroplating bath.
During plating, current parameters is set, such as by by the long-pending minimum plate of surfacing: it is 3 that small quantities of template is amassed by surfacing
ft2, and being amassed by surfacing of the mantissa's plate produced in enormous quantities is 2.75 ft2, current settings when producing of arranging in pairs or groups of the most above-mentioned form
For: amassed 2.75 × electric current density ASF by surfacing.
In order to obtain more preferable production effect, mantissa's plate of small quantities of template and production in enormous quantities by the long-pending difference ± 8% of surfacing with
In, such as: small quantities of template is amassed as 3ft by surfacing2, mantissa's plate of that small quantities of template and production in enormous quantities by surfacing is long-pending should be
2.5ft2—3.5ft2Between (3ft2± 8% within).The size difference ± 10% of mantissa's plate of small quantities of template and production in enormous quantities
Within, such as: the size of small quantities of template is: long 600MM width 500MM, then the mantissa's board size produced in enormous quantities should be: (long
540MM 66MM) wide (450MM 550MM)；Meanwhile, when the model of choosing collocation, prioritizing selection long limit size is eligible wants
The plate asked is carried out, when long limit size can not meet require time reselection broadside size arrange in pairs or groups.So, small quantities of template and
The mantissa's plate electroplating effect produced in enormous quantities is more preferable.
The present invention is by by size with amassed the mantissa plate of close small quantities of template and production in enormous quantities by surfacing and arrange in pairs or groups one
Rise and electroplate simultaneously, plating space can be avoided to waste, improve work efficiency, reduce entreprise cost；The most described method is by controlling
The electroplating quality that the discharging modes of electroplating current and plate are effectively ensured.
Being more than the specific implementation of the present invention, it describes more concrete and detailed, but can not therefore be interpreted as
Restriction to the scope of the claims of the present invention.It should be pointed out that, for the person of ordinary skill of the art, without departing from this
On the premise of bright design, it is also possible to make some deformation and improvement, these obvious alternative forms belong to the present invention's
Protection domain.
Claims (3)
1. a mixing electro-plating method, mantissa's plate collocation of small quantities of template and production in enormous quantities is carried out electricity by described method simultaneously
Plating；
Amassed by order from big to small by electroplating bath both sides to medial exhaust by surfacing according to plate is actual during plating；
During plating, current parameters is set by by the long-pending minimum plate of surfacing.
Mixing electro-plating method the most according to claim 1, it is characterised in that: described small quantities of template and the tail of production in enormous quantities
Number plate is by within the long-pending difference ± 8% of surfacing.
Mixing electro-plating method the most according to claim 1, it is characterised in that: described small quantities of template and the tail of production in enormous quantities
Within the size difference ± 10% of number plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610713572.3A CN106149019A (en) | 2016-08-24 | 2016-08-24 | A kind of mixing electro-plating method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610713572.3A CN106149019A (en) | 2016-08-24 | 2016-08-24 | A kind of mixing electro-plating method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106149019A true CN106149019A (en) | 2016-11-23 |
Family
ID=57342668
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610713572.3A Pending CN106149019A (en) | 2016-08-24 | 2016-08-24 | A kind of mixing electro-plating method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106149019A (en) |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201420100Y (en) * | 2009-03-27 | 2010-03-10 | 东莞市宏德电子设备有限公司 | Lifting mechanism for automatically adjusting anode baffle and floating frame |
| CN201420103Y (en) * | 2009-03-24 | 2010-03-10 | 东莞市宏德电子设备有限公司 | Hanging basket for PTH (plating through hole) of flexible printed board |
| CN201437557U (en) * | 2009-09-11 | 2010-04-14 | 深圳市深联电路有限公司 | Improved PCB template rack for automatic electroless copper plating line |
| CN202017067U (en) * | 2010-12-11 | 2011-10-26 | 美锐电路(惠州)有限公司 | Hanging bracket for loading plates |
| CN202323066U (en) * | 2011-11-23 | 2012-07-11 | 天津普林电路股份有限公司 | Shielding plate with adjustable edge copper plating for high-density interconnection circuit board electroplating technology |
| CN103757685A (en) * | 2014-01-24 | 2014-04-30 | 广东达进电子科技有限公司 | Ceramic circuit board clamp used for electroplating |
| CN204608197U (en) * | 2015-02-04 | 2015-09-02 | 雄昱电子（惠州）有限公司 | A kind of plating thin grillage supplementary unit |
| CN105063730A (en) * | 2015-07-14 | 2015-11-18 | 北京大学东莞光电研究院 | Electroplating roller |
| CN204918828U (en) * | 2015-09-04 | 2015-12-30 | 深圳市博敏兴电子有限公司 | It flies crust to electroplate overhead traveling crane |
| CN205474075U (en) * | 2016-01-22 | 2016-08-17 | 九江科盛电子科技有限公司 | PCB (Printed circuit board) electroplating clamp |
-
2016
- 2016-08-24 CN CN201610713572.3A patent/CN106149019A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201420103Y (en) * | 2009-03-24 | 2010-03-10 | 东莞市宏德电子设备有限公司 | Hanging basket for PTH (plating through hole) of flexible printed board |
| CN201420100Y (en) * | 2009-03-27 | 2010-03-10 | 东莞市宏德电子设备有限公司 | Lifting mechanism for automatically adjusting anode baffle and floating frame |
| CN201437557U (en) * | 2009-09-11 | 2010-04-14 | 深圳市深联电路有限公司 | Improved PCB template rack for automatic electroless copper plating line |
| CN202017067U (en) * | 2010-12-11 | 2011-10-26 | 美锐电路(惠州)有限公司 | Hanging bracket for loading plates |
| CN202323066U (en) * | 2011-11-23 | 2012-07-11 | 天津普林电路股份有限公司 | Shielding plate with adjustable edge copper plating for high-density interconnection circuit board electroplating technology |
| CN103757685A (en) * | 2014-01-24 | 2014-04-30 | 广东达进电子科技有限公司 | Ceramic circuit board clamp used for electroplating |
| CN204608197U (en) * | 2015-02-04 | 2015-09-02 | 雄昱电子（惠州）有限公司 | A kind of plating thin grillage supplementary unit |
| CN105063730A (en) * | 2015-07-14 | 2015-11-18 | 北京大学东莞光电研究院 | Electroplating roller |
| CN204918828U (en) * | 2015-09-04 | 2015-12-30 | 深圳市博敏兴电子有限公司 | It flies crust to electroplate overhead traveling crane |
| CN205474075U (en) * | 2016-01-22 | 2016-08-17 | 九江科盛电子科技有限公司 | PCB (Printed circuit board) electroplating clamp |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20161123 |