CN106148926A - Silver-coated copper powder and preparation method thereof - Google Patents
Silver-coated copper powder and preparation method thereof Download PDFInfo
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- CN106148926A CN106148926A CN201510198208.3A CN201510198208A CN106148926A CN 106148926 A CN106148926 A CN 106148926A CN 201510198208 A CN201510198208 A CN 201510198208A CN 106148926 A CN106148926 A CN 106148926A
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Abstract
The present invention relates to a kind of silver-coated copper powder and preparation method thereof.This preparation method, by first copper powder being carried out alkali cleaning process, can effectively be removed the impurity such as oxide of Copper Powder Surface, and make the surface activity of copper powder particle reduce, obtain uniform clad surface, provides good basis for follow-up silver cladding；In Surface coating processing procedure, this preparation method uses and first replaces the mode restored, and can form the silver coating of even compact at Copper Powder Surface；Finally being placed in acidic cleaning solution by silver-coated copper powder crude product and be carried out, the silver-coated copper powder dense uniform obtained, conductive effect significantly improves.
Description
Technical field
The present invention relates to conductive material field, especially relate to a kind of silver-coated copper powder and preparation method thereof.
Background technology
Argentum powder excellent electric conductivity and good in oxidation resistance, be the particularly important raw material of industry, made conductive paste
Material is widely used in the industry such as electronic information.But the price of silver is costly, and it is susceptible to migrate.Institute
To develop a kind of low cost, electric conductivity is close with silver and the powder body material migrated does not occurs, and has important meaning
Justice.
Silver-coated copper powder crosses generally by chemistry and uniformly plates one layer of silver at Copper Powder Surface, forms surface interior for silver
Core is the composite of copper.It is a kind of well high connductivity filler, maintains copper powder and excellent the leading of argentum powder
Electrical property, overcomes the defect that argentum powder the most easily migrates and copper powder easily aoxidizes simultaneously, therefore exists
Some fields can be used for substituting argentum powder.Made an addition to coating (paint), glue (binding agent), ink, gathered
In compound slip, plastics, rubber etc., can be made into the goods such as various conduction, electromagnetic shielding, be widely used in
The conduction of each industrial department, the electromagnetic shieldings such as electronics, electromechanics, communication, printing, Aero-Space, weapons
Produce in field, the such as electronics such as computer, mobile phone, electromedical equipment, electronic instrument, electrician, communication
The conduction of product, electromagnetic shielding.But generally there is the silver cladding effect of preparation in the preparation method of traditional silver-coated copper powder
The most bad, it is difficult to form the clad of dense uniform, and the conductive effect of silver-coated copper powder is the best, application
Time its substitute argentum powder amount relatively low, have much room for improvement.
Summary of the invention
Based on this, it is necessary to provide a kind of conduction effect can prepared dense uniform and silver-coated copper powder can be improved
Silver-coated copper powder of fruit and preparation method thereof.
The preparation method of a kind of silver-coated copper powder, comprises the steps:
To treat that silver-plated copper powder ultrasonic disperse, in solvent, and adds alkaline reagent and reducing agent, to described copper
Powder carries out alkali cleaning and reduction treatment；
Described copper powder after alkali cleaning and reduction treatment carrying out Surface coating at least one times process, described surface is wrapped
Cover process specifically: gradually dropped to by chemical plating liquid in copper powder solution, carry out replacement ag plating, and then
In reacted system, addition reducing agent is to carry out reduction treatment to the crude product obtained, and is filtrated to get silver bag
Copper powder crude product；
Obtain silver-coated copper powder crude product after being processed by Surface coating to be scattered in acidic cleaning solution and carry out post processing,
Filter and obtain silver-coated copper powder after drying.
Wherein in an embodiment, at least in the most described Surface coating processing procedure, to obtaining
After crude product carries out reduction treatment, also include continuing to add chemical plating liquid in reaction system, produce thick
Thing carries out reducing silver-plated step.
Wherein in an embodiment, described alkaline reagent is sodium hydroxide, potassium hydroxide, ammonia, oxidation
At least one in sodium and potassium oxide, the addition of described alkaline reagent need to control the pH value of solution 8～15
Between.
Wherein in an embodiment, the temperature that described alkali cleaning processes is 40～100 DEG C.
Wherein in an embodiment, described chemical plating liquid be argentiferous presoma is mixed with chelating agent after
The complex liquid of the silver arrived.
Wherein in an embodiment, described argentiferous presoma be in silver nitrate, silver acetate and silver sulfate extremely
Few one；Described chelating agent is ammonia, citric acid, tartaric acid, aminoacid, organic amine material and spreads out
At least one in biology.
Wherein in an embodiment, described organic amine material and derivant thereof include for ethylenediamine, second
Ethylenediamine tetraacetic acid (EDTA) and disodium salt, ethylenediamine triacetic acid and trisodium salt thereof, Methanamide, acetamide, n-butylamine,
Dimethylamine, hexamethylene diamine, triethylamine, triethanolamine, diethylenetriamine, diethylenetriamines, hexa-methylene
Imines, diethylene triamine pentacetic acid (DTPA) and morpholine.
Wherein in an embodiment, possibly together with dispersant in described chemical plating liquid.
Wherein in an embodiment, described dispersant is polyvinylpyrrolidone, polyvinyl alcohol, polycyclic oxygen
In ethane, Polyethylene Glycol and Radix Acaciae senegalis at least one.
Wherein in an embodiment, described reducing agent be hydrazine hydrate, sodium hypophosphite, formaldehyde, formic acid,
Acetaldehyde, glyoxalic acid, citric acid, citral, sodium citrate, potassium citrate, ascorbic acid, ascorbic acid
At least one in sodium, potassium ascorbate, glucide and derivant thereof, sodium sulfite and ferrous sulfate.
Wherein in an embodiment, described glucide and derivant thereof include glucose, D-pyrans Portugal
Grape sugar, N-Acetyl-D-glucosamine, gluconic acid, sodium gluconate, Ferrous gluconate, D-cellobiose,
Fructose, xylose, maltose, lactose, sucrose, erythrose, ribose, arabinose, Ah's threose, manna
Sugar, lyxose, talose, Isomaltotriose and chitosan.
Wherein in an embodiment, described acidic cleaning solution is the mixed liquor containing acid solution Yu coupling agent.
Wherein in an embodiment, described acid solution is at least one solution in mineral acid and organic acid；Institute
Stating coupling agent is silane coupler or zirconium ester coupling agent.
Wherein in an embodiment, the preparation method of described silver-coated copper powder is additionally included in and carries out described copper powder
Before alkali cleaning and reduction treatment, carry out the step of pickling by treating that silver-plated copper powder is placed in acid solution.
Present invention also offers the silver bag that a kind of preparation method used described in any of the above-described embodiment prepares
Copper powder.
The preparation method of above-mentioned silver-coated copper powder, by first copper powder being carried out alkali cleaning process, can effectively remove copper powder
The impurity such as the oxide on surface, and make the surface activity of copper powder particle reduce, obtain uniform clad surface,
Good basis is provided for follow-up silver cladding.In Surface coating processing procedure, this preparation method uses first
The mode that displacement restores, can form the silver coating of even compact at Copper Powder Surface；Finally by silver copper-clad
Powder crude product is placed in acidic cleaning solution and is carried out, the silver-coated copper powder dense uniform obtained, and conductive effect shows
Write and improve.
Accompanying drawing explanation
Fig. 1 is the schematic flow sheet of the preparation method of the silver-coated copper powder of an embodiment；
Fig. 2 is the SEM photograph of the silver-coated copper powder that embodiment 1 prepares；
Fig. 3 is the SEM photograph of the silver-coated copper powder that embodiment 2 prepares；
Fig. 4 is the SEM photograph of the silver-coated copper powder that embodiment 3 prepares；
Fig. 5 is the SEM photograph of the silver-coated copper powder that embodiment 4 prepares.
Detailed description of the invention
Mainly in combination with drawings and the specific embodiments, silver-coated copper powder of the present invention and preparation method thereof is made into one below
Step detailed description.
As it is shown in figure 1, the preparation method of the silver-coated copper powder of an embodiment, comprise the steps:
Step S110: will treat that silver-plated copper powder ultrasonic disperse, in solvent, and adds alkaline reagent and reducing agent,
Copper powder is carried out alkali cleaning and reduction treatment.
Treat that silver-plated copper powder can be flake copper, graininess, dendritic or wire copper powder etc..This embodiment party
In formula, solvent is preferably water.Alkaline reagent selects sodium hydroxide, potassium hydroxide solution, ammonia, sodium oxide
And at least one in potassium oxide, the pH value range controlling solution is 8-15.Temperature in alkali cleaning processing procedure
Control at 40～100 DEG C.In a preferred embodiment, this alkaline reagent has been also added with auxiliary agent.To copper powder
Carry out alkali cleaning process, can effectively remove the oxide of Copper Powder Surface, highly oxidized copper is occurred for surface
Powder has a good cleaning performance, and can reduce the surface activity of copper powder, prevents during silver is coated with
Oxidation is occurred to affect covered effect.
Further, in other embodiments, before copper powder is carried out alkali cleaning and reduction treatment, also include
Copper powder is carried out the step of pickling pre-treatment.Pickling can be with inorganic acid solution or organic acid soln or
The mixed solution of the two carries out a step cleaning to copper powder, or uses inorganic acid solution molten with organic acid successively
Liquid carries out step-by-step processing.
Reducing agent can be hydrazine hydrate, sodium hypophosphite, formaldehyde, formic acid, acetaldehyde, glyoxalic acid, citric acid,
Citral, sodium citrate, potassium citrate, ascorbic acid, sodium ascorbate, potassium ascorbate, saccharide thing
At least one in matter and derivant, sodium sulfite and ferrous sulfate.Wherein glucide and derivant thereof
Including glucose, D-Glucopyranose., N-Acetyl-D-glucosamine, gluconic acid, sodium gluconate, Fructus Vitis viniferae
Saccharic acid ferrous iron, D-cellobiose, fructose, xylose, maltose, lactose, sucrose, erythrose, ribose,
Arabinose, Ah's threose, mannose, lyxose, talose, Isomaltotriose and chitosan etc..Reduction
The concentration of agent is preferably 0.0001-10mol/L.
After carrying out pickling and after alkali cleaning and reduction treatment, need the copper powder after processing is filtered
Washing, to prevent residue from impacting subsequent processing steps.
Step S120: the copper powder after processing alkali cleaning carries out Surface coating at least one times and processes.
The most in the present embodiment, this Surface coating processes and is: chemical plating liquid gradually drops to copper powder
In solution, carry out replacement ag plating, in reacted system, and then add reducing agent with to the thick product obtained
Thing carries out reduction treatment, is filtrated to get silver-coated copper powder crude product.In other embodiments, this Surface coating
Process and also include reducing silver-plated step, namely at least in one-time surface cladding processing procedure, to obtaining
Crude product carry out reduction treatment after, also include in reaction system continue add chemical plating liquid, to slightly
Product carries out reducing silver-plated step.
In the present embodiment, chemical plating liquid be argentiferous presoma is mixed with chelating agent after obtain silver
Complex liquid.Wherein, during argentiferous presoma is the silver ion solutions such as silver nitrate, silver acetate and silver sulfate at least
One, concentration is preferably 0.0001-3mol/L.Chelating agent be ammonia, citric acid, tartaric acid, aminoacid,
At least one in organic amine material and derivant thereof.Wherein, organic amine material and derivant thereof include
Ethylenediamine, ethylenediaminetetraacetic acid and disodium salt thereof, ethylenediamine triacetic acid and trisodium salt thereof, Methanamide, acetyl
Amine, n-butylamine, dimethylamine, hexamethylene diamine, triethylamine, triethanolamine, diethylenetriamine, diethylidene three
Amine, hexamethylene imine, diethylene triamine pentacetic acid (DTPA) and morpholine etc..The concentration of chelating agent is preferably
0.0001-5mol/L.In other embodiments, chemical plating liquid also include polyvinylpyrrolidone (PVP),
Polyvinyl alcohol (PVA), poly(ethylene oxide) (PEO), Polyethylene Glycol (PEG) and Radix Acaciae senegalis etc. are at least
A kind of dispersant, mass percent concentration is preferably 0-5%.
Reducing agent is hydrazine hydrate, formaldehyde, formic acid, acetaldehyde, glyoxalic acid, ascorbic acid, maltose, Fructus Vitis viniferae
At least one in sugar, sucrose, lactose, sodium sulfite and ferrous sulfate, concentration is preferably 0.0001-10mol/L.
Silver cladding mode uses first replaces the mode restored, and once replacing the most also principle becomes one
Subsurface cladding processes, and the number of times that Surface coating processes can be 1 time, 2 times or how inferior.When completing once
Surface coating processes when carrying out next time again, needs previous sample to filter and wash.
Step S130: obtain silver-coated copper powder crude product after being processed by Surface coating and be scattered in acidic cleaning solution
Row post processing, filters and obtains silver-coated copper powder after drying.
In the present embodiment, at least one during acidic cleaning solution includes inorganic acid solution and organic acid soln
The mixed liquor of acid solution and coupling agent, as sulphuric acid, nitric acid, hydrochloric acid, formic acid, acetic acid, malonic acid, adipic acid,
1,3-propanedicarboxylic acid, 1,5-pentanedicarboxylic acid., oleic acid, stearic acid etc., acid solution mass percent concentration is preferably 0-30%.Coupling agent
For silane coupler or zirconium ester coupling agent, such as KH-550, KH560 etc., coupling agent mass percent concentration
It is preferably 0-10%.In other embodiments, acidic cleaning solution can also be added with antioxidant, such as ten
Eight amine, BTA, lauryl mercaptan, ascorbic acid etc., mass percent concentration is preferably 0-5% etc..
The preparation method of this silver-coated copper powder, by first copper powder being carried out alkali cleaning process, can effectively remove copper powder table
The impurity such as the oxide in face, and make the surface activity of copper powder particle reduce, obtain uniform clad surface, for
Follow-up silver cladding provides good basis；In Surface coating processing procedure, this preparation method uses and first puts
Change the mode restored, the silver coating of even compact can be formed at Copper Powder Surface；Finally by silver-coated copper powder
Crude product is placed in acidic cleaning solution and is carried out, and the silver-coated copper powder dense uniform obtained, conductive effect is notable
Improve.
It is below specific embodiment part:
Embodiment 1
Taking flake copper 100g, ultrasonic disperse, in 5L aqueous solvent, adds 50g sodium hydroxide and 50mL water
Close hydrazine, at 60 DEG C, process 2 hours.After filtration washing, then by copper powder ultrasonic disperse in 5L aqueous solvent
In, carrying out chemical silvering, the composition of chemical plating liquid is: 300mL water, 25g silver nitrate and 35mL second two
Amine.Chemical plating liquid is gradually added dropwise in the cupric powder liquid after above-mentioned process, after completion of dropwise addition, reacts 1
Hour, add the Vc aqueous solution that 50mL concentration is 0.5mol/L, continue reaction 30 minutes.Through filtering
After, carrying out secondary cladding, the composition of chemical plating liquid is: 150mL water, 12g silver nitrate and 18mL second two
Amine.Chemical plating liquid is gradually added dropwise in silver-coated copper powder crude product, after completion of dropwise addition, reacts 1 hour,
Add the Vc aqueous solution that 50mL concentration is 0.2mol/L, continue reaction 30 minutes.Clear water is used after filtration
Repeatedly rinse, then silver-coated copper powder is scattered in the ethanol containing formic acid, acetic acid and silane Rhizoma Nelumbinis connection agent KH-550
In solution, ultrasonic agitation 1 hour, after refiltering, within 5 hours, it is dried through 90 DEG C, obtains silver-coated copper powder and produce
Product.Detecting through EDX, its composition is silver and copper, and the weight percentage (wt%) of silver is about 22.7%,
Its SEM photograph is as in figure 2 it is shown, detect through SEM photograph, and the plated surface silver layer of this silver-coated copper powder uniformly causes
Close.After testing, its specific insulation is 1.6 × 10-4Ω·cm。
Embodiment 2
Taking graininess copper powder 100g, ultrasonic disperse, in 1L aqueous solvent, is subsequently adding 20mL oxalic acid and 20g
Adipic acid, processes 3 hours, filtration washing.By copper powder ultrasonic disperse in 2L aqueous solvent, add 112g
Potassium hydroxide, 1mL hydrazine hydrate and 270g ascorbic acid, at 95 DEG C, process 5 hours.Through filtration washing
After, by copper powder ultrasonic disperse in 2L aqueous solvent, carrying out chemical silvering, the composition of chemical plating liquid is: 600mL
Water, 12g silver nitrate and 55g disodiumedetate.After chemical plating liquid is gradually added dropwise to above-mentioned process
Cupric powder liquid in, after completion of dropwise addition, react 2 hours, adding 100mL concentration is 0.5mol/L's
Vc aqueous solution, continues reaction 5 minutes.Finally, adding new chemical plating liquid, its composition is: 300mL
Water, 6g silver nitrate and 27g disodiumedetate.It is gradually added dropwise in aforesaid liquid, dropping knot
Shu Hou, continues reaction 30 minutes.Repeatedly rinse with clear water after filtration, then silver-coated copper powder is scattered in containing
In the ethanol solution of stearic acid and silane Rhizoma Nelumbinis connection agent KH-560, ultrasonic agitation 2 hours, after refiltering, pass through
90 DEG C are dried, obtain silver-coated copper powder product for 5 hours.Detecting through EDX, its composition is silver and copper, silver
Weight percentage (wt%) be about 11.3%, its SEM photograph as it is shown on figure 3, through SEM photograph detect,
The plated surface silver layer even compact of this silver-coated copper powder.After testing, its specific insulation is 9.5 × 10-5Ω·cm。
Embodiment 3
Taking graininess copper powder 30g, ultrasonic disperse, in 1L aqueous solvent, is subsequently adding 50mL formic acid, processes
3 hours, filtration washing.By copper powder ultrasonic disperse in 0.5L aqueous solvent, add 30g sodium hydroxide, 65g
Sucrose and 5mL acetaldehyde, at 90 DEG C, process 8 hours.After filtration washing, by copper powder ultrasonic disperse in
In 1L aqueous solvent, carrying out chemical silvering, the composition of chemical plating liquid is: 300mL water, 18g silver nitrate,
10mL ammonia and 2mL diethylenetriamine.Chemical plating liquid is gradually added dropwise to after above-mentioned process containing copper powder
In liquid, after completion of dropwise addition, react 2 hours, add the Vc that 120mL concentration is 0.5mol/L water-soluble
Liquid, continues reaction 5 minutes.Adding new chemical plating liquid, its composition is: 150mL water, 6g nitric acid
Silver, 4mL ammonia and 1mL diethylenetriamine.It is gradually added dropwise in aforesaid liquid, after completion of dropwise addition,
Continue reaction 1 hour.Filtration washing, completes Surface coating process for the first time.After cladding for the first time
Silver-bearing copper powder ultrasonic disperse, in 1L aqueous solvent, carries out second time chemical silvering, and the composition of chemical plating liquid is:
200mL water, 12g silver nitrate, 7mL ammonia and 1.5mL diethylenetriamine.Chemical plating liquid is gradually dripped
Add in the cupric powder liquid after above-mentioned process, after completion of dropwise addition, react 2 hours, add 100mL dense
Degree is the Vc aqueous solution of 0.5mol/L, continues reaction 5 minutes.Add new chemical plating liquid, its composition
It is: 80mL water, 3g silver nitrate, 2mL ammonia and 1mL diethylenetriamine.It is gradually added dropwise to above-mentioned
In liquid, after completion of dropwise addition, continue reaction 1 hour.Repeatedly rinse with clear water after filtration, complete second time
Cladding process.Finally silver-coated copper powder is scattered in the ethanol solution containing acetic acid and ascorbic acid, ultrasonic stirs
Mix 1 hour, the BTA solution rinse 3 using mass percent concentration to be 0.1% filter cake during filtration
Secondary, within 5 hours, it is dried through 90 DEG C, obtains silver-coated copper powder product.Through EDX detect, its composition be silver with
Copper, silver weight percentage (wt%) be about 52.9%, its SEM photograph as shown in Figure 4, through SEM
Photo detects, the plated surface silver layer even compact of this silver-coated copper powder.After testing, its specific insulation is 2.3 × 10-5
Ω·cm。
Embodiment 4
Line taking shape copper powder 5g, ultrasonic disperse, in 200mL aqueous solvent, is subsequently adding 20mL0.5M sulphuric acid molten
Liquid, processes 1 hour, after filtration washing, by copper powder ultrasonic disperse in 200mL aqueous solvent, carries out chemistry
Silver-plated, the composition of chemical plating liquid is: 50mL water, 2.5g silver nitrate, 3.5mL ammonia and 0.5mL tri-second
Alkene tetramine.Chemical plating liquid is gradually added dropwise in the cupric powder liquid after above-mentioned process, after completion of dropwise addition,
React 3 hours, add the Vc aqueous solution that 20mL concentration is 0.2mol/L, continue reaction 10 minutes.
Finally, adding new chemical plating liquid, its composition is: 50mL water, 1.5g silver nitrate and 8g ethylenediamine
Tetraacethyl disodium.It is gradually added dropwise in aforesaid liquid, after completion of dropwise addition, continues reaction 2 hours.Cross
Repeatedly rinse with clear water after filter, be then scattered in the ethanol solution containing oleic acid and lauryl mercaptan with silver-coated copper powder
In, ultrasonic agitation 2 hours, after refiltering, within 12 hours, it is vacuum dried through 70 DEG C, obtains silver-coated copper powder and produce
Product.Detecting through EDX, its composition is silver and copper, and the weight percentage (wt%) of silver is about 37.5%,
Its SEM photograph is as it is shown in figure 5, detect through SEM photograph, and the plated surface silver layer of this silver-coated copper powder uniformly causes
Close.After testing, its specific insulation is 8.2 × 10-5Ω·cm。
Embodiment described above only have expressed the several embodiments of the present invention, and it describes more concrete and detailed,
But therefore can not be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that, for this area
Those of ordinary skill for, without departing from the inventive concept of the premise, it is also possible to make some deformation and
Improving, these broadly fall into protection scope of the present invention.Therefore, the protection domain of patent of the present invention should be with appended
Claim is as the criterion.
Claims (15)
1. the preparation method of a silver-coated copper powder, it is characterised in that comprise the steps:
To treat that silver-plated copper powder ultrasonic disperse, in solvent, and adds alkaline reagent and reducing agent, to described copper
Powder carries out alkali cleaning and reduction treatment；
Described copper powder after alkali cleaning and reduction treatment carrying out Surface coating at least one times process, described surface is wrapped
Cover process specifically: gradually dropped to by chemical plating liquid in copper powder solution, carry out replacement ag plating, and then
In reacted system, addition reducing agent is to carry out reduction treatment to the crude product obtained, and is filtrated to get silver bag
Copper powder crude product；
Obtain silver-coated copper powder crude product after being processed by Surface coating to be scattered in acidic cleaning solution and carry out post processing,
Filter and obtain silver-coated copper powder after drying.
2. the preparation method of silver-coated copper powder as claimed in claim 1, it is characterised in that at least in once institute
State in Surface coating processing procedure, after the crude product obtained is carried out reduction treatment, also include to reaction
System continues add chemical plating liquid, crude product is reduced silver-plated step.
3. the preparation method of silver-coated copper powder as claimed in claim 1 or 2, it is characterised in that described alkalescence
Reagent is at least one in sodium hydroxide, potassium hydroxide, ammonia, sodium oxide and potassium oxide, described alkalescence
The addition of reagent need to control the pH value of solution between 8～15.
4. the preparation method of silver-coated copper powder as claimed in claim 3, it is characterised in that described alkali cleaning processes
Temperature be 40～100 DEG C.
5. the preparation method of silver-coated copper powder as claimed in claim 1 or 2, it is characterised in that described chemistry
Silver plating liquid be argentiferous presoma is mixed with chelating agent after obtain silver complex liquid.
6. the preparation method of silver-coated copper powder as claimed in claim 5, it is characterised in that described argentiferous forerunner
Body is at least one in silver nitrate, silver acetate and silver sulfate；Described chelating agent is ammonia, citric acid, wine
At least one in stone acid, aminoacid, organic amine material and derivant thereof.
7. the preparation method of silver-coated copper powder as claimed in claim 6, it is characterised in that described organic amine
Class material and derivant thereof include for ethylenediamine, ethylenediaminetetraacetic acid and disodium salt thereof, ethylenediamine triacetic acid and
Its trisodium salt, Methanamide, acetamide, n-butylamine, dimethylamine, hexamethylene diamine, triethylamine, triethanolamine,
Diethylenetriamine, diethylenetriamines, hexamethylene imine, diethylene triamine pentacetic acid (DTPA) and morpholine.
8. the preparation method of silver-coated copper powder as claimed in claim 5, it is characterised in that described chemical silvering
Possibly together with dispersant in liquid.
9. the preparation method of silver-coated copper powder as claimed in claim 8, it is characterised in that described dispersant is
In polyvinylpyrrolidone, polyvinyl alcohol, poly(ethylene oxide), Polyethylene Glycol and Radix Acaciae senegalis at least one.
10. the preparation method of silver-coated copper powder as claimed in claim 1 or 2, it is characterised in that described also
Former dose be hydrazine hydrate, sodium hypophosphite, formaldehyde, formic acid, acetaldehyde, glyoxalic acid, citric acid, citral,
Sodium citrate, potassium citrate, ascorbic acid, sodium ascorbate, potassium ascorbate, glucide and spread out
At least one in biology, sodium sulfite and ferrous sulfate.
The preparation method of 11. silver-coated copper powders as claimed in claim 10, it is characterised in that described saccharide
Material and derivant thereof include glucose, D-Glucopyranose., N-Acetyl-D-glucosamine, gluconic acid, Portugal
Grape sodium saccharate, Ferrous gluconate, D-cellobiose, fructose, xylose, maltose, lactose, sucrose,
Erythrose, ribose, arabinose, Ah's threose, mannose, lyxose, talose, Isomaltotriose and
Chitosan.
The preparation method of 12. silver-coated copper powders as claimed in claim 1 or 2, it is characterised in that described acid
Property cleanout fluid is the mixed liquor containing acid solution Yu coupling agent.
The preparation method of 13. silver-coated copper powders as claimed in claim 12, it is characterised in that described acid solution is
At least one solution in mineral acid and organic acid；Described coupling agent is silane coupler or zirconium ester coupling agent.
The preparation method of 14. silver-coated copper powders as claimed in claim 1 or 2, it is characterised in that also include
Before described copper powder is carried out alkali cleaning and reduction treatment, carry out treating that silver-plated copper powder is placed in acid solution
The step of pickling.
15. 1 kinds use the silver-colored copper-clad that the preparation method as according to any one of claim 1～14 prepares
Powder.
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