CN102950283B - Preparation method for superfine silver plating copper powder used for electronic paste - Google Patents
Preparation method for superfine silver plating copper powder used for electronic paste Download PDFInfo
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- CN102950283B CN102950283B CN201210437816.1A CN201210437816A CN102950283B CN 102950283 B CN102950283 B CN 102950283B CN 201210437816 A CN201210437816 A CN 201210437816A CN 102950283 B CN102950283 B CN 102950283B
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Abstract
The invention discloses a preparation method for superfine silver plating copper powder used for electronic paste, and belongs to the technical field of functional powder. The preparation method solves the problem that the silver plating copper powder used for the electronic paste can not be prepared in the prior art. The preparation method comprises the following steps of: (1) after superfine copper powder is subjected to surface treatment, preparing copper powder to be plated; (2) adding dispersing agent, additive and reducing agent into deionized water, adding the copper powder to be plated, and regulating a pH (potential of hydrogen) value to 12-14 to obtain mixture to be plated; (3) adding silver nitrate into the deionized water and amine complexing agent to obtain silver amide solution; (4) adding the silver amide solution into the mixture to be plated to obtain the silver plating copper powder; (5) washing the silver plating copper powder with the deionized water to serve as the copper powder to be plated, entering steps (2) to (4) for silver plating circulation to obtain secondary silver plating copper powder; and (6) putting the secondary silver plating copper powder into organic solution, carrying out suction filtration, dewatering and drying to obtain the superfine silver plating copper powder. The preparation method has the advantages of simple technology, stable technology and high silver plating efficiency, and the product can be used as electronic slurry.
Description
Technical field
The invention belongs to function powder material preparing technical field, relate to a kind of preparation method of superfine cupper powder.
Background technology
Along with scientific and technical develop rapidly, electronic product is more and more tending towards miniaturization, highly integrated, the application of electric slurry is more and more extensive, and silver powder is as the optimal conductive filler of electric slurry, its consumption also increases thereupon, but under the effect of DC voltage, easily there is transport phenomena and cause short circuit in silver, this just becomes electronic product march toward miniaturization, highly integrated a great problem, and silver-colored price is higher, especially nearly 2 years, silver-colored valency was advanced by leaps and bounds, is remained high, and this makes the substitute of a kind of silver of a lot of field active demand.And copper powder low price (be only silver-colored price 1/100), ability of resisting to migration is much higher than silver, and (specific insulation is close with silver: ρ to have good electric conductivity
ν (Cu)=1.75 × 10
-8Ω m, ρ
ν (Ag)=1.60 × 10
-8Ω m), thereby is used widely, and superfine cupper powder, due to its larger specific area, higher apparent activation energy, has more excellent properties, makes it be widely used in the field such as electronics, catalyst.But copper powder is easily oxidized in preparation and application process, and superfine cupper powder is more easily oxidized.So at superfine cupper powder plated surface last layer silver, can improve like this oxidation resistance of copper powder, can keep again the premium properties of superfine cupper powder, the excellent properties of comprehensive two kinds of metal materials, form a kind of new composite, its each performance and silver are more approaching, even can be completely alternative in certain fields, thereby Silver Coated Copper Powders will have very vast potential for future development.
Patent of invention [US19910731313] has proposed a kind of substep and has added the method that complexing agent is prepared silver-plated copper powder, and the silver-plated copper powder of preparation has good non-oxidizability, stability and good electric conductivity.Application for a patent for invention [CN101709461A] proposes to utilize at the strong simple substance palladium of Copper Powder Surface pre-value catalytic activity and forms catalytic center, in silver plating liquid, promote silver ion reduction deposition, hinder cuprammonium and coordinate ion in the effect of copper adsorption, thereby obtain the silver coating covering continuously.Patent of invention [CN101294281B] discloses a kind of preparation method of silver-plated copper powder for low-temperature slurry, proposes to add polynary complexing agent complexed acidic Ag-containing solution in copper powder solution and carries out preparing silver-plated copper powder without the method for cyanogen chemical silvering.Document [electroless plating method is prepared silver-colored Coated copper powder reaction process research] is introduced strong reductant hydrazine hydrate, suppress displacement reaction by control, make silver ammino solution that Liquid reduction reaction process preferentially occur, prepared and former copper powder size and the roughly the same bimetal Cu-Ag powder of pattern.Application for a patent for invention [CN101214547A] discloses a kind of silver powder with micron-scale, silver-coated copper powder or silver-copper mixing split for supporting matrix, make silver salt be reduced to nano-silver powder with reproducibility compound, and described in being deposited on, support stromal surface, thereby obtain the preparation method of the micrometer silver-copper granule that contains nano level surface structure.
Silver-plated copper powder majority prepared by said method is only applicable to electromagnetic shielding field, the requirement that does not reach electric slurry field conductive filler used at aspects such as granularity, color, glossiness, electric conductivity, tap densities, and technological operation needs further to be optimized, have that silver-plated efficiency is low, have the thickness of deposition of silver, silvering to be difficult to the shortcomings such as control on coating bath.
Summary of the invention
Cannot prepare the problem of electric slurry field silver-plated copper powder conductive filler used for solving prior art, the invention provides the preparation method of a kind of electric slurry Silver Coated Copper Powders, its technical scheme is as follows:
A preparation method for Silver Coated Copper Powders for electric slurry, comprises following sequential steps:
(1) get the spherical or ultrafine flake copper powder that micro-granularity is 200 ~ 400nm, through alkali cleaning, pickling, remove greasy dirt and the oxide layer impurity of Copper Powder Surface;
Using above-mentioned superfine cupper powder after surface treatment as copper powder to be plated, enter the silver-plated circulation of following steps (2) to step (4);
(2) get the dispersant of 1 ~ 2 ‰ weight portion, the additive of 20 ~ 40% weight portions, the reducing agent of 30 ~ 60% weight portions, join in the deionized water of 20 weight portions, be mixed with reducing solution, in this reducing solution, add the copper powder to be plated of 1 weight portion, stir, then pH value to 12 ~ 14 that add NaOH or ammoniacal liquor regulator solution, are prepared into mixture to be plated;
Described additive is one or more the mixture in tartaric acid, sodium tartrate, sodium potassium tartrate tetrahydrate, disodium ethylene diamine tetraacetate, natrium citricum;
(3) silver nitrate of getting 0.6 ~ 1.6 weight portion adds in the deionized water of 40 weight portions, adds the amine complexing agent of 0.6 ~ 2.4 weight portion, is prepared into argentamine liquid;
(4) stir or ultrasound condition under, and under the condition of normal temperature, argentamine liquid prepared by step (3) is added dropwise in mixture to be plated prepared by step (2) continuously, reacts 15 minutes, obtains silver-plated copper powder;
(5) after above-mentioned silver-plated copper powder is cleaned up by deionized water, as copper powder to be plated, again enter the silver-plated circulation of above-mentioned steps (2) to step (4), obtain secondary silver-plated copper powder, secondary silver-plated copper powder is after vacuum filtration, extremely neutral by washed with de-ionized water;
(6) under the condition stirring, the secondary silver-plated copper powder of above-mentioned neutrality is put into the ethanolic solution of the surface modifier that is dissolved with 1 ~ 2% weight portion, stir 10 minutes, through suction filtration, clean up after, with acetone dehydration, then after 60 DEG C of vacuum drying, obtain Silver Coated Copper Powders.
As the priority scheme of the inventive method, such scheme also can be done following design:
Dispersant in described step (2) is any one in BTA, polyvinylpyrrolidone, APES or terpinol.
Further priority scheme as the inventive method:
Reducing agent in described step (2) is one or more the mixture in formaldehyde, hydrazine hydrate or glucose.
Further priority scheme as the inventive method:
Amine complexing agent in described step (3) is ethylenediamine or diethylenetriamine or polyhydric alcohol amine.
Further priority scheme as the inventive method:
Surface modifier in described step (6) is one or more the mixture in silane coupler, titanate coupling agent, fatty acid ester, polyvinylpyrrolidone or oleic acid.
The silver plating process the present invention relates to carries out under normal temperature, alkali condition, technological operation is simple, stable process conditions, silver-plated efficiency are high, adopt the method for displacement-reduction Composite Coatings to improve silver-plated efficiency, through twice silver-plated, increase thickness and the density of coating, and coating bath surface does not have the silver layer of deposition, can obtain granularity is 400 ~ 500nm, and coating is even, thickness is controlled, density is high, and antioxygenic property is good, good conductivity, apparent density is 1.4 ~ 1.6g/cm
3, tap density is 3.5 ~ 4.0g/cm
3, color is silvery white, near-spherical Silver Coated Copper Powders.The Silver Coated Copper Powders that adopts this method to prepare can be used as the conductive filler of the electric slurry in the fields such as thin film switch, flexible circuitry, touch-screen, solar cell, its dispersiveness in electric slurry is fine, electric conductivity is also fine, its amount of filling can be user and saves 10 ~ 20% silver nearly, can replace wholly or in part silver powder, greatly reduce user's production cost.
Detailed description of the invention
Below in conjunction with example, the technical scheme that the present invention is proposed is described further:
Embodiment mono-:
(1) get the near-spherical superfine cupper powder that micro-granularity is 200nm, through alkali cleaning, pickling, remove the impurity such as greasy dirt and oxide layer of Copper Powder Surface;
(2) 1 ‰ BTA, 20% tartaric acid, 30% formaldehyde of copper powder weight are added and in deionized water, form reducing solution, the mass ratio of deionized water and copper powder to be plated is: 20:1, add copper powder to be plated to stir, the pH value that then adds sodium hydrate regulator solution is 12;
(3) silver nitrate that to get with the weight ratio of superfine cupper powder be 0.6 adds deionized water, and the ethylenediamine that to add with silver nitrate mass ratio be 1:1, obtains argentamine liquid;
(4) under the condition stirring, under normal temperature, the argentamine liquid of step 3 is added dropwise in the reducing solution of step 2 continuously, reacts 15 minutes, obtain once silver-plated copper powder;
By through the silver-plated copper powder washed with de-ionized water obtaining once, after cleaning up, repeat step (2) preparation and obtain reducing solution, then add a silver-plated copper powder is stirred, the pH value that adds sodium hydrate regulator solution is 12, then repeats above-mentioned steps (3)-(4), obtains secondary silver-plated copper powder, secondary silver-plated copper powder is carried out to vacuum filtration, extremely neutral by washed with de-ionized water;
(5) under the condition stirring, the Silver Coated Copper Powders finally obtaining is placed in to the organic solution containing 1% silane coupler, stir 10 minutes, suction filtration after cleaning up, with acetone dehydration, obtains Silver Coated Copper Powders after 60 DEG C of vacuum drying.The granularity D50 of this Silver Coated Copper Powders is 1.0 μ m left and right, is mixed with cryotronics slurry, and sheet resistance is 20m Ω/ /mil.
Embodiment bis-:
(1) get the near-spherical superfine cupper powder that micro-granularity is 400nm, through alkali cleaning, pickling, remove the impurity such as greasy dirt and oxide layer of Copper Powder Surface;
(2) 2 ‰ BTA, 40% tartaric acid, 60% formaldehyde of copper powder weight are added in deionized water and forms reducing solution, add copper powder to stir, the pH value that then adds sodium hydrate regulator solution is 14;
(3) silver nitrate that to get with the weight ratio of superfine cupper powder be 1.6 adds deionized water, and the ethylenediamine that to add with silver nitrate mass ratio be 1:1.5, obtains argentamine liquid;
(4) under the condition stirring, under normal temperature, the argentamine liquid of step 3 is added dropwise in the reducing solution of step 2 continuously, reacts 15 minutes, obtain once silver-plated copper powder;
(5) by through the silver-plated copper powder washed with de-ionized water obtaining once, after cleaning up, repeat compound silver-plated step, repeat step (2) preparation and obtain reducing solution, then add a silver-plated copper powder is stirred, the pH value that adds sodium hydrate regulator solution is 12, then repeat above-mentioned steps (3)-(4), obtain secondary silver-plated copper powder, secondary silver-plated copper powder is carried out to vacuum filtration, extremely neutral by washed with de-ionized water;
(6) under the condition stirring, the Silver Coated Copper Powders obtaining is placed in to the organic solution of 2% silane coupler, stir 10 minutes, suction filtration after cleaning up, with acetone dehydration, obtains Silver Coated Copper Powders after 60 DEG C of vacuum drying.The granularity D50 of this Silver Coated Copper Powders is 1.5 μ m left and right, is mixed with cryotronics slurry, and sheet resistance is 10m Ω/ /mil.
Embodiment tri-:
(1) get the near-spherical superfine cupper powder that micro-granularity is 300nm, through alkali cleaning, pickling, remove the impurity such as greasy dirt and oxide layer of Copper Powder Surface;
(2) 1.5 ‰ BTA, 30% tartaric acid, 50% formaldehyde of copper powder weight are added in deionized water and forms reducing solution, add copper powder to stir, the pH value that then adds sodium hydrate regulator solution is 13;
(3) silver nitrate that to get with the weight ratio of superfine cupper powder be 1.1 adds deionized water, and the ethylenediamine that to add with silver nitrate mass ratio be 1:1.25, obtains argentamine liquid;
(4) under the condition stirring, under normal temperature, the argentamine liquid of step 3 is added dropwise in the reducing solution of step 2 continuously, reacts 15 minutes, obtain once silver-plated copper powder;
(5) by through the silver-plated copper powder washed with de-ionized water obtaining once, after cleaning up, repeat compound silver-plated step, repeat step (2) preparation and obtain reducing solution, then add a silver-plated copper powder is stirred, the pH value that adds sodium hydrate regulator solution is 12, then repeat above-mentioned steps (3)-(4), obtain secondary silver-plated copper powder, secondary silver-plated copper powder is carried out to vacuum filtration, extremely neutral by washed with de-ionized water;
(6) under the condition stirring, the Silver Coated Copper Powders obtaining is placed in to the organic solution of 1.5% silane coupler, stir 10 minutes, suction filtration after cleaning up, with acetone dehydration, obtains Silver Coated Copper Powders after 60 DEG C of vacuum drying.The granularity D50 of this Silver Coated Copper Powders is 1.3 μ m left and right, is mixed with cryotronics slurry, and sheet resistance is 15m Ω/ /mil.
Embodiment tetra-:
BTA in step (2) replaces with polyvinylpyrrolidone, others were same as embodiment 1-3.The granularity D50 of the Silver Coated Copper Powders making is 1.0 ~ 1.2 μ m left and right, is mixed with cryotronics slurry, and sheet resistance is 10 ~ 12m Ω/ /mil.
Embodiment five:
Polyvinylpyrrolidone in step (2) replaces with APES, others were same as embodiment 1-3.The granularity D50 of the Silver Coated Copper Powders making is 1.0 ~ 1.4 μ m left and right, is mixed with cryotronics slurry, and sheet resistance is 13 ~ 16m Ω/ /mil.
Embodiment six:
APES in step (2) replaces with terpinol, others were same as embodiment 1-3.The granularity D50 of the Silver Coated Copper Powders making is 1.2 ~ 1.6 μ m left and right, is mixed with cryotronics slurry, and sheet resistance is 15 ~ 20m Ω/ /mil.
Embodiment seven:
Tartaric acid in step (2) replaces with sodium tartrate, others were same as embodiment 1-6.The granularity D50 of the Silver Coated Copper Powders making is 1.0 ~ 1.6 μ m left and right, is mixed with cryotronics slurry, and sheet resistance is 10 ~ 20m Ω/ /mil.
Embodiment eight:
Sodium potassium tartrate tetrahydrate in step (2) replaces with sodium ethylene diamine tetracetate, others were same as embodiment 1-6.The granularity D50 of the Silver Coated Copper Powders making is 1.0 ~ 1.5 μ m left and right, is mixed with cryotronics slurry, and sheet resistance is 10 ~ 15m Ω/ /mil.
Embodiment nine:
Sodium ethylene diamine tetracetate in step (2) replaces with natrium citricum, others were same as embodiment 1-6.The granularity D50 of the Silver Coated Copper Powders making is 1.0 ~ 1.6 μ m left and right, is mixed with cryotronics slurry, and sheet resistance is 10 ~ 20m Ω/ /mil.
Embodiment ten:
Natrium citricum in step (2) replaces with sodium potassium tartrate tetrahydrate and sodium ethylene diamine tetracetate additive package, others were same as embodiment 1-6.The granularity D50 of the Silver Coated Copper Powders making is 1.0 ~ 1.4 μ m left and right, is mixed with cryotronics slurry, and sheet resistance is 10 ~ 15m Ω/ /mil.
Embodiment 11:
Sodium potassium tartrate tetrahydrate in step (2) and sodium ethylene diamine tetracetate additive package replace with the additive package of sodium potassium tartrate tetrahydrate and natrium citricum, others were same as embodiment 1-6.The granularity D50 of the Silver Coated Copper Powders making is 1.0 ~ 1.6 μ m left and right, is mixed with cryotronics slurry, and sheet resistance is 10 ~ 20m Ω/ /mil.
Embodiment 12:
Sodium potassium tartrate tetrahydrate in step (2) and the additive package of natrium citricum replace with the additive package of sodium ethylene diamine tetracetate and natrium citricum, others were same as embodiment 1-6.The granularity D50 of the Silver Coated Copper Powders making is 1.0 ~ 1.4 μ m left and right, is mixed with cryotronics slurry, and sheet resistance is 10 ~ 15m Ω/ /mil.
Embodiment 13:
Reducing agent formaldehyde in step (2) replaces with hydrazine hydrate, others were same as embodiment 1-12.The granularity D50 of the Silver Coated Copper Powders making is 1.0 ~ 1.6 μ m left and right, is mixed with cryotronics slurry, and sheet resistance is 10 ~ 15m Ω/ /mil.
Embodiment 14:
Reducing agent hydrazine hydrate in step (2) replaces with glucose, others were same as embodiment 1-12.The granularity D50 of the Silver Coated Copper Powders making is 1.0 ~ 1.8 μ m left and right, is mixed with cryotronics slurry, and sheet resistance is 10 ~ 16m Ω/ /mil.
Embodiment 15:
Reducing agent glucose in step (2) replaces with the mixing reducing agent of formaldehyde and hydrazine hydrate, others were same as embodiment 1-12.The granularity D50 of the Silver Coated Copper Powders making is 1.0 ~ 1.4 μ m left and right, is mixed with cryotronics slurry, and sheet resistance is 10 ~ 13m Ω/ /mil.
Embodiment 16:
Formaldehyde in step (2) replaces with the reducing agent that mixes of glucose with the reducing agent formaldehyde that mixes of hydrazine hydrate, others were same as embodiment 1-12.The granularity D50 of the Silver Coated Copper Powders making is 1.0 ~ 1.7 μ m left and right, is mixed with cryotronics slurry, and sheet resistance is 10 ~ 15m Ω/ /mil.
Embodiment 17:
Formaldehyde in step (2) replaces with the reducing agent that mixes of glucose with the reducing agent hydrazine hydrate that mixes of glucose, others were same as embodiment 1-12.The granularity D50 of the Silver Coated Copper Powders making is 1.0 ~ 1.7 μ m left and right, is mixed with cryotronics slurry, and sheet resistance is 10 ~ 15m Ω/ /mil.
Embodiment 18:
The NaOH aqueous ammonia to replace of the regulator solution pH value in step (2), others were same as embodiment 1-17.The granularity D50 of the Silver Coated Copper Powders making is 1.0 ~ 2.0 μ m left and right, is mixed with cryotronics slurry, and sheet resistance is 10 ~ 20m Ω/ /mil.
Embodiment 19:
Ethylenediamine in step (3) replaces with diethylenetriamine, others were same as embodiment 1-18.The granularity D50 of the Silver Coated Copper Powders making is 1.0 ~ 1.5 μ m left and right, is mixed with cryotronics slurry, and sheet resistance is 10 ~ 15m Ω/ /mil.
Embodiment 20:
Diethylenetriamine in step (3) substitutes with polyhydric alcohol amine, others were same as embodiment 1-18.The granularity D50 of the Silver Coated Copper Powders making is 1.0 ~ 1.4 μ m left and right, is mixed with cryotronics slurry, and sheet resistance is 10 ~ 15m Ω/ /mil.
Embodiment 21:
Silane coupler in step (6) replaces with titanate coupling agent, others were same as embodiment 1-20.The granularity D50 of the Silver Coated Copper Powders making is 1.0 ~ 2.0 μ m left and right, is mixed with cryotronics slurry, and sheet resistance is 10 ~ 20m Ω/ /mil.
Embodiment 22:
Titanate coupling agent in step (6) replaces with fatty acid ester, others were same as embodiment 1-20.The granularity D50 of the Silver Coated Copper Powders making is 1.0 ~ 2.0 μ m left and right, is mixed with cryotronics slurry, and sheet resistance is 10 ~ 20m Ω/ /mil.
Embodiment 23:
Fatty acid ester in step (6) replaces with polyvinylpyrrolidone, others were same as embodiment 1-20.The granularity D50 of the Silver Coated Copper Powders making is 1.0 ~ 1.8 μ m left and right, is mixed with cryotronics slurry, and sheet resistance is 10 ~ 14m Ω/ /mil.
Embodiment 24:
Polyvinylpyrrolidone in step (6) replaces with oleic acid, others were same as embodiment 1-19.The granularity D50 of the Silver Coated Copper Powders making is 1.0 ~ 2.0 μ m left and right, is mixed with cryotronics slurry, and sheet resistance is 10 ~ 20m Ω/ /mil.
Embodiment 25:
Oleic acid in step (6) replaces with the blending surface modifier of silane coupler and fatty acid ester, others were same as embodiment 1-20.The granularity D50 of the Silver Coated Copper Powders making is 1.0 ~ 1.5 μ m left and right, is mixed with cryotronics slurry, and sheet resistance is 10 ~ 15m Ω/ /mil.
Embodiment 26:
Silane coupler in step (6) and the blending surface modifier of fatty acid ester replace with the blending surface modifier of silane coupler and polyvinylpyrrolidone, others were same as embodiment 1-20.The granularity D50 of the Silver Coated Copper Powders making is 1.0 ~ 2.0 μ m left and right, is mixed with cryotronics slurry, and sheet resistance is 10 ~ 15m Ω/ /mil.
Embodiment 27:
Silane coupler in step (6) and the blending surface modifier of polyvinylpyrrolidone replace with the blending surface modifier of silane coupler and oleic acid, others were same as embodiment 1-20.The granularity D50 of the Silver Coated Copper Powders making is 1.0 ~ 2.0 μ m left and right, is mixed with cryotronics slurry, and sheet resistance is 10 ~ 20m Ω/ /mil.
Embodiment 28:
The blending surface modifier of the silane coupler in step (6) and the blending surface modifier of polyvinylpyrrolidone use silane coupler and fatty acid ester, polyvinylpyrrolidone replaces, others were same as embodiment 1-20.The granularity D50 of the Silver Coated Copper Powders making is 1.0 ~ 1.5 μ m left and right, is mixed with cryotronics slurry, and sheet resistance is 10 ~ 15m Ω/ /mil.
Embodiment 29:
The blending surface modifier of the silane coupler in step (6) and the blending surface modifier of polyvinylpyrrolidone use silane coupler and fatty acid ester, oleic acid replaces, others were same as embodiment 1-20.The granularity D50 of the Silver Coated Copper Powders making is 1.0 ~ 2.0 μ m left and right, is mixed with cryotronics slurry, and sheet resistance is 10 ~ 20m Ω/ /mil.
Embodiment 30:
Silane coupler in embodiment 26-29 replaces with titanate coupling agent, others were same as embodiment 1-20.The granularity D50 of the Silver Coated Copper Powders making is 1.0 ~ 2.0 μ m left and right, is mixed with cryotronics slurry, and sheet resistance is 10 ~ 22m Ω/ /mil.
Claims (5)
1. a preparation method for Silver Coated Copper Powders for electric slurry, is characterized in that, comprises following sequential steps:
(1) get the spherical or ultrafine flake copper powder that micro-granularity is 200 ~ 400nm, through alkali cleaning, pickling, remove greasy dirt and the oxide layer impurity of Copper Powder Surface;
Using above-mentioned superfine cupper powder after surface treatment as copper powder to be plated, enter the silver-plated circulation of following steps (2) to step (4);
(2) get the dispersant of 1 ~ 2 ‰ weight portion, the additive of 20 ~ 40% weight portions, the reducing agent of 30 ~ 60% weight portions, join in the deionized water of 20 weight portions, be mixed with reducing solution, in this reducing solution, add the copper powder to be plated of 1 weight portion, stir, then pH value to 12 ~ 14 that add NaOH or ammoniacal liquor regulator solution, are prepared into mixture to be plated;
Described additive is one or more the mixture in tartaric acid, sodium tartrate, sodium potassium tartrate tetrahydrate, disodium ethylene diamine tetraacetate, natrium citricum;
(3) silver nitrate of getting 0.6 ~ 1.6 weight portion adds in the deionized water of 40 weight portions, adds the amine complexing agent of 0.6 ~ 2.4 weight portion, is prepared into argentamine liquid;
(4) stir or ultrasound condition under, and under the condition of normal temperature, argentamine liquid prepared by step (3) is added dropwise in mixture to be plated prepared by step (2) continuously, reacts 15 minutes, obtains silver-plated copper powder;
(5) after above-mentioned silver-plated copper powder is cleaned up by deionized water, as copper powder to be plated, again enter the silver-plated circulation of above-mentioned steps (2) to step (4), obtain secondary silver-plated copper powder, secondary silver-plated copper powder is after vacuum filtration, extremely neutral by washed with de-ionized water;
(6) under the condition stirring, the secondary silver-plated copper powder of above-mentioned neutrality is put into the ethanolic solution of the surface modifier that is dissolved with 1 ~ 2% weight portion, stir 10 minutes, through suction filtration, clean up after, with acetone dehydration, then after 60 DEG C of vacuum drying, obtain Silver Coated Copper Powders.
2. the preparation method of Silver Coated Copper Powders for electric slurry according to claim 1, is characterized in that:
Dispersant in described step (2) is any one in BTA, polyvinylpyrrolidone, APES or terpinol.
3. the preparation method of Silver Coated Copper Powders for electric slurry according to claim 1 and 2, is characterized in that:
Reducing agent in described step (2) is one or more the mixture in formaldehyde, hydrazine hydrate or glucose.
4. the preparation method of Silver Coated Copper Powders for electric slurry according to claim 3, is characterized in that:
Amine complexing agent in described step (3) is ethylenediamine or diethylenetriamine or polyhydric alcohol amine.
5. the preparation method of Silver Coated Copper Powders for electric slurry according to claim 4, is characterized in that:
Surface modifier in described step (6) is one or more the mixture in silane coupler, titanate coupling agent, fatty acid ester, polyvinylpyrrolidone or oleic acid.
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