CN106145971A - 一种抗裂镁碳砖及其制备方法 - Google Patents
一种抗裂镁碳砖及其制备方法 Download PDFInfo
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- CN106145971A CN106145971A CN201610530487.3A CN201610530487A CN106145971A CN 106145971 A CN106145971 A CN 106145971A CN 201610530487 A CN201610530487 A CN 201610530487A CN 106145971 A CN106145971 A CN 106145971A
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- magnesia
- carbon brick
- cracking resistance
- magnesia carbon
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- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 title claims abstract description 189
- 239000000395 magnesium oxide Substances 0.000 title claims abstract description 95
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 title claims abstract description 77
- 239000011449 brick Substances 0.000 title claims abstract description 71
- 229910052799 carbon Inorganic materials 0.000 title claims abstract description 69
- 238000005336 cracking Methods 0.000 title claims abstract description 31
- 238000002360 preparation method Methods 0.000 title claims abstract description 12
- 239000002245 particle Substances 0.000 claims abstract description 42
- 239000000919 ceramic Substances 0.000 claims abstract description 21
- 239000008187 granular material Substances 0.000 claims abstract description 15
- VKYKSIONXSXAKP-UHFFFAOYSA-N hexamethylenetetramine Chemical compound C1N(C2)CN3CN1CN2C3 VKYKSIONXSXAKP-UHFFFAOYSA-N 0.000 claims abstract description 12
- JZCCFEFSEZPSOG-UHFFFAOYSA-L copper(II) sulfate pentahydrate Chemical compound O.O.O.O.O.[Cu+2].[O-]S([O-])(=O)=O JZCCFEFSEZPSOG-UHFFFAOYSA-L 0.000 claims abstract description 9
- 239000007767 bonding agent Substances 0.000 claims abstract description 8
- 239000010439 graphite Substances 0.000 claims abstract description 8
- 229910002804 graphite Inorganic materials 0.000 claims abstract description 8
- 239000004312 hexamethylene tetramine Substances 0.000 claims abstract description 6
- 235000010299 hexamethylene tetramine Nutrition 0.000 claims abstract description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 30
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 claims description 28
- 239000007788 liquid Substances 0.000 claims description 27
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 21
- 239000000843 powder Substances 0.000 claims description 21
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical group [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 19
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 19
- 229920001568 phenolic resin Polymers 0.000 claims description 19
- 238000002156 mixing Methods 0.000 claims description 18
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 15
- 239000006185 dispersion Substances 0.000 claims description 14
- 239000011259 mixed solution Substances 0.000 claims description 14
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 claims description 12
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 11
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 10
- 239000000376 reactant Substances 0.000 claims description 10
- 238000003756 stirring Methods 0.000 claims description 10
- 238000001035 drying Methods 0.000 claims description 9
- 239000005543 nano-size silicon particle Substances 0.000 claims description 9
- 239000004411 aluminium Substances 0.000 claims description 8
- 229910052782 aluminium Inorganic materials 0.000 claims description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 8
- 239000002994 raw material Substances 0.000 claims description 7
- 239000000377 silicon dioxide Substances 0.000 claims description 7
- 238000006243 chemical reaction Methods 0.000 claims description 6
- 235000013312 flour Nutrition 0.000 claims description 6
- NVVZQXQBYZPMLJ-UHFFFAOYSA-N formaldehyde;naphthalene-1-sulfonic acid Chemical compound O=C.C1=CC=C2C(S(=O)(=O)O)=CC=CC2=C1 NVVZQXQBYZPMLJ-UHFFFAOYSA-N 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 6
- 239000000243 solution Substances 0.000 claims description 6
- 239000002253 acid Substances 0.000 claims description 5
- 238000000498 ball milling Methods 0.000 claims description 5
- 238000009833 condensation Methods 0.000 claims description 5
- 230000005494 condensation Effects 0.000 claims description 5
- 238000001816 cooling Methods 0.000 claims description 5
- 230000018044 dehydration Effects 0.000 claims description 5
- 238000006297 dehydration reaction Methods 0.000 claims description 5
- 239000000428 dust Substances 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 5
- 229910052757 nitrogen Inorganic materials 0.000 claims description 5
- 239000003921 oil Substances 0.000 claims description 5
- 229920000642 polymer Polymers 0.000 claims description 5
- 238000004080 punching Methods 0.000 claims description 5
- 238000005245 sintering Methods 0.000 claims description 5
- 239000002893 slag Substances 0.000 abstract description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 238000012545 processing Methods 0.000 abstract description 3
- 230000003026 anti-oxygenic effect Effects 0.000 abstract description 2
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 5
- 239000000654 additive Substances 0.000 description 5
- 239000011777 magnesium Substances 0.000 description 5
- 229910052749 magnesium Inorganic materials 0.000 description 5
- 230000003647 oxidation Effects 0.000 description 5
- 238000007254 oxidation reaction Methods 0.000 description 5
- 239000000047 product Substances 0.000 description 5
- 230000000996 additive effect Effects 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 239000005011 phenolic resin Substances 0.000 description 4
- 230000007797 corrosion Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 238000000354 decomposition reaction Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229910010271 silicon carbide Inorganic materials 0.000 description 3
- 229910052582 BN Inorganic materials 0.000 description 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- 208000037656 Respiratory Sounds Diseases 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000003064 anti-oxidating effect Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000005457 optimization Methods 0.000 description 2
- 239000004576 sand Substances 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- CWYNVVGOOAEACU-UHFFFAOYSA-N Fe2+ Chemical compound [Fe+2] CWYNVVGOOAEACU-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- RWDBMHZWXLUGIB-UHFFFAOYSA-N [C].[Mg] Chemical class [C].[Mg] RWDBMHZWXLUGIB-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- OSMSIOKMMFKNIL-UHFFFAOYSA-N calcium;silicon Chemical compound [Ca]=[Si] OSMSIOKMMFKNIL-UHFFFAOYSA-N 0.000 description 1
- 239000003245 coal Substances 0.000 description 1
- 239000007859 condensation product Substances 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 238000005262 decarbonization Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 229910052839 forsterite Inorganic materials 0.000 description 1
- 239000011339 hard pitch Substances 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- -1 magnesium aluminate Chemical class 0.000 description 1
- HCWCAKKEBCNQJP-UHFFFAOYSA-N magnesium orthosilicate Chemical compound [Mg+2].[Mg+2].[O-][Si]([O-])([O-])[O-] HCWCAKKEBCNQJP-UHFFFAOYSA-N 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- VDGJOQCBCPGFFD-UHFFFAOYSA-N oxygen(2-) silicon(4+) titanium(4+) Chemical compound [Si+4].[O-2].[O-2].[Ti+4] VDGJOQCBCPGFFD-UHFFFAOYSA-N 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 239000011819 refractory material Substances 0.000 description 1
- 238000007634 remodeling Methods 0.000 description 1
- 229910052604 silicate mineral Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 229910052596 spinel Inorganic materials 0.000 description 1
- 239000011029 spinel Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
- C04B35/03—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on magnesium oxide, calcium oxide or oxide mixtures derived from dolomite
- C04B35/04—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on magnesium oxide, calcium oxide or oxide mixtures derived from dolomite based on magnesium oxide
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- C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
- C04B35/63—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B using additives specially adapted for forming the products, e.g.. binder binders
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- C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
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- C04B35/634—Polymers
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Abstract
本发明公开了一种抗裂镁碳砖,其由以下重量份的组分制成:75~80份镁砂,7~10份玄武岩颗粒,5~10份五水硫酸铜,0.3~0.5份六亚甲基四胺,15~18份石墨,3~5份陶瓷颗粒Al4SiC4,3~5份结合剂。本发明的抗裂镁碳砖能有效避免砖体层裂,大大降低碳损失量,提高镁碳砖的抗渣性和抗氧化性能,提高了使用寿命,砖体质量和性能佳。本发明还提供了一种抗裂镁碳砖制备方法,工艺步骤简单,可操作性强,对设备无特殊要求,制备成本低,适合工业化生产。
Description
技术领域
本发明涉及耐火材料技术领域,尤其是涉及一种抗裂镁碳砖及其制备方法。
背景技术
镁碳砖因具有良好的抗热震性和抗渣侵蚀性,所以被广泛应用于钢铁冶金工业。由于碳易氧化引起制品强度降低,抗侵蚀能力下降,使镁碳砖丧失优势。为提高镁碳砖在高温条件下的抗氧化能力,关键在于控制材料的脱碳速度。目前常用的一种方法是在镁碳砖中添加防止氧化的添加剂,常见的添加剂主要有两类,(1)金属或合金细粉;(2)非金属细粉。
例如,申请公布号CN101747065A,申请公布日2010.06.23的中国专利公开了一种镁碳砖,该镁碳砖的原料由30-80重量份废弃镁碳砖颗粒,3-40重量份镁砂颗粒,6-12重量份石墨,5-15重量份镁砂粉,3-15重量份微粉添加剂,2.2-3.5重量份有机结合剂组成。该镁碳砖中添加微粉添加剂(高温沥青粉、氧化铝微粉、金属铝粉、金属硅粉、金属镁粉、氮化硼粉、碳化硅粉中的任意一种或一种以上)以提高镁碳砖在高温下的抗氧化能力,其存在以下不足:(1)金属微粉(如金属铝粉、金属硅粉等)易发生氧化,已氧化的金属与镁砂和石墨中的杂质易发生不利的反应,氧化时会起熔剂的作用,众所周知,在烧成镁砖中,氧化铝与高钙硅比的硅酸盐矿物能发生反应形成液相,会对耐火度产生明显的影响,在钢水、熔渣和气体的侵蚀作用下,很容易导致制品使用寿命降低;另外该镁碳砖在生产过程中,添加的金属微粉会造成镁碳砖热膨胀过高,从而产生很高的应力,导致镁碳砖极易开裂;而非金属微粉(如氮化硼粉、碳化硅粉等)的加入又会影响镁碳砖的抗渣性;(2)在镁碳砖的制备过程中,易产生层裂、韧性差。
发明内容
本发明是为了解决现有技术的镁碳砖所存在的上述技术问题,提供了一种配方合理科学,能有效避免砖体层裂,提高使用寿命,砖体质量和性能佳的抗裂镁碳砖。
本发明还提供了一种抗裂镁碳砖制备方法,工艺步骤简单,可操作性强,成本低,适合工业化生产。
为了实现上述目的,本发明采用以下技术方案:
本发明的一种抗裂镁碳砖,所述抗裂镁碳砖由以下重量份的组分制成:75~80份镁砂,7~10份玄武岩颗粒,5~10份五水硫酸铜,0.3~0.5份六亚甲基四胺,15~18份石墨,3~5份陶瓷颗粒Al4SiC4,3~5份结合剂。本发明针对现有镁碳砖配方所存在的缺陷,对其进行了重新优化改进,尤其是添加了玄武岩颗粒、五水硫酸铜及陶瓷颗粒Al4SiC4,其中玄武岩颗粒能使砖体上形成的裂纹发生偏移和分岔,抑制长裂纹产生并改变方向,同时阻止砖体内裂纹的扩散,从能有效提高镁碳砖的抗热震性,五水硫酸铜中的结合水在高温条件下失去后,体积减小,使得硫酸铜周围产生微小空间,该空间可有效抵消镁碳砖的热膨胀,降低内应力,从而有效避免镁碳砖开裂,陶瓷颗粒Al4SiC4相对于常规添加剂(如金属铝粉、金属硅粉等),其能还原被氧化的碳,同时将自身的碳作为游离碳加入到镁碳砖中补充碳源,另外Al4SiC4分解生成的Al2O3、SiC与MgO反应最终生成镁铝尖晶石和镁橄榄石在砖体表面形成保护层以防止进一步氧化,能大大降低碳损失量,提高镁碳砖的抗渣性,能提高其使用寿命。
作为优选,所述镁砂由以下重量份的不同粒径镁砂混合而成:20~25份3~5mm的镁砂,25~30份1~2mm的镁砂,10~15份0.3~0.5mm的镁砂,5~8份0.05~0.08mm的镁砂。镁砂的粒度分布非常关键,小粒径的颗粒的比表面积较大,在加入时会带人更多的空气,使层裂的产生几率增加;而作为骨架材料的大粒径颗粒较少同样也会造成层裂,因此本发明通过严格控制镁砂颗粒的粒度范围和加入量,从而保证压制出密实的产品,有效防止层裂的产生。
作为优选,所述玄武岩颗粒的粒径为20~25mm。玄武岩颗粒的粒径过大,反而会增加砖体的裂纹,粒径过小,则效果不显著,因此本发明中限定玄武岩颗粒的粒径为20~25mm。
作为优选,所述陶瓷颗粒Al4SiC4通过以下方法制得:将铝粉、硅粉、碳粉按摩尔比4:1:4混合后,在氮气保护下加酒精于球磨机中球磨至少24h,在真空热压烧结炉中于1600~1800℃下烧结2~3h,冷却后研磨,即得陶瓷颗粒Al4SiC4。
作为优选,所述陶瓷颗粒Al4SiC4的粒径为5~10μm。
作为优选,所述结合剂为改性酚醛树脂,所述改性酚醛树脂通过以下方法制得:
(a)将萘磺酸盐甲醛缩聚物溶于乙醇中形成质量百分比浓度为0.5~1%的混合溶液。
(b)在混合溶液中加入为混合溶液质量1~1.5%的纳米二氧化硅,超声分散,得分散液,待用。二氧化硅分散后极易团聚,其分散性一直是本领域的技术难点,本发明中的萘磺酸钠甲醛缩合物可吸附在纳米二氧化硅界面上,使纳米二氧化硅界面带电,并产生ζ电位,分散的纳米二氧化硅相互靠近时,由于双电层的静电排斥而分离,从而维持其分散稳定性,使其不易团聚,本发明通过超声和萘磺酸钠甲醛缩合物有效解决了纳米二氧化硅不易分散的问题。
(c)按n(苯酚):n(甲醛)=1:1.25~1.32,将苯酚溶于甲醛溶液中,得预混液。
(d)按v(分散液):v(预混液)=1:5~6,边搅拌边在预混液中加入分散液,再按n(苯酚):n(氢氧化钠)=1:1.25~1.32,边搅拌边滴加入氢氧化钠溶液,得反应液。
(d)将反应液用油浴进行加热,加热搅拌至50℃后,控制升温速率为0.5~0.6℃/min,至温度为90~95℃后,恒温反应2~3h,加酸中和至pH为6.5~7.0,真空脱水后加入产物0.5~1倍体积的乙二醇,得改性酚醛树脂。目前在镁碳砖中仍广泛采用酚醛树脂作为粘合剂,但其热分解温度和抗氧化能力较差,因此已经不能满足新型耐火材料的使用,本发明中以二氧化硅对酚醛树脂进行了改性,使无机纳米二氧化硅与酚醛树脂的表面性能相匹配,提高二者的相容性、湿润性和粘结性,并有效改善了酚醛树脂的热分解温度和抗氧化能力(热分解温度可提高大约190℃,碳氧化温度可提高大约1200℃),还能提高镁碳砖的强度,拓宽了其应用领域。
一种抗裂镁碳砖制备方法,具体步骤为:按配比将各原料混合后加入混砂机中进行混炼,混炼后加入钢模中压制成型得砖坯,最后对砖坯干燥后即得抗裂镁碳砖。
作为优选,混炼时间为40~50min,成型压力为100~120Mpa,干燥温度为200~250℃,干燥时间为22~24h。
因此,本发明具有如下有益效果:
(1)本发明针对现有镁碳砖配方所存在的缺陷,对其进行了重新优化改进,尤其是添加了玄武岩颗粒、五水硫酸铜及陶瓷颗粒Al4SiC4,并对镁砂的粒度分布进行了调整,能有效避免砖体层裂,大大降低碳损失量,提高镁碳砖的抗渣性和抗氧化性能,提高了使用寿命,砖体质量和性能佳;
(2)提供了一种抗裂镁碳砖制备方法,工艺步骤简单,可操作性强,对设备无特殊要求,制备成本低,适合工业化生产。
具体实施方式
下面通过具体实施方式对本发明做进一步的描述。
在本发明中,若非特指,所有设备和原料均可从市场购得或是本行业常用的,下述实施例中的方法,如无特别说明,均为本领域常规方法。
实施例1
(1)制备陶瓷颗粒Al4SiC4
将铝粉、硅粉、碳粉按摩尔比4:1:4混合后,在氮气保护下加酒精于球磨机中球磨至少24h,在真空热压烧结炉中于1600℃下烧结3h,冷却后研磨,得粒径为5μm的陶瓷颗粒Al4SiC4,待用;
(2)制备改性酚醛树脂
(a)将萘磺酸盐甲醛缩聚物溶于乙醇中形成质量百分比浓度为0.5%的混合溶液;
(b)在混合溶液中加入为混合溶液质量1%的纳米二氧化硅,超声分散,得分散液,待用;
(c)按n(苯酚):n(甲醛)=1:1.25,将苯酚溶于甲醛溶液中,得预混液;
(d)按v(分散液):v(预混液)=1:5,边搅拌边在预混液中加入分散液,再按n(苯酚):n(氢氧化钠)=1:1.25,边搅拌边滴加入氢氧化钠溶液,得反应液;
(e)将反应液用油浴进行加热,加热搅拌至50℃后,控制升温速率为0.5℃/min,至温度为90℃后,恒温反应3h,加酸中和至pH为6.5,真空脱水后加入产物0.5倍体积的乙二醇,得改性酚醛树脂,待用;
(3)制备抗裂镁碳砖
按75kg镁砂,7kg粒径为20mm的玄武岩颗粒,5kg五水硫酸铜,0.3kg六亚甲基四胺,15kg石墨,3kg陶瓷颗粒Al4SiC4,3kg结合剂(改性酚醛树脂)的重量配比将各原料混合后加入混砂机中进行混炼,混炼后加入钢模中压制成型得砖坯,最后对砖坯干燥后即得抗裂镁碳砖,其中镁砂由以下重量配比的不同粒径镁砂混合而成:20kg3mm的镁砂,25kg1mm的镁砂,10kg0.3mm的镁砂,5kg0.05mm的镁砂,混炼时间为40min,成型压力为100Mpa,干燥温度为200℃,干燥时间为24h。
实施例2
(1)制备陶瓷颗粒Al4SiC4
将铝粉、硅粉、碳粉按摩尔比4:1:4混合后,在氮气保护下加酒精于球磨机中球磨至少24h,在真空热压烧结炉中于1800℃下烧结2h,冷却后研磨,得粒径为10μm的陶瓷颗粒Al4SiC4,待用;
(2)制备改性酚醛树脂
(a)将萘磺酸盐甲醛缩聚物溶于乙醇中形成质量百分比浓度为1%的混合溶液;
(b)在混合溶液中加入为混合溶液质量1.5%的纳米二氧化硅,超声分散,得分散液,待用;
(c)按n(苯酚):n(甲醛)=1:1.32,将苯酚溶于甲醛溶液中,得预混液;
(d)按v(分散液):v(预混液)=1:6,边搅拌边在预混液中加入分散液,再按n(苯酚):n(氢氧化钠)=1:1.32,边搅拌边滴加入氢氧化钠溶液,得反应液;
(e)将反应液用油浴进行加热,加热搅拌至50℃后,控制升温速率为0.6℃/min,至温度为95℃后,恒温反应2h,加酸中和至pH为7.0,真空脱水后加入产物1倍体积的乙二醇,得改性酚醛树脂,待用;
(3)制备抗裂镁碳砖
按80kg镁砂,7kg粒径为25mm的玄武岩颗粒,5kg五水硫酸铜,0.5kg六亚甲基四胺,18kg石墨,5kg陶瓷颗粒Al4SiC4,5kg结合剂(改性酚醛树脂)的重量配比将各原料混合后加入混砂机中进行混炼,混炼后加入钢模中压制成型得砖坯,最后对砖坯干燥后即得抗裂镁碳砖,其中镁砂由以下重量配比的不同粒径镁砂混合而成:25kg5mm的镁砂,30kg2mm的镁砂,15kg0.5mm的镁砂,8kg0.08mm的镁砂,混炼时间为50min,成型压力为120Mpa,干燥温度为250℃,干燥时间为22h。
实施例3
(1)制备陶瓷颗粒Al4SiC4
将铝粉、硅粉、碳粉按摩尔比4:1:4混合后,在氮气保护下加酒精于球磨机中球磨至少24h,在真空热压烧结炉中于1700℃下烧结2.5h,冷却后研磨,得粒径为8μm的陶瓷颗粒Al4SiC4,待用;
(2)制备改性酚醛树脂
(a)将萘磺酸盐甲醛缩聚物溶于乙醇中形成质量百分比浓度为0.7%的混合溶液;
(b)在混合溶液中加入为混合溶液质量1.2%的纳米二氧化硅,超声分散,得分散液,待用;
(c)按n(苯酚):n(甲醛)=1:1.28,将苯酚溶于甲醛溶液中,得预混液;
(d)按v(分散液):v(预混液)=1:5.5,边搅拌边在预混液中加入分散液,再按n(苯酚):n(氢氧化钠)=1:1.26,边搅拌边滴加入氢氧化钠溶液,得反应液;
(e)将反应液用油浴进行加热,加热搅拌至50℃后,控制升温速率为0.55℃/min,至温度为92℃后,恒温反应2.5h,加酸中和至pH为6.8,真空脱水后加入产物0.7倍体积的乙二醇,得改性酚醛树脂,待用;
(3)制备抗裂镁碳砖
按78kg镁砂,8kg粒径为22mm的玄武岩颗粒,7kg五水硫酸铜,0.4kg六亚甲基四胺,17kg石墨,4kg陶瓷颗粒Al4SiC4,4kg结合剂(改性酚醛树脂)的重量份配比将各原料混合后加入混砂机中进行混炼,混炼后加入钢模中压制成型得砖坯,最后对砖坯干燥后即得抗裂镁碳砖,其中镁砂由以下不同重量份的不同粒径镁砂混合而成:22kg4mm的镁砂,28kg1.5mm的镁砂,12kg0.4mm的镁砂,6kg0.07mm的镁砂,混炼时间为45min,成型压力为110Mpa,干燥温度为230℃,干燥时间为22.5h。
本发明的抗裂镁碳砖性能指标如下:
气孔率(%):2.1;
体积密度(g/cm3):3.02;
脱碳层(mm):1.32;
耐压强度(Mpa):46;
高温抗折强度(Mpa,1400℃×1h埋碳):20.2。
以上所述的实施例只是本发明的一种较佳的方案,并非对本发明作任何形式上的限制,在不超出权利要求所记载的技术方案的前提下还有其它的变体及改型。
Claims (8)
1.一种抗裂镁碳砖,其特征在于,所述抗裂镁碳砖由以下重量份的组分制成:75~80份镁砂,7~10份玄武岩颗粒,5~10份五水硫酸铜,0.3~0.5份六亚甲基四胺,15~18份石墨,3~5份陶瓷颗粒Al4SiC4,3~5份结合剂。
2.根据权利要求1所述的一种抗裂镁碳砖,其特征在于,所述镁砂由以下重量份的不同粒径镁砂混合而成:20~25份3~5mm的镁砂,25~30份1~2mm的镁砂,10~15份0.3~0.5mm的镁砂,5~8份0.05~0.08mm的镁砂。
3.根据权利要求1所述的一种抗裂镁碳砖,其特征在于,所述玄武岩颗粒的粒径为20~25mm。
4.根据权利要求1所述的一种抗裂镁碳砖,其特征在于,所述陶瓷颗粒Al4SiC4通过以下方法制得:将铝粉、硅粉、碳粉按摩尔比4:1:4混合后,在氮气保护下加酒精于球磨机中球磨至少24h,在真空热压烧结炉中于1600~1800℃下烧结2~3h,冷却后研磨,即得陶瓷颗粒Al4SiC4。
5.根据权利要求4所述的一种抗裂镁碳砖,其特征在于,所述陶瓷颗粒Al4SiC4的粒径为5~10μm。
6.根据权利要求1所述的一种抗裂镁碳砖,其特征在于,所述结合剂为改性酚醛树脂,所述改性酚醛树脂通过以下方法制得:
(a)将萘磺酸盐甲醛缩聚物溶于乙醇中形成质量百分比浓度为0.5~1%的混合溶液;
(b)在混合溶液中加入为混合溶液质量1~1.5%的纳米二氧化硅,超声分散,得分散液,待用;
(c)按n(苯酚):n(甲醛)=1:1.25~1.32,将苯酚溶于甲醛溶液中,得预混液;
(d)按v(分散液):v(预混液)=1:5~6,边搅拌边在预混液中加入分散液,再按n(苯酚):n(氢氧化钠)=1:1.25~1.32,边搅拌边滴加入氢氧化钠溶液,得反应液;
(e)将反应液用油浴进行加热,加热搅拌至50℃后,控制升温速率为0.5~0.6℃/min,至温度为90~95℃后,恒温反应2~3h,加酸中和至pH为6.5~7.0,真空脱水后加入产物0.5~1倍体积的乙二醇,得改性酚醛树脂。
7.一种如权利要求1所述的抗裂镁碳砖制备方法,其特征在于,具体步骤为:按配比将各原料混合后加入混砂机中进行混炼,混炼后加入钢模中压制成型得砖坯,最后对砖坯干燥后即得抗裂镁碳砖。
8.根据权利要求7所述的抗裂镁碳砖制备方法,其特征在于,混炼时间为40~50min,成型压力为100~120Mpa,干燥温度为200~250℃,干燥时间为22~24h。
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