CN106119914B - A kind of cobalt manganese alloy electroplate liquid and its application - Google Patents
A kind of cobalt manganese alloy electroplate liquid and its application Download PDFInfo
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- CN106119914B CN106119914B CN201610669764.9A CN201610669764A CN106119914B CN 106119914 B CN106119914 B CN 106119914B CN 201610669764 A CN201610669764 A CN 201610669764A CN 106119914 B CN106119914 B CN 106119914B
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/562—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of iron or nickel or cobalt
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
- C23G1/14—Cleaning or pickling metallic material with solutions or molten salts with alkaline solutions
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
Abstract
The present invention provides a kind of cobalt manganese alloy electroplate liquids, include each component of following concentration：Cobalt ions source 0.01mol/L~0.05mol/L, manganese ion source 0.35mol/L~0.7mol/L, chelating agent 20g/L~40g/L, conductive salt 30g/L~50g/L, stabilizer 250g/L~450g/L, surplus is solvent.The present invention also provides a kind of methods that cobalt manganese alloy coating is prepared using the electroplate liquid, include the following steps：First, oil removing and activation；2nd, it is electroplated.Inventive formulation is reasonable, and technological operation is simple, environmental-friendly, and obtained cobalt manganese alloy coating is uniformly, bright, ingredient is controllable.
Description
Technical field
The invention belongs to electrochemical technology fields, and in particular to a kind of cobalt manganese alloy electroplate liquid and its application.
Background technology
Plating is a kind of conventional method of prepares coating, strictly can control coating by conditions such as control parameters
Can, and manufacturing cost is cheap, adapts to complicated substrate shape, is widely used.Recently, plating Mn or Mn alloys are closed by people
Note.Wherein, Co-Mn alloys can be applied by being heat-treated conversion processing for cobalt-manganese spinel available for soild oxide metal connector
Layer can improve the electric conductivity and high temperature resistance of connector, prevent " Cr poisons " from occurring.But system is electroplated in cobalt manganese alloy
In, Co2+The normal potential of/Co is -0.277VH, Mn2+The normal potential of/Mn is -1.18VH, the two normal potential differs greatly,
And manganese be can from aqueous solution the most negative metal of electrodepositable metal Plays current potential, so plating cobalt manganese alloy difficulty is very
Greatly.Cobalt manganese alloy is electroplated in Agladaz et al. sulfate electroplate liquids, but the manganese content of cobalt manganese alloy coating is only 2%.Cobalt
There was only MnCo in galaxite2O4Or Mn1.5Co1.5O4Coefficient of thermal expansion and conductivity meet connector coating needs, so cobalt
Manganese content in manganese coating cannot be below 20%, otherwise be difficult to obtain the cobalt-manganese spinel coating for meeting performance requirement, therefore need
Adding the suitable complexing agent cobalt manganese alloy sedimentation potential that furthers increases in cobalt manganese alloy coating manganese content.Wu etc. is just with glucose
Cobalt manganese alloy is prepared for complexing agent, using direct current electrode position and pulse plating method, as a result shows and is obtained using direct current electrode position method
The coating obtained is porous and thin, and the coating surface that pulse plating obtains is there are crackle, so needing to invent a kind of new cobalt manganese alloy
Electroplate liquid.
Invention content
The technical problems to be solved by the invention are in view of the above shortcomings of the prior art, it is steady to provide a kind of chemical property
The cobalt manganese alloy electroplate liquid of fixed, non-volatile pernicious gas, drug environmental sound used.The electroplate liquid preparing process is simple, into
This is cheap, and manganese content is up to more than 20wt%.
In order to solve the above technical problems, the technical solution adopted by the present invention is：A kind of cobalt manganese alloy electroplate liquid, feature exist
In including each component of following concentration：
Cobalt ions source 0.01mol/L~0.05mol/L；
Manganese ion source 0.35mol/L~0.7mol/L；
Chelating agent 20g/L~40g/L；
Conductive salt 30g/L~50g/L；
Stabilizer 250g/L~450g/L；
Surplus is solvent.
Above-mentioned a kind of cobalt manganese alloy electroplate liquid, which is characterized in that include each component of following concentration：
Cobalt ions source 0.01mol/L；
Manganese ion source 0.59mol/L；
Chelating agent 30g/L；
Conductive salt 36g/L；
Stabilizer 400g/L；
Surplus is solvent.
Above-mentioned a kind of cobalt manganese alloy electroplate liquid, which is characterized in that the cobalt ions source is cobalt chloride.
Above-mentioned a kind of cobalt manganese alloy electroplate liquid, which is characterized in that the manganese ion source is protochloride manganese.
Above-mentioned a kind of cobalt manganese alloy electroplate liquid, which is characterized in that the chelating agent is ammonium chloride.
Above-mentioned a kind of cobalt manganese alloy electroplate liquid, which is characterized in that the conductive salt is sodium chloride or potassium chloride.
Above-mentioned a kind of cobalt manganese alloy electroplate liquid, which is characterized in that the stabilizer is n,N-Dimethylformamide.
Above-mentioned a kind of cobalt manganese alloy electroplate liquid, which is characterized in that the solvent is deionized water.
Above-mentioned a kind of cobalt manganese alloy electroplate liquid, which is characterized in that the pH value of the electroplate liquid is 1~4.
The present invention also provides a kind of method for preparing cobalt manganese alloy coating using above-mentioned cobalt manganese alloy electroplate liquid, features
It is, this method includes the following steps：
Step 1: treatment before plating, including oil removal treatment and activation process, detailed process is：
Step 101, oil removal treatment：Alkaline degreaser is heated to 80 DEG C~90 DEG C, then plating metal part is placed in and is added
30min is impregnated in alkaline degreaser after heat, cleans up and dries after taking-up；The alkaline degreaser includes following concentration
Each component：Tertiary sodium phosphate 30g/L~45g/L, sodium carbonate 35g/L~50g/L, sodium hydroxide 50g/L~60g/L, sodium metasilicate 4g/
L~6g/L, surplus are deionized water；
Step 102, activation process：It is 15 DEG C~60 that plating metal part after oil removal treatment in step 101 is placed in temperature
DEG C activation process liquid in impregnate 60s, cleaned up after taking-up；The activation process is not less than 98% by mass percent concentration
The concentrated sulfuric acid and deionized water by volume (0.015~0.04): 1 is uniformly mixed；
Step 2: electroplating processes：Plating metal part after activation process in step 102 is placed in and is loaded with cobalt manganese alloy electricity
In the coating bath of plating solution, using plating metal part as cathode, using graphite cake as anode, in cobalt manganese alloy temperature of electroplating solution 20 DEG C~25
DEG C, current density is 20mA cm-2~200mA cm-2Under conditions of be electroplated 5min~10min, later by the metalwork after plating
It takes out, is dried up after being cleaned up with deionized water, cobalt manganese alloy coating is obtained on metalwork surface.
Compared with the prior art, the present invention has the following advantages：
1st, inventive formulation is reasonable, with NH4Cl is chelating agent, and can further cobalt manganese deposition current potential, realizes that cobalt manganese is co-deposited.
DMF can effectively prevent the Co in solution2+And Mn2+Be converted to the oxide Co of high price2O3And Mn2O3, and can effectively prevent anode chlorine
The generation of gas.Simple, environmental-friendly using the cobalt plating manganese alloy technological operation of the electroplating liquid composition, obtained coating is bright,
Ingredient is controllable.
2nd, cobalt manganese alloy electroplate liquid electroplate liquid preparing process of the present invention is simple, of low cost, manganese content be up to 20wt% with
On；Chemistry is electroplated to stablize, non-volatile pernicious gas, drug environmental sound used.
3rd, after cobalt manganese alloy electroplate liquid of the present invention is oxidation-treated, cobalt-manganese spinel coating can be obtained, and obtained
Cobalt-manganese spinel coating and the adhesion property of metalwork matrix are excellent.
4th, present invention process is simple, condition is controllable, coating even compact, good with metalwork matrix adhesiveness, suitable for heavy
Product is on soild oxide metal connector surface, via can be changed into cobalt-manganese spinel coating after oxidation processes.
The present invention is described in further detail with reference to the accompanying drawings and examples.
Description of the drawings
Fig. 1 is the surface SEM photograph of cobalt manganese alloy coating prepared using 6 cobalt manganese alloy electroplate liquid of the embodiment of the present invention.
Specific embodiment
Embodiment 1
The present embodiment cobalt manganese alloy electroplate liquid includes each component of following concentration：
Cobalt ions source 0.01mol/L；The cobalt ions source is cobalt chloride；
Manganese ion source 0.59mol/L；The manganese ion source is protochloride manganese；
Chelating agent 30g/L；The chelating agent is ammonium chloride；
Conductive salt 36g/L；The conductive salt is potassium chloride；
Stabilizer 400g/L；The stabilizer is N,N-dimethylformamide；
Surplus is solvent；The solvent is deionized water；
The pH value of the electroplate liquid is 2.5.
The preparation method of electroplate liquid described in the present embodiment is：
Step 1: taking portions of de-ionized water, chelating agent addition is removed in ionized water, after mixing makes dissolving complete, side
Cobalt ions source is added on stirring side into the solution dissolved with chelating agent, is stirred evenly, is obtained solution A；
Step 2: taking portions of de-ionized water again, manganese ion source is dissolved in removed ionized water, then sequentially adds conduction
Salt and stabilizer obtain solution B after stirring evenly；
Step 3: after solution A is stirred 1h, it is uniformly mixed with solution B, stirs 2h, is adjusted pH value with dilute hydrochloric acid, finally add
Remaining deionized water constant volume obtains cobalt manganese electroplate liquid.
The present embodiment is included the following steps using the method that above-mentioned cobalt manganese alloy electroplate liquid prepares cobalt manganese alloy coating：
Step 1: treatment before plating, including oil removal treatment and activation process, detailed process is：
Step 101, oil removal treatment：Alkaline degreaser is heated to 85 DEG C, after plating metal part then is placed in heating
30min is impregnated in alkaline degreaser, cleans up and dries after taking-up；The alkaline degreaser includes each group of following concentration
Point：Tertiary sodium phosphate 35g/L, sodium carbonate 35g/L, sodium hydroxide 55g/L, sodium metasilicate 5g/L, surplus are deionized water；
Step 102, activation process：Plating metal part after oil removal treatment in step 101 is placed in the work that temperature is 50 DEG C
Change in treatment fluid and impregnate 60s, cleaned up after taking-up；The activation process is not less than 98% dense sulphur by mass percent concentration
Acid is uniformly mixed at 0.03: 1 by volume with deionized water；
Step 2: electroplating processes：Plating metal part after activation process in step 102 is placed in and is loaded with cobalt manganese alloy electricity
In the coating bath of plating solution, using plating metal part as cathode, using graphite cake as anode, in 22 DEG C of cobalt manganese alloy temperature of electroplating solution, electric current
Density is 100mA cm-2Under conditions of 8min is electroplated, later by after plating metalwork take out, after being cleaned up with deionized water
Drying, finally obtains cobalt manganese alloy coating on metalwork surface.The plated layer compact, is well combined with matrix, wherein atomic percent
Than [Co]/[Mn]=1.23.
Embodiment 2
The present embodiment cobalt manganese alloy electroplate liquid includes each component of following concentration：
Cobalt ions source 0.03mol/L；The cobalt ions source is cobalt chloride；
Manganese ion source 0.45mol/L；The manganese ion source is protochloride manganese；
Chelating agent 26g/L；The chelating agent is ammonium chloride；
Conductive salt 38g/L；The conductive salt is sodium chloride；
Stabilizer 290g/L；The stabilizer is N,N-dimethylformamide；
Surplus is solvent；The solvent is deionized water；
The pH value of the electroplate liquid is 3.
The preparation method of electroplate liquid described in the present embodiment is：
Step 1: taking portions of de-ionized water, chelating agent addition is removed in ionized water, after mixing makes dissolving complete, side
Cobalt ions source is added on stirring side into the solution dissolved with chelating agent, is stirred evenly, is obtained solution A；
Step 2: taking portions of de-ionized water again, manganese ion source is dissolved in removed ionized water, then sequentially adds conduction
Salt and stabilizer obtain solution B after stirring evenly；
Step 3: after solution A is stirred 1h, it is uniformly mixed with solution B, stirs 2h, is adjusted pH value with dilute hydrochloric acid, finally add
Remaining deionized water constant volume obtains cobalt manganese electroplate liquid.
The present embodiment is included the following steps using the method that above-mentioned cobalt manganese alloy electroplate liquid prepares cobalt manganese alloy coating：
Step 1: treatment before plating, including oil removal treatment and activation process, detailed process is：
Step 101, oil removal treatment：Alkaline degreaser is heated to 88 DEG C, after plating metal part then is placed in heating
30min is impregnated in alkaline degreaser, cleans up and dries after taking-up；The alkaline degreaser includes each group of following concentration
Point：Tertiary sodium phosphate 35g/L, sodium carbonate 45g/L, sodium hydroxide 55g/L, sodium metasilicate 5g/L, surplus are deionized water；
Step 102, activation process：Plating metal part after oil removal treatment in step 101 is placed in the work that temperature is 50 DEG C
Change in treatment fluid and impregnate 60s, cleaned up after taking-up；The activation process is not less than 98% dense sulphur by mass percent concentration
Acid is uniformly mixed at 0.02: 1 by volume with deionized water；
Step 2: electroplating processes：Plating metal part after activation process in step 102 is placed in and is loaded with cobalt manganese alloy electricity
In the coating bath of plating solution, using plating metal part as cathode, using graphite cake as anode, in 25 DEG C of cobalt manganese alloy temperature of electroplating solution, electric current
Density is 25mA cm-2Under conditions of 8min is electroplated, later by after plating metalwork take out, after being cleaned up with deionized water
Drying, finally obtains cobalt manganese alloy coating on metalwork surface.The coating is uniform, and atomic percentage [Co]/[Mn]=
4.73。
Embodiment 3
The present embodiment cobalt manganese alloy electroplate liquid includes each component of following concentration：
Cobalt ions source 0.03mol/L；The cobalt ions source is cobalt chloride；
Manganese ion source 0.5mol/L；The manganese ion source is protochloride manganese；
Chelating agent 28g/L；The chelating agent is ammonium chloride；
Conductive salt 40g/L；The conductive salt is potassium chloride；
Stabilizer 300g/L；The stabilizer is N,N-dimethylformamide；
Surplus is solvent；The solvent is deionized water；
The pH value of the electroplate liquid is 4.
Step 1: taking portions of de-ionized water, chelating agent addition is removed in ionized water, after mixing makes dissolving complete, side
Cobalt ions source is added on stirring side into the solution dissolved with chelating agent, is stirred evenly, is obtained solution A；
Step 2: taking portions of de-ionized water again, manganese ion source is dissolved in removed ionized water, then sequentially adds conduction
Salt and stabilizer obtain solution B after stirring evenly；
Step 3: after solution A is stirred 1h, it is uniformly mixed with solution B, stirs 2h, is adjusted pH value with dilute hydrochloric acid, finally add
Remaining deionized water constant volume obtains cobalt manganese electroplate liquid.
The present embodiment is included the following steps using the method that above-mentioned cobalt manganese alloy electroplate liquid prepares cobalt manganese alloy coating：
Step 1: treatment before plating, including oil removal treatment and activation process, detailed process is：
Step 101, oil removal treatment：Alkaline degreaser is heated to 80 DEG C, after plating metal part then is placed in heating
30min is impregnated in alkaline degreaser, cleans up and dries after taking-up；The alkaline degreaser includes each group of following concentration
Point：Tertiary sodium phosphate 45g/L, sodium carbonate 35g/L, sodium hydroxide 60g/L, sodium metasilicate 4g/L, surplus are deionized water；
Step 102, activation process：Plating metal part after oil removal treatment in step 101 is placed in the work that temperature is 60 DEG C
Change in treatment fluid and impregnate 60s, cleaned up after taking-up；The activation process is not less than 98% dense sulphur by mass percent concentration
Acid is uniformly mixed at 0.015: 1 by volume with deionized water；
Step 2: electroplating processes：Plating metal part after activation process in step 102 is placed in and is loaded with cobalt manganese alloy electricity
In the coating bath of plating solution, using plating metal part as cathode, using graphite cake as anode, in 25 DEG C of cobalt manganese alloy temperature of electroplating solution, electric current
Density is 20mA cm-2Under conditions of 5min is electroplated, later by after plating metalwork take out, after being cleaned up with deionized water
Drying, finally obtains cobalt manganese alloy coating on metalwork surface.The coating even compact, atomic percentage [Co]/[Mn]
=4.05.
Embodiment 4
The present embodiment cobalt manganese alloy electroplate liquid includes each component of following concentration：
Cobalt ions source 0.05mol/L；The cobalt ions source is cobalt chloride；
Manganese ion source 0.7mol/L；The manganese ion source is protochloride manganese；
Chelating agent 30g/L；The chelating agent is ammonium chloride；
Conductive salt 50g/L；The conductive salt is sodium chloride；
Stabilizer 400g/L；The stabilizer is N,N-dimethylformamide；
Surplus is solvent；The solvent is deionized water；
The pH value of the electroplate liquid is 1.
Step 1: taking portions of de-ionized water, chelating agent addition is removed in ionized water, after mixing makes dissolving complete, side
Cobalt ions source is added on stirring side into the solution dissolved with chelating agent, is stirred evenly, is obtained solution A；
Step 2: taking portions of de-ionized water again, manganese ion source is dissolved in removed ionized water, then sequentially adds conduction
Salt and stabilizer obtain solution B after stirring evenly；
Step 3: after solution A is stirred 1h, it is uniformly mixed with solution B, stirs 2h, is adjusted pH value with dilute hydrochloric acid, finally add
Remaining deionized water constant volume obtains cobalt manganese electroplate liquid.
The present embodiment is included the following steps using the method that above-mentioned cobalt manganese alloy electroplate liquid prepares cobalt manganese alloy coating：
Step 1: treatment before plating, including oil removal treatment and activation process, detailed process is：
Step 101, oil removal treatment：Alkaline degreaser is heated to 90 DEG C, after plating metal part then is placed in heating
30min is impregnated in alkaline degreaser, cleans up and dries after taking-up；The alkaline degreaser includes each group of following concentration
Point：Tertiary sodium phosphate 30g/L, sodium carbonate 50g/L, sodium hydroxide 50g/L, sodium metasilicate 6g/L, surplus are deionized water；
Step 102, activation process：Plating metal part after oil removal treatment in step 101 is placed in the work that temperature is 15 DEG C
Change in treatment fluid and impregnate 60s, cleaned up after taking-up；The activation process is not less than 98% dense sulphur by mass percent concentration
Acid is uniformly mixed at 0.04: 1 by volume with deionized water；
Step 2: electroplating processes：Plating metal part after activation process in step 102 is placed in and is loaded with cobalt manganese alloy electricity
In the coating bath of plating solution, using plating metal part as cathode, using graphite cake as anode, in 20 DEG C of cobalt manganese alloy temperature of electroplating solution, electric current
Density is 200mA cm-2Under conditions of 5min is electroplated, later by after plating metalwork take out, after being cleaned up with deionized water
Drying, finally obtains cobalt manganese alloy coating on metalwork surface.The coating even compact, wherein atom strong with basal body binding force
Percentage [Co]/[Mn]=2.75.
In addition, applicant of the present invention, in order to determine the optimum proportioning of cobalt manganese alloy electroplate liquid, spy has carried out a large amount of reality
Verification carries out dosage optimization to the basic components of exploitation, adjusts main salt concentration, pH value etc. in formula successively, specific as follows：Examination
It tests the middle 430 stainless steel substrates identical using size to be electroplated, electroplating temperature is 25 DEG C, chelating agent, conductive salt and stabilization
The additive amount of agent is constant, respectively 30g/L, 36g/L and 400g/L.Pretreatment mode is the same as embodiment 1.Bath components, pH value
Selection with current density is as shown in table 1 to Coating composition ([Co]/[Mn] atomic ratios) and the influence test result of appearance.
Influence of the selection of 1 bath components of table, pH value and current density to coating
As shown in Table 1, comparative example 5,6,7 and 8, it is known that a concentration of embodiment of optimization of the higher cobalt manganese coating of manganese content
6.Fig. 1 is the surface SEM photograph of cobalt manganese alloy coating prepared using 6 cobalt manganese alloy electroplate liquid of embodiment.By Fig. 1 it can be seen that
The coating even compact, binding force is strong, and quality is good, atomic percentage [Co]/[Mn]=1.69.The coating is aoxidized
Afterwards, uniform one layer of Mn is formed on metalwork surface1.5Co1.5O4Spinelle coating, meets design requirement, is SOFC connectors surface
The development of protective coating provides technical support.
The above is only presently preferred embodiments of the present invention, not the present invention is imposed any restrictions.It is every according to invention skill
Any simple modification, change and equivalence change that art substantially makees above example, still fall within technical solution of the present invention
Protection domain in.
Claims (8)
1. a kind of cobalt manganese alloy electroplate liquid, which is characterized in that include each component of following concentration：
Cobalt ions source 0.01mol/L~0.05mol/L；
Manganese ion source 0.35mol/L~0.7mol/L；
Chelating agent 20g/L~40g/L；The chelating agent is ammonium chloride；
Conductive salt 30g/L~50g/L；
Stabilizer 250g/L~450g/L；The stabilizer is N,N-dimethylformamide；
Surplus is solvent.
2. a kind of cobalt manganese alloy electroplate liquid according to claim 1, which is characterized in that include each component of following concentration：
Cobalt ions source 0.01mol/L；
Manganese ion source 0.59mol/L；
Chelating agent 30g/L；
Conductive salt 36g/L；
Stabilizer 400g/L；
Surplus is solvent.
3. a kind of cobalt manganese alloy electroplate liquid according to claim 1 or 2, which is characterized in that the cobalt ions source is chlorination
Sub- cobalt.
4. a kind of cobalt manganese alloy electroplate liquid according to claim 1 or 2, which is characterized in that the manganese ion source is chlorination
Sub- manganese.
5. a kind of cobalt manganese alloy electroplate liquid according to claim 1 or 2, which is characterized in that the conductive salt is sodium chloride
Or potassium chloride.
6. a kind of cobalt manganese alloy electroplate liquid according to claim 1 or 2, which is characterized in that the solvent is deionized water.
7. a kind of cobalt manganese alloy electroplate liquid according to claim 1 or 2, which is characterized in that the pH value of the electroplate liquid is 1
~4.
8. a kind of method for preparing cobalt manganese alloy coating using cobalt manganese alloy electroplate liquid as claimed in claim 1 or 2, feature exist
In this method includes the following steps：
Step 1: treatment before plating, including oil removal treatment and activation process, detailed process is：
Step 101, oil removal treatment：Alkaline degreaser is heated to 80 DEG C~90 DEG C, after plating metal part then is placed in heating
Alkaline degreaser in impregnate 30min, clean up and dry after taking-up；The alkaline degreaser includes each group of following concentration
Point：Tertiary sodium phosphate 30g/L~45g/L, sodium carbonate 35g/L~50g/L, sodium hydroxide 50g/L~60g/L, sodium metasilicate 4g/L~
6g/L, surplus are deionized water；
Step 102, activation process：It is 15 DEG C~60 DEG C that plating metal part after oil removal treatment in step 101 is placed in temperature
60s is impregnated in activation process liquid, is cleaned up after taking-up；The activation process is dense not less than 98% by mass percent concentration
Sulfuric acid and deionized water be by volume (0.015~0.04): 1 is uniformly mixed；
Step 2: electroplating processes：Plating metal part after activation process in step 102 is placed in and is loaded with cobalt manganese alloy electroplate liquid
Coating bath in, using plating metal part as cathode, using graphite cake as anode, in 20 DEG C~25 DEG C of cobalt manganese alloy temperature of electroplating solution, electricity
Current density is 20mA cm-2~200mA cm-2Under conditions of be electroplated 5min~10min, later by after plating metalwork take out,
It is dried up after being cleaned up with deionized water, cobalt manganese alloy coating is obtained on metalwork surface.
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| Co-Mn尖晶石涂层的制备;张慧慧 等;《腐蚀科学与防护技术》;20150315;第27卷(第2期);全文 * |
| DMF 中电化学制备Ce-Fe-Co 合金及磁性研究;王建朝 等;《中山大学学报( 自然科学版)》;20120915;第51卷(第5期);全文 * |
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