CN106119595A - 半导体用铜合金接合线 - Google Patents
半导体用铜合金接合线 Download PDFInfo
- Publication number
- CN106119595A CN106119595A CN201610480089.5A CN201610480089A CN106119595A CN 106119595 A CN106119595 A CN 106119595A CN 201610480089 A CN201610480089 A CN 201610480089A CN 106119595 A CN106119595 A CN 106119595A
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- Prior art keywords
- copper alloy
- copper
- semiconductor
- bonding wire
- line
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21C—MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES OR PROFILES, OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
- B21C1/00—Manufacture of metal sheets, metal wire, metal rods, metal tubes by drawing
- B21C1/003—Drawing materials of special alloys so far as the composition of the alloy requires or permits special drawing methods or sequences
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21C—MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES OR PROFILES, OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
- B21C37/00—Manufacture of metal sheets, bars, wire, tubes or like semi-manufactured products, not otherwise provided for; Manufacture of tubes of special shape
- B21C37/04—Manufacture of metal sheets, bars, wire, tubes or like semi-manufactured products, not otherwise provided for; Manufacture of tubes of special shape of bars or wire
- B21C37/047—Manufacture of metal sheets, bars, wire, tubes or like semi-manufactured products, not otherwise provided for; Manufacture of tubes of special shape of bars or wire of fine wires
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0255—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in welding
- B23K35/0261—Rods, electrodes, wires
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/302—Cu as the principal constituent
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
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- C22C9/00—Alloys based on copper
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- C—CHEMISTRY; METALLURGY
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- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
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- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Engineering & Computer Science (AREA)
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- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
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- Materials Engineering (AREA)
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- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
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- Non-Insulated Conductors (AREA)
Abstract
Description
Claims (9)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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JP2009-150206 | 2009-06-24 | ||
JP2009150206 | 2009-06-24 | ||
CN2010800247729A CN102459668A (zh) | 2009-06-24 | 2010-06-23 | 半导体用铜合金接合线 |
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CN2010800247729A Division CN102459668A (zh) | 2009-06-24 | 2010-06-23 | 半导体用铜合金接合线 |
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CN2010800247729A Pending CN102459668A (zh) | 2009-06-24 | 2010-06-23 | 半导体用铜合金接合线 |
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EP (1) | EP2447380B1 (zh) |
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KR (1) | KR101704839B1 (zh) |
CN (2) | CN106119595A (zh) |
SG (1) | SG177358A1 (zh) |
TW (1) | TWI496900B (zh) |
WO (1) | WO2010150814A1 (zh) |
Cited By (2)
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CN108122877A (zh) * | 2017-12-21 | 2018-06-05 | 汕头市骏码凯撒有限公司 | 薄金铜合金线及其制造方法 |
CN114761591A (zh) * | 2019-12-02 | 2022-07-15 | 日铁新材料股份有限公司 | 半导体装置用铜接合线及半导体装置 |
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Publication number | Priority date | Publication date | Assignee | Title |
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SG190480A1 (en) * | 2011-12-01 | 2013-06-28 | Heraeus Materials Tech Gmbh | 3n copper wire with trace additions for bonding in microelectronics device |
CN104205314B (zh) * | 2012-03-22 | 2017-02-22 | 住友电木株式会社 | 半导体装置及其制造方法 |
TWI486970B (zh) * | 2013-01-29 | 2015-06-01 | Tung Han Chuang | 銅基合金線材及其製造方法 |
EP2768019A3 (en) * | 2013-02-15 | 2014-10-29 | Heraeus Materials Singapore Pte. Ltd. | Copper bond wire and method of making the same |
SG11201508519YA (en) * | 2013-05-03 | 2015-11-27 | Heraeus Materials Singapore Pte Ltd | Copper bond wire and method of making the same |
US20150262731A1 (en) * | 2014-03-12 | 2015-09-17 | Merry Electronics (Suzhou) Co., Ltd. | Method of making copper-clad graphene conducting wire |
JP6037464B2 (ja) | 2014-05-29 | 2016-12-07 | インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Machines Corporation | 電気機器の寿命を予測する装置及び方法 |
JP2016028417A (ja) * | 2014-07-11 | 2016-02-25 | ローム株式会社 | 電子装置 |
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JP5807992B1 (ja) * | 2015-02-23 | 2015-11-10 | 田中電子工業株式会社 | ボールボンディング用パラジウム(Pd)被覆銅ワイヤ |
TWI628671B (zh) * | 2015-05-26 | 2018-07-01 | 日鐵住金新材料股份有限公司 | Bonding wire for semiconductor device |
SG11201604432SA (en) | 2015-06-15 | 2017-01-27 | Nippon Micrometal Corp | Bonding wire for semiconductor device |
CN105161476B (zh) * | 2015-06-19 | 2018-10-30 | 汕头市骏码凯撒有限公司 | 一种用于细间距ic封装的键合铜丝及其制造方法 |
EP3136435B1 (en) * | 2015-07-23 | 2022-08-31 | Nippon Micrometal Corporation | Bonding wire for semiconductor device |
JP6369994B2 (ja) * | 2015-09-02 | 2018-08-08 | 田中電子工業株式会社 | ボールボンディング用銅合金細線 |
CN105420547B (zh) * | 2015-12-17 | 2017-07-14 | 天津华北集团铜业有限公司 | 一种铜线坯及其生产方法 |
WO2017221434A1 (ja) * | 2016-06-20 | 2017-12-28 | 日鉄住金マイクロメタル株式会社 | 半導体装置用ボンディングワイヤ |
CN106222483A (zh) * | 2016-08-29 | 2016-12-14 | 芜湖楚江合金铜材有限公司 | 一种高耐磨铜线材及其加工工艺 |
CN108823463A (zh) * | 2018-06-30 | 2018-11-16 | 汕头市骏码凯撒有限公司 | 一种铜合金键合丝及其制造方法 |
JP6507329B1 (ja) * | 2019-02-08 | 2019-04-24 | 田中電子工業株式会社 | パラジウム被覆銅ボンディングワイヤ、ワイヤ接合構造、半導体装置及び半導体装置の製造方法 |
KR20210074899A (ko) | 2019-12-12 | 2021-06-22 | 엘티메탈 주식회사 | 구리 합금 본딩 와이어 및 그의 제조 방법 |
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KR102579479B1 (ko) * | 2022-09-06 | 2023-09-21 | 덕산하이메탈(주) | 접속핀 |
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- 2010-06-23 CN CN201610480089.5A patent/CN106119595A/zh active Pending
- 2010-06-23 KR KR1020117029048A patent/KR101704839B1/ko active IP Right Grant
- 2010-06-23 JP JP2011519918A patent/JP4866490B2/ja active Active
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CN108122877A (zh) * | 2017-12-21 | 2018-06-05 | 汕头市骏码凯撒有限公司 | 薄金铜合金线及其制造方法 |
CN108122877B (zh) * | 2017-12-21 | 2020-10-13 | 汕头市骏码凯撒有限公司 | 薄金铜合金线及其制造方法 |
CN114761591A (zh) * | 2019-12-02 | 2022-07-15 | 日铁新材料股份有限公司 | 半导体装置用铜接合线及半导体装置 |
CN114761591B (zh) * | 2019-12-02 | 2024-01-05 | 日铁新材料股份有限公司 | 半导体装置用铜接合线及半导体装置 |
Also Published As
Publication number | Publication date |
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WO2010150814A1 (ja) | 2010-12-29 |
TWI496900B (zh) | 2015-08-21 |
JP5246314B2 (ja) | 2013-07-24 |
US20120094121A1 (en) | 2012-04-19 |
CN102459668A (zh) | 2012-05-16 |
JP2012084878A (ja) | 2012-04-26 |
EP2447380A1 (en) | 2012-05-02 |
JPWO2010150814A1 (ja) | 2012-12-10 |
KR20120031005A (ko) | 2012-03-29 |
EP2447380B1 (en) | 2015-02-25 |
KR101704839B1 (ko) | 2017-02-08 |
JP4866490B2 (ja) | 2012-02-01 |
JP5360179B2 (ja) | 2013-12-04 |
JP2012074706A (ja) | 2012-04-12 |
US9427830B2 (en) | 2016-08-30 |
SG177358A1 (en) | 2012-02-28 |
TW201107499A (en) | 2011-03-01 |
EP2447380A4 (en) | 2012-12-05 |
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