CN106105384B - Heater and igniter - Google Patents
Heater and igniter Download PDFInfo
- Publication number
- CN106105384B CN106105384B CN201580012328.8A CN201580012328A CN106105384B CN 106105384 B CN106105384 B CN 106105384B CN 201580012328 A CN201580012328 A CN 201580012328A CN 106105384 B CN106105384 B CN 106105384B
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- heat generating
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- 239000000919 ceramic Substances 0.000 claims abstract description 75
- 239000002245 particle Substances 0.000 claims abstract description 23
- 239000000446 fuel Substances 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 7
- 235000013339 cereals Nutrition 0.000 description 22
- 206010037660 Pyrexia Diseases 0.000 description 12
- 229910052581 Si3N4 Inorganic materials 0.000 description 5
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 5
- 239000007789 gas Substances 0.000 description 4
- 230000007774 longterm Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 238000005382 thermal cycling Methods 0.000 description 3
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 3
- 229910052721 tungsten Inorganic materials 0.000 description 3
- 239000010937 tungsten Substances 0.000 description 3
- 238000009423 ventilation Methods 0.000 description 3
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- 229910052681 coesite Inorganic materials 0.000 description 2
- 229910052906 cristobalite Inorganic materials 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 238000010191 image analysis Methods 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- 150000004767 nitrides Chemical class 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910052682 stishovite Inorganic materials 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052905 tridymite Inorganic materials 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910020968 MoSi2 Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229910008814 WSi2 Inorganic materials 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000003763 carbonization Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 230000001351 cycling effect Effects 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 239000002320 enamel (paints) Substances 0.000 description 1
- VQCBHWLJZDBHOS-UHFFFAOYSA-N erbium(III) oxide Inorganic materials O=[Er]O[Er]=O VQCBHWLJZDBHOS-UHFFFAOYSA-N 0.000 description 1
- 235000013312 flour Nutrition 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- XZWYZXLIPXDOLR-UHFFFAOYSA-N metformin Chemical compound CN(C)C(=N)NC(N)=N XZWYZXLIPXDOLR-UHFFFAOYSA-N 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000003345 natural gas Substances 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 239000011224 oxide ceramic Substances 0.000 description 1
- 229910052574 oxide ceramic Inorganic materials 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 229910052761 rare earth metal Inorganic materials 0.000 description 1
- 229910052702 rhenium Inorganic materials 0.000 description 1
- WUAPFZMCVAUBPE-UHFFFAOYSA-N rhenium atom Chemical compound [Re] WUAPFZMCVAUBPE-UHFFFAOYSA-N 0.000 description 1
- 229910021332 silicide Inorganic materials 0.000 description 1
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- FIXNOXLJNSSSLJ-UHFFFAOYSA-N ytterbium(III) oxide Inorganic materials O=[Yb]O[Yb]=O FIXNOXLJNSSSLJ-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/02—Details
- H05B3/06—Heater elements structurally combined with coupling elements or holders
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/02—Details
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F23—COMBUSTION APPARATUS; COMBUSTION PROCESSES
- F23Q—IGNITION; EXTINGUISHING-DEVICES
- F23Q7/00—Incandescent ignition; Igniters using electrically-produced heat, e.g. lighters for cigarettes; Electrically-heated glowing plugs
- F23Q7/001—Glowing plugs for internal-combustion engines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
- H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/18—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor the conductor being embedded in an insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/40—Heating elements having the shape of rods or tubes
- H05B3/42—Heating elements having the shape of rods or tubes non-flexible
- H05B3/48—Heating elements having the shape of rods or tubes non-flexible heating conductor embedded in insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/027—Heaters specially adapted for glow plug igniters
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Resistance Heating (AREA)
Abstract
Heater has: the ceramic layer stack that multiple ceramic layers are laminated, it is arranged at the band-like heat generating resistor that between the ceramic layer and both ends are drawn out to the side of the ceramic layer stack, and it is layered between the ceramic layer on two ends of the heat generating resistor and one end is drawn out to the band-like conductive layer of the side respectively, the conductive layer includes the 1st conductive layer and 2nd conductive layer adjacent with the 1st conductive layer for being drawn out to the side, 1st conductive layer and the 2nd conductive layer are made of multiple particles, and the average grain diameter of the particle of the 1st conductive layer is smaller than the average grain diameter of the particle of the 2nd conductive layer.
Description
Technical field
The present invention relates to heater and igniters.
Background technique
As being used for gas burner, vehicle-mounted heating installation, petroleum fan heater or glow plug of automobile engine etc.
Heater, it is known that in the heater (ceramic heater) for being internally provided with heater of ceramic body.As ceramic heater, example
It such as illustrates ceramic heater disclosed in Patent Document 1.
Ceramic heater disclosed in Japanese Unexamined Patent Publication 2000-156275 bulletin (hereinafter referred to as patent document 1) has:
Ceramic structural body, connect with heat generating resistor and is drawn out to ceramics construction the heat generating resistor for being embedded in ceramic structural body
The supply lines on the surface of body.
Ceramic heater described in patent document 1 may produce in the case where Reusability under high temperature environment in supply lines
Raw crack.Particularly, it is resulted among supply lines in the case where the region that the surface of ceramic structural body is exposed, outside in the crack
Portion's air is possibly into the inside for arriving supply lines.Therefore, because supply lines is reacted with outside air, the resistance value of supply lines becomes
Change, may locally generate abnormal fever.As a result, being difficult to improve situation about being repeatedly used for ceramic heater under hot environment
Under long-term reliability.
Summary of the invention
Heater has: ceramic layer stack that multiple ceramic layers are laminated, be arranged between the ceramic layer and
Both ends are drawn out to the band-like heat generating resistor of the side of the ceramic layer stack and are layered in institute between the ceramic layer
It states on two ends of heat generating resistor and one end is drawn out to the band-like conductive layer of the side, conductive layer tool respectively
Have: being drawn out to the 1st conductive layer and 2nd conductive layer adjacent with the 1st conductive layer of the side, the 1st conductive layer
And the 2nd conductive layer is made of multiple particles, and the average grain diameter of the particle of the 1st conductive layer is led than the described 2nd
The average grain diameter of the particle of electric layer is small.
Detailed description of the invention
Fig. 1 is the longitudinal section view for indicating heater.
Fig. 2 is the sectional elevation for being cut off heater shown in FIG. 1 with A-A ' line.
Fig. 3 is the sectional elevation for being cut off heater shown in FIG. 1 with B-B ' line.
Fig. 4 is the sectional elevation for indicating the variation of heater.
Fig. 5 is the perspective view for indicating to have used the igniter of heater shown in FIG. 1.
Specific embodiment
Hereinafter, being illustrated referring to attached drawing to 10 attached drawing of heater.
As shown in FIG. 1 to 3, heater 10 has: ceramic layer stack 1 that multiple ceramic layers 11 are laminated is set
Heat generating resistor 2 between adjacent ceramic layer 11 and the conductive layer 3 for being laminated in heat generating resistor 2.Heater 10 for example can
It is enough in glow plug or the gas burner etc. of automobile engine.
Ceramic layer stack 1 is to be embedded with the component of heat generating resistor 2 and conductive layer 3 in inside.By in multilayered ceramic
The inside setting heat generating resistor 2 and conductive layer 3 of body 1, can be improved the durability of heat generating resistor 2 and conductive layer 3.Pottery
Enamel coating stack 1 is for example bar-like or the component of plate.
Ceramic layer stack 1 such as insulating ceramics, nitride ceramics or carbide ceramics with electrical insulating property
Ceramics are constituted.Specifically, ceramic layer stack 1 is by aluminum oxide ceramics, silicon nitride ceramics, aluminum nitride ceramics or carbonization
Siliceous ceramics etc. are constituted.
The ceramic layer stack 1 being made of silicon nitride ceramics can be obtained by the following method.Specifically, example
Such as, for the silicon nitride of principal component, the Y of 5~15 mass % is mixed2O3、Yb2O3Or Er2O3Equal rare earth elements oxide,
The Al of 0.5~5 mass %2O3And SiO2As sintering aid, the SiO2Amount be adjusted to: the SiO for including in sintered body2
Amount be 1.5~5 mass %.Also, by being fired after the shape as defined in being shaped to 1650~1780 DEG C of temperature,
It can obtain the ceramic layer stack 1 being made of silicon nitride ceramics.Such as hot pressing firing is able to use in firing.
In the case where the shape of ceramic layer stack 1 is bar-like, more specifically, in the case where being quadrangular shape, ceramics
The length of laminated body 1 is set to such as 20~100mm.In addition, the section of ceramic layer stack 1 be set to for example thickness 1~
The quadrangle of 6mm, 2~40mm of width.
Heat generating resistor 2 is the component for the stratiform generated heat and being applied voltage.Heat generating resistor 2 is arranged on adjacent
Ceramic layer 11 between.By applying voltage incoming flow overcurrent to heat generating resistor 2, heat generating resistor 2 generates heat.Pass through the fever
And the heat generated is conducted to the inside of ceramic layer stack 1, the surface of ceramic layer stack 1 becomes high temperature.Then, by from ceramics
Heat is conducted to heating object in the surface of laminated body 1, and heater 10 plays a role.As can be from the surface of ceramic layer stack 1
The heating object of heat is conducted, such as example there are light oil for the inside for being provided to diesel engine for automobile etc..
The both ends of heat generating resistor 2 are drawn out to the side of the rear end side of ceramic layer stack 1.The vertical profile of heat generating resistor 2
The shape in face (section parallel with the length direction of heat generating resistor 2) is, for example, fold-back shape.In detail, heat generating resistor 2
Include 2 adjacent straight sections and periphery and inner circumferential side by side be substantially semi-circular shape or substantially half-oval shaped and
The linking portion that 2 straight line portions are turned back and linked.Heat generating resistor 2 turns back near the front end of ceramic layer stack 1.Fever
The overall length of resistor 2 is set to such as 35~100mm.
Heat generating resistor 2 is designed in the larger fever in the front end side of ceramic layer stack 1.Specifically, in multilayered ceramic
Conductive layer 3 is laminated in the rear end side of body 1 on two ends of heat generating resistor 2.Therefore, in the rear end side of ceramic layer stack 1,
Electric current had both flowed through heat generating resistor 2 or had flowed through conductive layer 3.As a result, in the rear end side of ceramic layer stack 1, heat generating resistor 2
Fever becomes smaller.On the contrary, electric current flows only through heat generating resistor 2 in the front end side of ceramic layer stack 1.As a result, in multilayered ceramic
The fever of the front end side of body 1, heat generating resistor 2 becomes larger.
Heat generating resistor 2 is such as with carbide, nitride or silicide tungsten (W), molybdenum (Mo) either titanium (Ti) etc.
For principal component.In the case where ceramic layer stack 1 is made of silicon nitride ceramics, preferably the principal component of heat generating resistor 2 is by carbon
Change tungsten to constitute.Thereby, it is possible to keep the coefficient of thermal expansion of the coefficient of thermal expansion of ceramic layer stack 1 and heat generating resistor 2 close.
Conductive layer 3 is in the rear end side of ceramic layer stack 1, that is heat generating resistor 2 is drawn out to ceramic layer
The component of the calorific value of heat generating resistor 2 is adjusted near the position of the side of stack 1.In Fig. 1, indicate conductive by a dotted line
Layer 3.In addition, in Fig. 1, it is in order to be easy observation attached drawing, the dotted line for indicating conductive layer 3 and the solid line for indicating heat generating resistor 2 is wrong
Record is opened, but in fact, conductive layer 3 has almost the same width, and conductive layer 3 and heating resistor with heat generating resistor 2
2 tegillum of device is stacked as equivalent width.As shown in FIG. 2 and 3, conductive layer 3 between ceramic layer 11, i.e. heat generating resistor 2 two
It is laminated on a end, one end is drawn out to the side of ceramic layer stack 1 respectively.In this way, by covering fever using conductive layer 3
Among resistor 2 and on two ends of external circuit connection, the fever of the rear end side of ceramic layer stack 1 can be reduced.Cause
This, can be improved the reliability that external circuit is connect with heater 10.
Conductive layer 3 have be drawn out to ceramic layer stack 1 side the 1st conductive layer 31 and with 31 phase of the 1st conductive layer
The 2nd adjacent conductive layer 32.1st conductive layer 31 and the 2nd conductive layer 32 are made of multiple particles.Also, the grain of the 1st conductive layer 31
The average grain diameter of son is smaller than the average grain diameter of the particle of the 2nd conductive layer 32.In this way, being located at the 1st conductive layer 31 in outside by average
The lesser particle of partial size is constituted, and thus, it is possible to improve the density of the 1st conductive layer 31.As a result, the voidage of the 1st conductive layer 31 becomes
It is low, therefore outside air can be reduced and enter conductive layer 3.
In addition, not only conductive layer 3 but also heat generating resistor 2 are also drawn out to the side of ceramic layer stack 1, thus it enables that
The part for being drawn out to side is double-layer structural.Therefore, even if generating crack in a side of conductive layer 3 or heat generating resistor 2,
Also a possibility that crack is extended to another party can be reduced.
In addition, the 2nd conductive layer 32 is made of the biggish particle of average grain diameter, thus, it is possible to reduce in the 2nd conductive layer 32
The crystal boundary of particle, therefore the resistance value of the 2nd conductive layer 32 can be reduced.Thereby, it is possible to reduce in the unnecessary of the generation of conductive layer 3
Fever.
These as a result, long-term reliability when heater 10 uses under thermal cycling improves.
Specifically, for example, differently with above-mentioned heater 10, the average grain diameter of conductive layer size and position without
Close it is constant in the case where, there is a problem of following.That is, only merely reducing the big of the average grain diameter of conductive layer
In the case where small, that is, allow to reduce outside air intrusion conductive layer, the resistance of conductive layer itself also becomes larger, therefore in conductive layer
Generate unnecessary fever.On the contrary, in the case where only merely increasing the size of average grain diameter of conductive layer, i.e., it is enabled
The unnecessary fever in conductive layer is enough reduced, outside air is also easy to invade conductive layer.On the other hand, by such as above-mentioned
Heater 10 like that, keep the average grain diameter of the particle of the 1st conductive layer 31 smaller than the average grain diameter of the particle of the 2nd conductive layer 32,
The entrance of outside air can be reduced, and the unnecessary fever in conductive layer 3 can be reduced.
Further, as shown in Fig. 2, it is preferred that the 1st conductive layer 31 is Chong Die with 32 part of the 2nd conductive layer.It is led as a result, with the 1st
Electric layer 31 when observing conductive layer 3 in the longitudinal direction, can make conductive layer 3 compared with the nonoverlapping situation of the 2nd conductive layer 32
Change to the coefficient of thermal expansion stage.As a result, it is possible to reduce under thermal cycling a possibility that conductive layer 3 generates crack.
Further, it is preferable to which the 1st conductive layer 31 between the 2nd conductive layer 32 and heat generating resistor 2, is led being located at the 2nd
Part between electric layer 32 and heat generating resistor 2, the 1st conductive layer 31 with towards the other end and it is thinning.Thereby, it is possible to make conduction
The coefficient of thermal expansion of layer 3 is slowly varying.As a result, it is possible to be further reduced to generate the possibility in crack in conductive layer 3 under thermal cycling
Property.
In addition, though conductive layer 3 is only by the 1st conductive layer 31 and 32 structure of the 2nd conductive layer in above-mentioned heater 10
At however, it is not limited to this.Conductive layer 3 also can have the part other than the 1st conductive layer 31 and the 2nd conductive layer 32.
For example, as shown in figure 4, conductive layer 3 can also also have the 3rd conductive layer 33 in addition to the 1st conductive layer 31 and the 2nd conductive layer 32.
3rd conductive layer 33 is adjacent with side opposite with the 1st conductive layer 31 among the 2nd conductive layer 32.
As being used as the layer of the 3rd conductive layer 33, and it is not specifically limited.For example, it is also possible to the grain of the 3rd conductive layer 33
The average grain diameter of son is smaller than the average grain diameter of the particle of the 2nd conductive layer 32.The crystallization of the particle in the 3rd conductive layer 33 is brilliant as a result,
Boundary increases.Therefore, the resistance value in the 3rd conductive layer 33 can be made bigger than the resistance value in the 2nd conductive layer 32.Thereby, it is possible to make
Change to the calorific value stage of heat generating resistor 2.Therefore, change while the temperature stage on the surface of heater 10 can be made.It is tied
Fruit can reduce and generate biggish thermal stress in 1 part of ceramic layer stack.
1st conductive layer, 31 to the 3rd conductive layer 33 is such as the gold of the excellent heat resistance as molybdenum (Mo), tungsten (W) or rhenium (Re)
Belong to material to constitute.Particularly, in order to make coefficient of thermal expansion close to ceramic layer stack 1, preferably by MoSi2And WSi2Deng mixing.1st
The length of conductive layer 31 is as follows: being set to 2~10mm or so along the length of the part of the length direction of heat generating resistor 2.
The thickness of 1st conductive layer 31 is set to 5~30 μm or so.In addition, the length of the 2nd conductive layer 32 is as follows: along heating resistor
The length of the part of the length direction of device 2 is set to 5~20mm or so.The thickness of 2nd conductive layer 32 is set to 25~75 μ
M or so.In addition, the length in the region is set to such as 500 in the case where the 1st conductive layer 31 is Chong Die with the 2nd conductive layer 32
μm or so.
The partial size of 1st conductive layer 31 and the 2nd conductive layer 32 can adjust as follows.Specifically, the 1st conductive layer 31 with
And the 2nd conductive layer 32 be all made of W in the case where, the partial size of the powder of the W by making initial feed is different, can adjust the 1st
The partial size of conductive layer 31 and the 2nd conductive layer 32.For example, the average grain diameter of the powder for the W for being used for the 1st conductive layer 31 is set as
0.2 μm, the average grain diameter for the powder for being used for the W of the 2nd conductive layer 32 is set as 1.2 μm.Thereby, it is possible to conductive by the 1st
The average grain diameter of layer 31 is set as 0.2~2 μm, and the average grain diameter of the 2nd conductive layer 32 is set as 1.2~12 μm.
In particular it is preferred to which the average grain diameter of the 1st conductive layer 31 is less than 1 μm.Thereby, it is possible to reduce outside air between particle
It immerses, therefore a possibility that outside air enters the 1st conductive layer 31 can be reduced.In addition, at this point, the it is preferred that sky of the 1st conductive layer
Gap rate is less than 20%.Thereby, it is possible to reduce outside air into the 1st conductive layer 31.
The average grain diameter of conductive layer 3 can for example be confirmed by the following method.Specifically, diamond-like is being used
Cutter uses diamond-like mountain flour by heater 10 after through the cutting of the face in the direction vertical with conductive layer 3 of conductive layer 3
End carries out the grinding on surface.Then, observed using scanning electron microscope or metallurgical microscopes the 1st conductive layer 31 with
And the 2nd conductive layer 32.More specifically, in the image as obtained from scanning electron microscope or metallurgical microscopes
On, draw arbitrary 5 straight lines.Then, it finds out the average value of the distance of 10 crosscutting particles of 5 straight lines.Passing through will
The average value can find out average grain diameter divided by 10 of the number as particle.In addition it is also possible to use image analysis apparatus
(NIRECO corporation: LUZEX-FS) calculates average grain diameter.It is also able to use when measuring the voidage of the 1st conductive layer 31
The image analysis apparatus stated.
Heater 10 is for example used as igniter 100 shown in fig. 5.Igniter 100 is by heater 10 and gas
The flow path 20 that fuel flows to heater 10 is constituted.Ventilation duct 22 of the flow path 20 for example by air valve 21 and with ejiction opening 23 is constituted.
Air valve 21 has the function of controlling the flow of gaseous fuel.As the gaseous fuel provided from air valve 21, such as example there are natural
Gas or propane gas etc..Ventilation duct 22 will be sprayed from the gaseous fuel that air valve 21 provides from ejiction opening 23 to heater 10.And
And the gaseous fuel for being ejected thus allows for lighting a fire by heating heater 10.Have by igniter 100
The heater 10 for thering is long-term reliability to improve, so that the stability of the igniting of gaseous fuel improves.
Symbol description-
1: ceramic layer stack
11: ceramic layer
2: heat generating resistor
3: conductive layer
31: the 1 conductive layers
32: the 2 conductive layers
10: heater
20: flow path
21: air valve
22: ventilation duct
23: ejiction opening
100: igniter
Claims (7)
1. a kind of heater, has:
The ceramic layer stack that multiple ceramic layers are laminated；
It is arranged between the ceramic layer, and both ends are drawn out to the band-like heating electric of the side of the ceramic layer stack
Hinder device；With
Be layered between the ceramic layer on two ends of the heat generating resistor, and one end be drawn out to respectively it is described
The band-like conductive layer of side,
The conductive layer includes the 1st conductive layer and 2nd conductive layer adjacent with the 1st conductive layer for being drawn out to the side,
1st conductive layer and the 2nd conductive layer are made of multiple particles, and the average grain of the particle of the 1st conductive layer
Diameter is smaller than the average grain diameter of the particle of the 2nd conductive layer.
2. heater according to claim 1, wherein
1st conductive layer is Chong Die with the 2nd conductive layer part.
3. heater according to claim 2, wherein
In the 1st conductive layer part Chong Die with the 2nd conductive layer, the 1st conductive layer be located at the 2nd conductive layer with
Between the heat generating resistor,
In the part between the 2nd conductive layer and the heat generating resistor, the 1st conductive layer is with towards the other end
And it is thinning.
4. heater described in any one to 3 according to claim 1, wherein
The average grain diameter of the particle of 1st conductive layer is 0.2~2 μm, and the average grain diameter of the particle of the 2nd conductive layer is
1.2~12 μm.
5. heater described in any one to 3 according to claim 1, wherein
The voidage of 1st conductive layer is less than 20%.
6. heater according to claim 4, wherein
The voidage of 1st conductive layer is less than 20%.
7. a kind of igniter, has:
Heater described in any one of the claim 1 to claim 6；With
Gaseous fuel is flowed to the flow path of the ceramic layer stack among the heater.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014-090911 | 2014-04-25 | ||
| JP2014090911 | 2014-04-25 | ||
| PCT/JP2015/062651 WO2015163483A1 (en) | 2014-04-25 | 2015-04-27 | Heater and ignition device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106105384A CN106105384A (en) | 2016-11-09 |
| CN106105384B true CN106105384B (en) | 2019-08-02 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201580012328.8A Active CN106105384B (en) | 2014-04-25 | 2015-04-27 | Heater and igniter |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP3136819B1 (en) |
| JP (1) | JP6027289B2 (en) |
| CN (1) | CN106105384B (en) |
| WO (1) | WO2015163483A1 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6987995B2 (en) * | 2018-07-31 | 2022-01-05 | 京セラ株式会社 | heater |
| JP2022544996A (en) * | 2019-08-19 | 2022-10-24 | エスシーピー ホールディングス，アン アシュームド ビジネス ネーム オブ ナイトライド イグナイターズ，リミティド ライアビリティ カンパニー | Thermally actuated gas valve with ceramic heater |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0275188A (en) * | 1988-09-09 | 1990-03-14 | Ngk Spark Plug Co Ltd | Ceramic heating element |
| JPH0429192U (en) * | 1990-07-02 | 1992-03-09 | ||
| EP1696704A1 (en) * | 2003-11-25 | 2006-08-30 | Kyocera Corporation | Ceramic heater and method for manufacture thereof |
| WO2013047849A1 (en) * | 2011-09-29 | 2013-04-04 | 京セラ株式会社 | Heater and glow plug provided with same |
| CN105165113A (en) * | 2013-04-27 | 2015-12-16 | 京瓷株式会社 | Ceramic heater |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01272078A (en) * | 1988-04-21 | 1989-10-31 | Rinnai Corp | Ceramic heater |
| JP3121860B2 (en) * | 1991-06-06 | 2001-01-09 | 京セラ株式会社 | Ceramic heater |
| JP2828575B2 (en) * | 1993-11-12 | 1998-11-25 | 京セラ株式会社 | Silicon nitride ceramic heater |
| DE19731900A1 (en) * | 1997-07-24 | 1999-02-11 | Heraeus Electro Nite Int | Conductive layer with variable electrical resistance, process for its manufacture and use |
| JP3691649B2 (en) * | 1997-10-28 | 2005-09-07 | 日本特殊陶業株式会社 | Ceramic heater |
| JP2001244053A (en) * | 2000-02-29 | 2001-09-07 | Tdk Corp | Resistive element for heating |
| JP3924193B2 (en) * | 2001-05-02 | 2007-06-06 | 日本特殊陶業株式会社 | Ceramic heater, glow plug using the same, and method for manufacturing ceramic heater |
| KR100908429B1 (en) * | 2003-12-24 | 2009-07-21 | 쿄세라 코포레이션 | Ceramic heater and its manufacturing method |
| JP4183186B2 (en) * | 2004-03-29 | 2008-11-19 | 京セラ株式会社 | Ceramic heater |
| CN101647314B (en) * | 2007-02-22 | 2012-05-23 | 京瓷株式会社 | Ceramic heater, glow plug using the ceramic heater, and ceramic heater manufacturing method |
| JP5357628B2 (en) * | 2009-05-26 | 2013-12-04 | 日本特殊陶業株式会社 | Manufacturing method of ceramic heater |
| JP5721584B2 (en) * | 2011-08-10 | 2015-05-20 | 京セラ株式会社 | Heater and glow plug equipped with the same |
-
2015
- 2015-04-27 CN CN201580012328.8A patent/CN106105384B/en active Active
- 2015-04-27 EP EP15782910.2A patent/EP3136819B1/en active Active
- 2015-04-27 WO PCT/JP2015/062651 patent/WO2015163483A1/en active Application Filing
- 2015-04-27 JP JP2016515248A patent/JP6027289B2/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0275188A (en) * | 1988-09-09 | 1990-03-14 | Ngk Spark Plug Co Ltd | Ceramic heating element |
| JPH0429192U (en) * | 1990-07-02 | 1992-03-09 | ||
| EP1696704A1 (en) * | 2003-11-25 | 2006-08-30 | Kyocera Corporation | Ceramic heater and method for manufacture thereof |
| WO2013047849A1 (en) * | 2011-09-29 | 2013-04-04 | 京セラ株式会社 | Heater and glow plug provided with same |
| CN105165113A (en) * | 2013-04-27 | 2015-12-16 | 京瓷株式会社 | Ceramic heater |
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2015163483A1 (en) | 2017-04-20 |
| CN106105384A (en) | 2016-11-09 |
| EP3136819A4 (en) | 2017-12-27 |
| WO2015163483A1 (en) | 2015-10-29 |
| JP6027289B2 (en) | 2016-11-16 |
| EP3136819B1 (en) | 2020-05-06 |
| EP3136819A1 (en) | 2017-03-01 |
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